Adsorption device for wafer processing

Abstract

The utility model relates to the technical field of wafer adsorption, and discloses an adsorption device for wafer processing, which comprises a mounting plate and an adsorption disc, the adsorption disc is fixed below the mounting plate through a connecting rod, the outer ring of the bottom of the adsorption disc is uniformly provided with a plurality of tension sensors, and the measuring end of each tension sensor is provided with a vacuum chuck. And electric sliding rails are symmetrically mounted on the two sides of the bottom of the mounting plate, vertical rods are vertically fixed to the lower portions of sliding blocks of the electric sliding rails, anti-falling blocks are fixed to the lower portions of the side edges, facing the adsorption discs, of the vertical rods, and clamping grooves are formed in the side surfaces of the anti-falling blocks. According to the technical scheme, the tension sensors are installed at the bottoms of the suction discs above the vacuum suction discs, the anti-falling blocks capable of being driven by the electric sliding rails to move are arranged, and when the vacuum suction discs do not suck tightly, the situation that the vacuum suction discs are uneven in stress is detected by the tension sensors; the electric sliding rail can be automatically controlled to drive the anti-falling block to be clamped on the side edge of the wafer through the clamping groove, and the problems of loss and cleaning caused by wafer falling are avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer adsorption technology, specifically an adsorption device for wafer processing. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a basic material in semiconductor manufacturing. It is usually a wafer with silicon as the main component. During the processing of wafers, an adsorption device is needed to adsorb the silicon crystals, and then the wafers are transferred or processed.

[0003] Wafers are typically held in place by multiple vacuum chucks. If one or more chucks fail to hold the wafer securely, there is a risk of the wafer falling, resulting in material loss and increased cleaning difficulty. Therefore, we propose a wafer adsorption device for wafer processing. Utility Model Content

[0004] The purpose of this invention is to provide an adsorption device for wafer processing. By installing a tension sensor at the bottom of the adsorption cup above each vacuum suction cup and setting an anti-fall block that can be moved by an electric slide rail, when the vacuum suction cup is not firmly adsorbed, resulting in uneven force on the vacuum suction cup, the tension sensor can detect this and automatically control the electric slide rail to move the anti-fall block through the slot and lock it to the side of the wafer, avoiding the loss and cleaning problems caused by the wafer falling, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an adsorption device for wafer processing, comprising a mounting plate and an adsorption disk, wherein the adsorption disk is circular and parallel to the center of the mounting plate and is fixed to the bottom of the mounting plate by a connecting rod; multiple tension sensors are evenly installed on the bottom outer ring of the adsorption disk, and a vacuum suction cup is installed on the measuring end of the tension sensor; electric slide rails are symmetrically installed on both sides of the bottom of the mounting plate, and a vertical rod is fixed below the slider of the electric slide rail; a fall arrestor block is fixed below the side of the vertical rod facing the adsorption disk, and a slot is formed on the side surface of the fall arrestor block.

[0006] By adopting the above technical solution, when using vacuum chucks to adsorb wafers, the force on each vacuum chuck can be detected by the tension sensor. If there is a vacuum chuck that does not adsorb the wafer tightly, there will be uneven force, which will be detected by the tension sensor. Then, the anti-fall block can be controlled to move towards the side of the wafer, and the anti-fall block can be used to lock the side of the wafer to prevent the wafer from falling.

[0007] Optionally, a rubber pad is attached and fixed to the inner surface of the card slot, and the rubber pad is evenly distributed on the upper, lower and side surfaces of the card slot.

[0008] By adopting the above technical solution, when the card slot is placed on the outer ring of the wafer, the wafer is prevented from directly contacting the inner surface of the card slot, thereby preventing the wafer from being scratched.

[0009] Optionally, mounting holes are provided at each of the four corners of the surface of the mounting plate, and multiple mounting holes are provided.

[0010] By adopting the above technical solution, the mounting plate is installed and fixed by bolts passing through the mounting holes.

[0011] Optionally, the anti-fall blocks on both sides of the adsorption disk are at the same height, and the line connecting the anti-fall blocks passes through the center of the adsorption disk.

[0012] By adopting the above technical solution, it is ensured that when the anti-fall block is moved closer to the wafer, it can be precisely locked onto both sides of the wafer.

[0013] Optionally, six vacuum suction cups and tension sensors are evenly arranged.

[0014] By adopting the above technical solution and setting up multiple vacuum chucks, a more stable adsorption effect can be achieved on the wafer.

[0015] Compared with the prior art, the beneficial effects of the technical solution of this application are as follows:

[0016] 1. The technical solution of this application is to install a tension sensor at the bottom of the suction cup above each vacuum suction cup, and to set an anti-fall block that can be moved by an electric slide rail. When the vacuum suction cup is not firmly attached, there is an uneven force on the vacuum suction cup, which is detected by the tension sensor. The electric slide rail can be automatically controlled to move the anti-fall block through the slot and lock it on the side of the wafer, so as to avoid the loss and cleaning problems caused by the wafer falling.

[0017] 2. The technical solution of this application also includes a rubber pad attached to the inner wall surface of the card slot, which prevents the card block from causing wear to the wafer when it is stuck on the side of the wafer through the card slot. Attached Figure Description

[0018] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the overall structure of the adsorption device for wafer processing according to this utility model;

[0020] Figure 2 This is a schematic diagram of the bottom structure of the adsorption disk of the adsorption device for wafer processing according to this utility model;

[0021] Figure 3 This is a schematic diagram of the anti-fall block structure of the adsorption device for wafer processing according to this utility model.

[0022] In the diagram: 1. Mounting plate; 11. Connecting rod; 12. Mounting hole; 2. Adsorption plate; 21. Tension sensor; 22. Vacuum suction cup; 3. Electric slide rail; 31. Vertical rod; 4. Anti-fall block; 41. Slot; 411. Rubber pad. Detailed Implementation

[0023] Please see Figure 1-3 This utility model provides a technical solution: an adsorption device for wafer processing, including a mounting plate 1 and an adsorption disk 2. The adsorption disk 2 is circular and is placed parallel to the center of the mounting plate 1 below it. The adsorption disk 2 is fixed to the bottom of the mounting plate 1 by connecting rods 11, each connecting rod 11 having the same length. Mounting holes 12 are provided at the four corners of the surface of the mounting plate 1. Multiple mounting holes 12 are provided. During installation, the mounting plate 1 is placed against the bottom of the lifting and translating structure. Bolts pass through the mounting holes 12 to fix the mounting plate 1, so that it can be lifted and translated by the lifting and translating structure.

[0024] Multiple tension sensors 21 are evenly installed on the bottom outer ring of the suction cup 2. Vacuum suction cups 22 are installed on the measuring end of the tension sensors 21. There are six vacuum suction cups 22 and tension sensors 21 evenly arranged. In use, the control end of the vacuum suction cup 22 is connected to the vacuum pump through an electronically controlled valve. When the wafer touches the surface below the vacuum suction cup 22, the vacuum suction cup 22 can be activated to adsorb the wafer. When the vacuum suction cup 22 stably adsorbs the wafer, the force on all vacuum suction cups 22 is the same, so the value detected by the tension sensors 21 is also the same. However, considering the measurement error, the value will be within a very small range. If there is a vacuum suction cup 22 that does not adsorb, it will increase the force on the other vacuum suction cups 22, resulting in different values ​​of the tension sensors 21. In this case, it can be determined that the wafer is not firmly adsorbed.

[0025] To prevent the wafer from falling, electric slide rails 3 are symmetrically installed on both sides of the bottom of the mounting plate 1. A vertical rod 31 is fixed below the slider of the electric slide rail 3. A fall arrestor block 4 is fixed below the side of the vertical rod 31 facing the adsorption plate 2. The side surface of the fall arrestor block 4 is provided with a slot 41. The fall arrestor blocks 4 on both sides of the adsorption plate 2 are the same height. The line connecting the fall arrestor blocks 4 passes through the center of the adsorption plate 2. When it is determined that the wafer is not firmly adsorbed, the electric slide rail 3 is controlled to drive the vertical rod 31 and the fall arrestor block 4 to move closer to the side of the wafer until the fall arrestor block 4 passes through the slot 41 from the side and is locked on the outside of the wafer. This can prevent the wafer from falling and facilitate workers to inspect the equipment. At the same time, it can safely remove wafers that are not firmly adsorbed.

[0026] A rubber pad 411 is attached and fixed to the inner surface of the slot 41. The rubber pad 411 is evenly distributed on the upper, lower and side surfaces of the slot 41. When the slot is attached to the outer ring of the wafer, it prevents the wafer from directly contacting the inner surface of the slot 41, thereby preventing the wafer from being scratched.

[0027] In use, the mounting plate 1 is installed below the lifting and conveying structure using bolts through the mounting holes 12 at the four corners. The control end of the vacuum suction cup 22 is connected to the vacuum pump via an electronically controlled valve. The tension sensor 21 and the electric slide rail 3 are both connected to the industrial control computer. When adsorbing the wafer, the mounting plate 1 and the suction plate 2 lower their height, causing the vacuum suction cup 22 to contact the surface of the wafer, thus activating the vacuum suction cup 22 to lift the wafer. Afterward, the mounting plate 1 and the suction plate are lifted and moved horizontally, enabling the transfer of the wafer. During this process, the vacuum pump at each point... The tension sensor 21 above the vacuum suction cup 22 measures the same value within the error range. If there is a vacuum suction cup 22 that is not adsorbed, it will increase the force on other vacuum suction cups 22, resulting in different values ​​of the tension sensor 21. It can be determined that the wafer is not firmly adsorbed. In order to prevent the wafer from falling, the electric slide rail 3 is controlled to drive the vertical rod 31 and the anti-fall block 4 to move closer to the side of the wafer until the anti-fall block 4 is stuck on the outside of the wafer through the slot 41 from the side, which can prevent the wafer from falling. Then the worker can inspect and repair the equipment.

Claims

1. An adsorption device for wafer processing, comprising a mounting plate (1) and an adsorption plate (2), characterized in that: The adsorption disc (2) is circular and is arranged below the middle position of the mounting plate (1), and the adsorption disc (2) is fixed below the mounting plate (1) through a connecting rod (11); A plurality of tension sensors (21) are uniformly arranged on the outer circle of the bottom of the adsorption disc (2), a vacuum chuck (22) is arranged on the measuring end of the tension sensor (21), electric slide rails (3) are symmetrically arranged on the bottom of the mounting plate (1), vertical rods (31) are vertically fixed below the sliding blocks of the electric slide rails (3), and the vertical rods (31) are fixed below the side edges of the adsorption disc (2) and are provided with anti-falling blocks (4), and the side surfaces of the anti-falling blocks (4) are provided with clamping grooves (41).

2. The wafer processing adsorption apparatus according to claim 1, characterized by: The inner surfaces of the clamping grooves (41) are fixedly connected with rubber pads (411), and the rubber pads (411) are uniformly distributed on the upper and lower surfaces and the side surfaces of the clamping grooves (41).

3. The wafer processing adsorption apparatus according to claim 1, characterized by: A plurality of mounting holes (12) are arranged on the surface of the mounting plate (1).

4. The wafer processing adsorption apparatus according to claim 1, wherein: The heights of the anti-falling blocks (4) on the two sides of the adsorption disc (2) are the same, and the connecting line between the anti-falling blocks (4) passes through the center of the adsorption disc (2).

5. The wafer processing adsorption apparatus according to claim 1, wherein: The vacuum chucks (22) and the tension sensors (21) are uniformly arranged in six numbers.

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