Efficient cooling table for injection molding machining of Bluetooth earphone shell
By introducing a dual cooling system of water cooling and air cooling into the high-efficiency cooling stage for Bluetooth earphone shell injection molding, and by utilizing the design of lifting and placement components, the problems of low heat dissipation efficiency and easy loss of Bluetooth earphone shells in the mold are solved, achieving a more efficient cooling effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-06
- Publication Date
- 2026-04-03
AI Technical Summary
In the existing technology, the cooling efficiency of Bluetooth earphone shells inside the mold is low, and they are easily lost after molding because they have no fixed position, which affects the cooling effect.
A high-efficiency cooling platform for injection molding of Bluetooth earphone shells was designed, comprising a water cooling mechanism, a rotating mechanism, and an air cooling mechanism. Through the cooperation of the lifting component and the placing component, the upper mold can be moved and the air cooling mechanism can directly blow air into the lower mold, combining the dual cooling methods of water cooling and air cooling.
The cooling efficiency of the Bluetooth earphone shell has been improved, ensuring stable placement and efficient cooling of the earphone shell after molding, and avoiding the problem of uneven heat dissipation inside the mold.
Smart Images

Figure CN224074914U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of Bluetooth earphone shell processing technology, specifically relating to a high-efficiency cooling platform for Bluetooth earphone shell injection molding. Background Technology
[0002] Injection molding is a method of shaping industrial products. Products are typically produced using rubber injection molding and plastic injection molding. Injection molding can also be divided into injection molding compression molding and die casting.
[0003] Chinese patent application number 202223476473.8 discloses a heat dissipation and cooling device for injection molds. Its key technical features include a cooling platform and a rotary drive mechanism. A heat-conducting plate within a positioning groove provides excellent heat conduction to the mold. A cooling water tank below the heat-conducting plate circulates cooling water through inlet and outlet pipes, achieving effective water cooling of the mold. The output shaft of a first motor drives the cooling fan blades to rotate, achieving air cooling of the mold. The rotary drive mechanism rotates the first motor to the outside of the mold, allowing the cooling fan blades to blow air onto the mold from various angles, resulting in uniform airflow and excellent cooling performance.
[0004] In the aforementioned patent, the Bluetooth earphone shell, after injection molding, undergoes heat dissipation and cooling operations inside the mold. Since the Bluetooth earphone shell is formed inside the mold, the mold can easily affect the heat dissipation and cooling efficiency of the Bluetooth earphone shell. In addition, the cooled and formed Bluetooth earphone shell has no fixed place to be placed, which can easily lead to the loss of the Bluetooth earphone shell. At the same time, placing the Bluetooth earphone shell in other places can easily affect the heat dissipation and cooling efficiency of the Bluetooth earphone shell. Utility Model Content
[0005] To address the problems mentioned in the background section, this invention provides a high-efficiency cooling platform for injection molding of Bluetooth headset shells, which improves cooling performance.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-efficiency cooling platform for injection molding of Bluetooth earphone shells, comprising a water cooling mechanism, a lower mold fixedly connected inside the water cooling mechanism, an upper mold above the lower mold, a rotating mechanism surrounding the water cooling mechanism, an air cooling mechanism above the rotating mechanism, a lifting component between the upper mold and the water cooling mechanism, and a placement component at one end of the air cooling mechanism.
[0007] Preferably, the lifting assembly includes a connecting rope, a U-shaped frame, an electric push rod, a moving plate, and a guide. A U-shaped frame is fixedly connected above the water-cooling mechanism and to one side of the upper mold. An electric push rod is fixedly connected to the inner wall of the U-shaped frame. A moving plate is fixedly connected to the output end of the electric push rod. A connecting rope connects the moving plate and the upper mold. A guide is provided above the water-cooling mechanism and between the upper mold and the U-shaped frame.
[0008] Preferably, the guide component includes a guide frame, mounting blocks, guide wheels, and rotating shafts. The guide frame is fixedly connected above the water-cooling mechanism and between the upper mold and the U-shaped frame. Mounting blocks are fixedly connected to both ends of the upper part of the guide frame. A rotating shaft is rotatably connected to the side of the two mounting blocks that are close to each other. A guide wheel is fixedly connected between the two rotating shafts.
[0009] Preferably, limit sliders are fixedly connected to both sides of the movable plate, and limit grooves are provided on the side wall of the U-shaped frame at the positions corresponding to the limit sliders.
[0010] Preferably, the placement assembly includes a placement frame, a receiving plate, a bottom support plate, and a connector. The receiving plate is fixedly connected to the upper end of the air-cooling mechanism, the bottom support plate is provided above the receiving plate, the connector is provided between the receiving plate and the bottom support plate, and the placement frame is fixedly connected to the upper end of the bottom support plate.
[0011] Preferably, the connector includes a connector frame, a connecting spring, a connector block, and a connector post. Connectors frame are fixedly connected to both sides of the receiving plate. Connectors block are fixedly connected to the bottom of the base plate at the position corresponding to the connector frame. Connectors post are inserted into the inside of the connector frame. A connecting spring connects the connector frame and the connector post. Connectors block are provided with connector holes at the position corresponding to the connector post.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. This utility model is equipped with a lifting component. After the Bluetooth earphone shell is formed, the electric push rod on the side wall of the U-shaped frame is activated. The electric push rod drives the moving plate to move, and the moving plate drives the connecting rope to move. During the movement of the connecting rope, the guide wheel rotates under the force of the rotating shaft, which can provide guidance for the movement of the connecting rope. The movement of the connecting rope drives the upper mold to move away from the lower mold, so that the wind generated by the operation of the air cooling mechanism can directly blow the Bluetooth earphone shell formed inside the lower mold, thereby improving the cooling efficiency of the Bluetooth earphone shell.
[0014] 2. This utility model features a placement component. The insertion post moves outward from the insertion frame, causing the connecting spring to stretch. The bottom plate is then placed on the receiving plate, and the insertion block is inserted into the insertion frame. The insertion post is then released, and the connecting spring, freed from external force, returns to its original position, causing the insertion post to move and insert into the insertion hole. This allows the placement frame to be installed at the upper end of the air-cooling mechanism. Subsequently, after removing the injection-molded Bluetooth earphone shell from the lower mold, the shell is placed on the bottom plate. While the air-cooling mechanism cools the subsequently produced Bluetooth earphone shells, airflow can be directed through the gaps in the placement frame onto the Bluetooth earphone shell on the bottom plate, improving the cooling efficiency of the earphone shell. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of this utility model;
[0016] Figure 2 This is a partial cross-sectional view of the U-shaped frame and the connecting rope of this utility model.
[0017] Figure 3 This is a schematic diagram of the structure of the guide component of this utility model;
[0018] Figure 4 This is a structural diagram showing the connection between the air-cooling mechanism and the placement component of this utility model;
[0019] Figure 5 This is a cross-sectional view of the connection state between the base plate and the plug-in frame of this utility model.
[0020] Figure 6 This utility model Figure 5 Enlarged view of point A in the middle.
[0021] In the diagram: 1. Rotating mechanism; 2. Upper mold; 3. Lifting assembly; 31. Connecting rope; 32. U-shaped frame; 33. Electric push rod; 34. Moving plate; 35. Guide component; 351. Guide frame; 352. Mounting block; 353. Guide wheel; 354. Rotating shaft; 4. Lower mold; 5. Water cooling mechanism; 6. Air cooling mechanism; 7. Placement assembly; 71. Placement frame; 72. Support plate; 73. Bottom support plate; 74. Connector; 741. Connector frame; 742. Connecting spring; 743. Connector block; 744. Connector post. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Example 1
[0024] Please see Figure 1-6 The present invention provides the following technical solution: a high-efficiency cooling platform for injection molding of Bluetooth earphone shell, including a water cooling mechanism 5, a lower mold 4 fixedly connected inside the water cooling mechanism 5, an upper mold 2 arranged above the lower mold 4, a rotating mechanism 1 arranged around the water cooling mechanism 5, an air cooling mechanism 6 arranged above the rotating mechanism 1, a lifting component 3 arranged between the upper mold 2 and the water cooling mechanism 5, and a placement component 7 arranged at one end of the upper part of the air cooling mechanism 6.
[0025] Specifically, the lifting assembly 3 includes a connecting rope 31, a U-shaped frame 32, an electric push rod 33, a moving plate 34, and a guide 35. A U-shaped frame 32 is fixedly connected above the water-cooling mechanism 5 and to one side of the upper mold 2. An electric push rod 33 is fixedly connected to the inner wall of the U-shaped frame 32. A moving plate 34 is fixedly connected to the output end of the electric push rod 33. A connecting rope 31 connects the moving plate 34 and the upper mold 2. A guide 35 is provided above the water-cooling mechanism 5 and between the upper mold 2 and the U-shaped frame 32.
[0026] By adopting the above technical solution, after the Bluetooth earphone shell between the upper mold 2 and the lower mold 4 is injection molded, the electric push rod 33 on the side wall of the U-shaped frame 32 is activated. The electric push rod 33 drives the moving plate 34 to move, the moving plate 34 drives the connecting rope 31 to move, and the moving rope 31 drives the upper mold 2 to move away from the lower mold 4, so that the wind generated by the operation of the air cooling mechanism 6 can blow the Bluetooth earphone shell formed inside the lower mold 4, thereby improving the cooling efficiency of the Bluetooth earphone shell.
[0027] Specifically, the guide component 35 includes a guide frame 351, mounting blocks 352, guide wheels 353, and a rotating shaft 354. The guide frame 351 is fixedly connected above the water-cooling mechanism 5 and between the upper mold 2 and the U-shaped frame 32. Mounting blocks 352 are fixedly connected to both ends of the upper part of the guide frame 351. The rotating shaft 354 is rotatably connected to the side of the two mounting blocks 352 that is close to each other. The guide wheel 353 is fixedly connected between the two rotating shafts 354.
[0028] By adopting the above technical solution, under the support of the guide frame 351 and the guide wheel 353, the connecting rope 31 can be moved away from the upper mold 2. In the subsequent movement of the connecting rope 31, the guide wheel 353 rotates under the force of the rotating shaft 354, which can provide guidance for the movement of the connecting rope 31, avoid friction between the connecting rope 31 and external objects, and thus avoid wear of the connecting rope 31.
[0029] Specifically, limit sliders are fixedly connected to both sides of the movable plate 34, and limit grooves are provided on the side wall of the U-shaped frame 32 at the positions corresponding to the limit sliders.
[0030] By adopting the above technical solution, the moving plate 34 moves and drives the limiting slider to move inside the limiting groove. With the sliding cooperation of the limiting slider and the limiting groove, the moving plate 34 can be guided, thereby improving the stability of the moving plate 34.
[0031] In this embodiment, the Bluetooth earphone shell injection molding material is injected between the lower mold 4 and the upper mold 2 for injection molding. At the same time, the water cooling mechanism 5 is used to cool the lower mold 4, the upper mold 2 and the Bluetooth earphone shell inside. The rotating mechanism 1 drives the air cooling mechanism 6 to rotate, and the lower mold 4, the upper mold 2 and the Bluetooth earphone shell inside are cooled by air in multiple directions. After the Bluetooth earphone shell is formed, the electric push rod 33 on the side wall of the U-shaped frame 32 is activated. The electric push rod 33 drives the moving plate 34 to move. The moving plate 34 drives the connecting rope 31 to move. During the movement of the connecting rope 31, the guide wheel 353 rotates under the force of the rotating shaft 354, which can provide guidance for the movement of the connecting rope 31. The movement of the connecting rope 31 drives the upper mold 2 to move away from the lower mold 4, so that the air force generated by the operation of the air cooling mechanism 6 can directly blow the Bluetooth earphone shell formed inside the lower mold 4, thereby improving the cooling efficiency of the Bluetooth earphone shell.
[0032] Example 2
[0033] The difference between this embodiment and Embodiment 1 is that: the placement component 7 includes a placement frame 71, a receiving plate 72, a bottom support plate 73, and a connector 74; the receiving plate 72 is fixedly connected to one upper end of the air-cooling mechanism 6; the bottom support plate 73 is disposed above the receiving plate 72; the connector 74 is disposed between the receiving plate 72 and the bottom support plate 73; and the placement frame 71 is fixedly connected to the top of the bottom support plate 73.
[0034] Specifically, the connector 74 includes a connector frame 741, a connecting spring 742, a connector block 743, and a connector post 744. Connectors 741 are fixedly connected to both sides of the receiving plate 72. A connector block 743 is fixedly connected to the bottom of the base plate 73 at a position corresponding to the connector frame 741. A connector post 744 is inserted into the inside of the connector frame 741. A connecting spring 742 connects the connector frame 741 and the connector post 744. A connector hole is provided on the connector block 743 at a position corresponding to the connector post 744.
[0035] By adopting the above technical solution, the plug-in post 744 is moved to the periphery of the plug-in frame 741. The movement of the plug-in post 744 causes the connecting spring 742 to stretch. Then, the bottom support plate 73 is placed on the receiving plate 72, and the plug-in block 743 is inserted into the plug-in frame 741. Then, the plug-in post 744 is released, and the connecting spring 742 loses its external force and returns to its original position, causing the plug-in post 744 to move and insert into the plug-in hole. This can fix the plug-in block 743, thereby ensuring the stability of the bottom support plate 73 and the receiving plate 72.
[0036] In this embodiment, the insertion post 744 is moved to the periphery of the insertion frame 741. The movement of the insertion post 744 causes the connecting spring 742 to stretch. Then, the bottom support plate 73 is placed on the receiving plate 72, and the insertion block 743 is inserted into the insertion frame 741. Then, the insertion post 744 is released, and the connecting spring 742 loses its external force and returns to its original position, causing the insertion post 744 to move and insert into the insertion hole. Thus, the placement frame 71 can be installed on the upper end of the air-cooling mechanism 6. After the injection-molded Bluetooth earphone shell is taken out from the lower mold 4, the Bluetooth earphone shell is placed on the bottom support plate 73. While the air-cooling mechanism 6 is running to perform air-cooling operation on the Bluetooth earphone shells produced later, the air force can blow onto the Bluetooth earphone shell on the bottom support plate 73 through the gaps in the placement frame 71, thereby improving the cooling efficiency of the Bluetooth earphone shell.
[0037] The structure and principle of the rotating mechanism 1, which consists of a rotating ring, a guide ring, a first guide groove, a slider, a second guide groove, teeth, a connecting shaft, a bevel gear pair, a second motor, a fixed box, and a rotating gear, have been disclosed in Chinese Patent Application No. 202223476473.8, in a heat dissipation and cooling device for injection molds. Its working principle is as follows: a fixed box is fixedly connected to the side wall of the water-cooling mechanism 5; a second motor is fixedly connected to the inner side wall of the fixed box; the connecting shaft is rotatably connected to the output shaft of the second motor via a bevel gear pair; a rotating gear is fixedly connected to the end of the connecting shaft away from the fixed box; a rotating ring is sleeved around the water-cooling mechanism 5; several teeth are provided on the inner side of the rotating ring to mesh with the rotating gear; and a guide ring is fixedly connected to the inner side of the rotating ring. The water-cooling mechanism 5 has a first guide groove adapted to connect the guide ring, and the air-cooling mechanism 6 has a slider fixedly connected to it. The water-cooling mechanism 5 has a second guide groove adapted to connect the slider. In use, the second motor is started, and the output shaft of the second motor drives the rotating gear on the connecting shaft to rotate under the connection relationship of the bevel gear pair. Under the meshing connection relationship between the rotating gear and the inner teeth of the rotating ring, the rotating ring is driven to rotate and connect to the outside of the water-cooling mechanism 5 through the guide ring, and the slider on the air-cooling mechanism 6 is driven to slide and connect to the second guide groove on the water-cooling mechanism 5. Thus, the air-cooling mechanism 6 can perform air-blowing heat dissipation treatment on the upper mold 2 and the lower mold 4 from various angles, achieving uniform air-blowing heat dissipation treatment on the upper mold 2 and the lower mold 4, with good cooling effect and easy to use.
[0038] The structure and principle of the water-cooling mechanism 5, which consists of a cooling platform, a positioning groove, a heat-conducting plate, a cooling water tank, an inlet pipe, and an outlet pipe, have been disclosed in Chinese Patent Application No. 202223476473.8, which discloses a heat dissipation and cooling device for injection molds. Its working principle is as follows: A cooling platform is provided inside the rotating mechanism 1. A positioning groove is provided inside the cooling platform at the position corresponding to the lower mold 4. A heat-conducting plate is connected between the positioning groove and the lower mold 4. A cooling water tank is connected inside the cooling platform and below the heat-conducting plate. One end of the cooling water tank is connected to an inlet pipe, and the other end of the cooling water tank is connected to an outlet pipe. Corresponding circulating water pumps and water storage tanks are connected to the outside of both the inlet and outlet pipes. In use, through the cooperation of the inlet and outlet pipes, circulating cooling water can be injected into the cooling water tank. Under the action of the heat-conducting plate, heat exchange between the cooling water tank and the lower mold 4 can be realized, thereby realizing the water cooling operation of the lower mold 4 and the upper mold 2.
[0039] The structure and principle of the air-cooling mechanism 6, which consists of a fixed plate, a first motor, and cooling fan blades, in this utility model have been disclosed in a heat dissipation and cooling device for injection molds disclosed in Chinese patent application number 202223476473.8. Its working principle is as follows: a fixed plate is fixedly connected above the rotating mechanism 1, a first motor is fixedly connected above the fixed plate, and a cooling fan blade is connected to the output end of the first motor. In use, the rotating mechanism 1 drives the fixed plate to rotate, and at the same time, the first motor drives the cooling fan blade to rotate. During the rotation of the cooling fan blade, the lower mold 4 and the upper mold 2 can be air-cooled.
[0040] The working principle and usage process of this utility model are as follows: The plug-in post 744 moves to the periphery of the plug-in frame 741. The movement of the plug-in post 744 stretches the connecting spring 742. Then, the bottom support plate 73 is placed on the receiving plate 72, and the plug-in block 743 is inserted into the plug-in frame 741. Then, the plug-in post 744 is released, and the connecting spring 742, losing its external force, returns to its original position, causing the plug-in post 744 to move and insert into the plug hole. This allows the mesh frame 71 to be installed at the upper end of the air-cooling mechanism 6. The Bluetooth headset shell injection molding material is injected between the lower mold 4 and the upper mold 2 for injection molding. Simultaneously, the water-cooling mechanism 5 performs water-cooling operations on the lower mold 4, the upper mold 2, and the internally injection-molded Bluetooth headset shell. The rotating mechanism 1 drives the air-cooling mechanism 6 to rotate, performing multi-directional air-cooling operations on the lower mold 4, the upper mold 2, and the internally injection-molded Bluetooth headset shell. After the earphone shell is formed, the electric push rod 33 on the side wall of the U-shaped frame 32 is activated. The electric push rod 33 drives the moving plate 34 to move, and the moving plate 34 drives the connecting rope 31 to move. During the movement of the connecting rope 31, the guide wheel 353 rotates under the force of the rotating shaft 354, which can provide guidance for the movement of the connecting rope 31. The movement of the connecting rope 31 drives the upper mold 2 to move away from the lower mold 4, so that the air force generated by the operation of the air cooling mechanism 6 can directly blow the Bluetooth earphone shell formed inside the lower mold 4, improving the cooling efficiency of the Bluetooth earphone shell. After the injection-molded Bluetooth earphone shell is taken out from the lower mold 4, the Bluetooth earphone shell is placed on the bottom tray 73. While the air cooling mechanism 6 operates to perform air cooling operation on the Bluetooth earphone shells produced later, the air force can blow onto the Bluetooth earphone shell on the bottom tray 73 through the gaps in the mesh frame 71, improving the cooling efficiency of the Bluetooth earphone shell.
[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A high-efficiency cooling platform for injection molding of Bluetooth earphone shells, comprising a water-cooling mechanism (5), wherein a lower mold (4) is fixedly connected inside the water-cooling mechanism (5), an upper mold (2) is disposed above the lower mold (4), a rotating mechanism (1) is disposed around the water-cooling mechanism (5), and an air-cooling mechanism (6) is disposed above the rotating mechanism (1), characterized in that: The upper mold (2) and the water cooling mechanism (5) are provided with a pulling assembly (3), and the upper end of the air cooling mechanism (6) is provided with a placing assembly (7).
2. The high-efficiency cooling table for Bluetooth earphone shell injection molding processing according to claim 1, characterized in that: The pulling assembly (3) comprises a connecting rope (31), a U-shaped frame (32), an electric push rod (33), a moving plate (34) and a guide piece (35), the upper side of the water cooling mechanism (5) and one side of the upper mold (2) are fixedly connected with the U-shaped frame (32), the inner side wall of the U-shaped frame (32) is fixedly connected with the electric push rod (33), the output end of the electric push rod (33) is fixedly connected with the moving plate (34), the connecting rope (31) is connected between the moving plate (34) and the upper mold (2), and the upper side of the water cooling mechanism (5) and between the upper mold (2) and the U-shaped frame (32) is provided with the guide piece (35).
3. The high-efficiency cooling table for Bluetooth earphone shell injection molding processing according to claim 2, characterized in that: The guide piece (35) comprises a guide frame (351), a mounting block (352), a guide wheel (353) and a rotating shaft (354), the upper side of the water cooling mechanism (5) and between the upper mold (2) and the U-shaped frame (32) are fixedly connected with the guide frame (351), the upper ends of the guide frame (351) are fixedly connected with the mounting block (352), the rotating shaft (354) is rotatably connected to the side of the two mounting blocks (352) close to each other, and the guide wheel (353) is fixedly connected between the two rotating shafts (354).
4. The high-efficiency cooling table for Bluetooth earphone shell injection molding processing according to claim 2, characterized in that: The two sides of the moving plate (34) are fixedly connected with limit sliding blocks, and the side wall of the U-shaped frame (32) is provided with a limit sliding groove corresponding to the position of the limit sliding block.
5. The high-efficiency cooling table for injection molding of Bluetooth headset shells of claim 1, wherein: The placing assembly (7) comprises a placing net frame (71), a bearing plate (72), a bottom supporting plate (73) and a plug-in piece (74), the upper end of the air cooling mechanism (6) is fixedly connected with the bearing plate (72), the upper side of the bearing plate (72) is provided with the bottom supporting plate (73), the plug-in piece (74) is arranged between the bearing plate (72) and the bottom supporting plate (73), and the upper side of the bottom supporting plate (73) is fixedly connected with the placing net frame (71).
6. The high-efficiency cooling table for Bluetooth earphone shell injection molding processing according to claim 5, characterized in that: The plug-in piece (74) comprises a plug-in frame (741), a connecting spring (742), a plug-in block (743) and a plug-in column (744), the two side walls of the bearing plate (72) are fixedly connected with the plug-in frame (741), the lower side of the bottom supporting plate (73) and the position corresponding to the plug-in frame (741) are fixedly connected with the plug-in block (743), the plug-in column (744) is plugged into the plug-in frame (741), the connecting spring (742) is connected between the plug-in frame (741) and the plug-in column (744), and the plug-in hole is formed in the plug-in block (743) and the position corresponding to the plug-in column (744).
Citation Information
Patent Citations
Heat dissipation cooling device for injection mold
CN219028395U