Local electroplating tool for metal cover plate for ceramic packaging
By designing a local electroplating fixture consisting of a metal frame, insulating rubber sheet, and air valve, the problems of electroplating solution penetration and long operation cycle were solved, achieving efficient local electroplating of ceramic-encapsulated metal covers, improving yield and saving precious metal consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-06
- Publication Date
- 2026-04-03
AI Technical Summary
Existing local electroplating technologies, such as film application and wax protection, suffer from problems such as electroplating solution penetration and long operation cycles when used on ceramic-encapsulated metal covers, which affect yield and efficiency.
A local electroplating fixture consisting of a metal frame, insulating rubber sheet, and air valve is used. By creating a negative pressure through vacuuming, the insulating rubber sheet is firmly adsorbed onto the non-plating surface, forming a conductive path for electroplating with the conductor, thus preventing the electroplating solution from entering the non-plating area.
It improves the electroplating yield and production efficiency, simplifies the operation process, reduces the consumption of precious metals, and is suitable for ceramic encapsulation metal covers with complex shapes.
Smart Images
Figure CN224077582U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a tooling structure, specifically to an electroplating tooling. Background Technology
[0002] In chip packaging processes, it is often necessary to electroplate precious metals onto the structure. In order to avoid the waste of precious metals, the process proposes the requirement of local electroplating for the metal cover plate used for ceramic packaging. Many models of products can save 1 / 3 of the consumption of electroplated precious metals through the design of local electroplating.
[0003] Existing localized electroplating technologies mainly include the film-coating method and the wax-protection method. The film-coating method uses materials such as tape to cover the non-plated surface for insulation and protection. However, the edges of the tape are prone to curling, allowing the electroplating solution to seep in, and even causing the film to detach, affecting the electroplating yield. The wax-protection method uses a wax preparation to cover the non-plated surface for insulation and protection. Wax is insulating and has good adhesion to metal parts, a wide operating temperature range, and the edges of the insulating layer will not curl, making it suitable for parts with high tolerance requirements for the dimensional dimensions of the insulating ends and complex shapes. However, the wax-protection method is more complex to use, resulting in a longer operation cycle and lower electroplating efficiency. Summary of the Invention
[0004] Purpose of the invention: In view of the above-mentioned prior art, this invention proposes a tooling for partial electroplating of metal cover plates for ceramic packaging, which improves the efficiency and yield of partial electroplating production of cover plates.
[0005] Technical solution: A tooling for partial electroplating of a metal cover plate for ceramic encapsulation, comprising a metal frame, an insulating rubber sheet, and a gas valve; the insulating rubber sheet covers the outside of the metal frame, forming a semi-cavity with a bottom opening that precisely covers the non-plated surface of the metal cover plate; the end of the metal frame located at the opening serves as a contact point for contacting the metal cover plate; the gas valve is connected to the insulating rubber sheet and is used to create a negative pressure by evacuation, allowing the semi-cavity to adsorb and cover the non-plated area; a conductor connected to the metal frame is provided on the semi-cavity.
[0006] Furthermore, the air valve is a resin air valve or a plastic air valve.
[0007] Furthermore, the conductor is disposed on the air valve, with one end of the conductor located outside the air valve and the other end located inside the air valve connected to the metal frame via a wire.
[0008] Furthermore, the conductor is disposed on the insulating rubber sheet, with one end of the conductor located outside the air valve and the other end located inside the air valve connected to the metal frame via a wire.
[0009] Beneficial Effects: This utility model's partial electroplating fixture for metal covers features a metal frame designed to support the semi-cavity structure based on the shape and size of the non-plated surface of the metal cover. By evacuating the semi-cavity structure through a valve, the cavity is firmly adhered to the non-plated surface due to negative pressure, preventing the electroplating solution from penetrating during electroplating and thus improving the yield rate compared to existing technologies. The metal frame at the open end of the structure serves as a contact point with the metal cover, forming a conductive path during electroplating when the fixture adheres to the cover, improving assembly efficiency. Conductors connected to the metal frame are provided on the semi-cavity, serving both as a connection to external circuits and as a structure for connecting the electroplating metal hanger. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of the structure of the metal cover plate in the embodiment;
[0011] Figure 2 This is a schematic cross-sectional view of the metal cover plate electroplating fixture in the embodiment.
[0012] Figure 3 This is a schematic diagram of the batch electroplating mounting of products using this electroplating fixture. Detailed Implementation
[0013] The present invention will be further explained below with reference to the accompanying drawings.
[0014] like Figure 1 As shown, in this embodiment, the square metal cover plate 5 has a size of 7cm×7cm, and its non-plated surface 501 is a 4cm×4cm square area in the center of the front of the metal cover plate 5.
[0015] Correspondingly, such as Figure 2 As shown, the metal cover plate partial electroplating fixture of this embodiment prepares a metal frame 1 for supporting the outer rubber. An insulating rubber sheet 2 covers and is fixed to the outside of the metal frame 1, forming a semi-cavity with a bottom opening that exactly covers the non-plated surface 501. The semi-cavity has an inverted conical structure. The metal frame 1 includes metal strips located on each edge of the inverted conical structure. One or more of the ends 101 of these strips located at the opening of the semi-cavity serve as contact points for contacting the metal cover plate 5, and are used for conductive connection during electroplating.
[0016] The air valve 3 is connected to the insulating rubber sheet 2 and is used to create a negative pressure by evacuation, allowing the semi-cavity to adsorb and cover the non-plated area 501 on the front of the metal cover plate 5. The semi-cavity is provided with a conductor 4 connected to the metal frame 1.
[0017] In this embodiment, the air valve 3 is a resin air valve or a plastic air valve, and it has a valve. The resin air valve or plastic air valve can prevent electroplated metal from sticking to the surface during electroplating.
[0018] Conductor 4 is installed on air valve 3. One end of conductor 4 is located on the outside of air valve 3, and the other end, located on the inside of air valve 3, is connected to metal frame 1 through a wire.
[0019] In some embodiments, a probe-type conductor 4 is disposed on an insulating rubber sheet 2, with one end of the conductor 4 located outside the air valve 3 and the other end located inside the air valve 3 connected to the metal frame 1 via a wire. The outer end of the conductor 4 is designed in the shape of a hook, making it easy to hang directly on an electroplated metal hanger.
[0020] like Figure 3 As shown, the overall structure 6, after connecting several partial electroplating fixtures of this utility model with the metal cover plate, is connected to the electroplating metal hanger 7 via the conductor 4 located on the outer part of the half cavity. The specific connection method can be the traditional copper wire binding or the hook suspension, and then it is placed in the electroplating tank for batch electroplating.
[0021] During the electroplating process, the metal cover plate is firmly adsorbed onto the non-plating surface 501 by negative pressure in the semi-cavity, preventing the electroplating solution from penetrating it. After electroplating is completed, the fixture and the metal cover plate can be easily separated by opening the air valve 3, and the electroplating fixture can be reused.
[0022] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A tooling for partial electroplating of a metal cover plate for ceramic encapsulation, characterized in that, The device includes a metal frame (1), an insulating rubber sheet (2), and an air valve (3). The insulating rubber sheet (2) covers the outside of the metal frame (1), forming a half-cavity with a bottom opening that covers the non-plated surface of the metal cover plate. The end (101) of the metal frame (1) at the opening serves as a contact point for contacting the metal cover plate. The air valve (3) is connected to the insulating rubber sheet (2) and is used to create a negative pressure by drawing a vacuum so that the half-cavity can adsorb and cover the non-plated area. A conductor (4) connected to the metal frame (1) is provided on the half-cavity.
2. The metal cover plate partial electroplating fixture for ceramic encapsulation according to claim 1, characterized in that, The air valve (3) is a resin air valve or a plastic air valve.
3. The metal cover plate partial electroplating fixture for ceramic encapsulation according to claim 2, characterized in that, The conductor (4) is disposed on the air valve (3), with one end of the conductor (4) located outside the air valve (3) and the other end located inside the air valve (3) connected to the metal frame (1) via a wire.
4. The metal cover plate partial electroplating fixture for ceramic encapsulation according to claim 2, characterized in that, The conductor (4) is disposed on the insulating rubber sheet (2). One end of the conductor (4) is located outside the air valve (3), and the other end, located inside the air valve (3), is connected to the metal frame (1) through a wire.