Transceiving radio frequency optical module

Abstract

The utility model relates to the technical field of optical radio frequency conversion modules in ROF (Radio over Fiber) and telecommunication, in particular to a transceiving radio frequency optical module, which comprises a shell, a receiving and transmitting combined part and a printed circuit board are fixedly mounted in the shell, the receiving and transmitting combined part is positioned at the front end of the printed circuit board, and the receiving and transmitting combined part is positioned at the rear end of the printed circuit board. A golden finger is arranged at one end, far away from the receiving and transmitting combined part, of the printed circuit board, a transmitting flexible circuit board and a receiving flexible circuit board are connected between the receiving and transmitting combined part and the printed circuit board, and an external connector is fixedly mounted at the front end of the golden finger. According to the utility model, through an SFP packaging structure, various anti-interference designs, a temperature control circuit, a clear gain calculation mode and the like, module standardization universality and batch production are realized, signal crosstalk is reduced, gain and wavelength are stabilized, and module protection and stability are enhanced; the problems of lack of standardization, serious signal crosstalk, unstable gain, unreasonable structural design and the like of the existing optical radio frequency conversion module are solved.

Description

Technical Field

[0001] This utility model relates to the field of optical radio frequency conversion modules in optical microwave communication (ROF) and telecommunications, and particularly to a transceiver radio frequency optical module. Background Technology

[0002] With the rapid development of society, the demand for signal transmission technology in various fields is increasing. As a key device for realizing the integration of optical fiber communication and wireless communication, the optical radio frequency conversion module plays a vital role. In scenarios such as 5G small cells, Wi-Fi 6, and 6G communication, the optical radio frequency conversion module modulates microwaves onto lasers, transmits them through optical fiber links, and then demodulates them back into microwave signals for users at the base station. This technology not only realizes high-speed and high-capacity wireless communication, but also has the advantages of wider cellular coverage, wider bandwidth, and lower cost, which greatly promotes the development of the communication industry.

[0003] However, existing optical-to-radio frequency conversion modules have many problems in practical use. On the one hand, existing analog optical modules require the use of dedicated RF heads for signal connection and lack standardized form, which makes them less universal across different devices, making it difficult to achieve mass production and application, increasing production costs and usage barriers. On the other hand, analog optical transmission requires the transmission of broadband analog signals of at least 7GHz, and some applications even require a frequency coverage range of 10MHz-20GHz, and good linearity within this frequency band. However, existing analog optical modules have serious crosstalk problems between channels, affecting linearity. Currently, most are single-channel, and multi-channel small analog optical modules have not yet been officially put into use due to crosstalk problems. This not only limits the performance improvement of communication systems, but also cannot meet the growing demand for multi-user, high-speed communication. Utility Model Content

[0004] In view of this, the present invention provides a transceiver radio frequency optical module, the main technical problem to be solved is: to solve the problems of existing optical radio frequency conversion modules lacking standardized form, large size, serious signal crosstalk between channels, resulting in poor versatility, difficulty in mass application, and inability to meet the needs of multi-channel, high-speed communication.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a transceiver radio frequency optical module, comprising a housing, wherein a receiving and transmitting assembly and a printed circuit board are fixedly installed inside the housing, the receiving and transmitting assembly is located at the front end of the printed circuit board, a gold finger is provided at the end of the printed circuit board away from the receiving and transmitting assembly, a transmitting flexible circuit board and a receiving flexible circuit board are connected between the receiving and transmitting assembly and the printed circuit board, an external connector is fixedly installed at the front end of the gold finger, the signal line of the gold finger is surrounded by ground lines on its left and right sides and below, and an isolation structure is provided between the gold finger and the external connector;

[0006] The receiving and transmitting assembly includes a BOSA housing, an optical interface, a BOSA transmitter, and a BOSA receiver. The optical interface is fixedly installed at the front end inside the BOSA housing, the BOSA transmitter is fixedly installed at the rear end inside the housing, and the BOSA receiver is installed at the side end inside the housing.

[0007] The printed circuit board is equipped with a laser chip LD, a transmitter RF transmission line, a ground transmission line, vias, a receiver chip PD, and a receiver RF transmission line. The laser chip LD is connected to the gold finger via the transmitter RF transmission line, and the receiver chip PD is connected to the gold finger via the receiver RF transmission line. The ground transmission line wraps around the transmitter RF transmission line and the receiver RF transmission line from three sides. Multiple vias are formed inside the ground transmission line.

[0008] The BOSA transmitter includes a temperature control circuit, which includes a temperature controller TEC, a thermistor TH, a laser chip LD, a matching resistor R, and an inductor L. The thermistor TH is used to detect the temperature of the laser chip LD and feed it back to the transmitter circuit. The transmitter circuit controls the output current of the temperature controller TEC by adjusting the variable resistor to achieve temperature regulation and wavelength adjustment of the laser chip LD.

[0009] By adopting the above technical solution, precise control of the temperature and wavelength of the laser chip LD is achieved, ensuring stable gain. At the same time, by surrounding the signal lines of the gold fingers with ground wires and setting up isolation structures, signal interference is reduced, and the stability and reliability of signal transmission are improved.

[0010] As a further description of the above technical solution: the printed circuit board is provided with a transmitting circuit and a receiving circuit. The output terminal of the receiving circuit is connected to the input terminal of the transmitting flexible circuit board. The output terminal of the transmitting flexible circuit board is connected to the input terminal of the BOSA receiver. The input terminal of the transmitting circuit is connected to the output terminal of the receiving flexible circuit board. The input terminal of the receiving flexible circuit board is connected to the output terminal of the BOSA transmitter.

[0011] By adopting the above technical solution, it is ensured that the signals between the transmitting circuit, the receiving circuit and the BOSA transmitter and receiver can be transmitted smoothly, realizing the effective conversion and transmission and reception functions of optical signals and electrical signals.

[0012] As a further description of the above technical solution: the isolation structure is as follows: a slot 1 is opened at the front end of the printed circuit board, and a connector retainer is fixedly installed inside the external connector, the connector retainer being embedded in the slot 1; or, a slot 2 is opened inside the external connector, and a PCB retainer is fixedly installed at the front end of the printed circuit board, the PCB retainer being embedded in the slot 2, and the PCB retainer is made of metal and electrically connected to the ground pin of the gold finger.

[0013] By adopting the above technical solution, the interference between the received and transmitted signals when the gold finger is connected to the external connector is effectively isolated by the cooperation of the slot one and the connector retainer, which further improves the signal transmission quality. The metal PCB retainer is electrically connected to the ground pin of the gold finger and embedded in the slot two, which also plays the role of isolating the transmitted and received signals, enhancing the signal isolation effect and ensuring the stability of signal transmission.

[0014] As a further description of the above technical solution: the housing includes an SFP packaged metal housing, a top cover, an EMI shielding spring, a pull ring, a slider, and a spring. The top cover is fixedly installed on the top of the SFP packaged metal housing. The EMI shielding spring is fixedly installed on the outer wall of the SFP packaged metal housing and the top cover. The pull ring is fixedly installed on the front end of the SFP packaged metal housing. The slider is slidably installed on the top of the transmitting flexible circuit board. The spring is installed between the SFP packaged metal housing and the slider.

[0015] By adopting the above technical solutions, the SFP package metal housing and top cover provide protection and mounting base for internal components; the EMI shielding spring reduces electromagnetic interference and ensures normal module operation; the pull ring facilitates module insertion and removal; and the slider and spring configuration helps to fix and buffer the flexible circuit board, improving the stability and reliability of the module.

[0016] As a further description of the above technical solution: the edge and middle of the printed circuit board are provided with gold-plated areas, and the gold-plated areas are electrically connected to the signal ground and the metal shell of the outer casing to form an independent gold-plated isolation cavity.

[0017] By adopting the above technical solution, signal crosstalk between channels is effectively reduced, the anti-interference capability of the module is greatly improved, and the stable transmission of multi-channel signals is ensured, meeting the requirements of communication systems for high isolation.

[0018] As a further description of the above technical solution: the gain of the receiving and transmitting combination component is determined based on the matching resistor R1 of the transmitting end RF transmission line and the matching resistor R2 of the receiving end RF transmission line. R1 is 20-100 ohms, and R2 is 50-500 ohms. Appropriate matching of R1 and R2 ensures the continuity of the RF signal while maximizing the gain. The specific formula for calculating the gain is as follows:

[0019] Gain = 20 × log(se × Res × M);

[0020] Where Gain is the gain of the receiver and transmitter combination, se is the luminous efficiency of the BOSA receiver, which is 0.32 W / A, Res is the responsivity of the BOSA transmitter, which is 0.95 A / W, and M is the RF matching factor.

[0021] By adopting the above technical solution and adjusting the matching resistors of the transmitter and receiver according to actual needs, high-gain output of radio frequency signals can be achieved to meet the needs of different communication scenarios.

[0022] As a further description of the above technical solution: the frequency matching factor is related to the matching resistor R1 and the matching resistor R2. The matching resistor R1 is set to 50 ohms and the matching resistor R2 is set to 500 ohms, and the frequency matching factor M = 0.91.

[0023] By adopting the above technical solution and adjusting the matching resistors of the transmitter and receiver according to actual needs, high-gain output of radio frequency signals can be achieved.

[0024] By employing the above technical solution, the transceiver radio frequency optical module of this utility model has at least the following beneficial effects:

[0025] 1. Compared with existing technologies, this transceiver RF optical module utilizes the gold finger signal lines being surrounded by ground lines, the isolation structure between the gold fingers and external connectors, and the gold-plated isolation cavity on the printed circuit board. During use, the gold finger signal lines are surrounded by ground lines on their left, right, and bottom sides, physically reducing interference from external signals to the transmitted signal. Whether the gold finger and external connector are connected via slot one and connector retainer, or by the PCB retainer being embedded in slot two and electrically connected to the gold finger ground pin, signal reception and transmission are isolated at the interface. The gold-plated areas on the edge and center of the printed circuit board are electrically connected to the signal ground and the outer metal casing to form an isolation cavity, reducing signal crosstalk from different levels. Through physical isolation and grounding shielding, interference signals are blocked, solving the problem of existing analog optical modules suffering from severe crosstalk affecting linearity and preventing the formal use of multi-channel small analog optical modules. The crosstalk isolation between channels is reduced to below -70dB, ensuring the stability and accuracy of multi-channel signal transmission.

[0026] 2. Compared with existing technologies, this transceiver RF optical module, through the temperature control circuit within the BOSA transmitter, uses a thermistor TH to monitor the temperature of the laser chip LD in real time and feed it back to the transmitting circuit. The transmitting circuit adjusts the variable resistor based on the feedback, thereby controlling the output current of the temperature controller TEC, achieving temperature and wavelength adjustment of the laser chip LD. Simultaneously, based on the well-defined gain calculation formula Gain=20×log(se×Res×M), the gain is determined based on the matching resistance of the transmitter and receiver RF transmission lines, achieving stable gain by utilizing the linear relationship between temperature and wavelength. By adjusting the matching resistor to optimize the gain, the problem of unstable gain and difficulty in meeting communication requirements of existing modules is solved, achieving high-gain output of RF signals and meeting the wavelength and gain stability requirements of the new ROF-PON system for multi-user communication.

[0027] 3. Compared with existing technologies, this transceiver RF optical module, through the setting of an outer shell, provides physical protection for internal components during use. The SFP packaged metal shell and top cover shield external electromagnetic interference and prevent internal electromagnetic leakage. The pull ring facilitates insertion and removal. The slider and spring play a role in fixing and buffering the transmitting flexible circuit board, realizing physical protection, electromagnetic shielding and buffering fixation, ensuring module stability. It solves the problem of poor stability caused by unreasonable structural design of existing modules, ensuring that the module works normally in complex environments and that signal transmission is stable. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of a transceiver radio frequency optical module proposed in this utility model;

[0029] Figure 2 This is a schematic diagram of a single-receiver, single-transmit structure of a transceiver radio frequency optical module proposed in this utility model;

[0030] Figure 3 This is a schematic diagram of a multi-receiver and multi-transmitter structure for a transceiver radio frequency optical module proposed in this utility model;

[0031] Figure 4 This is an enlarged structural schematic diagram of the receiving and transmitting combined component in a transceiver radio frequency optical module proposed in this utility model;

[0032] Figure 5 This is a schematic diagram of the back structure of the receiving and transmitting combined component in a transceiver radio frequency optical module proposed in this utility model;

[0033] Figure 6 This is a schematic diagram of the structure of a gold finger in a transceiver radio frequency optical module proposed in this utility model;

[0034] Figure 7This is a schematic diagram of another structure of the gold finger in a transceiver radio frequency optical module proposed in this utility model;

[0035] Figure 8 This is a schematic diagram of the link principle of a transceiver radio frequency optical module proposed in this utility model;

[0036] Figure 9 This is a schematic diagram of the internal connection principle of the transmitter end in a transceiver radio frequency optical module proposed in this utility model;

[0037] Figure 10 This is a schematic diagram illustrating the design principle and structure of a microstrip line in a transceiver radio frequency optical module proposed in this utility model.

[0038] Figure 11 Gain test curve of a transceiver radio frequency optical module proposed in this utility model;

[0039] Figure 12 This diagram illustrates the signal isolation effect of a transceiver radio frequency optical module proposed in this utility model.

[0040] Legend:

[0041] 1. Housing; 101. SFP packaged metal housing; 102. Top cover; 103. EMI shielding spring; 104. Pull ring; 105. Slider; 106. Spring; 2. Receiver and transmitter assembly; 201. BOSA housing; 202. Optical interface; 203. BOSA transmitter; 204. BOSA receiver; 3. Printed circuit board; 301. Transmitting circuit; 302. Receiving circuit; 4. Gold fingers; 5. Transmitting flexible circuit board; 6. Receiving flexible circuit board; 7. Laser chip (LD); 8. Transmitting RF transmission line; 9. Ground transmission line; 10. Via; 11. Receiver chip (PD); 12. Receiver RF transmission line; 13. External connector; 14. Slot 1; 15. Connector retainer; 16. Slot 2; 17. PCB retainer. Detailed Implementation

[0042] Reference Figure 1-12This utility model provides a transceiver radio frequency optical module, comprising a housing 1, which serves as the external protective structure of the module. Inside the housing 1, a receiving and transmitting assembly 2 and a printed circuit board 3 are fixedly installed. The receiving and transmitting assembly 2 is responsible for the conversion and transmission / reception of optical and electrical signals. The printed circuit board 3 provides a mounting platform for various electronic components and enables their electrical connections. The receiving and transmitting assembly 2 is located at the front end of the printed circuit board 3. A gold finger 4 is provided at the end of the printed circuit board 3 furthest from the receiving and transmitting assembly 2. The gold finger 4 is used for electrical connection with external devices, transmitting electrical signals and broadband radio frequency signals. A transmitting flexible circuit board 5 and a receiving flexible circuit board 6 connect the receiving and transmitting assembly 2 and the printed circuit board 3. The transmitting flexible circuit board 5 transmits the signal from the transmitting circuit 301 on the printed circuit board 3 to the BOSA transmitter 203, and the receiving flexible circuit board 6 transmits the signal from the BOSA receiver 204. The signal is transmitted to the receiving circuit 302 on the printed circuit board 3. An external connector 13 is fixedly installed at the front end of the gold finger 4. The signal line of the gold finger 4 is surrounded by the ground wires on its left, right and bottom sides, and an isolation structure is provided between the gold finger 4 and the external connector 13. The receiving and transmitting combination component 2 includes a BOSA housing 201. The BOSA housing 201 is a metal structure used to protect the internal optical and electronic components, optical interface 202, BOSA transmitter 203 and BOSA receiver 204. The optical interface 202 is fixedly installed at the front end of the BOSA housing 201. The optical interface 202 is the channel for optical signal input and output. The BOSA transmitter 203 is fixedly installed at the rear end of the housing 1. The BOSA transmitter 203 is responsible for converting electrical signals into optical signals and transmitting them. The BOSA receiver 204 is installed on the side end of the housing 1. The BOSA receiver 204 is used to receive optical signals and convert them into electrical signals.

[0043] A laser chip LD7 is mounted on the printed circuit board 3. The laser chip LD7 converts the RF input signal into an optical signal with a modulation signal. There is also a transmitter RF transmission line 8, a ground transmission line 9, a via 10, a receiver chip PD11 which converts the received optical signal into an RF electrical signal, and a receiver RF transmission line 12. The receiver RF transmission line 12 connects the receiver chip PD11 and the gold finger 4 to transmit the RF signal. The matching resistor R2 in the middle is used to match the broadband RF signal. The transmitter RF transmission line 8 is connected between the laser chip LD7 and the gold finger 4. The transmitter RF transmission line 8 is used to transmit the RF signal. The matching resistor R1 in the middle is used to match the broadband RF signal to maximize the gain. The receiver chip PD11 is connected to the gold finger 4. The ground transmission line 9 wraps around the transmitter RF transmission line 8 and the receiver RF transmission line 12 from three sides, which can effectively isolate interference from other signals. There are multiple vias 10 inside the ground transmission line 9 to connect the ground lines of the upper and lower layers and enhance the shielding effect.

[0044] The BOSA transmitter 203 includes a temperature control circuit, which comprises a temperature controller TEC, a thermistor TH, a laser chip LD7, a matching resistor R, and an inductor L. The thermistor TH detects the temperature of the laser chip LD7 and feeds it back to the transmitter circuit 301. The thermistor TH monitors the temperature changes of the laser chip LD7 in real time and provides temperature information to the transmitter circuit 301, providing a basis for temperature adjustment. The transmitter circuit 301 controls the output current of the temperature controller TEC by adjusting a variable resistor to achieve temperature and wavelength adjustment of the laser chip LD7. Based on the temperature information fed back by the thermistor TH, the transmitter circuit 301 adjusts the variable resistor, thereby controlling the output current of the temperature controller TEC. Since wavelength and temperature have a linear relationship, adjusting the temperature allows for wavelength adjustment of the laser chip LD7, ensuring stable gain and meeting different communication requirements.

[0045] The printed circuit board 3 is equipped with a transmitting circuit 301 and a receiving circuit 302. The transmitting circuit 301 is used to process and amplify the transmitted signal, and the receiving circuit 302 is used to process and amplify the received signal. They are key circuits for realizing effective signal conversion and transmission. The output terminal of the receiving circuit 302 is connected to the input terminal of the transmitting flexible circuit board 5. The output terminal of the transmitting flexible circuit board 5 is connected to the input terminal of the BOSA receiver 204. The input terminal of the transmitting circuit 301 is connected to the output terminal of the receiving flexible circuit board 6. The input terminal of the receiving flexible circuit board 6 is connected to the output terminal of the BOSA transmitter 203. This connection method ensures that the transmitted and received signals can be smoothly transmitted within the module, realizing efficient conversion and transmission / reception functions of optical and electrical signals.

[0046] The isolation structure is as follows: a slot 14 is provided at the front end of the printed circuit board 3, and a connector retainer 15 is fixedly installed inside the external connector 13, with the connector retainer 15 embedded in the slot 14; or, a slot 2 16 is provided inside the external connector 13, and a PCB retainer 17 is fixedly installed at the front end of the printed circuit board 3, with the PCB retainer 17 embedded in the slot 2 16, and the PCB retainer 17 is made of metal and is electrically connected to the ground pin of the gold finger 4.

[0047] The housing 1 includes an SFP package metal housing 101, a top cover 102, an EMI shielding spring 103, a pull ring 104, a slider 105, and a spring 106. The top cover 102 is fixedly installed on the top of the SFP package metal housing 101. The top cover 102 cooperates with the SFP package metal housing 101 to form a closed space, providing protection for internal components and preventing dust, moisture, etc. from entering, thus protecting the internal circuits and components for normal operation. The EMI shielding spring 103 is fixedly installed on the outer wall of the SFP package metal housing 101 and the top cover 102. The EMI shielding spring 103 can shield external electromagnetic interference and prevent electrical interference generated inside the module. To prevent magnetic signal leakage and interference with other equipment, ensuring stable module operation, a pull ring 104 is fixedly installed at the front end of the SFP package metal housing 101. The pull ring 104 facilitates the insertion and removal of the module by the operator, providing a force point during module installation and removal, making the operation more convenient. A slider 105 is slidably installed on the top of the transmitting flexible circuit board 5. A spring 106 is installed between the SFP package metal housing 101 and the slider 105. The slider 105 and the spring 106 work together to fix and buffer the transmitting flexible circuit board 5, preventing it from shifting or being damaged when the module is inserted or removed or subjected to vibration, thus ensuring the stability of signal transmission.

[0048] The printed circuit board 3 has gold-plated areas on its edges and in the middle. These gold-plated areas are electrically connected to the signal ground and the metal casing of the outer shell 1, forming independent gold-plated isolation cavities to reduce signal crosstalk between channels. The isolation level reaches below -70dB. The connection between the gold-plated areas and the signal ground and the metal casing of the outer shell 1 forms an independent isolation cavity, which can effectively block mutual interference between signals from different channels, making the isolation level between channels reach below -70dB. This greatly improves the anti-interference capability of the module during multi-channel signal transmission and ensures the accuracy and stability of communication signals.

[0049] The gain of the receiver and transmitter assembly 2 is determined based on the matching resistor R1 of the transmitter RF transmission line 8 and the matching resistor R2 of the receiver RF transmission line 12. R1 is 20–100 ohms, and R2 is 50–500 ohms. Proper matching of R1 and R2 ensures the continuity of the RF signal while maximizing the gain. The specific formula for calculating the gain is as follows:

[0050] Gain = 20 × log(se × Res × M);

[0051] Where Gain is the gain of the receiver and transmitter combination unit 2, se is the luminous efficiency of the BOSA receiver 204, taken as 0.32 W / A, Res is the responsivity of the BOSA transmitter 203, taken as 0.95 A / W, and M is the RF matching factor; it can be concluded that the gain Gain = -11.2 dB. For an optical transmission RF system, this gain value is very high, such as... Figure 11Gain test curves for this matching process.

[0052] The frequency matching factor is related to the matching resistors R1 and R2. If the matching resistor R1 is 50 ohms and the matching resistor R2 is 500 ohms, the frequency matching factor M = 500 / (500+50) = 0.91.

[0053] Working principle: When transmitting a signal, the transmitting circuit 301 processes and amplifies the electrical signal to be transmitted, and transmits it to the BOSA transmitter 203 through the receiving flexible circuit board 6. The temperature control circuit in the BOSA transmitter 203 starts to work. The thermistor TH detects the temperature of the laser chip LD7 and feeds the temperature information back to the transmitting circuit 301. The transmitting circuit 301 adjusts the variable resistor according to the feedback, thereby controlling the output current of the temperature controller TEC, accurately adjusting the temperature of the laser chip LD7, realizing wavelength adjustment, ensuring stable gain, and the adjusted electrical signal is loaded onto the laser chip LD7, converting it into an optical signal with a modulation signal, which is then transmitted through the optical interface 202.

[0054] During signal transmission, the matching resistor R1 in the middle of the transmitter RF transmission line 8 plays a role, working with other components to maximize the gain of the transmitted signal. At the same time, the ground transmission line 9 wraps around the transmitter RF transmission line 8 from three sides, and together with the via 10, connects the upper and lower ground lines, effectively isolating external interference signals and ensuring the purity of the transmitted signal.

[0055] When receiving a signal, the optical signal with modulation signal enters the BOSA receiver 204 through the optical interface 202. The BOSA receiver 204 converts the optical signal into an radio frequency electrical signal. This electrical signal is transmitted to the receiving circuit 302 on the printed circuit board 3 through the transmitting flexible circuit board 5. The matching resistor R2 in the middle of the receiving end radio frequency transmission line 12 matches the received signal, optimizes the signal transmission, and makes the received signal gain reach the ideal state. The ground transmission line 9 also shields the receiving end radio frequency transmission line 12 to reduce external interference. After the receiving circuit 302 processes and amplifies the received signal, it is transmitted to the external device through the gold finger 4. When the gold finger 4 is connected to the external connector 13, whether it is through the slot 14 and the connector retainer 15, or the PCB retainer 17 is embedded in the slot 2 16, the received and transmitted signals can be effectively isolated to prevent crosstalk.

[0056] The gold-plated areas at the edges and center of the printed circuit board 3, together with the signal ground and the metal casing of the outer shell 1, form an isolation cavity, further reducing signal crosstalk between channels and ensuring the accuracy of the received signal. By reasonably setting the matching resistors of the transmitting end RF transmission line 8 and the receiving end RF transmission line 12, and based on the gain calculation formula, the high-gain output of the receiving and transmitting combination component 2 is achieved, meeting the signal strength requirements of the communication system and ensuring that the entire transceiver RF optical module works efficiently and stably.

[0057] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A transceiver radio frequency optical module, comprising a housing (1), characterized in that: The receiving and transmitting assembly (2) and the printed circuit board (3) are fixedly installed inside the outer shell (1). The receiving and transmitting assembly (2) is located at the front end of the printed circuit board (3). A gold finger (4) is provided at the end of the printed circuit board (3) away from the receiving and transmitting assembly (2). A transmitting flexible circuit board (5) and a receiving flexible circuit board (6) are connected between the receiving and transmitting assembly (2) and the printed circuit board (3). An external connector (13) is fixedly installed at the front end of the gold finger (4). The signal line of the gold finger (4) is surrounded by ground lines on its left and right sides and below. An isolation structure is provided between the gold finger (4) and the external connector (13). The receiving and transmitting assembly (2) includes a BOSA housing (201), an optical interface (202), a BOSA transmitter (203), and a BOSA receiver (204). The optical interface (202) is fixedly installed at the front end inside the BOSA housing (201), the BOSA transmitter (203) is fixedly installed at the rear end inside the housing (1), and the BOSA receiver (204) is installed at the side end inside the housing (1). The printed circuit board (3) is equipped with a laser chip LD (7), a transmitter RF transmission line (8), a ground transmission line (9), a via (10), a receiver chip PD (11), and a receiver RF transmission line (12). The laser chip LD (7) is connected to the gold finger (4) via the transmitter RF transmission line (8). The receiver chip PD (11) is connected to the gold finger (4) via the receiver RF transmission line (12). The ground transmission line (9) wraps around the transmitter RF transmission line (8) and the receiver RF transmission line (12) from three sides. Multiple vias (10) are opened inside the ground transmission line (9). The BOSA transmitter (203) includes a temperature control circuit, which includes a temperature controller TEC, a thermistor TH, a laser chip LD (7), a matching resistor R, and an inductor L. The thermistor TH is used to detect the temperature of the laser chip LD (7) and feed it back to the transmitter circuit (301). The transmitter circuit (301) controls the output current of the temperature controller TEC by adjusting the variable resistor to achieve temperature regulation and wavelength adjustment of the laser chip LD (7).

2. The transceiver radio frequency optical module according to claim 1, characterized in that: The printed circuit board (3) is provided with a transmitting circuit (301) and a receiving circuit (302). The output terminal of the receiving circuit (302) is connected to the input terminal of the transmitting flexible circuit board (5). The output terminal of the transmitting flexible circuit board (5) is connected to the input terminal of the BOSA receiver (204). The input terminal of the transmitting circuit (301) is connected to the output terminal of the receiving flexible circuit board (6). The input terminal of the receiving flexible circuit board (6) is connected to the output terminal of the BOSA transmitter (203).

3. The transceiver radio frequency optical module according to claim 1, characterized in that: The isolation structure is as follows: a slot 1 (14) is provided at the front end of the printed circuit board (3), and a connector retainer (15) is fixedly installed inside the external connector (13), and the connector retainer (15) is embedded in the slot 1 (14); or, a slot 2 (16) is provided inside the external connector (13), and a PCB retainer (17) is fixedly installed at the front end of the printed circuit board (3), and the PCB retainer (17) is embedded in the slot 2 (16), and the PCB retainer (17) is made of metal and is electrically connected to the ground pin of the gold finger (4).

4. The transceiver radio frequency optical module according to claim 1, characterized in that: The housing (1) includes an SFP packaged metal housing (101), a top cover (102), an EMI shielding spring (103), a pull ring (104), a slider (105), and a spring (106). The top cover (102) is fixedly installed on the top of the SFP packaged metal housing (101). The EMI shielding spring (103) is fixedly installed on the outer walls of the SFP packaged metal housing (101) and the top cover (102). The pull ring (104) is fixedly installed on the front end of the SFP packaged metal housing (101). The slider (105) is slidably installed on the top of the transmitting flexible circuit board (5). The spring (106) is installed between the SFP packaged metal housing (101) and the slider (105).

5. A transceiver radio frequency optical module according to claim 1, characterized in that: The printed circuit board (3) has gold-plated areas on its edges and in the middle. The gold-plated areas are electrically connected to the signal ground and the metal shell of the outer casing (1) to form an independent gold-plated isolation cavity.

6. A transceiver radio frequency optical module according to claim 1, characterized in that: The gain of the receiving and transmitting combination component (2) is determined based on the matching resistor R1 of the transmitting end RF transmission line (8) and the matching resistor R2 of the receiving end RF transmission line (12), where R1 is 20-100 ohms and R2 is 50-500 ohms. The specific formula for calculating the gain is as follows: Gain = 20 × log(se × Res × M); Wherein, Gain is the gain of the receiver and transmitter combination component (2), se is the luminous efficiency of the BOSA receiver (204) with a value of 0.32 W / A, Res is the responsivity of the BOSA transmitter (203) with a value of 0.95 A / W, and M is the radio frequency matching factor.

7. A transceiver radio frequency optical module according to claim 6, characterized in that: The frequency matching factor is related to the matching resistors R1 and R2. If the matching resistor R1 is 50 ohms and the matching resistor R2 is 500 ohms, the RF matching factor is 0.91.

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