Computer and circulation system

Abstract

The utility model discloses a computer and circulation system, and relates to the technical field of server heat dissipation, the computer and circulation system comprises a box body, a server and a plurality of liquid cooling coil pipes, the server is arranged in the accommodating cavity; the plurality of liquid cooling coils are sequentially connected end to end and are distributed on at least two different outer surface sides of the server, and the plane where each liquid cooling coil is located is parallel to the corresponding outer surface of the same side of the server; wherein at least one liquid cooling coil pipe in the plurality of liquid cooling coil pipes comprises a coil pipe body and a buffer part, the buffer part is arranged on the coil pipe body, the buffer part is provided with a buffer cavity used for communicating with the coil pipe body, and the buffer cavity is used for temporarily storing part of the liquid cooling fluid so as to increase the heat exchange area of the liquid cooling coil pipe. According to the invention, the technical problems of unreasonable cooling flow channel structural form design, less fluid cold water amount and poor heat dissipation capability of the liquid cooling server cold plate in the prior art are solved, and the technical effect of effective heat dissipation of the server is achieved.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and more particularly to computers and circulation systems. Background Technology

[0002] In existing technologies, the heat dissipation method for low heat density modules of servers is usually air cooling. As the performance of servers improves, their internal heat density also increases. The heat of high heat density modules cannot be effectively dissipated by pure air cooling, resulting in an increase in the internal temperature of the server, which seriously affects the operational stability and lifespan of the server. Especially in non-professional data center environments, where there is a lack of sufficient cooling conditions, the heat dissipation problem of servers is even more severe.

[0003] As a result, data communication equipment centers have gradually adopted liquid-cooled server chassis, which mainly utilize the circulation of liquid in the cooling channels of the cold plate to remove heat from the inside of the chassis through the cold plate structure.

[0004] However, the existing liquid-cooled server cold plates have an unreasonable cooling channel structure design, with a small amount of fluid cooling water and weak heat dissipation capacity. Utility Model Content

[0005] This application provides a computer and a circulation system to at least solve the problems of unreasonable cooling channel structure design, insufficient fluid cooling water volume, and weak heat dissipation capacity in liquid-cooled server cold plates in related technologies.

[0006] This application provides a computer, including a chassis, a server, and multiple liquid cooling coils. The chassis has a receiving cavity; the server is disposed within the receiving cavity; the multiple liquid cooling coils are connected end to end and distributed on at least two different outer surface sides of the server, and the plane of each liquid cooling coil is parallel to the corresponding outer surface of the server on the same side; wherein at least one of the multiple liquid cooling coils includes a coil body and a buffer section, the buffer section is disposed on the coil body, and the buffer section has a buffer cavity for communicating with the coil body, the buffer cavity being used to temporarily store a portion of the liquid cooling fluid to increase the heat exchange area of ​​the liquid cooling coil.

[0007] In one exemplary embodiment, the cross-sectional area of ​​the buffer cavity is larger than the cross-sectional area of ​​the coil body.

[0008] In one exemplary embodiment, the buffer section includes a buffer ball having a buffer cavity, and the diameter of the buffer ball is larger than the diameter of the coil body; and / or, the buffer section includes a buffer tube segment having a buffer cavity, and the diameter of the buffer tube segment is larger than the diameter of the coil body.

[0009] In one exemplary embodiment, there are multiple buffer balls, which are spaced apart on the coil body and staggered in the radial direction from the outside to the inside of the liquid cooling coil; or, there are multiple buffer tube segments, which are spaced apart on the coil body and staggered in the radial direction from the outside to the inside of the liquid cooling coil; or, the buffer section includes multiple buffer balls and multiple buffer tube segments, which are arranged crosswise on the coil body.

[0010] In one exemplary embodiment, there are multiple buffer balls, which are spaced apart on the coil body. In the radial direction of the liquid cooling coil from the outside to the inside, the diameter of the inner buffer ball is smaller than that of the outer buffer ball. Alternatively, there are multiple buffer tube segments, which are spaced apart on the coil body. In the radial direction of the liquid cooling coil from the outside to the inside, the diameter of the inner buffer tube segment is smaller than that of the outer buffer tube segment.

[0011] In one exemplary embodiment, at least two liquid cooling coils correspond to the same outer surface of the server.

[0012] In one exemplary embodiment, the computer further includes a soundproofing structure disposed on the cavity wall of the receiving cavity.

[0013] In one exemplary embodiment, the enclosure also has louvers, and the computer also includes a cooling structure disposed within the housing cavity and located at the louvers.

[0014] In one exemplary embodiment, the computer also includes a cover that covers the opening of the receiving cavity, and the opening of the receiving cavity is disposed opposite to the louvers.

[0015] This application also provides a circulation system, including a computer, an input pipe, an output pipe, and a water storage tank, wherein the computer is the aforementioned computer; the first end of the input pipe is connected to an external liquid cooling source, and the second end of the input pipe is connected to the liquid cooling coil located at the head of a plurality of liquid cooling coils; the first end of the output pipe is connected to the liquid cooling coil located at the tail of a plurality of liquid cooling coils; and the second end of the output pipe is connected to the water storage tank.

[0016] This application ensures reliable heat dissipation for the server by connecting multiple liquid cooling coils sequentially end-to-end and distributing them on at least two different outer surfaces of the server. The plane of each liquid cooling coil is parallel to the corresponding outer surface of the server on the same side. Furthermore, by configuring at least one of the liquid cooling coils into a structure including a coil body and a buffer section, with the buffer section located on the coil body and having a buffer cavity for communicating with the coil body to temporarily store a portion of the liquid cooling fluid, the heat exchange area of ​​the liquid cooling coil is increased, further improving the heat exchange efficiency and reliability of the liquid cooling coil for the heat generated by the server. Therefore, this application solves the technical problems of unreasonable cooling channel structure design, insufficient fluid cooling water volume, and weak heat dissipation capacity in related technologies for liquid-cooled server cold plates, achieving effective heat dissipation for the server. Attached Figure Description

[0017] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the layout of a circulatory system provided in an embodiment of this application;

[0019] Figure 2 for Figure 1 A schematic diagram of the liquid cooling coil structure of a computer's circulating system.

[0020] The above figures include the following reference numerals:

[0021] 1. Input pipe; 2. Output pipe; 3. Water storage tank; 4. Pump body structure; 5. Check valve;

[0022] 10. Box body; 11. Receiving cavity; 12. Louvers;

[0023] 20. Server;

[0024] 30. Liquid cooling coil; 31. Coil body; 32. Buffer section;

[0025] 40. Sound insulation structure; 50. Air-cooled structure; 60. Lid; 70. Support feet. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0027] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] In existing technologies, the heat dissipation method for low heat density modules of servers is usually air cooling. As the performance of servers improves, their internal heat density also increases. The heat of high heat density modules cannot be effectively dissipated by pure air cooling, resulting in an increase in the internal temperature of the server, which seriously affects the operational stability and lifespan of the server. Especially in non-professional data center environments, where there is a lack of sufficient cooling conditions, the heat dissipation problem of servers is even more severe.

[0029] As a result, data communication equipment centers have gradually adopted liquid-cooled server chassis, which mainly utilize the circulation of liquid in the cooling channels of the cold plate to remove heat from the inside of the chassis through the cold plate structure.

[0030] However, the existing liquid-cooled server cold plate has an unreasonable cooling channel structure design, with a small amount of fluid cooling water and weak heat dissipation capacity. Therefore, a computer and circulation system is proposed.

[0031] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] The embodiments of this application provide a computer and a circulatory system. The device is described in detail in conjunction with the structure and working principle of the computer and the circulatory system (the technical terms involved must be explained).

[0033] like Figure 1 and Figure 2 As shown, the computer includes a chassis 10, a server 20, and multiple liquid cooling coils 30. The chassis 10 has a receiving cavity 11. The server 20 is disposed within the receiving cavity 11. The multiple liquid cooling coils 30 are connected end to end and distributed on at least two different outer surface sides of the server 20. The plane of each liquid cooling coil 30 is parallel to the corresponding outer surface of the server 20 on the same side. At least one of the multiple liquid cooling coils 30 includes a coil body 31 and a buffer section 32. The buffer section 32 is disposed on the coil body 31 and has a buffer cavity for communicating with the coil body 31. The buffer cavity is used to temporarily store a portion of the liquid cooling fluid to increase the heat exchange area of ​​the liquid cooling coil 30.

[0034] This application connects multiple liquid cooling coils 30 sequentially end-to-end and distributes them on at least two different outer surfaces of the server 20. The plane of each liquid cooling coil 30 is parallel to the corresponding outer surface of the server 20 on the same side, ensuring reliable heat dissipation for the server 20. Furthermore, by configuring at least one of the multiple liquid cooling coils 30 into a structure including a coil body 31 and a buffer section 32, with the buffer section 32 disposed on the coil body 31 and having a buffer cavity for communicating with the coil body 31, the buffer cavity temporarily stores a portion of the liquid cooling fluid, thereby increasing the heat exchange area of ​​the liquid cooling coil 30 and further improving the heat exchange efficiency and reliability of the liquid cooling coil 30 for the heat generated by the server 20. Therefore, this application solves the technical problems of unreasonable cooling channel structure design, insufficient fluid cooling water volume, and weak heat dissipation capacity in related technologies for liquid-cooled server cold plates, achieving effective heat dissipation for the server 20.

[0035] Furthermore, by connecting multiple liquid cooling coils 30 end to end to form a continuous liquid cooling path, the liquid cooling fluid is evenly distributed on different outer surfaces of the server 20, optimizing the heat dissipation effect, making the heat dissipation of the server 20 more balanced, avoiding local overheating, and improving the overall heat dissipation efficiency of the server 20. It is especially suitable for server environments that require long-term stable operation, and can effectively improve the operational reliability and service life of the server 20.

[0036] In some embodiments, the inlets and outlets of multiple liquid cooling coils 30 are connected end-to-end to form a series circulation system. The inlet of the liquid cooling coil 30 located at the beginning is connected to an external water supply, such as a tap water pipe, through an input pipe 1 to ensure a continuous supply of coolant. The outlet of the liquid cooling coil 30 located at the end is connected to the upper part of a water storage tank 3 (i.e., a water heater) through an output pipe 2, converting the heat energy generated during the operation of the server 20 into usable hot water, reducing the use of electric water heaters, and achieving energy efficiency and environmental protection goals.

[0037] In some embodiments, the cross-sectional area of ​​the buffer cavity is greater than the cross-sectional area of ​​the coil body 31.

[0038] In some embodiments, the buffer section 32 includes a buffer ball having a buffer cavity, and the diameter of the buffer ball is larger than the diameter of the coil body 31; and / or, the buffer section 32 includes a buffer tube segment having a buffer cavity, and the diameter of the buffer tube segment is larger than the diameter of the coil body 31.

[0039] In some embodiments, there are multiple buffer balls, which are spaced apart on the coil body 31 and staggered in the radial direction from the outside to the inside of the liquid cooling coil 30; or, there are multiple buffer tube segments, which are spaced apart on the coil body 31 and staggered in the radial direction from the outside to the inside of the liquid cooling coil 30; or, the buffer section 32 includes multiple buffer balls and multiple buffer tube segments, which are arranged crosswise on the coil body 31.

[0040] like Figure 2 As shown, multiple buffer balls are staggered radially and from the outside inward in the liquid cooling coil 30. This staggered distribution of the buffer balls increases the flow path of the liquid cooling fluid, enhances the turbulence, and thus improves heat transfer performance. This allows for more complete flow of the liquid cooling fluid on the coil body 31, facilitating an increase in heat transfer area and significantly improving heat dissipation efficiency. This design is suitable for server environments with high heat dissipation requirements and can effectively meet the heat dissipation needs of servers operating under high load.

[0041] In some embodiments, there are multiple buffer balls, which are spaced apart on the coil body 31. In the radial direction of the liquid cooling coil 30 from the outside to the inside, the diameter of the inner buffer ball is smaller than that of the outer buffer ball. Alternatively, there are multiple buffer tube segments, which are spaced apart on the coil body 31. In the radial direction of the liquid cooling coil 30 from the outside to the inside, the diameter of the inner buffer tube segment is smaller than that of the outer buffer tube segment.

[0042] like Figure 2 As shown, the diameter of the buffer spheres located on the inner ring side is smaller than that of the buffer spheres located on the outer ring side. This variation in the diameter of the buffer spheres creates a gradual fluid channel, optimizing the flow characteristics of the liquid cooling fluid and increasing the turbulence within the channel, thereby enhancing the heat exchange effect. The implementation results in more uniform flow of the liquid cooling fluid on the coil body 31, better heat dissipation, and the ability for the server to maintain a stable operating temperature under high load. This is suitable for server environments that require processing large amounts of data and complex computing tasks, effectively improving the server's heat dissipation capacity and operational stability.

[0043] In some embodiments, at least two liquid cooling coils 30 correspond to the same outer surface of the server 20. This increases the number of liquid cooling coils 30 on the same outer surface, thereby increasing the contact area between the liquid cooling fluid and the outer surface of the server 20, further optimizing the heat dissipation effect, and significantly improving the heat dissipation capacity of the server 20. This effectively meets the heat dissipation requirements of high heat density modules, maintains the operational stability of the server 20, and extends its service life. It is suitable for server environments that require processing high-density computing tasks, and effectively improves the server's heat dissipation capacity and operating efficiency.

[0044] It should be noted that in this application, the coil body 31 has a mosquito coil-like structure.

[0045] like Figure 1 As shown, the computer also includes a soundproof structure 40, which is disposed on the cavity wall of the receiving cavity 11. Thus, the soundproof structure 40 effectively isolates the noise generated during the operation of the server 20, providing users with a quieter working environment. This effectively controls noise during computer operation, improving user comfort and making it suitable for noise-sensitive environments, providing users with a quieter and more comfortable working and living environment.

[0046] In some embodiments, the sound insulation structure 40 is sound insulation cotton, which is tightly fitted to the inner wall of the enclosure 10 to effectively absorb the noise generated during the operation of the server 20, creating a quiet working environment. The thickness and density of the sound insulation cotton can be adjusted according to the noise level of the server 20 to ensure optimal noise reduction.

[0047] like Figure 1 As shown, the enclosure 10 also features louvers 12, and the computer further includes a cooling structure 50, which is located within the housing 11 and at the louvers 12. This louver 12 optimizes airflow between the inside and outside of the enclosure 10, while ensuring internal safety and dust prevention. It also allows heat to dissipate effectively from the enclosure 10, preventing dust from entering, maintaining server stability, and extending service life. This design is suitable for environments requiring controlled airflow between the inside and outside of the enclosure 10, effectively improving server heat dissipation and operational safety.

[0048] It should be noted that in this application, the louvers 12 not only help with ventilation and noise reduction, but also serve as the entry point for the network cable and power cord of the server 20, ensuring the dryness and safety of the interior of the enclosure 10.

[0049] Furthermore, by setting up the air-cooled structure 50, the air-cooled structure 50 and the liquid cooling coil 30 work together to further optimize the heat dissipation effect of the server. When the server 20 is running under high load, the air-cooled structure 50 can promptly supplement the heat dissipation demand that the liquid cooling coil 30 cannot cover. This maintains the server's operational stability and extends its service life. It also helps to prevent moisture from appearing inside the housing cavity 11 of the enclosure 10 caused by liquid cooling. This is suitable for server environments that need to process large amounts of data and perform complex computing tasks, and can effectively improve the server's heat dissipation capacity and operating efficiency.

[0050] It should be noted that in this application, the louver 12 not only serves as the outer shell of the air-cooled structure 50 (fan), but also has a specially designed cable entry channel, which allows the network cable and power cable of the server 20 to pass through safely and orderly, avoiding poor heat dissipation and safety hazards that may be caused by messy cables. The blade angle of the louver 12 can be adjusted to adapt to different ventilation needs, while reducing interference from external noise.

[0051] like Figure 1 As shown, the computer also includes a cover 60, which covers the opening of the receiving cavity 11, and the opening of the receiving cavity 11 is positioned opposite to the louver 12. In this way, the cover 60 protects the server from external environmental influences while facilitating server installation and maintenance. The implementation results in an optimized server operating environment, extended server lifespan, and improved ease of installation and maintenance. Application scenarios include data centers and corporate offices, and it is particularly suitable for server environments requiring frequent maintenance and upgrades, effectively improving server operational stability and maintenance efficiency.

[0052] Furthermore, the lid 60 is connected to the box body 10 by a latch.

[0053] In some embodiments, the cover 60 is connected to the enclosure 10 via a hinge structure, allowing the cover 60 to be easily opened and closed, facilitating the maintenance and upgrades of the server 20. Furthermore, the cover 60 is equipped with a latch to ensure that the cover 60 remains tightly closed while the server 20 is running, preventing accidental opening that could cause equipment damage or data security issues. The latch is designed with convenience and security in mind; users can easily lock and unlock it, while it is not easily opened by unauthorized personnel.

[0054] like Figure 1 As shown, the computer also includes a support foot 70, which is located at the bottom of the housing 10.

[0055] In some embodiments, the support foot 70 has a height-adjustable structure to adapt to different ground conditions and ensure the stability of the box 10. In addition, the support foot 70 is covered with a rubber pad to reduce vibration and noise generated when the box 10 is placed, while providing anti-slip effect and increasing stability. The support foot 70 is connected to the wall through a bracket or placed directly on the ground, providing installation flexibility and facilitating use in different application scenarios.

[0056] like Figure 1 As shown, the circulation system includes a computer, an input pipe 1, an output pipe 2, and a water storage tank 3. The computer is the one described above and below. The first end of the input pipe 1 is connected to an external liquid cooling source, and the second end of the input pipe 1 is connected to the first liquid cooling coil 30 among multiple liquid cooling coils 30. The first end of the output pipe 2 is connected to the last liquid cooling coil 30 among multiple liquid cooling coils 30. The second end of the output pipe 2 is connected to the water storage tank 3. Thus, through the water storage tank 3, the hot water after heat exchange by the liquid cooling coils 30 is recycled and reused to provide domestic hot water for users, achieving efficient energy utilization. This effectively enhances the heat dissipation capacity of the liquid cooling coils 30 for the server, provides domestic hot water for users, reduces the use of household water heaters, and further reduces carbon emissions. It is suitable for server environments that require processing large amounts of data and complex computing tasks, effectively improving the server's heat dissipation capacity and operating efficiency. Simultaneously, it responds to the development trend of green data centers, achieving energy conservation, emission reduction, and user-friendliness.

[0057] It should be noted that, in a specific embodiment of this application, the water storage device 3 is selected as a water heater. In this way, the hot water after heat exchange can be directly guided into the water heater and stored in a warm place, which is convenient for users to use for showering. This can save some households the electricity consumption of water heaters and significantly reduce carbon emissions.

[0058] like Figure 1As shown, the output pipe 2 is also equipped with a pump body structure 4 and a check valve 5. The pump body structure 4 is closer to the housing 10 than the check valve 5. The pump body structure 4 is used to drive the coolant to circulate in multiple continuous liquid cooling coils 30. Its power and speed can be adjusted according to the heat load of the server 20 to achieve the best cooling effect. The check valve 5 ensures that the coolant flows in only one direction, preventing backflow and protecting the liquid cooling coils 30 and the server 20.

[0059] Using the computer provided in this application, server 20 can effectively avoid overheating issues under high-density computing and long-term working conditions, extending its service life and reducing maintenance costs. Simultaneously, the water storage tank 3 stores the heated water, providing domestic hot water to users, achieving efficient energy utilization, reducing the use of household water heaters, further reducing carbon emissions, and responding to the development trend of green data centers. Furthermore, the addition of the sound insulation structure 40 and the air-cooling structure 50 effectively controls the noise of server 20 during operation, providing users with a quieter and more comfortable working environment.

[0060] The computer's structural design in this application, through the optimized structure of the liquid cooling coil 30, the application of the sound insulation structure 40, the rational layout of the air-cooling structure 50 (i.e., the fan) and the louvers 12, and the shock-resistant design of the support feet 70, not only effectively reduces the noise of the server 20 during operation but also significantly improves energy efficiency, achieving the dual goals of low noise and low carbon emissions. Furthermore, by recycling the heated water to a water heater, electricity consumption is reduced, demonstrating efficient resource utilization and environmental friendliness, and providing an innovative solution for the sustainable development of the server industry.

[0061] The beneficial effects of this application are:

[0062] 1. Noise Reduction Design Enhances User Experience: This new server chassis utilizes sound-absorbing cotton and louvers to reduce noise. The sound-absorbing cotton covering the inner walls of the chassis effectively isolates noise generated inside the server, preventing disturbance to users. Furthermore, the louvered structure not only provides excellent ventilation but also further reduces noise generated by the fans. This design is particularly suitable for home or small office environments, providing users with a quieter and more comfortable workspace.

[0063] 2. High-efficiency liquid cooling system improves heat dissipation efficiency. Traditional forced air cooling methods can no longer meet the heat dissipation requirements of high heat density modules, while liquid cooling technology exhibits higher heat exchange efficiency. This invention adopts a liquid cooling coil structure, achieving efficient heat exchange through tap water circulation. The liquid cooling coil adopts a serpentine coil design and is equipped with multiple buffer balls, increasing the storage capacity of cold water and the heat exchange area, thereby improving the overall cooling effect. Compared with traditional air cooling, the liquid cooling system can more effectively remove heat from the server's interior, extending the equipment's lifespan and reducing the failure rate caused by overheating.

[0064] 3. Green and Environmentally Friendly, Energy-Saving and Emission-Reducing: A major highlight of this design is the integration of a liquid cooling system with a water heater. Waste heat generated during server operation is used to heat water, which is then stored in the water heater for later use. This innovation not only achieves water resource recycling but also significantly reduces the demand for electric water heaters in homes and offices, saving electricity. Statistics show that this design can substantially reduce carbon emissions, aligning with the current global advocacy for green and energy-saving principles. For businesses and individual users, this not only helps save energy costs but also demonstrates corporate social responsibility.

[0065] 4. Flexible Installation, Adaptable to Multiple Scenarios: The server chassis design takes into account the diversity of practical application scenarios. The chassis bottom features rubber-padded feet, allowing for wall mounting via brackets or direct floor placement, enabling users to choose the appropriate installation method based on their needs. Furthermore, the chassis cover employs a hinged design with locking latches for easy maintenance and repair. Power cables and network cables are routed through louvers, ensuring the interior of the chassis remains dry and preventing short circuits caused by moisture.

[0066] 5. Enhanced Safety and Stability: To ensure system stability and safety, a water pump and check valve are incorporated into the design. When the tap water pressure is insufficient, the water pump automatically starts to pump water, ensuring the normal operation of the liquid cooling system. The check valve prevents warm water backflow, avoiding unnecessary energy loss. These detailed design features not only improve system reliability but also enhance the user experience.

[0067] 6. Combining Economy and Practicality: From an economic perspective, this design reduces electricity costs by decreasing reliance on electric water heaters. Simultaneously, its efficient heat dissipation reduces the risk of hardware damage due to overheating, indirectly saving on maintenance costs. Furthermore, this design can be applied to large-scale facilities such as data centers, further reducing costs and improving overall efficiency through large-scale application. In summary, the server chassis with its low-noise, low-carbon structural design proposed in this invention significantly improves user experience, reduces energy consumption, and extends equipment lifespan through innovative noise reduction, liquid cooling, and hot water recovery systems. It also demonstrates extremely high economic and social benefits in practical applications. It not only meets the modern user's demand for high performance, low noise, energy saving, and environmental protection, but also provides new ideas and development directions for future server design.

[0068] The foregoing has provided a detailed description of a computer and a cyclic system provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A computer, characterized in that, include: The housing (10) has a receiving cavity (11); Server (20), the server (20) being disposed within the receiving cavity (11); Multiple liquid cooling coils (30) are connected end to end and distributed on at least two different outer surface sides of the server (20). The plane of each liquid cooling coil (30) is parallel to the corresponding outer surface of the server (20). Among them, at least one of the liquid cooling coils (30) includes a coil body (31) and a buffer section (32). The buffer section (32) is disposed on the coil body (31) and has a buffer cavity for communicating with the coil body (31). The buffer cavity is used to temporarily store part of the liquid cooling fluid to increase the heat exchange area of ​​the liquid cooling coil (30).

2. The computer according to claim 1, characterized in that, The cross-sectional area of ​​the buffer cavity is greater than the cross-sectional area of ​​the tube body (31).

3. The computer according to claim 1, characterized in that, The buffer section (32) includes a buffer ball having the buffer cavity, and the diameter of the buffer ball is larger than the diameter of the coil body (31); and / or, The buffer section (32) includes a buffer tube segment having the buffer cavity, and the diameter of the buffer tube segment is larger than the diameter of the coil body (31).

4. The computer according to claim 3, characterized in that, The buffer balls are multiple in number and are spaced apart on the coil body (31). In the radial direction from the outside to the inside of the liquid cooling coil (30), the buffer balls are staggered; or... The buffer tube segments are multiple, and the multiple buffer tube segments are spaced apart on the coil body (31). In the radial direction from the outside to the inside of the liquid cooling coil (30), the multiple buffer tube segments are staggered; or, The buffer section (32) includes a plurality of buffer balls and a plurality of buffer tube segments, which are arranged crosswise on the coil body (31).

5. The computer according to claim 3, characterized in that, The buffer balls are multiple in number and are spaced apart on the coil body (31). In the radial direction from the outside to the inside of the liquid cooling coil (30), the diameter of the buffer balls located on the inner side is smaller than the diameter of the buffer balls located on the outer side; or, The buffer tube segments are multiple and are spaced apart on the coil body (31). In the radial direction of the liquid cooling coil (30) from the outside to the inside, the diameter of the buffer tube segment located on the inner side is smaller than the diameter of the buffer tube segment located on the outer side.

6. The computer according to claim 1, characterized in that, At least two of the liquid cooling coils (30) correspond to the same outer surface of the server (20).

7. The computer according to any one of claims 1 to 6, characterized in that, The computer also includes a soundproof structure (40) disposed on the cavity wall of the receiving cavity (11).

8. The computer according to any one of claims 1 to 6, characterized in that, The enclosure (10) also has louvers (12), and the computer also includes a cooling structure (50) disposed within the receiving cavity (11) and located at the louvers (12).

9. The computer according to claim 8, characterized in that, The computer also includes a cover (60) which covers the opening of the receiving cavity (11), and the opening of the receiving cavity (11) is opposite to the louver (12).

10. A circulating system, characterized in that, include: The computer is the computer according to any one of claims 1 to 9; An input pipe (1) is connected at its first end to an external liquid cooling source and at its second end to the liquid cooling coil (30) located at the head of a plurality of liquid cooling coils (30). Output pipe (2), the first end of which is connected to the liquid cooling coil (30) located at the tail of the plurality of liquid cooling coils (30); The water storage device (3) is connected to the second end of the output pipe (2).

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