Controllable liquid cooling heat dissipation device and vehicle-mounted domain controller equipment

Abstract

The utility model provides a controllable liquid cooling heat dissipation device and a vehicle-mounted domain controller device, the controllable liquid cooling heat dissipation device comprises an upper shell, a lower shell and a rear shell which are connected to form a rectangular shell structure, a main board, a cooling unit and an auxiliary board are sequentially installed in the rectangular shell from top to bottom, the cooling unit is used for cooling and heat dissipation of the main board and the auxiliary board, and the cooling unit is used for cooling and heat dissipation of the auxiliary board. The cooling unit comprises a liquid cooling water channel module, and a water channel capable of controlling the water pressure loss and the water flow speed is arranged in the liquid cooling water channel module. According to the controllable liquid cooling heat dissipation device and the vehicle-mounted domain controller equipment, the cooling unit is arranged, so that the problem that a chip needs to dissipate heat massively and quickly is effectively solved, and the chip can be used in a high-frequency band.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology for communication equipment, and in particular relates to a controllable liquid cooling heat dissipation device and an on-board domain controller device. Background Technology

[0002] As market demands become increasingly diverse, the functions that in-vehicle central control systems need to integrate are also increasing. This leads to greater heat generation during chip operation. Existing methods of heat dissipation—such as increasing the size of the casting, raising the fin height, and using fans to draw air from the internal structure and disrupt airflow—are no longer sufficient to meet product requirements. Therefore, accelerating the removal of heat from the chip and dissipating it as quickly as possible has become a pressing issue. Utility Model Content

[0003] In view of this, the present invention aims to propose a controllable liquid cooling heat dissipation device to solve the problem of chips requiring large amounts of rapid heat dissipation.

[0004] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0005] A controllable liquid cooling heat dissipation device includes an upper shell, a lower shell, and a rear shell that are connected to form a rectangular shell structure. Inside the rectangular shell, a main board, a cooling unit, and a sub-board are installed sequentially from top to bottom. The cooling unit is used to cool and dissipate heat from the main board and the sub-board. The cooling unit includes a liquid cooling water channel module, and the liquid cooling water channel module has water channels inside that can control water pressure loss and water flow rate.

[0006] Furthermore, the cooling unit also includes a support plate, a hot and cold liquid semiconductor, and a cooling plate. The two ends of the support plate are fixedly connected to the lower shell. A cooling water channel module is installed on one side of the support plate, and a cooling plate is installed on the other side. A liquid-cooled semiconductor is fixedly installed on the side of the cooling plate closest to the support plate.

[0007] Furthermore, the liquid cooling water channel module has a cavity structure with several baffles inside, forming several interconnected water channels, the two ends of which are connected to a drain pipe and an inlet pipe, respectively.

[0008] Furthermore, the sub-board is fixedly connected to the lower shell, and the space between the chip on the sub-board and the lower shell is filled with thermal grease.

[0009] Furthermore, the gap between the motherboard chip and the liquid cooling channel module is filled with thermal grease.

[0010] Furthermore, the support plate is rectangular.

[0011] Furthermore, the support plate has a rectangular frame structure.

[0012] Furthermore, a heat dissipation hole is provided on one side of the upper shell.

[0013] Compared with existing technologies, the controllable liquid cooling heat dissipation device of this utility model has the following advantages:

[0014] (1) The controllable liquid cooling heat dissipation device of this utility model has a cooling unit that effectively solves the problem of the chip needing a large amount of heat dissipation and rapid cooling, so that the chip can be used in the high frequency band.

[0015] (2) The controllable liquid cooling heat dissipation device described in this utility model can also achieve the purpose of heat dissipation by increasing the flow rate of the water channel in the cooling water channel module as the chip is upgraded and functional modules are added, making it more practical.

[0016] Another objective of this invention is to provide an in-vehicle domain controller device to solve the problem of the need for large-scale and rapid heat dissipation of chips.

[0017] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0018] An on-board domain controller device, which uses a controllable liquid cooling heat dissipation device.

[0019] The advantages of the vehicle-mounted domain controller device over the prior art are the same as those of the aforementioned controllable liquid cooling heat dissipation device, and will not be repeated here. Attached Figure Description

[0020] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0021] Figure 1 This is an exploded view of the controllable liquid cooling heat dissipation device described in an embodiment of the present invention;

[0022] Figure 2 This is a cross-sectional view of the cooling water channel module described in an embodiment of this utility model.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1-Upper shell; 2-Main board; 3-Cooling water channel module; 31-Drain pipe; 32-Inlet pipe; 33-Water channel; 34-Baffle; 4-Support plate; 5-Hot and cold liquid semiconductor; 6-Cooling plate; 7-Sub-board; 8-Lower shell; 9-Rear shell. Detailed Implementation

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] A controllable liquid cooling heat dissipation device, such as Figure 1 and Figure 2 As shown, the structure includes an upper shell 1, a main board 2, a cooling water channel module 3, a support plate 4, a hot and cold liquid semiconductor 5, a cooling plate 6, a sub-plate 7, a lower shell 8, and a rear shell 9. The upper shell 1, lower shell 8, and rear shell 9 are connected to form a rectangular shell structure. Inside the rectangular shell, from top to bottom, the main board 2, the cooling unit, and the sub-plate 7 are installed sequentially. The cooling unit is used to cool and dissipate heat from the main board 2 and the sub-plate 7. The cooling unit includes a liquid cooling water channel module 3, which has water channels 33 inside that can control water pressure loss and water flow rate.

[0030] The cooling unit also includes a support plate 4, a liquid-cooled semiconductor 5, and a cooling plate 6. The two ends of the support plate 4 are fixedly connected to the lower shell 8. A cooling water channel module 3 is installed on one side of the support plate 4, and a cooling plate 6 is installed on the other side. The liquid-cooled semiconductor 5 is fixedly installed on the side of the cooling plate 6 closest to the support plate 4. This structure allows the cooling plate 6 to concentrate heat, which is then dissipated through the liquid-cooled semiconductor 5.

[0031] The power of the hot and cold liquid semiconductor 5 can be selected or modified according to the heat dissipation of the main board 2 and the sub-board 7.

[0032] The upper shell 1 also has heat dissipation holes on one side.

[0033] The sub-board 7 is fixedly connected to the lower shell 8, and the space between the chip on the sub-board 7 and the lower shell 8 is filled with thermal grease.

[0034] The gap between the chip on the motherboard 2 and the liquid cooling channel module 3 is filled with thermal grease.

[0035] In one or more embodiments, the support plate 4 is rectangular. In one or more embodiments, when the heat dissipation of the chip is relatively large, the support plate 4 is a rectangular frame structure used to cooperate with the water channel heat dissipation of the liquid cooling module.

[0036] The liquid cooling water channel module 3 has a cavity structure with several baffles 34 inside. The baffles 34 form several interconnected water channels 33. The two ends of the water channels 33 are connected to the drain pipe 31 and the inlet pipe 32, respectively. The water channels 33 are used to change the speed and pressure loss of the water flow, thereby achieving the purpose of controlling the water pressure loss and water flow speed. After the water flow enters the water channel 33 from the inlet pipe 32, it will be evenly dispersed by the baffles 34, so the water flow speed and direction can be controlled. Then, the baffles 34 will also guide the water flow from the inlet pipe 32 to the drain pipe 31, effectively avoiding the generation of eddies in the water flow that would cause excessive water pressure loss, thereby helping the main board 2 and the sub-board 7 to dissipate heat fully.

[0037] An in-vehicle domain controller device is an in-vehicle domain controller device that uses a controllable liquid cooling heat dissipation device.

[0038] The working principle of a controllable liquid cooling heat dissipation device is as follows:

[0039] Sub-board 7 is fixed to lower shell 8. The gap between the chip on sub-board 7 and lower shell 8 is filled with thermal grease and fixed with bolts. Hot and cold semiconductor 5 is fixed to cooling plate 6. Liquid cooling channel module 3 is fixed to support plate 4 with bolts and tape. The gap between them is filled with thermal grease. Cooling plate 6 is fixed to support plate 4 with bolts or welding. The whole assembly is fixed to lower shell 8 with bolts. Mainboard 2 is fixed to lower shell 8 with bolts. The gap between the chip on mainboard 2 and liquid cooling channel module 3 is filled with thermal grease. Upper shell 1 is assembled with lower shell 8 and fixed with bolts. Through liquid cooling channel module 3, hot and cold semiconductor 5 and cooling plate 6, heat dissipation of mainboard 2 and sub-board 7 is accelerated, enabling it to operate at high performance and maintain junction temperature within the specified range.

[0040] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A controllable liquid cooling heat dissipation device, characterized in that: The device includes an upper shell, a lower shell, and a rear shell that, when connected, form a rectangular shell structure. Inside the rectangular shell, from top to bottom, a main board, a cooling unit, and a sub-board are installed sequentially. The cooling unit is used to cool and dissipate heat from the main board and the sub-board. The cooling unit includes a liquid cooling channel module, which has channels inside that can control water pressure loss and water flow rate.

2. The controllable liquid cooling heat dissipation device according to claim 1, characterized in that: The cooling unit also includes a support plate, a hot and cold liquid semiconductor, and a cooling plate. The two ends of the support plate are fixedly connected to the lower shell. A cooling water channel module is installed on one side of the support plate, and a cooling plate is installed on the other side. A liquid-cooled semiconductor is fixedly installed on the side of the cooling plate closest to the support plate.

3. The controllable liquid cooling heat dissipation device according to claim 1, characterized in that: The liquid cooling water channel module has a cavity structure with several baffles inside. The baffles form several interconnected water channels, and the two ends of the water channels are connected to the drain pipe and the inlet pipe, respectively.

4. The controllable liquid cooling heat dissipation device according to claim 1, characterized in that: The sub-board is fixedly connected to the lower shell, and the space between the chip on the sub-board and the lower shell is filled with thermal grease.

5. The controllable liquid cooling heat dissipation device according to claim 1, characterized in that: The gap between the motherboard chips and the liquid cooling channel module is filled with thermal grease.

6. The controllable liquid cooling heat dissipation device according to claim 2, characterized in that: The support plate is rectangular.

7. The controllable liquid cooling heat dissipation device according to claim 2, characterized in that: The support plate is a rectangular frame structure.

8. The controllable liquid cooling heat dissipation device according to claim 1, characterized in that: The upper shell also has ventilation holes on one side.

9. A vehicle-mounted domain controller device, characterized in that: The controllable liquid cooling heat dissipation device according to any one of claims 1 to 8 is applied.

Images