Filtering device and etching system

Abstract

The utility model provides a filter device and etching system, including: input valve, filter chamber and output valve, the installation height of filter chamber input end is higher than the installation height of output end, and the filter chamber is provided with the filter membrane that the filtration performance is good and the chemical stability is high, therefore, the filter efficiency is improved. According to the utility model, impurities can be effectively prevented from entering the output pipeline of the filtering device by virtue of gravity and air buoyancy, the production efficiency of a semiconductor process is improved, and the defective rate of wafer processing is reduced. In addition, the device has the advantages of being simple in structure and convenient and fast to operate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a filtration device and an etching system. Background Technology

[0002] In semiconductor packaging, bumps are the core structure for electrical interconnection between the chip and the packaging substrate. Their manufacturing process directly determines the reliability, signal transmission performance, and integration density of the package.

[0003] Currently, etching technology is commonly used in the production of semiconductor packaging bumps. However, the etching solution generates bubbles during use. At present, the etching solution in filtration devices is mainly in a bottom-in, top-out configuration. This configuration can cause bubbles in the etching solution to enter the pipeline, leading to Ti (Ti) floating to the surface and remaining, resulting in a loss of wafer yield and affecting the etching rate. Furthermore, the presence of bubbles can cause discrepancies between the actual flow rate and the flow meter reading in the filtration device.

[0004] Therefore, how to provide a filtration device that improves filtration performance has become one of the problems that urgently needs to be solved by those skilled in the art.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a filtration device and an etching system to solve the problem that the filtration performance of the filtration device in the prior art needs to be improved.

[0007] To achieve the above and other related objectives, this utility model provides a filtration device, which includes at least: an input valve, a filter chamber, and an output valve; the output end of the input valve is connected to the input end of the filter chamber via a pipe; the filter chamber includes a filter membrane; the filter membrane is located on the cross-section within the filter chamber and is disposed between the input end and the output end of the filter chamber; the output end of the filter chamber is connected to the input end of the output valve via a pipe; the installation height of the input end of the filter chamber is higher than the installation height of the output end of the filter chamber.

[0008] Optionally, the installation height of the input valve is higher than the installation height of the filter chamber, and the installation height of the filter chamber is higher than the installation height of the output valve.

[0009] Optionally, the filter membrane is a proton exchange membrane.

[0010] Optionally, the filtration device further includes a flow meter; the flow meter is connected between the input valve and the filter chamber via a pipe.

[0011] Optionally, the filtration device further includes a pH meter; the pH meter is installed between the filtration chamber and the output valve via a pipe.

[0012] Optionally, the filtration device further includes a thermometer; the thermometer is installed between the filter chamber and the output valve via a pipe.

[0013] Optionally, the cross-sectional area of ​​the filter cavity on the input side is larger than the cross-sectional area on the output side.

[0014] Alternatively, the filter cavity is a cone; the bottom surface of the cone is located on the input side, and the apex is located on the output side.

[0015] Alternatively, the filtration device may further include a mounting base on which the filter chamber is mounted.

[0016] To achieve the above and other related objectives, this utility model also provides an etching system, which includes at least: an etching solution collection device, an etching device, and the filtration device; the etching solution collection device is connected to the input valve of the filtration device, and the output valve of the filtration device is connected to the etching device.

[0017] As described above, the filtration device and etching system of this invention have the following beneficial effects:

[0018] 1. This utility model effectively prevents impurities from entering the output pipe of the filter device by setting the input end of the filter chamber at a high position and the output end at a low position, thereby improving the production efficiency of semiconductor processes and reducing the defect rate of wafer processing.

[0019] 2. By setting the filter chamber to a structure that is wider at the top and narrower at the bottom, this utility model can improve the flow rate of the etching solution and increase the filtration efficiency of the filter device.

[0020] 3. This utility model uses a proton exchange membrane as a filter membrane. Taking advantage of the good filtration performance and high chemical stability of the proton exchange membrane, this utility model can effectively filter impurities in the etching solution, thereby improving the etching rate and Ti residue of the filtration device, and thus improving the production efficiency and product yield of semiconductor processing. Attached Figure Description

[0021] Figure 1 The diagram shown is a structural schematic of a filtration device.

[0022] Figure 2 The diagram shown is a structural schematic of the filtration device of this utility model.

[0023] Figure 3 The diagram shown is a structural schematic of the etching system of this utility model.

[0024] Component designation explanation

[0025] 1. Filtration device

[0026] 11. Input valve

[0027] 12 Filter chambers

[0028] 13 Output valve

[0029] 14 Mounting Base

[0030] 15 Flowmeter

[0031] 16 pH meter

[0032] 17. Thermometer Detailed Implementation

[0033] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0034] Please see Figures 1-3 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0035] The function of the filtration device is to filter the etching solution, ensuring that the etching equipment can use a high-purity etching solution for subsequent semiconductor processes. Since wafer processing equipment is typically located at a high position, such as... Figure 1As shown, one type of filtration device has its inlet positioned low and its outlet positioned high to allow the etching solution to enter the etching apparatus for wafer processing. However, due to air buoyancy, air bubbles in the etching solution carry impurities to the surface, resulting in impurities in the etching solution output from the filtration device, causing some loss during wafer processing. Therefore, to improve the filtration performance of the filtration device, this invention proposes a filtration device and etching system, the specific technical solution of which is as follows:

[0036] Example 1

[0037] like Figure 2 As shown, this embodiment provides a filtration device 1, including: an input valve 11, a filter chamber 12, and an output valve 13.

[0038] like Figure 2 As shown, the output end of the input valve 11 is connected to the input end of the filter chamber 12 via a pipe.

[0039] Specifically, in this embodiment, since external etching solutions typically contain certain impurities, such as photoresist residue generated during photolithography and metallic impurities generated during semiconductor processing, including Cu, Al, and Ti, these impurities, if mixed in the etching solution, will cause certain losses to the wafer. Therefore, after the etching solution is pumped into the external environment by the input valve 11, it needs to be fed into the filter chamber 12, where the filter chamber 12 filters the etching solution. The connecting pipe between the input valve 11 and the filter chamber 12 should be made of corrosion-resistant material. As an example, the input valve 11 can use a pneumatic valve structure. In practical applications, the specific structure of the input valve 11 can be set as needed, and is not limited to this embodiment.

[0040] like Figure 2 As shown, the filter chamber 12 includes a filter membrane; the filter membrane is located on the cross-section inside the filter chamber 12 and is disposed between the input end and the output end of the filter chamber 12.

[0041] Specifically, in this embodiment, such as Figure 2 As shown, the etching solution flows from top to bottom through the filter chamber 12. The filter membrane is disposed on the cross-section inside the filter chamber 12 to filter Cu ions, Ti ions, and other impurities in the etching solution. Furthermore, the filter membrane is a proton exchange membrane. Because proton exchange membranes have good filtration performance, high chemical stability, and strong mechanical strength, this embodiment can filter out etching solution with very high purity, and the filtration speed is fast and the stability is strong.

[0042] Specifically, in this embodiment, to improve the flow rate of the filter device 1, the cross-sectional area of ​​the filter cavity 12 on the input side is larger than the cross-sectional area on the output side; that is, the filter cavity 12 is a container that is wider at the top and narrower at the bottom. Furthermore, to fix the filter cavity 12, such as... Figure 2As shown, the filter device 1 also includes a mounting base 14, on which the filter chamber 12 is mounted. The shape of the mounting base 14 is configured according to actual needs. Furthermore, the filter chamber 12 is conical, such as... Figure 2 As shown, the bottom surface of the cone is located on the input side, and the apex is located on the output side. The filter chamber 12 of the cone can effectively improve the flow rate of the filter device and also improve the filtration efficiency of the filter membrane. In practical applications, the specific shape of the filter chamber can be set as needed, and is not limited to this embodiment.

[0043] Specifically, in this embodiment, such as Figure 2 As shown, the filter device 1 also includes a flow meter 15, which is connected between the inlet valve 11 and the filter chamber 12 via a pipe. The flow meter 15 is positioned between the inlet valve 11 and the filter chamber 12 to allow operators to monitor and adjust the flow rate in a timely manner, ensuring the filtration efficiency of the filter device 1. Furthermore, the installation height of the flow meter 15 can be higher than the installation height of the filter chamber 12, allowing the etching solution to flow smoothly into the filter chamber 12 by gravity. Simultaneously, the pipes between the inlet valve 11 and the flow meter 15, as well as the pipes between the flow meter 15 and the filter chamber 12, must be made of corrosion-resistant material.

[0044] like Figure 2 As shown, the output end of the filter chamber 12 is connected to the input end of the output valve 13 via a pipe.

[0045] Specifically, in this embodiment, after filtration is completed, the filter chamber 12 outputs the etchant to the output valve 13. The pipeline between the filter chamber 12 and the output valve 13 should be made of corrosion-resistant material. Since the filter device 1 needs to output the etching solution to the etching device located at a higher position, the output valve 13 in this embodiment needs to have sufficient power to output the etching solution upwards. As an example, the output valve 13 can be a pneumatic valve. In practical applications, the specific structure of the output valve 13 can be selected according to needs, and is not limited to this embodiment.

[0046] Specifically, in this embodiment, such as Figure 2 As shown, the filtration device 1 also includes a pH meter 16. The pH meter 16 is installed between the filter chamber 12 and the output valve 13 via a pipeline. The pipelines between the filter chamber 12 and the pH meter 16, as well as between the pH meter 16 and the output valve 13, are made of corrosion-resistant materials. The pH meter 16 is positioned between the filter chamber 12 and the output valve 13 to allow operators to monitor the pH value of the solution and ensure the filtration quality of the etching solution. Furthermore, the pH meter 16 and the output valve 13 can be installed on the same horizontal plane to eliminate interference from liquid level differences and ensure process stability. In practical applications, the specific structure and location of the pH meter 16 can be set as needed, and are not limited to this embodiment.

[0047] Specifically, in this embodiment, such as Figure 2 As shown, the filtration device 1 also includes a thermometer 17, which is installed between the filter chamber 12 and the output valve 13 via a pipe. The pipes between the filter chamber 12 and the thermometer 17, as well as between the thermometer 17 and the output valve 13, are made of corrosion-resistant materials. The thermometer 17 is positioned between the filter chamber 12 and the output valve 13 to allow operators to monitor the solution temperature and ensure the filtration quality of the etching solution. Furthermore, the thermometer 17 and the output valve 13 can be installed on the same horizontal plane to eliminate interference from liquid level differences and ensure process stability. In practical applications, the specific structure and location of the thermometer 17 can be set as needed, and are not limited to this embodiment.

[0048] It should be noted that, as Figure 2 As shown, the installation height of the input end of the filter chamber 12 is higher than the installation height of the output end of the filter chamber 12. Therefore, the filtrate in the filter chamber 12 can flow from top to bottom through the filter chamber 12. With the help of gravity and air buoyancy, the bubbles in the etching solution carry impurities such as Ti to the surface, causing the impurities such as Ti to move away from the output end of the filter chamber 12. Therefore, this invention can effectively prevent bubbles from entering the output pipe of the filter device 1, thereby improving the etching process, increasing the production efficiency of semiconductor processes, and reducing the defect rate of wafer processing. Furthermore, as Figure 2 As shown, to facilitate the flow of etching solution through the components of the filter device 1 and to facilitate the installation of the components, the installation height of the input valve 11 is higher than the installation height of the filter chamber 12, and the installation height of the filter chamber 12 is higher than the installation height of the output valve 13. In practical applications, the specific installation positions of the input valve 11, filter chamber 12, and output valve 13 can be set as needed, and are not limited to this embodiment.

[0049] Example 2

[0050] like Figure 3 As shown, this embodiment provides an etching system, including: an etching liquid collection device 2, an etching device 3, and a filtering device 1; the etching liquid collection device 2 is connected to the input valve 11 of the filtering device 1, and the output valve 13 of the filtering device 1 is connected to the etching device 3.

[0051] Specifically, in this embodiment, the etching solution collection device 2 carries unfiltered etching solution, and the etching solution collection device 2 outputs the unfiltered etching solution to the filtering device 1; the filtering device 1 filters the etching solution, and the etching solution flows from top to bottom through the filtering device 1, and then the filtering device 1 outputs the etching solution to the etching device 3, and the etching device 3 performs etching processing on the wafer.

[0052] It should be noted that the filter device 1 used in this embodiment can be the filter device 1 of Embodiment 1, or any filter device 1 that allows the etching solution to enter from the top and exit from the bottom, and is not limited to this embodiment.

[0053] In summary, the filtration device and etching system of this invention include: an inlet valve, a filter chamber, and an outlet valve. The installation height of the inlet end of the filter chamber is higher than that of the outlet end, and the filter chamber is equipped with a filter membrane that has good filtration performance and high chemical stability. Therefore, this invention can effectively prevent impurities from entering the outlet pipe of the filtration device by utilizing gravity and air buoyancy, thereby improving the production efficiency of semiconductor processes and reducing the defect rate of wafer processing. Furthermore, this invention has the advantages of simple structure and convenient operation. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0054] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A filter device, characterized in that The filter device comprises at least an input valve, a filter cavity and an output valve. The output end of the input valve is connected to the input end of the filter cavity through a pipeline. The filter cavity comprises a filter membrane; the filter membrane is located on the cross section of the filter cavity and is arranged between the input end and the output end of the filter cavity. The output end of the filter cavity is connected to the input end of the output valve through a pipeline. The installation height of the input end of the filter cavity is higher than that of the output end of the filter cavity.

2. The filter device of claim 1, wherein: The installation height of the input valve is higher than that of the filter cavity, and the installation height of the filter cavity is higher than that of the output valve.

3. The filter device of claim 1, wherein: The filter membrane is a proton exchange membrane.

4. The filter device of claim 1, wherein: The filter device further comprises a flow meter; the flow meter is connected between the input valve and the filter cavity through a pipeline.

5. The filter device of claim 1, wherein: The filter device further comprises a pH meter; the pH meter is installed between the filter cavity and the output valve through a pipeline.

6. The filter device of claim 1, wherein: The filter device further comprises a thermometer; the thermometer is installed between the filter cavity and the output valve through a pipeline.

7. The filter device of claim 1, wherein: The cross-sectional area of the input end of the filter cavity is larger than that of the output end.

8. The filter device of claim 7, wherein: The filter cavity is a conical body; the bottom of the conical body is arranged at the input end side, and the vertex is arranged at the output end side.

9. The filter device of claim 7, wherein: The filter device further comprises a mounting base; the filter cavity is mounted on the mounting base.

10. An etching system, comprising: The etching system comprises at least an etching liquid collecting device, an etching device and the filter device according to any one of claims 1-9; the etching liquid collecting device is connected to the input valve of the filter device, and the output valve of the filter device is connected to the etching device.

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