Radial synthesis radiator and radial synthesizer thereof
By using a radially synthesized heat sink design, heat exchange is achieved through connecting rods and heat sink modules, which solves the problem of large heat sink size and independence from the power amplifier in the prior art, and realizes the heat dissipation reliability and miniaturization of high power amplifiers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-04-03
AI Technical Summary
Existing heat dissipation designs are not suitable for radial synthesis, resulting in large heat sinks that are separate from the power amplifier, which cannot meet the heat dissipation requirements of high power applications.
The radially synthesized radiator design includes an upper radiator mounting plate, an upper radiator baffle, a lower radiator baffle and a lower radiator mounting plate, connecting rods and a ring array of radiator modules. Heat exchange, support and heat dissipation are achieved through heat pipes and radiator modules.
It achieves a simple structure and reliable heat dissipation, meeting the miniaturization and integration design requirements of high-power amplifiers.
Smart Images
Figure CN224083905U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radial synthesis heat dissipation technology, and in particular to a radial synthesis heat sink and its radial synthesizer. Background Technology
[0002] With the development of the communications industry, the output power requirements for power amplifiers in many application areas, such as EMC testing, electronic countermeasures, and satellite communications, are increasing dramatically from tens of watts to hundreds or even thousands of watts. Currently, the single-tube output power of GaN power amplifier chips in the K and Ka bands is only between 10 and 40 watts. Therefore, to obtain greater output power, multi-channel combining is required.
[0003] Currently, the heat dissipation design of existing power amplifiers generally involves eutectic bonding of the heat source (i.e., the GaN chip) to a carrier board, then securing it to the bottom of a unified cavity with screws. Finally, a heat pipe or profile heat sink is fitted to the bottom of the cavity, and heat is dissipated by air cooling. Traditional heat dissipation designs are relatively large, and the power amplifier and heat sink are typically separate modules. Therefore, this heat dissipation method is not suitable for radial combining; it can only be used for traditional power dividers, bridge circuits, and other combining methods.
[0004] Therefore, there is an urgent need to propose a radially synthesized radiator with a simple structure and reliable heat dissipation, as well as its radial synthesizer. Utility Model Content
[0005] To address the aforementioned problems, the purpose of this utility model is to provide a radially synthesized heat sink and its radial synthesizer. The technical solution adopted by this utility model is as follows:
[0006] A radially synthesized heat sink for dissipating heat from a radially synthesized power amplifier includes, from top to bottom, an upper heat sink mounting plate, an upper heat sink baffle, a lower heat sink baffle, and a lower heat sink mounting plate; connecting rods connected to the upper heat sink mounting plate, the upper heat sink baffle, the lower heat sink baffle, and the lower heat sink mounting plate; several heat sink modules arranged in a ring array around the perimeter of the upper heat sink mounting plate, the upper heat sink baffle, the lower heat sink baffle, and the lower heat sink mounting plate; several heat dissipation pipes with one end placed inside the heat sink modules; and a power amplifier mounting base fixed to the other end of the heat dissipation pipes. The power amplifier is fixed on the power amplifier mounting base and transfers heat to the heat dissipation pipes and heat sink modules.
[0007] Furthermore, the radiator module is provided with several heat dissipation slots; the upper radiator baffle and the lower radiator baffle are engaged in the heat dissipation slots.
[0008] Furthermore, the heat sink module is in the shape of a segmented arc.
[0009] A radial combiner includes a power divider and a combiner, an upper heat sink mounting plate, an upper heat sink baffle, a lower heat sink baffle, and a lower heat sink mounting plate arranged sequentially from top to bottom and positioned between the power divider and the combiner, a connecting rod connected to the upper heat sink mounting plate, the upper heat sink baffle, the lower heat sink baffle, and the lower heat sink mounting plate, and several single-channel power amplifier components arranged in a ring array and positioned between the power divider and the combiner; each of the single-channel power amplifier components includes a cable transmission module and a power amplifier connected between the power divider and the combiner, a heat sink module fixedly connected to the upper heat sink mounting plate, the upper heat sink baffle, the lower heat sink baffle, and the lower heat sink mounting plate, several heat pipes with one end placed inside the heat sink module, and a power amplifier mounting base fixed to the other end of the heat pipes; the power amplifier is fixed on the power amplifier mounting base and transfers heat to the heat pipes and the heat sink module.
[0010] Furthermore, several U-shaped grooves are provided on the upper radiator fixing plate, the upper radiator baffle, the lower radiator baffle, and the lower radiator fixing plate; the cable transmission modules are respectively installed in the U-shaped grooves.
[0011] Compared with the prior art, the present invention has the following beneficial effects:
[0012] This utility model supports several radiator modules arranged in a ring array by setting up connecting rods, upper radiator fixing plates, upper radiator baffles, lower radiator baffles, and lower radiator fixing plates, ensuring the reliability of their support.
[0013] This invention sets up a power amplifier and a cable transmission module between the power divider and the combiner, and uses heat pipes and heat sink modules to exchange the heat generated by the power amplifier, ensuring its heat dissipation reliability.
[0014] The single-channel power amplifier component of this invention adopts a ring array layout, which meets the requirements of integration and miniaturization design.
[0015] In summary, this utility model has the advantages of simple structure and reliable heat dissipation. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the radial synthesis structure of this utility model.
[0018] Figure 2 This is a schematic diagram of the first layout of the single-channel power amplifier component of this utility model.
[0019] Figure 3 This is a second layout diagram of the single-channel power amplifier component of this utility model.
[0020] Figure 4 This is a first-angle structural diagram of the power amplifier mounting base, heat pipe, and heat sink module of this utility model.
[0021] Figure 5 This is a second-angle structural diagram of the power amplifier mounting base, heat pipe, and heat sink module of this utility model.
[0022] In the above figures, the component names corresponding to the reference numerals are as follows:
[0023] 1. Power divider; 2. Single-channel power amplifier assembly; 3. Combiner; 4. Connecting rod; 5. Upper heat sink mounting plate; 6. Upper heat sink baffle; 7. Lower heat sink baffle; 8. Lower heat sink mounting plate; 21. Power amplifier; 22. Cable transmission module; 23. Power amplifier mounting bracket; 24. Heat pipe; 25. Heat sink module; 251. Heat sink groove. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of this utility model include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0025] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.
[0026] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.
[0027] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.
[0028] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.
[0029] like Figures 1 to 5 As shown, this embodiment provides a radial combiner, which includes a power divider 1 and a combiner 3. From top to bottom, an upper heat sink mounting plate 5, an upper heat sink baffle 6, a lower heat sink baffle 7, and a lower heat sink mounting plate 8 are arranged between the power divider 1 and the combiner 3. Connecting rods 4 are connected to the upper heat sink mounting plate 5, the upper heat sink baffle 6, the lower heat sink baffle 7, and the lower heat sink mounting plate 8. Several single-channel power amplifier components 2 are arranged in a ring array between the power divider 1 and the combiner 3. Several U-shaped grooves are formed on the upper heat sink mounting plate 5, the upper heat sink baffle 6, the lower heat sink baffle 7, and the lower heat sink mounting plate 8, and cable transmission modules 22 are correspondingly arranged in the U-shaped grooves.
[0030] Additionally, each single-channel power amplifier assembly 2 includes a cable transmission module 22 and a power amplifier 21 connected between the power divider 1 and the combiner 3, a heat sink module 25 fixedly connected to the upper heat sink mounting plate 5, the upper heat sink baffle 6, the lower heat sink baffle 7, and the lower heat sink mounting plate 8, several heat dissipation pipes 24 with one end placed inside the heat sink module 25, and a power amplifier mounting base 23 fixed to the other end of the heat dissipation pipes 24. Several heat dissipation slots 251 are provided on the heat sink module 25, and the upper heat sink baffle 6 and the lower heat sink baffle 7 are secured within the heat dissipation slots 251. In this embodiment, the power amplifier 21 is fixed on the power amplifier mounting base 23 and transfers heat to the heat dissipation pipes 24 and the heat sink module 25. In this embodiment, several heat sink modules 25 together form a cylindrical shape, and one heat sink module 25 is in a segmented arc shape.
[0031] In this embodiment, the input signal is divided into 10 paths by the power divider 1 and transmitted from the cable transmission module 22 to the power amplifier 21. Power amplification is performed within the power amplifier 21, and the heat generated during amplification is transferred to the heat sink 24 and the heat sink module 25. In this embodiment, the amplified signal is then synthesized in the synthesizer 3.
[0032] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any changes made based on the design principles of this utility model, or any non-creative changes made on this basis, shall fall within the scope of protection of this utility model.
Claims
1. A radially synthesized heat sink for dissipating heat from a radially synthesized power amplifier (21), characterized in that, The system includes an upper radiator mounting plate (5), an upper radiator baffle (6), a lower radiator baffle (7), and a lower radiator mounting plate (8) arranged sequentially from top to bottom; connecting rods (4) connected to the upper radiator mounting plate (5), the upper radiator baffle (6), the lower radiator baffle (7), and the lower radiator mounting plate (8); several radiator modules (25) arranged in a ring array around the four edges of the upper radiator mounting plate (5), the upper radiator baffle (6), the lower radiator baffle (7), and the lower radiator mounting plate (8); several heat pipes (24) with one end placed inside the radiator module (25); and a power amplifier mounting base (23) fixed to the other end of the heat pipes (24); the power amplifier (21) is fixed on the power amplifier mounting base (23) and transfers heat to the heat pipes (24) and the radiator module (25).
2. The radially synthesized heat sink according to claim 1, characterized in that, The radiator module (25) is provided with several heat dissipation slots (251); the upper radiator baffle (6) and the lower radiator baffle (7) are fitted into the heat dissipation slots (251).
3. A radially synthesized heat sink according to claim 1 or 2, characterized in that, The heat sink module (25) is in the shape of a split arc.
4. A radial synthesizer, characterized in that, The system includes a power divider (1) and a combiner (3), an upper heat sink mounting plate (5), an upper heat sink baffle (6), a lower heat sink baffle (7), and a lower heat sink mounting plate (8) arranged sequentially from top to bottom between the power divider (1) and the combiner (3), a connecting rod (4) connected to the upper heat sink mounting plate (5), the upper heat sink baffle (6), the lower heat sink baffle (7), and the lower heat sink mounting plate (8), and several single-channel power amplifier components (2) arranged in a ring array between the power divider (1) and the combiner (3); each of the single-channel power amplifier components (2) includes a power amplifier assembly connected to the power divider assembly (1) and the combiner (3). The cable transmission module (22) between the rate distributor (1) and the synthesizer (3) and the power amplifier (21), the heat sink module (25) fixedly connected to the upper heat sink mounting plate (5), the upper heat sink baffle (6), the lower heat sink baffle (7) and the lower heat sink mounting plate (8), several heat sink pipes (24) with one end placed in the heat sink module (25), and the power amplifier mounting base (23) fixed to the other end of the heat sink pipes (24); the power amplifier (21) is fixed on the power amplifier mounting base (23) and transfers heat to the heat sink pipes (24) and the heat sink module (25).
5. A radial synthesizer according to claim 4, characterized in that, Several U-shaped grooves are provided on the upper radiator fixing plate (5), upper radiator baffle (6), lower radiator baffle (7) and lower radiator fixing plate (8); the cable transmission module (22) is set in the U-shaped grooves one by one.
6. A radial synthesizer according to claim 4, characterized in that, The radiator module (25) is provided with several heat dissipation slots (251); the upper radiator baffle (6) and the lower radiator baffle (7) are fitted into the heat dissipation slots (251).