Circuit board, antenna structure including same, and image display device including antenna structure

Abstract

According to an embodiment of the present disclosure, there are provided a circuit board, an antenna structure including the circuit board, and an image display device including the antenna structure. The circuit board includes a core layer including a wiring portion and a ground portion disposed around the wiring portion, a circuit wiring extending on the wiring portion, a first ground pattern disposed around the circuit wiring and spaced apart from the circuit wiring, and a first via structure disposed in the ground portion to penetrate the core layer, the first via structure is not disposed in the wiring portion.

Description

Technical Field

[0001] This utility model relates to a circuit board, an antenna structure including the circuit board, and an image display device including the antenna structure. Background Technology

[0002] With the development of information technology, wireless communication technologies such as Wi-Fi and Bluetooth are being combined with image display devices, such as smartphones. In this case, an antenna can be integrated with the image display device to provide communication functionality.

[0003] Recently, with the development of mobile communication technology, antennas are needed in image display devices for communication in the high frequency or ultra-high frequency bands.

[0004] However, as the antenna's driving frequency increases, signal loss may also increase. As the transmission path becomes longer, signal loss may increase further.

[0005] For example, a circuit board, including circuit wiring and connection intermediate structures such as through-hole structures, can be used to connect an antenna to the motherboard of a display device. In this case, antenna performance may be degraded due to signal interference or signal loss caused by bending or deformation of the circuit board. Utility Model Content

[0006] According to one aspect of the present invention, a circuit board with improved electrical reliability is provided.

[0007] According to one aspect of the present invention, an antenna structure with improved electrical reliability is provided.

[0008] According to one aspect of the present invention, an image display device with improved electrical reliability is provided.

[0009] (1) A circuit board comprising: a core layer including a wiring portion and a ground portion arranged around the wiring portion; circuit wiring extending on the wiring portion; a first ground pattern arranged around and spaced apart from the circuit wiring; and a first through-hole structure arranged in the ground portion to penetrate the core layer, wherein the first through-hole structure is not arranged in the wiring portion.

[0010] (2) The circuit board according to (1) above, wherein the circuit wiring is not arranged on the ground portion.

[0011] (3) The circuit board according to (1) above, wherein the circuit wiring includes a plurality of circuit wirings extending on the wiring portion, and the distance between the ground portion and the outermost circuit wiring among the plurality of circuit wirings is at least three times the line width of the circuit wiring.

[0012] (4) The circuit board according to (1) above, wherein the core layer has a first surface and a second surface facing each other, and the circuit wiring and the first ground pattern are arranged on the first surface, wherein the circuit board further includes a second ground pattern arranged on the second surface.

[0013] (5) The circuit board according to (4) above, wherein the first through-hole structure electrically connects the first ground pattern and the second ground pattern.

[0014] (6) According to the circuit board of (1) above, wherein the first through-hole structure includes a plurality of first through-hole structures, each of the plurality of first through-hole structures penetrating the core layer in the grounding portion.

[0015] (7) The circuit board according to (6) above, wherein the plurality of first through-hole structures includes an external through-hole structure arranged continuously along the outermost portion of the circuit board.

[0016] (8) According to the circuit board of (7) above, the plurality of first through-hole structures further includes internal through-hole structures in addition to the external through-hole structures.

[0017] (9) The circuit board according to (8) above, wherein the distance between adjacent internal through-hole structures is greater than the distance between adjacent external through-hole structures.

[0018] (10) The circuit board according to (1) above, wherein the core layer has a first extension portion, a bent portion connected to the first extension portion, and a second extension portion connected to the bent portion to face the first extension portion.

[0019] (11) The circuit board according to (1) above further includes a second through-hole structure that penetrates the core layer to connect to the terminal end of the circuit wiring.

[0020] (12) The circuit board according to (1) above further includes a protective layer covering the circuit wiring and the first grounding pattern.

[0021] (13) An antenna structure comprising: the circuit board described above; and an antenna device electrically connected to the circuit board.

[0022] (14) According to the antenna structure of (13) above, the antenna device includes a radiator and a transmission line connected to the radiator, and the transmission line and the circuit wiring are electrically connected.

[0023] (15) An image display device, comprising: a display panel; and the antenna structure described above.

[0024] According to an embodiment of the present invention, the core layer may include a bent portion, thereby improving the space efficiency of a device including a circuit board (e.g., an image display device).

[0025] According to an embodiment of this invention, a first through-hole structure penetrating the core layer can be arranged in the ground portion of the circuit board, and the first through-hole structure may not be arranged in the wiring portion extending from the circuit wiring. Therefore, unnecessary electric field formation caused by bending of the circuit board around the circuit wiring can be suppressed, and signal loss can be prevented. Thus, antenna performance substantially the same as or similar to that of an inflexible circuit board can be achieved. Attached Figure Description

[0026] Figure 1 and Figure 2 These are schematic plan views and schematic cross-sectional views of a circuit board according to an example embodiment.

[0027] Figure 3 This is a schematic plan view showing a circuit board according to an example embodiment.

[0028] Figure 4 and Figure 5 These are schematic cross-sectional views and schematic plan views illustrating the antenna structure according to an example embodiment.

[0029] Figure 6 and Figure 7 These are schematic cross-sectional views and schematic plan views illustrating an image display device according to an example embodiment.

[0030] Figure 8 This is a schematic plan view showing the antenna structure according to the reference example and the comparative example.

[0031] Figure 9 This is an image showing the electric field generation diagram of the antenna structure of the embodiment and comparative example.

[0032] Figure 10 This is a graph showing the peak antenna gain at frequencies according to the antenna structures of the reference example, embodiment, and comparative example. Detailed Implementation

[0033] According to an embodiment of the present invention, a circuit board including circuit wiring is provided. According to an embodiment of the present invention, an antenna structure including the circuit board is provided. According to an embodiment of the present invention, an image display device including the circuit board or the antenna structure is provided.

[0034] The present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that such embodiments described with reference to the drawings are provided to further understand the spirit of the present invention and are not intended to limit the subject matter to be protected as disclosed in the detailed description and the appended claims.

[0035] Figure 1 and Figure 2 These are schematic plan views and schematic cross-sectional views of a circuit board according to an exemplary embodiment. Figure 2 yes Figure 1 A cross-sectional view of the wiring section CP in the circuit board.

[0036] Reference Figure 1 and Figure 2 The circuit board 100 may include a core layer 105, circuit wiring 110, a first grounding pattern 120, and a first through-hole structure 130.

[0037] The core layer 105 may include a wiring portion CP and a ground portion GP disposed around the wiring portion CP.

[0038] For example, the wiring portion CP may include the area of ​​the circuit board 100 where the circuit wiring 110 is provided. For example, the ground portion GP may represent the area of ​​the circuit board 100 other than the wiring portion CP.

[0039] For example, the grounding portion GP can surround the wiring portion CP.

[0040] For example, circuit wiring 110 may not be provided on the grounding part GP.

[0041] The core layer 105 may have a first surface 105a and a second surface 105b facing each other.

[0042] In an example implementation, the core layer 105 may include a first extension 102, a bent portion 104 connected to the first extension 102, and a second extension 106 connected to the bent portion 104 to face the first extension 102. For example, the first extension 102 and the second extension 106 may be configured such that the bent portion 104 is located between them.

[0043] For example, the bent portion 104 can be defined as the area where the circuit board 100 is bent. Figure 2 As shown, the circuit board 100 can be bent by the bending portion 104, such that the first surface 105a of the first extension portion 102 and the first surface 105a of the second extension portion 105 can face each other. Therefore, the space efficiency of the device including the circuit board 100 (e.g., an image display device) can be improved.

[0044] For example, core layer 105 may include flexible resins such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cyclic olefin polymer (COP), liquid crystal polymer (LCP), etc. For example, core layer 105 may include an internal insulating layer contained in circuit board 100.

[0045] In an example implementation, circuit wiring 110 and a first ground pattern 120 may be disposed on a first surface 105a of the core layer 105.

[0046] Multiple circuit wirings 110 can extend on the first surface 105a of the core layer 105.

[0047] In some embodiments, the distance D between the ground portion GP and the outermost circuit trace in the circuit trace 110 can be more than three times the linewidth of the circuit trace 110. In one embodiment, the distance D can be 3 to 200 times the linewidth of the circuit trace 110. Within the above range, unwanted electric field formation caused by the bending of the circuit board 100 around the circuit trace 110 can be suppressed, and antenna gain can be improved.

[0048] "The outermost circuit wiring in circuit wiring 110" can refer to the circuit wiring closest to the grounding part among multiple circuit wirings 110.

[0049] The first grounding pattern 120 can be positioned around the circuit wiring 110 and spaced apart from it. Therefore, noise around the circuit wiring 110 can be suppressed.

[0050] For example, the first grounding pattern 120 and the circuit wiring 110 can be set on the same layer or at the same level.

[0051] In some embodiments, the first grounding pattern 120 may include a first grounding portion 120a disposed on a first surface 105a of the first extension portion 102 and a second grounding portion 120b disposed on a first surface 105a of the second extension portion 106.

[0052] For example, the first grounding pattern 120 may further include a bent grounding portion 120c disposed between the first grounding portion 120a and the second grounding portion 120b and disposed on the first surface 105a of the bent portion 104. The bent grounding portion 120c may be bent along the bending profile of the bent portion 104 of the core layer 105.

[0053] For example, the first grounding portion 120a, the bent grounding portion 120c, and the second grounding portion 120b can be formed substantially integrally with each other.

[0054] In the example embodiment, the first via structure 130 may be disposed in the ground portion GP of the circuit board 100 to penetrate the core layer 105, and may not be disposed in the wiring portion CP. Therefore, unwanted electric field formation caused by bending of the circuit board 100 around the circuit wiring 110 can be suppressed, while preventing signal loss. Thus, antenna performance substantially the same as or similar to that of an unbent circuit board 100 can be achieved.

[0055] In a comparative example where the first via structure 130 is provided in the wiring portion CP, interference capacitance may occur around the circuit wiring 110 due to the bending of the circuit board 100, which may reduce the antenna gain.

[0056] In an example implementation, a plurality of first through-hole structures 130 may be arranged in the ground portion GP.

[0057] In some embodiments, the plurality of first via structures 130 may include external via structures 132 arranged continuously along the outermost portion of the circuit board 100.

[0058] In some embodiments, the plurality of first through-hole structures 130 may include internal through-hole structures 134 in addition to external through-hole structures 132.

[0059] In some embodiments, the distance between adjacent internal via structures 134 can be greater than the distance between adjacent external via structures 132. Therefore, process efficiency can be improved, noise can be further shielded, and the electrical reliability of the circuit board 100 can be enhanced.

[0060] In one embodiment, the distance between adjacent external through-hole structures 132 can be substantially uniform.

[0061] In one embodiment, the distance between adjacent internal through-hole structures 134 can be uniform.

[0062] In some embodiments, the circuit board 100 may further include a second ground pattern 140 disposed on a second surface 105b of the core layer 105. Therefore, electric field concentration of signals transmitted to the circuit wiring 110 can be improved while noise is shielded.

[0063] For example, the first through-hole structure 130 can penetrate the core layer 105 in the ground portion GP to electrically connect the first ground pattern 120 and the second ground pattern 140. Therefore, the signal compatibility of the first surface 105a and the second surface 105b of the core layer 105 can be improved, and signal loss can be suppressed.

[0064] For example, in a plan view, the first through-hole structure 130 may overlap with each of the first grounding pattern 120 and the second grounding pattern 140.

[0065] For example, the first through-hole structure 130, the first grounding pattern 120, and the second grounding pattern 140 can be formed as a substantially integral or single monolithic component. For example, after forming a through-hole penetrating the core layer 105 in the grounding portion GP, ​​the first through-hole structure 130, the first grounding pattern 120, and the second grounding pattern 140 can be integrally formed by shaping and patterning metal or alloy layers.

[0066] In some embodiments, the circuit board 100 may further include a protective layer 150 covering the circuit wiring 110 and the first ground pattern 120. Therefore, the shock resistance of the circuit wiring 110 and the driving stability of the circuit board 100 can be improved.

[0067] For example, a cover film covering the circuit wiring 110 can be provided as a protective layer 150.

[0068] For example, the protective layer 150 may include a material type substantially the same as that of the core layer 105.

[0069] In one embodiment, the protective layer 150 may include a cover window. The cover window may include, for example, ultra-thin glass (UTG) or a transparent resin film. Thus, external impacts applied to the circuit wiring 110 can be reduced or buffered.

[0070] Figure 3 This is a schematic plan view showing a circuit board according to an exemplary embodiment. Figure 3 This is a plan view of the core layer 105 as observed in the direction of the second surface 105b.

[0071] Although for ease of description, Figure 1 and Figure 3 The circuit board 100 is shown in a non-bent state, but the circuit board 100 of this application will be through, as Figure 2 The curved portion 104 shown is interpreted as a curved shape.

[0072] Reference Figure 3 The circuit board 100 may also include a second through-hole structure 115 that penetrates the core layer 105 and connects to the terminal end of the circuit wiring 110. Signals transmitted to the circuit wiring 110 on the first surface 105a can be transmitted to the second surface 105b through the second through-hole structure 115.

[0073] For example, the second through-hole structure 115 can be provided in the wiring section CP.

[0074] For example, signals can be sent and received from a control device connected to the second surface 105a via the second through-hole structure 115.

[0075] For example, the circuit wiring 110 and the second via structure 115 can be formed as substantially single or integral components. For example, after forming the via through the core layer 105, the circuit wiring 110 and the second via structure 115 can be integrally formed by shaping and patterning a metal or alloy layer.

[0076] In some embodiments, a separation space SS in the form of a trench can be formed between the circuit wiring 110 and the first ground pattern 120. Therefore, signal loss transmitted through the circuit wiring 110 can be suppressed, and noise can be shielded.

[0077] For example, the shape of the space SS can be changed by adjusting the patterned shape of the first grounding pattern 120.

[0078] For example, a separation space SS may also be formed between the second via structure 115 and the first grounding pattern 120 and / or between the second via structure 115 and the second grounding pattern 140. For example, the second via structure 115 and the second grounding pattern 140 may be separated by the separation space SS.

[0079] In some embodiments, the first ground pattern 120 may be completely disposed in the area on the first surface 105a of the core layer 105, excluding the circuit wiring 110, the second via structure 115 and the spacing space SS.

[0080] In some embodiments, the second grounding pattern 140 may be completely disposed on the second surface 105b of the core layer 105 in the area excluding the second through-hole structure 115 and the separation space SS.

[0081] The circuit wiring 110, the first grounding pattern 120, the second grounding pattern 140, the first via structure 130, and / or the second via structure 115 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or alloys containing at least one of these. They may be used alone or in combination of two or more of them.

[0082] In one embodiment, the circuit wiring 110, the first ground pattern 120, the second ground pattern 140, the first via structure 130 and / or the second via structure 115 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy) or copper or a copper alloy (e.g., a copper-calcium (CuCa) alloy) to achieve low resistance and fine linewidth patterns.

[0083] For example, circuit wiring 110, first ground pattern 120, second ground pattern 140, first via structure 130 and / or second via structure 115 can be formed in solid patterns to reduce feed resistance and prevent signal loss.

[0084] Figure 4 and Figure 5 These are schematic cross-sectional views and schematic plan views illustrating an antenna structure according to an exemplary embodiment.

[0085] Reference Figure 4 and Figure 5 The antenna structure may include the circuit board 100 described above and the antenna device 200 electrically connected to the circuit board 100.

[0086] For example, antenna device 200 may include dielectric layer 210 and antenna element 220 disposed on dielectric layer 210.

[0087] The dielectric layer 210 may include a transparent resin material. For example, the dielectric layer 210 may include polyester-based resins, such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose-based resins, such as diacetylcellulose and triacetylcellulose; polycarbonate-based resins; acrylic resins, such as poly(meth)acrylate and poly(meth)acrylate; styrene-based resins, such as polystyrene and acrylonitrile-styrene copolymers; polyolefin-based resins, such as polyethylene, polypropylene, cycloolefins, or polyolefins having a norbornene structure and ethylene-propylene copolymers; vinyl chloride resins; amide-based resins, such as nylon and aromatic polyamides; imide-based resins; polyethersulfone-based resins; sulfone-based resins; polyetheretherketone-based resins; polyphenylene sulfide resins; vinyl alcohol-based resins; vinylidene chloride resins; vinyl butyral-based resins; allyl resins; polyoxymethylene-based resins; epoxy-based resins; urethane or acrylate-based resins; siloxane-based resins, etc. They can be used individually or in combination of two or more of them.

[0088] In some embodiments, the dielectric layer 210 may include an adhesive film such as optically transparent adhesive (OCA) or optically transparent resin (OCR).

[0089] In some embodiments, the dielectric layer 210 may comprise an inorganic insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, glass, etc.

[0090] In one implementation, dielectric layer 210 may be provided as a substantially single layer.

[0091] In one embodiment, dielectric layer 210 may include a multilayer structure of at least two or more layers. For example, dielectric layer 210 may include a substrate layer and a dielectric layer, and may include an adhesive layer located between the substrate layer and the dielectric layer.

[0092] The impedance or inductance of the antenna element 220 can be formed through the dielectric layer 210, allowing the frequency band in which the antenna structure can be driven or operated to be adjusted. In some embodiments, the dielectric constant of the dielectric layer 210 can be adjusted in the range of about 1.5 to about 12. When the dielectric constant is greater than about 12, the driving frequency may be excessively reduced, and driving in the high-frequency band may not be possible.

[0093] In one embodiment, an antenna grounding portion (not shown) may be provided below the bottom surface of the dielectric layer 210.

[0094] In one embodiment, the conductive component of the image display device or display panel with the antenna structure can be used as the antenna grounding part.

[0095] For example, conductive components may include electrodes or wiring, such as gate electrodes, source / drain electrodes, pixel electrodes, common electrodes, data lines, scan lines, etc., included in a thin-film transistor array panel.

[0096] In one embodiment, metal components such as SUS plates, sensor components such as digital converters, and heat sinks disposed on the back of the image display device can be used as antenna grounding parts.

[0097] In an example implementation, antenna element 220 may include a radiator 222 and a transmission line 224 connected to the radiator 222. The transmission line 224 may extend from the radiator 222.

[0098] For example, the radiator 222 has a polygonal flat plate shape, the width of the transmission line 224 can be smaller than the width of the radiator 222, and the transmission line 224 can be connected to one end or one side of the radiator 222. The radiator 222 and the transmission line 224 can be formed as a single component integrally connected to each other.

[0099] The target resonant frequency of the antenna device 200 can be adjusted according to the shape / size of the radiator 222. In a non-limiting embodiment, the radiator 222 can be designed to radiate in high-frequency / ultra-high-frequency bands above 3G, 4G, and 5G. For example, the radiator 222 can achieve radiation bands in frequency bands of 0.5 GHz or higher, 1 GHz or higher, 10 GHz or higher, 20 GHz or higher, 30 GHz or higher, or 40 GHz or higher.

[0100] For example, radiator 222 can be provided as a high-frequency radiator of antenna element 220. In one embodiment, the resonant frequency of radiator 222 can be about 28 GHz or higher.

[0101] The transmission lines may include a first transmission line 224a and a second transmission line 224b connected to the radiator 222 and facing each other. Therefore, two polarization directions (dual polarization) can be achieved in a single radiator.

[0102] In some implementations, each of the first transmission line 224a and the second transmission line 224b may be connected to two lateral portions of the lower surface of the radiator 222 (e.g., two vertices of the lower surface of the radiator 222).

[0103] The first transmission line 224a and the second transmission line 224b can extend from the radiator 222 in different directions. Therefore, dual polarization characteristics can be achieved from a single radiator 222.

[0104] In some embodiments, the angle formed by the extending directions of the first transmission line 224a and the second transmission line 224b can be approximately 90°. For example, the extending directions of the first transmission line 224a and the second transmission line 224b can be orthogonal to each other. In one embodiment, the first transmission line 224a and the second transmission line 224b can extend towards the center of the radiator.

[0105] Therefore, the radiator 222 can be fed in two substantially orthogonal directions via the first transmission line 224a and the second transmission line 224b. For example, vertical and horizontal radiation from the radiator 222 can be achieved together.

[0106] In some embodiments, the first transmission line 224a and the second transmission line 224b can be arranged symmetrically to each other. For example, the first transmission line 224a and the second transmission line 224b can be arranged symmetrically to each other with respect to a centerline passing through the center of the radiator 222. Therefore, the signal intensity in the two polarization directions can become substantially uniform.

[0107] In some embodiments, signal pad 226 may be disposed at the end of transmission line 224. Signal pad 226 may be a single component substantially integrated with transmission line 224. In this case, the end of transmission line 224 can be used as signal pad 226.

[0108] For example, radiator 222 and signal pad 226 can be electrically connected via transmission line 224.

[0109] The circuit board 100 and the antenna unit 220 can be electrically connected via the signal pad 226. Therefore, signal transmission and reception between the antenna driver integrated circuit (IC) chip and the radiator 222 of the circuit board 100 can be realized.

[0110] In some embodiments, antenna element 220 may further include a grounding pad 228 spaced apart from signal pad 226 around signal pad 226. Grounding pad 228 may be electrically and physically separated from transmission line 224 and signal pad 226. In one embodiment, a pair of grounding pads 228 may be configured to face each other with signal pad 226 inserted between them. Therefore, noise generation of signals transmitted through signal pad 226 can be reduced.

[0111] For example, signal pad 226 and ground pad 228 can be disposed in the bonding area BR where the antenna device 200 and the circuit board 100 are joined. For example, the bonding stability between the antenna device 200 and the circuit board 100 in the bonding area BR can be improved by ground pad 228.

[0112] In one embodiment, the signal pad 226 and the ground pad 228 may have a solid structure. Therefore, the increase in resistance due to the connection at the junction of the antenna device 200 and the circuit board 100 can be suppressed, and the feeding efficiency can be improved.

[0113] In some embodiments, the circuit wiring 110 and the antenna device 200 may be connected to the first extension 102 of the circuit board 100. For example, the transmission line 224 and the circuit wiring 110 may be electrically connected.

[0114] For example, a conductive bonding structure such as an ACF can be attached to the end of the signal pad 226 or transmission line 224 in the bonding region BR. For example, a portion of the protective layer 150 (e.g., a cover film) can be removed to expose one end of the circuit wiring 110 disposed on the first surface 105a of the first extension 102. The exposed end can be disposed on the conductive bonding structure, and the circuit board 100 and the antenna device 200 can be connected to each other through heat treatment and pressure processes.

[0115] Therefore, power supply and signal transmission between the device including the antenna structure and the antenna device 200 can be realized.

[0116] For example, one end of the circuit wiring 110 can be connected to the antenna device 200, and the other end can be connected to the second through-hole structure 115.

[0117] Antenna element 220 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. They may be used individually or in combination of two or more of these metals.

[0118] In one embodiment, antenna element 220 may include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa)) to achieve low resistance and fine linewidth patterns.

[0119] In some embodiments, antenna element 220 may include transparent conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), etc.

[0120] In some embodiments, antenna element 220 may include a stacked structure of transparent conductive oxide layer and metal layer. For example, the antenna element may include a two-layer structure of transparent conductive oxide layer-metal layer, or a three-layer structure of transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer can improve flexibility, and the low resistance of the metal layer can also improve the signal transmission rate. The transparent conductive oxide layer can improve corrosion resistance and transparency.

[0121] Antenna element 220 may include a blackened portion, which reduces the reflectivity at the surface of antenna element 220 to suppress visual recognition of the antenna element due to light reflection.

[0122] In one embodiment, the surface of the metal layer included in the antenna element 220 may be converted into a metal oxide or metal sulfide to form a blackening layer. In one embodiment, a blackening layer, such as a black material coating or plating, may be formed on the antenna element 220 or the metal layer. The black material or plating may include silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or an oxide, sulfide, or alloy containing at least one of these materials.

[0123] Considering the reflectivity reduction effect and antenna radiation characteristics, the composition and thickness of the blackening layer can be adjusted.

[0124] In some embodiments, radiator 222 may include a mesh structure, and at least a portion of transmission line 224 and signal pad 226 may include a solid structure. In one embodiment, at least a portion of radiator 222 may be formed as a mesh structure, and the remaining portion may be formed as a solid structure.

[0125] Figure 6 and Figure 7 These are schematic cross-sectional views and schematic plan views illustrating an image display device according to an exemplary embodiment.

[0126] The front portion of the image display device 300 may include a display area DA 330 and a non-display area NDA 340. The non-display area 340 may correspond to, for example, a light-shielding portion or a bezel portion of the image display device 300.

[0127] According to the example embodiment, the antenna device 200 can be disposed facing the front surface of the image display device 300. For example, the antenna device 200 can be disposed on the display panel 310.

[0128] In some embodiments, the antenna device 200 may be attached to the display panel 310 in the form of a film.

[0129] In one embodiment, the antenna device 200 may be formed above the display area 330 and the non-display area 340 of the image display device 300. In one embodiment, the radiator 222 may be at least partially disposed in the display area 330.

[0130] As described above, the transmission line 224, signal pad 226, and ground pad 228 may overlap with the non-display area 340 in the thickness direction. For example, the solid structure portion of the antenna element 220 may overlap with the non-display area 340.

[0131] In some embodiments, the antenna device 200 may be located in the central portion of one side of the image display device 300. Therefore, degradation of radiation performance from either side can be prevented.

[0132] The antenna device 200 can be powered or driven via the circuit board 100.

[0133] An antenna driver integrated circuit (IC) chip 250 can be mounted on circuit board 100. For example... Figure 6 As shown, an intermediate circuit board 260, such as a rigid printed circuit board, can be disposed between the circuit board 100 and the antenna driver IC chip 250. In one embodiment, the antenna driver IC chip 250 can be directly mounted on the circuit board 100.

[0134] Reference Figure 6The image display device 300 may include a display panel 310 and the aforementioned antenna device 200 disposed on the display panel 310.

[0135] In the example embodiment, an optical layer 320 may also be included on the display panel 310. For example, the optical layer 320 may be a polarizing layer including a polarizer or a polarizing plate.

[0136] The circuit board 100 (e.g., a flexible printed circuit board) can be bent along the side profile of the display panel 310 and can be positioned on the rear side of the image display device 300, and can extend toward the intermediate circuit board 260 (e.g., a motherboard) on which the antenna driver IC chip 250 is mounted.

[0137] The circuit board 100 and the intermediate circuit board 260 can be joined or interconnected via connectors, so that the power supply and antenna drive control of the antenna device 200 can be performed by the antenna drive IC chip 250.

[0138] In some embodiments, the antenna device 200 can be disposed on the display panel 310, and the circuit board 100 can be bent using the bending portion 104 to extend below the display panel 310. Therefore, the space efficiency of the image display device 300 can be improved. Furthermore, the aforementioned construction of the circuit board 100 can suppress the generation of unwanted electric fields caused by bending and improve antenna gain.

[0139] For example, the circuit board 100 and the antenna device 200 can be connected to the first extension 102, and the circuit board 100 and the antenna driver IC chip 250 can be connected to the second extension 106. Therefore, power supply and signal transmission from the antenna driver IC chip 250 to the antenna element 220 can be achieved.

[0140] In the following description, embodiments are provided to enhance understanding of the present invention. However, these embodiments are illustrative and do not limit the scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications to the embodiments are possible within the scope of the present invention and its technical concept. Such modifications and variations fall within the scope of the appended claims.

[0141] Example for reference (non-curved)

[0142] like Figure 8 As shown, a copper (Cu) conductor and a via structure penetrating the COP dielectric layer are patterned on the COP dielectric layer to obtain an antenna structure.

[0143] The wire has a linewidth of 2μm and a thickness of 0.5μm.

[0144] The target resonant frequency of the antenna element was adjusted to approximately 28 GHz.

[0145] Example

[0146] An antenna structure manufactured using the same method as in the reference example was used as a preliminary antenna structure, except that it did not resemble... Figure 5 As shown, a through-hole structure is formed in the wiring section.

[0147] The antenna structure is manufactured by bending the circuit board of the initial antenna structure.

[0148] Comparative example

[0149] The antenna structure is manufactured using the same method as in the embodiment, except that the antenna structure manufactured using the same method as in the reference example (with a first through-hole structure formed in the wiring portion) is used as the preliminary antenna structure.

[0150] Experimental Example

[0151] The electric field formation and peak gain of the antenna structures according to the embodiments and comparative examples were measured using an HFSS simulator (Ansys Ltd).

[0152] In the embodiments and comparative examples, power is applied to four of the eight circuit traces. The circuit traces that are applied to them and the circuit traces that are not applied to them are arranged alternately.

[0153] Figure 9 This is an image showing the electric field generation diagram of the antenna structure of the embodiment and comparative example.

[0154] Reference Figure 9 In this embodiment, compared to the comparative example, the formation of unwanted electric fields around the circuit wiring was suppressed.

[0155] Specifically, in the embodiment, the electric field is concentrated in the circuit wiring, and the formation of the electric field in the first ground pattern is suppressed. However, in the comparative example, an unwanted electric field is formed in the first ground pattern, resulting in a reduction in antenna gain.

[0156] Figure 10 This is a graph showing the peak antenna gain at frequencies according to the antenna structures of the reference example, embodiment, and comparative example.

[0157] Reference Figure 10 In embodiments where the first via structure is not provided in the wiring section, the antenna peak gain in the target frequency band (square box area) is improved compared to the antenna peak gain from the comparative example.

[0158] In the comparative example, the bending of the circuit board created an unwanted electric field, and the antenna peak gain decreased compared to when the circuit board was not bent.

[0159] In the embodiment where the first via structure is located on the ground portion and not in the wiring portion, an antenna peak gain substantially similar to that from a reference example where the circuit board is not bent is measured, even when the circuit board is bent.

Claims

1. A circuit board, characterized by, comprising: a core layer including a wiring portion and a ground portion disposed around the wiring portion; a circuit wiring extending on the wiring portion; a first ground pattern disposed around the circuit wiring and spaced apart from the circuit wiring; and a first via structure disposed in the ground portion to penetrate the core layer, wherein the first via structure is not disposed in the wiring portion.

2. The circuit board of claim 1, wherein The circuit wiring is not disposed on the ground portion.

3. The circuit board of claim 1, wherein The circuit wiring includes a plurality of circuit wirings extending on the wiring portion, and a distance between the ground portion and an outermost circuit wiring among the plurality of circuit wirings is at least three times a line width of the circuit wiring.

4. The circuit board of claim 1, wherein The core layer has a first surface and a second surface facing each other, and the circuit wiring and the first ground pattern are disposed on the first surface, wherein the circuit board further includes a second ground pattern disposed on the second surface.

5. The circuit board of claim 4, wherein, The first via structure electrically connects the first ground pattern and the second ground pattern.

6. The circuit board of claim 1, wherein The first via structure includes a plurality of first via structures, each of the plurality of first via structures penetrating the core layer in the ground portion.

7. The circuit board of claim 6, wherein The plurality of first via structures includes an outer via structure continuously disposed along an outermost portion of the circuit board.

8. The circuit board of claim 7, wherein, The plurality of first via structures further includes an inner via structure other than the outer via structure.

9. The circuit board of claim 8, wherein, A distance between adjacent inner via structures is greater than a distance between adjacent outer via structures.

10. The circuit board of claim 1, wherein, The core layer has a first extension portion, a curved portion connected to the first extension portion, and a second extension portion connected to the curved portion to face the first extension portion.

11. The circuit board of claim 1, wherein, Further including a second via structure penetrating the core layer to connect to a terminal end of the circuit wiring.

12. The circuit board of claim 1, wherein, Further including a protective layer covering the circuit wiring and the first ground pattern.

13. An antenna structure, characterized by comprising: the circuit board according to claim 1; and an antenna device electrically connected to the circuit board.

14. The antenna structure of claim 13, wherein, The antenna device includes a radiator and a transmission line connected to the radiator, and the transmission line is electrically connected to the circuit wiring.

15. An image display device, characterized by comprising: comprising: a display panel; and the antenna structure according to claim 13 on the display panel.

Images