Double-MOS wafer packaging device

Abstract

The utility model discloses a double-MOS wafer packaging device, which relates to the technical field of wafer packaging equipment and comprises a cleaning tank, a mounting plate, a first metal oxide semiconductor (MOS), a second metal oxide semiconductor (MOS) and a second metal oxide semiconductor (MOS), the mounting disc is fixedly connected with the mounting plate, and the mounting disc is fixedly connected with a group of fixed circular shafts; the rotating ring is rotationally connected with the mounting disc, and the rotating ring is fixedly connected with a group of swinging circular shafts; the group of outer arc rods are rotationally connected with the corresponding fixed circular shafts respectively; the L-shaped rods are rotationally connected with the corresponding swinging circular shafts respectively; the group of spray heads are fixedly communicated with hollow pipes respectively, and each hollow pipe is fixedly connected with the corresponding L-shaped rod respectively. The technical problem to be solved by the utility model is to provide the double-MOS wafer packaging device, the rotation of the rotating ring is realized by utilizing the extension and retraction of the electric push rod, and the spray head swings back and forth, so that the cleaning effect of the wafer is better.

Description

Technical Field

[0001] This utility model relates to the field of wafer packaging equipment technology, specifically a dual MOS wafer packaging device. Background Technology

[0002] A dual MOS (metal-oxide-semiconductor) wafer typically refers to a chip that integrates two MOSFETs (metal-oxide-semiconductor field-effect transistors) on the same wafer. This design is very common in microelectronics, especially in circuits that require complementary functions, such as N-channel and P-channel MOSFETs.

[0003] Existing technologies, such as the invention of a wafer cleaning device and wafer packaging equipment, application number 202411138834.9, can change the spray angle of the nozzle in the wafer cleaning process. The movement of the nozzle can improve the uniformity of the spray surface, resulting in better wafer cleaning effect and more comprehensive cleaning of the wafer without dead angles or blind spots.

[0004] Currently, there is a lack of wafer packaging devices that allow for easy adjustment of the spray angle by changing the position of the nozzle, with the nozzle driving the cleaning fluid to achieve better wafer cleaning results. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a dual MOS wafer packaging device, which uses the extension and retraction of an electric push rod to realize the rotation of the rotating ring, causing the nozzle to swing back and forth, thereby improving the cleaning effect of the wafer.

[0006] This utility model achieves its purpose through the following technical solution:

[0007] A dual MOS wafer packaging device is characterized by comprising: a cleaning tank, wherein a mounting plate is fixedly connected within the cleaning tank as the main body of the device, for containing cleaning fluid and providing an environment for wafer cleaning; a mounting plate, fixedly connected to the mounting plate, wherein a set of fixed circular shafts is fixedly connected to the mounting plate; a rotating ring, rotatably connected to the mounting plate, wherein a set of swinging circular shafts is fixedly connected to the rotating ring; a set of outer arc rods, respectively rotatably connected to the corresponding fixed circular shafts; a set of L-rods, respectively rotatably connected to the corresponding swinging circular shafts; and a set of nozzles, respectively fixedly connected to hollow tubes, wherein each hollow tube is fixedly connected to the corresponding L-rod for spraying cleaning fluid to clean the wafer. When the rotating ring rotates, the nozzles swing, and the nozzles can push the cleaning fluid to impact the wafer, resulting in better cleaning effect.

[0008] As a further limitation of this technical solution, a power assembly is also included. The power assembly includes an electric push rod, the mounting base of which is rotatably connected to the corresponding fixed circular shaft, and the push rod of which is rotatably connected to the corresponding swing circular shaft. The electric push rod provides power to drive the rotating ring to rotate, thereby causing the nozzle to swing and achieving multi-angle cleaning of the wafer.

[0009] As a further limitation of this technical solution, it also includes a pick-and-place component, which includes a linear module. The slider of the linear module is connected to a mounting block, and the mounting block is connected to at least one gripping component for realizing automatic pick-and-place of wafers.

[0010] As a further limitation of this technical solution, the gripping component includes a horizontal cylinder, which is fixedly connected to the mounting block and used to drive the horizontal movement of the gripping component. The piston rod of the horizontal cylinder is fixedly connected to a cylinder block, and the cylinder block is fixedly connected to a vertical cylinder, used to drive the vertical movement of the gripping ring to realize the gripping and release of the wafer. The piston rod of the vertical cylinder is fixedly connected to the gripping ring, used to directly grip and release the wafer, ensuring the stability and safety of the wafer during the transmission process.

[0011] As a further limitation of this technical solution, the number of gripping components is two, each installed at one end of the mounting block. This enables simultaneous wafer gripping and release operations, improving the automation level and working efficiency of the device.

[0012] As a further limitation of this technical solution, each of the hollow tubes is fixedly connected to a water inlet pipe for introducing cleaning fluid from an external supply system into the hollow tube.

[0013] Compared with related technologies, the dual MOS wafer packaging device provided by this utility model has the following advantages:

[0014] (1) This device achieves multi-angle cleaning of wafers by working together with the nozzle and power components, driving the cleaning fluid to move and improving the cleaning effect;

[0015] (2) The two gripping components of this device are designed to realize dual-station operation, realize automatic loading and unloading of wafers, and improve the automation level and working efficiency of the device;

[0016] (3) This device ensures the stability and safety of the wafer during the transmission process through precise control of the linear module and cylinder. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0018] Figure 2 This is a partial three-dimensional structural diagram of the present invention. Figure 1 ;

[0019] Figure 3 This is a partial three-dimensional structural diagram of the present invention. Figure 2 ;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 .

[0021] In the diagram: 1. Linear module, 2. Horizontal cylinder, 3. Cylinder block, 4. Vertical cylinder, 5. Gripping ring, 6. Cleaning tank, 7. Mounting plate, 8. Mounting disc, 9. Outer arc rod, 10. L-shaped rod, 11. Rotating ring, 13. Fixed round shaft, 14. Electric push rod, 15. Swinging round shaft, 16. Hollow tube, 17. Water inlet pipe, 18. Nozzle, 19. Mounting block. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1: A dual MOS wafer packaging device includes: a cleaning tank 6, in which a mounting plate 7 is fixedly connected, serving as the main body of the device, for containing cleaning fluid and providing an environment for wafer cleaning; a mounting plate 8, fixedly connected to the mounting plate 7, and a set of fixed circular shafts 13 fixedly connected to the mounting plate 7; a rotating ring 11, rotatably connected to the mounting plate 8, and a set of swinging circular shafts 15 fixedly connected to the rotating ring 11; a set of outer arc rods 9, rotatably connected to the corresponding fixed circular shafts 13; a set of L-rods 10, rotatably connected to the corresponding swinging circular shafts 15; and a set of nozzles 18, fixedly connected to hollow tubes 16, each hollow tube 16 being fixedly connected to the corresponding L-rod 10 for spraying cleaning fluid to clean the wafer. When the rotating ring 11 rotates, the nozzles 18 swing, and the nozzles 18 can push the cleaning fluid to impact the wafer, resulting in better cleaning effect.

[0024] It also includes a power assembly, which includes an electric push rod 14. The mounting base of the electric push rod 14 is rotatably connected to the corresponding fixed circular shaft 13, and the push rod of the electric push rod 14 is rotatably connected to the corresponding swing circular shaft 15. The electric push rod 14 provides power to drive the rotating ring 11 to rotate, thereby causing the nozzle 18 to swing, realizing multi-angle cleaning of the wafer.

[0025] The electric push rod 14 is model YZD12-200.

[0026] Each of the hollow tubes 16 is fixedly connected to a water inlet pipe 17 for introducing cleaning fluid from an external supply system into the hollow tube 16.

[0027] The working principle of the dual MOS wafer packaging device provided by this utility model is as follows:

[0028] Connect one end of a hose to the water inlet pipe 17 and the other end to the cleaning tank that drives the booster pump. Add an appropriate amount of cleaning solution to the cleaning tank 6 beforehand, so that the upper part of the solution surface is level with the drain outlet on the upper side of the cleaning tank 6.

[0029] The equipment places the wafer into the area comprised of a set of nozzles 18. The cleaning tank is controlled to operate, causing the cleaning solution to spray from the nozzles 18. The electric push rod 14 extends and reciprocates, driving a swinging shaft 15 to swing. This swinging shaft 15, in turn, drives the electric push rod 14 to swing, and then drives a rotating ring 11 to rotate. The rotating ring 11 drives the remaining swinging shafts 15 to swing, which in turn drives an L-shaped rod 10 to swing. The L-shaped rod 10, in turn, drives an outer arc rod 9 to swing, which in turn drives the hollow tube 16, water inlet pipe 17, and nozzles 18 to swing. The nozzles 18 adjust the spray angle and move the cleaning solution, resulting in better wafer cleaning. Excess cleaning solution is discharged from the drain outlet on the upper side of the cleaning tank 6, and a material container can be placed below it for collection.

[0030] Example 2: This example is a further elaboration based on Example 1, and also includes a pick-and-place component. The pick-and-place component includes a linear module 1, and the slider of the linear module 1 is connected to a mounting block 19. The mounting block 19 is connected to at least one gripping component to realize automatic pick-and-place of wafers.

[0031] The linear module 1 is model number MISUMI E-RAM10-S-600-NN.

[0032] The gripping assembly includes a horizontal cylinder 2, which is fixedly connected to the mounting block 19 and is used to drive the horizontal movement of the gripping assembly. The piston rod of the horizontal cylinder 2 is fixedly connected to a cylinder block 3, and the cylinder block 3 is fixedly connected to a vertical cylinder 4, which is used to drive the vertical movement of the gripping ring to realize the gripping and release of the wafer. The piston rod of the vertical cylinder 4 is fixedly connected to the gripping ring 5, which is used to directly grip and release the wafer to ensure the stability and safety of the wafer during the transmission process.

[0033] The model of the horizontal cylinder 2 is MGPMJ20 25.

[0034] The vertical cylinder 4 is model SC63*200.

[0035] Two gripping components are installed at one end of the mounting block 19. This allows for simultaneous wafer gripping and release operations, improving the automation level and work efficiency of the device.

[0036] The gripping ring 5 is a vacuum chuck. A vacuum pump generates negative pressure, creating a vacuum suction force between the chuck and the wafer surface, thus gripping the wafer. This non-contact operation avoids direct contact with the wafer surface, reducing scratches and contamination. It is suitable for wafers of various sizes and shapes, including ultra-thin wafers. It is widely used in wafer handling, cleaning, and inspection equipment.

[0037] The working principle of the dual MOS wafer packaging device provided by this utility model is as follows:

[0038] One gripping ring 5 grips the pre-placed wafer and places it into the area formed by a set of nozzles 18, while the other gripping ring 5 grips the cleaned wafer and places it into the next work station.

[0039] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A dual MOS wafer packaging device, characterized by, Include: The cleaning tank (6), the mounting plate (7) is fixedly connected in the cleaning tank (6); The installation disc (8) is fixedly connected with the mounting plate (7), and a group of fixed circular shafts (13) are fixedly connected with the installation disc (8); The rotating ring (11) is rotatably connected with the installation disc (8), and a group of swing circular shafts (15) are fixedly connected with the rotating ring (11); A group of outer arc rods (9) are rotatably connected with the corresponding fixed circular shafts (13) respectively; A group of L rods (10) are rotatably connected with the corresponding swing circular shafts (15) respectively; A group of spray heads (18) are fixedly connected with hollow pipes (16) respectively, and each hollow pipe (16) is fixedly connected with the corresponding L rod (10).

2. The dual MOS wafer package device of claim 1, wherein: It also includes a power assembly, the power assembly includes an electric push rod (14), the mounting seat of the electric push rod (14) is rotatably connected with the corresponding fixed circular shaft (13), and the push rod of the electric push rod (14) is rotatably connected with the corresponding swing circular shaft (15).

3. The dual MOS wafer package device of claim 1, wherein: It also includes a pick-and-place assembly, the pick-and-place assembly includes a linear module (1), the slider of the linear module (1) is connected with a mounting block (19), and the mounting block (19) is connected with at least one grabbing assembly.

4. The dual MOS wafer package device of claim 3, wherein: The grabbing assembly includes a horizontal air cylinder (2), the horizontal air cylinder (2) is fixedly connected with the mounting block (19), the piston rod of the horizontal air cylinder (2) is fixedly connected with an air cylinder block (3), the air cylinder block (3) is fixedly connected with a vertical air cylinder (4), and the piston rod of the vertical air cylinder (4) is fixedly connected with a grabbing ring (5).

5. The dual MOS wafer package device of claim 3, wherein: The number of the grabbing assembly is two, and each is installed at one end of the mounting block (19).

6. The dual MOS wafer package device of claim 1, wherein: Each hollow pipe (16) is fixedly connected with a water inlet pipe (17) respectively.

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