FPC circuit board processing alignment laminating machine

By introducing upper and lower scrapers into the FPC circuit board processing alignment and bonding machine, combined with a specific structure and rubber bladder system, the problem of adhesive overflow affecting bonding is solved, and the cleaning and maintenance of the hot press plate and the stable bonding of the cover film are achieved.

CN224072777UActive Publication Date: 2026-04-03SHENZHEN XINLITE CIRCUIT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-30
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

In existing FPC circuit board processing alignment and bonding machines, during the hot pressing process, adhesive overflows and adheres to the upper and lower hot pressing plates, affecting the subsequent bonding effect of the cover film with the insulating substrate and copper foil.

Method used

An FPC circuit board processing alignment and bonding machine was designed, equipped with an upper scraper and a lower scraper. Through the design of raised parts, V-shaped surfaces and inclined surfaces, combined with the cooperation of rubber bladders and pressure strips, the adhesive can be effectively scraped and cleaned, preventing the adhesive from sticking to the scraper and concentrating it in front of the lower hot platen for easy subsequent cleaning.

Benefits of technology

It effectively prevents adhesives from affecting the cleanliness of the hot press plate surface, ensures the bonding quality of the cover film with the insulating substrate and copper foil, and improves the convenience and efficiency of cleaning.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides an FPC circuit board processing alignment laminating machine, and belongs to the technical field of circuit board processing. Comprising a machine body, the top of the machine body is provided with a lower hot pressing plate and a support, the top of the support is provided with a driving part, the telescopic end of the driving part is provided with an upper hot pressing plate, the cleaning mechanism comprises an upper scraper used for cleaning the upper hot pressing plate and a lower scraper used for cleaning the lower hot pressing plate, and the upper scraper and the lower scraper are staggered and separated. A handle is arranged between the upper scraper and the lower scraper, and guiding pieces are installed on the opposite sides of the lower hot pressing plate. Through the arrangement of the upper scraper and the lower scraper, when an overflowed adhesive is adhered to the upper hot pressing plate and the lower hot pressing plate, the handle is held to pull the upper scraper and the lower scraper, and the overflowed adhesive is scraped by the upper scraper and the lower scraper, so that the surfaces of the upper hot pressing plate and the lower hot pressing plate are ensured to be clean and tidy; and the influence on the subsequent lamination of the covering film with the insulating base material and the copper foil is prevented.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to an FPC circuit board processing alignment and bonding machine. Background Technology

[0002] FPC (Flexible Printed Circuit) refers to flexible circuit boards. A flexible circuit board mainly consists of an insulating substrate, copper foil, and a cover film. During manufacturing, the copper foil is first bonded to the insulating substrate to form a circuit. Then, an adhesive is used to bond the cover film to the copper foil and the insulating substrate. After bonding, an alignment and laminating machine is used to heat-press the cover film to ensure it is firmly bonded to the copper foil and the insulating substrate. The alignment and laminating machine mainly consists of a machine body, a support, a drive unit, an upper hot press plate, and a lower hot press plate. First, the copper foil with the cover film bonded to it and the insulating substrate are placed on the lower hot press plate. Then, the drive unit is activated, causing the upper hot press plate to move downwards and heat-press the cover film on the lower hot press plate. Under the action of heat pressing, the cover film is tightly bonded to the insulating substrate and the copper foil, thus completing the manufacturing of the flexible circuit board.

[0003] Common FPC circuit board processing alignment and bonding machines use upper and lower hot press plates to heat-press the cover film, making it tightly bonded to the insulating substrate and copper foil. However, the adhesive on the cover film is easily overflowed at the edge of the cover film due to the heat-pressing effect. The overflowed adhesive adheres to the upper and lower hot press plates, which will affect the subsequent heat-pressing of the cover film, thus affecting the subsequent bonding of the cover film to the insulating substrate and copper foil. Therefore, this application provides an FPC circuit board processing alignment and bonding machine to meet the requirements. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide an FPC circuit board processing alignment and bonding machine to solve the technical problem that the adhesive overflowing under heat pressure and sticking to the upper and lower hot press plates will affect the subsequent heat pressing of the cover film, thereby affecting the subsequent bonding of the cover film to the insulating substrate and copper foil.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] An FPC circuit board processing alignment and bonding machine includes a machine body, a lower hot press plate and a bracket respectively mounted on the top of the machine body, a driving component mounted on the top of the bracket, and an upper hot press plate mounted on the telescopic end of the driving component. The machine body also includes:

[0007] The cleaning mechanism includes an upper scraper for cleaning the upper hot plate and a lower scraper for cleaning the lower hot plate. The upper and lower scrapers are staggered and separated, and a handle is provided between the upper and lower scrapers. Guide members are installed on opposite sides of the lower hot plate. The guide members are located at the bottom of the handle and are used to guide the upper and lower scrapers during their movement.

[0008] Preferably, both the upper and lower scrapers have several protrusions on their sides.

[0009] Preferably, the side of the protrusion is provided with a V-shaped surface.

[0010] Preferably, the top of the protrusion is provided with an inclined surface, which is connected to the V-shaped surface.

[0011] Preferably, both the upper and lower scrapers are V-shaped.

[0012] Preferably, the handle has an internal cavity containing a rubber bladder filled with hydraulic oil. A pressure strip is provided on the side of the handle, and a pressure rod is fixed to the side of the pressure strip near the handle. The end of the pressure rod away from the pressure strip passes through the handle and is embedded in the side of the rubber bladder. Movable blocks are fixed to the top and bottom of the rubber bladder, and the sides of the movable blocks are slidably connected to the sides of the inner wall of the cavity. An upper connecting block is fixed to the end of the upper scraper, and the bottom of the upper connecting block passes through the handle and is fixedly connected to the movable block located above the rubber bladder. A lower connecting block is fixed to the end of the lower scraper, and the top of the lower connecting block passes through the handle and is fixedly connected to the movable block located below the rubber bladder. A spring is connected between the side of the inner wall of the rubber bladder and the end of the pressure rod.

[0013] Preferably, the corner of the handle side is provided with a rounded chamfer.

[0014] Preferably, the handle has anti-slip texture on its side.

[0015] Compared with the prior art, this utility model has at least the following beneficial effects:

[0016] In the above solution, by setting up upper and lower scrapers, when there is excess adhesive adhering to the upper and lower hot press plates, the handle is held and the upper and lower scrapers are pulled to scrape off the excess adhesive, ensuring that the surfaces of the upper and lower hot press plates are clean and tidy, preventing it from affecting the subsequent bonding of the cover film to the insulating substrate and copper foil. At the same time, the upper scraper is located in front of the lower scraper, so the adhesive scraped off by the upper scraper can fall in front of the direction of travel of the lower scraper. As the lower scraper moves forward, the adhesive falling from the upper scraper can be cleaned up. This design further improves the convenience of cleaning adhesive.

[0017] By incorporating protrusions, V-shaped surfaces, and bevels, the upper and lower scrapers create an uneven surface on their sides during the adhesive removal process. This effectively prevents the adhesive from adhering to the scrapers. Furthermore, the protrusions also feature V-shaped surfaces to further prevent adhesion between the adhesive and the protrusions. The bevels prevent adhesive buildup at the top of the protrusions on the lower scraper, further preventing adhesion.

[0018] By using the rubber bladder and pressure strip, when pulling the upper and lower scrapers forward, you need to hold the handle and press the pressure strip simultaneously. This pressure causes the rubber bladder to move the upper and lower scrapers towards the upper and lower hot press plates, respectively, thus cleaning the adhesive. When pushing the upper and lower scrapers backward, release the pressure strip to remove pressure from the rubber bladder. At this point, the upper and lower scrapers move closer together and separate from the upper and lower hot press plates, respectively. During the adhesive cleaning process, prevent the adhesive from being cleaned to the rear of the upper and lower hot press plates. Instead, ensure that the cleaned adhesive falls in front of the lower hot press plate, facilitating subsequent cleaning and collection of the adhesive. Attached Figure Description

[0019] The accompanying drawings, which form part of this specification, illustrate embodiments of the present disclosure and, together with the specification, further serve to explain the principles of the present disclosure and enable those skilled in the art to implement and use the present disclosure.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a three-dimensional structural diagram of the upper scraper of this utility model;

[0022] Figure 3 This is a cross-sectional view of the handle of this utility model;

[0023] Figure 4 This is a three-dimensional structural diagram of the protruding part of this utility model;

[0024] Figure 5 This is a three-dimensional structural diagram of the V-shaped surface of this utility model.

[0025] Figure Labels

[0026] 1. Body; 2. Upper hot plate; 3. Lower hot plate; 4. Drive component; 5. Cleaning mechanism; 6. Upper scraper; 7. Lower scraper; 8. Handle; 9. Guide component; 10. Rubber bladder; 11. Movable block; 12. Upper connecting block; 13. Lower connecting block; 14. Pressure strip; 15. Pressure rod; 16. Spring; 17. Protrusion; 18. V-shaped surface; 19. Inclined surface.

[0027] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to the specific structure, device and environment. According to specific needs, those skilled in the art can adjust or modify these devices and environments, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation

[0028] The following is a detailed description of an FPC circuit board processing alignment and bonding machine provided by this utility model, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0029] like Figures 1-5 As shown, an embodiment of this utility model provides an FPC circuit board processing alignment and bonding machine, including a machine body 1. A lower hot press plate 3 and a bracket are respectively installed on the top of the machine body 1. A driving component 4 is installed on the top of the bracket. An upper hot press plate 2 is installed on the telescopic end of the driving component 4. The machine also includes:

[0030] The cleaning mechanism 5 includes an upper scraper 6 for cleaning the upper hot press plate 2 and a lower scraper 7 for cleaning the lower hot press plate 3. The upper scraper 6 and the lower scraper 7 are staggered and separated, and a handle 8 is provided between the upper scraper 6 and the lower scraper 7. Guide members 9 are installed on opposite sides of the lower hot press plate 3. The guide members 9 are located at the bottom of the handle 8 and are used to guide the upper scraper 6 and the lower scraper 7 during movement. The guide members 9 consist of a square strip fixed to the bottom of the handle 8, a guide rail fixed to the opposite side of the lower hot press plate 3, and a rail fixed to the side of the square strip. The system consists of sliders that slide on the inner wall of the guide rail. When the handle 8 moves, the slider moves along the inner wall of the guide rail via the square bar, thereby guiding the handle 8, the upper scraper 6, and the lower scraper 7. This makes the movement of the upper scraper 6 and the lower scraper 7 smoother. The upper scraper 6 and the lower scraper 7 can effectively remove the adhesive residue caused by the overflow of adhesive on the upper hot press plate 2 and the lower hot press plate 3 after the hot pressing process, ensuring that the surfaces of the upper hot press plate 2 and the lower hot press plate 3 are clean and avoiding affecting the subsequent bonding effect of the cover film with the insulating substrate and copper foil.

[0031] like Figure 4As shown in this embodiment, both the upper scraper 6 and the lower scraper 7 have several protrusions 17 on their sides. The protrusions 17 make the sides of the upper scraper 6 and the lower scraper 7 uneven, thereby reducing the contact area between the adhesive and the sides of the upper scraper 6 and the lower scraper 7. This effectively prevents the adhesive from sticking to the upper scraper 6 and the lower scraper 7, thus ensuring that the upper scraper 6 and the lower scraper 7 maintain good cleaning performance in multiple cleaning operations and reducing the trouble of frequently cleaning the upper scraper 6 and the lower scraper 7 due to adhesive sticking to the scrapers.

[0032] like Figure 5 As shown, in this embodiment, the side of the protrusion 17 is provided with a V-shaped surface 18, which further optimizes the effect of preventing adhesive from sticking. When adhesive comes into contact with the V-shaped surface 18, it will slide off due to the guiding effect of the V-shape. The V-shaped surface 18 makes it difficult for adhesive to stay on the side of the protrusion 17, thereby more effectively reducing the possibility of adhesive sticking to the protrusion 17.

[0033] like Figure 5 As shown, in this embodiment, the top of the protrusion 17 is provided with a slope 19, which is connected to the V-shaped surface 18. The design of the slope 19 prevents the adhesive from accumulating at the top of the protrusion 17, further preventing the adhesive from sticking.

[0034] like Figure 2 As shown in this embodiment, both the upper scraper 6 and the lower scraper 7 are V-shaped. The V-shaped design can gather the adhesive when the upper scraper 6 and the lower scraper 7 scrape it off, effectively preventing the adhesive from falling off from the left and right sides of the upper hot plate 2 and the lower hot plate 3, thus facilitating the subsequent cleaning and collection of the scraped adhesive.

[0035] like Figure 3As shown, in this embodiment, the handle 8 has a cavity inside, and a rubber bladder 10 is placed inside the cavity. The rubber bladder 10 is filled with hydraulic oil. A pressure strip 14 is provided on the side of the handle 8. A pressure rod 15 is fixed on the side of the pressure strip 14 near the handle 8. The end of the pressure rod 15 away from the pressure strip 14 movably passes through the handle 8 and is embedded in the side of the rubber bladder 10. Movable blocks 11 are fixed at the top and bottom of the rubber bladder 10. The side of the movable block 11 is slidably connected to the side of the inner wall of the cavity. The end of the upper scraper 6 is fixed. An upper connecting block 12 is fixedly provided. The bottom of the upper connecting block 12 movably passes through the handle 8 and is fixedly connected to the movable block 11 located above the rubber bladder 10. A lower connecting block 13 is fixedly provided at the end of the lower scraper 7. The top of the lower connecting block 13 movably passes through the handle 8 and is fixedly connected to the movable block 11 located below the rubber bladder 10. A spring 16 is connected between the side of the inner wall of the rubber bladder 10 and the end of the pressure rod 15. When the operator holds the handle 8 and presses the pressure strip 14, the pressure strip 14 squeezes the rubber through the pressure rod 15. The pressure change of the hydraulic oil inside the rubber bladder 10 causes it to expand, pushing the two movable blocks 11 to move upward and downward along the inner wall of the cavity. This, in turn, drives the upper scraper 6 and lower scraper 7 to move towards the upper hot press plate 2 and lower hot press plate 3 respectively, via the upper connecting block 12 and lower connecting block 13. This ensures stable cleaning of the adhesive as the upper and lower scrapers 6 and 7 move forward. After cleaning, when the upper and lower scrapers 6 and 7 move backward, the pressure strip 14 is released, and the rubber bladder 10... Under the action of spring 16, the rubber bladder 10 returns to its original shape. During the reset process, the two movable blocks 11 drive the upper connecting block 12 and the lower connecting block 13 to move closer to each other, thereby causing the upper scraper 6 and the lower scraper 7 to move closer to each other and separate from the upper hot plate 2 and the lower hot plate 3 respectively. This design can prevent the adhesive from being cleaned to the rear side of the upper hot plate 2 and the lower hot plate 3 during the cleaning process, so that the cleaned adhesive falls in front of the lower hot plate 3, which facilitates the subsequent cleaning and collection of the adhesive.

[0036] like Figure 1 and Figure 2 As shown in this embodiment, a rounded chamfer is provided at the corner of the side of the handle 8. The rounded chamfer design can effectively prevent the operator from hurting their hand when holding the handle 8, and improve the grip comfort.

[0037] like Figure 1 and Figure 2 As shown, in this embodiment, the side of the handle 8 is provided with anti-slip texture. The anti-slip texture increases the friction between the operator's hand and the handle 8, so that the operator can hold the handle 8 more firmly when pulling back and forth.

[0038] Working principle: The insulating substrate with the cover film and copper foil are placed on the lower hot press plate 3. The driving component 4 is activated, and the piston rod of the driving component 4 extends, driving the upper hot press plate 2 to move downward to achieve hot pressing of the cover film. The cover film is tightly bonded to the copper foil and insulating substrate by the adhesive to form a flexible circuit board. After the hot pressing is completed, the piston rod of the driving component 4 shortens, driving the upper hot press plate 2 to move upward. Then the flexible circuit board can be removed from the lower hot press plate 3. During the hot pressing process, the adhesive that overflows from the edge of the cover film adheres to the upper hot press plate 2 and the lower hot press plate 3 and needs to be cleaned.

[0039] During cleaning, the operator holds the handle 8 and presses the pressure bar 14, causing the pressure bar 14 to squeeze the hydraulic oil inside the rubber bladder 10 through the pressure rod 15, causing the top and bottom of the rubber bladder 10 to expand. The spring 16 is in a compressed state. After the rubber bladder 10 expands, it drives the two movable blocks 11 in the cavity to move away from each other along the inner wall of the cavity. This, in turn, drives the upper scraper 6 and the lower scraper 7 to move away from each other through the upper connecting block 12 and the lower connecting block 13, and they move towards the upper hot plate 2 and the lower hot plate 3 respectively. Then, the operator holds the handle 8 and pulls the upper scraper 6 and the lower scraper 7 forward, with the upper scraper 6 in front and the lower scraper 7 behind. The upper scraper 6 first scrapes off the adhesive on the surface of the upper hot plate 2. The scraped adhesive will fall in front of the lower scraper 7 in the direction of travel. As the lower scraper 7 moves forward, it can clean the adhesive that falls from the upper scraper 6 and clean the adhesive that is stuck on the lower hot plate 3.

[0040] During the cleaning process, the design of the protrusion 17 makes the sides of the upper scraper 6 and the lower scraper 7 uneven, thereby effectively preventing the adhesive from sticking to the upper scraper 6 and the lower scraper 7. The V-shaped surface 18 on the side of the protrusion 17 can further reduce the possibility of the adhesive sticking to the protrusion 17. At the same time, the slope 19 at the top of the protrusion 17 can prevent the adhesive from accumulating at the top of the protrusion 17, thus preventing the adhesive from sticking.

[0041] During the process of pushing the upper scraper 6 and the lower scraper 7 backward, the operator releases the pressure strip 14, and the rubber bladder 10 is no longer compressed. Under the action of the spring 16, it returns to its original state. At this time, the two movable blocks 11 in the cavity approach each other, thereby driving the upper scraper 6 and the lower scraper 7 to approach each other through the upper connecting block 12 and the lower connecting block 13 respectively. After approaching each other, the upper scraper 6 and the lower scraper 7 separate from the upper hot plate 2 and the lower hot plate 3 respectively. This design can prevent the adhesive from being cleaned to the rear side of the upper hot plate 2 and the lower hot plate 3 during the cleaning process, so that the cleaned adhesive falls in front of the lower hot plate 3, which facilitates the subsequent cleaning and collection of the adhesive.

[0042] During the forward and backward movement of handle 8, handle 8 drives slider to move along the inner wall of guide rail via square bar. The guide rail and slider cooperate to guide the movement of handle 8, thereby guiding the movement of upper scraper 6 and lower scraper 7, making their movement more stable, and thus ensuring stable cleaning of adhesive.

[0043] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details have been described in detail in the above preferred embodiments; however, those skilled in the art can fully understand this utility model even without these detailed descriptions.

[0044] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An FPC circuit board processing alignment and bonding machine, comprising a machine body (1), wherein a lower hot press plate (3) and a bracket are respectively installed on the top of the machine body (1), a driving component (4) is installed on the top of the bracket, and an upper hot press plate (2) is installed on the telescopic end of the driving component (4), characterized in that, Also includes: The cleaning mechanism (5) includes an upper scraper (6) for cleaning the upper hot platen (2) and a lower scraper (7) for cleaning the lower hot platen (3). The upper scraper (6) and the lower scraper (7) are separated by a misalignment, and a handle (8) is provided between the upper scraper (6) and the lower scraper (7). Guide members (9) are installed on opposite sides of the lower hot platen (3). The guide members (9) are located at the bottom of the handle (8) and are used to guide the upper scraper (6) and the lower scraper (7) during their movement.

2. The FPC circuit board processing alignment and bonding machine according to claim 1, characterized in that, The upper scraper (6) and the lower scraper (7) are provided with several protrusions (17) on their sides.

3. The FPC circuit board processing alignment and bonding machine according to claim 2, characterized in that, The protrusion (17) has a V-shaped surface (18) on its side.

4. The FPC circuit board processing alignment and bonding machine according to claim 3, characterized in that, The top of the protrusion (17) is provided with a slope (19), which is connected to the V-shaped surface (18).

5. The FPC circuit board processing alignment and bonding machine according to claim 1, characterized in that, Both the upper scraper (6) and the lower scraper (7) are V-shaped.

6. The FPC circuit board processing alignment and bonding machine according to claim 1, characterized in that, The handle (8) has an internal cavity containing a rubber bladder (10) filled with hydraulic oil. A pressure strip (14) is provided on the side of the handle (8). A pressure rod (15) is fixed to the side of the pressure strip (14) near the handle (8). The end of the pressure rod (15) away from the pressure strip (14) passes through the handle (8) and is embedded in the side of the rubber bladder (10). Movable blocks (11) are fixed to the top and bottom of the rubber bladder (10). The side of the movable block (11) is flush with the side of the inner wall of the cavity. The upper scraper (6) is fixed to the end of the upper connecting block (12). The bottom of the upper connecting block (12) moves through the handle (8) and is fixedly connected to the movable block (11) located above the rubber bladder (10). The lower scraper (7) is fixed to the end of the lower connecting block (13). The top of the lower connecting block (13) moves through the handle (8) and is fixedly connected to the movable block (11) located below the rubber bladder (10). A spring (16) is connected between the side of the inner wall of the rubber bladder (10) and the end of the pressure rod (15).

7. The FPC circuit board processing alignment and bonding machine according to claim 1, characterized in that, The handle (8) has a rounded chamfer at the corner of its side.

8. The FPC circuit board processing alignment and bonding machine according to claim 1, characterized in that, The handle (8) has anti-slip texture on its side.