Cooling disc for plasma cleaning equipment

Abstract

The utility model relates to the technical field of semiconductors, and discloses a cooling disc for ion cleaning equipment. A cooling disc for plasma cleaning equipment comprises a heat conduction lower cover plate, a heat conduction upper cover plate and a D-shaped cooling pipe. Wherein the heat-conducting upper cover plate is provided with a mounting groove, the section of the mounting groove is D-shaped, the heat-conducting lower cover plate is fixedly mounted on the heat-conducting upper cover plate, and an opening of the mounting groove faces the heat-conducting lower cover plate; the D-shaped cooling pipe is arranged in the mounting groove, the shape of the D-shaped cooling pipe is matched with that of the mounting groove, and the D-shaped cooling pipe is communicated with an external cooling source. According to the cooling disc for the plasma cleaning equipment, in the working process, the D-shaped cooling pipe can increase the contact area between the D-shaped cooling pipe and the heat conduction upper cover plate, and therefore the speed of cooling the cooling disc for the plasma cleaning equipment through cooling liquid can be increased; and the wafer placed on the cooling disc is always at a stable temperature in the plasma cleaning process, so that the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a cooling plate for plasma cleaning equipment. Background Technology

[0002] In semiconductor chip manufacturing, plasma cleaning is a common method. This process involves spraying a plasma-state reactive gas onto the wafer surface within a reaction chamber. The gas reacts with contaminants on the wafer surface, and then is extracted from the cleaning system by a vacuum pump. Because plasma consists of high-energy particles, the reaction causes a rapid increase in chip temperature. To ensure uniform reaction on the wafer surface, a cooling system is needed to regulate and stabilize the wafer temperature during cleaning. However, current cooling systems used in plasma cleaning equipment have relatively low efficiency and cannot quickly reduce the wafer temperature, thus affecting the cleaning efficiency.

[0003] Therefore, there is an urgent need for a cooling plate for plasma cleaning equipment to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a cooling plate for plasma cleaning equipment, which can solve the problem that the current cooling devices used in plasma cleaning equipment have low cooling efficiency and cannot reduce the temperature of the wafer in a short time, thus affecting the cleaning efficiency of the plasma cleaning equipment on the wafer.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A cooling plate for a plasma cleaning equipment, comprising

[0007] Thermally conductive lower cover plate;

[0008] A heat-conducting upper cover plate is provided with a mounting groove. The mounting groove has a D-shaped cross-section. The arc surface of the mounting groove is away from the heat-conducting lower cover plate. The heat-conducting lower cover plate is fixedly installed on the heat-conducting upper cover plate. The opening of the mounting groove faces the heat-conducting lower cover plate.

[0009] The D-shaped cooling pipe is disposed in the mounting groove, and the shape of the D-shaped cooling pipe matches the shape of the mounting groove. The D-shaped cooling pipe is connected to an external cooling source.

[0010] As an alternative, a wafer receiving device is provided on the surface of the thermally conductive upper cover away from the thermally conductive lower cover, and the wafer receiving device is used to receive wafers.

[0011] As an optional solution, the thermally conductive lower cover plate, the thermally conductive upper cover plate, and the wafer receiving device are provided with mounting holes at corresponding locations, and the thermally conductive lower cover plate, the thermally conductive upper cover plate, and the wafer receiving device are fixedly connected to the mounting holes by bolts.

[0012] As an alternative, the overall shape of the mounting groove is curved.

[0013] As an alternative, the D-shaped cooling tube is a metal tube.

[0014] As an optional solution, a lifting column is also included, which is connected to the heat-conducting lower cover plate. The lifting column is used to install the cooling plate on the ion cleaning equipment. The lifting column is provided with an inlet pipe and an outlet pipe, which are respectively connected to the two ends of the D-shaped cooling pipe.

[0015] As an optional solution, the wafer receiving device includes a body and a receiving plate covering the body. The surface of the body away from the thermally conductive cover plate is provided with a venting groove, and the receiving plate is provided with a venting hole communicating with the venting groove. The venting groove is connected to a gas source.

[0016] As an optional solution, the lifting column is provided with a gas channel, one end of which is connected to the ventilation slot and the other end of which is connected to the gas source.

[0017] As an alternative, the surface of the thermally conductive top cover facing the wafer receiving device is provided with a suction groove, which is connected to a suction source.

[0018] As an optional solution, the lifting column is provided with an air extraction channel, one end of which is connected to the air suction groove, and the other end of which is connected to the suction source.

[0019] This utility model has at least the following beneficial effects:

[0020] This utility model provides a cooling tray for plasma cleaning equipment. During operation, the D-shaped cooling pipe can increase the contact area between the D-shaped cooling pipe and the heat-conducting upper cover plate, thereby accelerating the cooling speed of the liquid. This ensures that the wafer placed on the cooling tray remains at a stable temperature during the plasma cleaning process, thus improving production efficiency. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments of this utility model will be briefly introduced below.

[0022] Figure 1A schematic diagram of the structure of a cooling plate for a plasma cleaning equipment provided in an embodiment of this utility model;

[0023] Figure 2 An exploded view of a cooling plate for a plasma cleaning equipment provided in an embodiment of this utility model;

[0024] Figure 3 A schematic diagram of the structure of the heat-conducting top cover provided in this embodiment of the utility model;

[0025] Figure 4 A schematic diagram of the structure of the heat-conducting top cover plate (with the D-shaped cooling pipe removed) provided in this embodiment of the utility model;

[0026] Figure 5 A cross-sectional view of the heat-conducting top cover (with the D-shaped cooling pipe removed) provided in this embodiment of the utility model.

[0027] Figure label:

[0028] 1. Heat-conducting lower cover plate; 2. Heat-conducting upper cover plate; 21. Air intake groove; 22. Mounting groove; 3. Lifting column; 4. Wafer receiving device; 41. Body; 411. Vent groove; 42. Receiving plate; 421. Vent hole; 5. D-shaped cooling pipe. Detailed Implementation

[0029] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0030] In existing technologies, during the cleaning of semiconductor chips using plasma cleaning equipment, the high-energy particles of plasma cause a rapid increase in chip temperature during the reaction. To ensure uniform reaction on the wafer surface, a cooling device is needed to adjust the wafer temperature, making it stable and uniform during the cleaning process. However, the cooling devices currently used in plasma cleaning equipment have low cooling efficiency and cannot reduce the wafer temperature in a short time, thus affecting the cleaning efficiency of the plasma cleaning equipment.

[0031] Therefore, such as Figures 1 to 5 As shown, an embodiment of this utility model provides a cooling plate for a plasma cleaning equipment to solve the above-mentioned technical problems.

[0032] Specifically, a cooling tray for a plasma cleaning equipment includes a thermally conductive lower cover plate 1, a thermally conductive upper cover plate 2, and a D-shaped cooling pipe 5. The thermally conductive upper cover plate 2 has a mounting groove 22 with a D-shaped cross-section. The arc surface of the mounting groove 22 is away from the thermally conductive lower cover plate 1. The thermally conductive lower cover plate 1 is fixedly mounted on the thermally conductive upper cover plate 2, and the opening of the mounting groove 22 faces the thermally conductive lower cover plate 1. The D-shaped cooling pipe 5 is disposed within the mounting groove 22, and its shape matches the shape of the mounting groove 22. The D-shaped cooling pipe 5 is connected to an external cooling source, which can supply cooling liquid to the D-shaped cooling pipe, allowing the cooling liquid to flow within it. The D-shaped cooling pipe 5 increases the contact area between itself and the thermally conductive upper cover plate 2, thereby accelerating the cooling speed of the cooling liquid and ensuring that the wafer placed on the cooling tray remains at a stable temperature during the plasma cleaning process, thus improving production efficiency. The external cooling source mentioned here can be a water pump, and the cooling liquid can be water.

[0033] In some embodiments, to prevent the cooling plate of the plasma cleaning equipment of this application from scratching the wafer, a wafer receiving device 4 is provided on the surface of the heat-conducting upper cover plate 2 away from the heat-conducting lower cover plate 1. The wafer receiving device 4 is used to receive the wafer.

[0034] In some embodiments, to facilitate the fixing of the thermally conductive lower cover plate 1, the thermally conductive upper cover plate 2, and the wafer receiving device 4 together, mounting holes are provided at corresponding locations of the thermally conductive lower cover plate 1, the thermally conductive upper cover plate 2, and the wafer receiving device 4. The thermally conductive lower cover plate 1, the thermally conductive upper cover plate 2, and the wafer receiving device 4 are fixedly connected by bolts and mounting holes. This also facilitates the manufacture of the cooling plate for plasma cleaning equipment of this application, and the manufacturing cost is low.

[0035] In some embodiments, such as Figure 3 and Figure 4 As shown, in order to further increase the contact area between the D-shaped cooling pipe 5 and the heat-conducting upper cover plate 2, the overall shape of the mounting groove 22 is curved, and the shape of the D-shaped cooling pipe 5 inside the mounting groove 22 matches the overall shape of the mounting groove 22.

[0036] In some embodiments, in order to improve the heat diffusion efficiency between the D-shaped cooling pipe 5 and the heat-conducting upper cover plate 2, and to facilitate the manufacture of the D-shaped cooling pipe 5, the material of the D-shaped cooling pipe 5 is preferably aluminum, copper, stainless steel or other metal pipes with good thermal conductivity.

[0037] In some embodiments, in order to facilitate the installation of the cooling plate of the plasma cleaning equipment of this application on the plasma cleaning equipment, this application also includes a lifting column 3. The lifting column 3 is connected to the heat-conducting lower cover plate 1. The lifting column 3 is used to install the cooling plate on the plasma cleaning equipment. The lifting column 3 is provided with an inlet pipe and an outlet pipe inside. The inlet pipe and the outlet pipe are respectively connected to both ends of the D-shaped cooling pipe 5. The other ends of the inlet pipe and the outlet pipe are respectively connected to an external cooling source.

[0038] In some embodiments, such as Figure 1 and Figure 2 As shown, to further improve the cooling efficiency of the wafer placed on the wafer receiving device 4, the wafer receiving device 4 includes a body 41 and a receiving plate 42 covering the body 41. A venting groove 411 is provided on the surface of the body 41 away from the heat-conducting upper cover plate 2. The receiving plate 42 is provided with a venting hole 421 communicating with the venting groove 411. The venting groove 411 is connected to a gas source. When the wafer is placed on the receiving plate 42, gas from the gas source flows through the venting groove 41 and the venting hole 421 to the surface of the wafer, cooling it. The gas source mentioned here can be low-temperature nitrogen.

[0039] In some embodiments, to facilitate the connection between the ventilation slot 411 and the air source, the lifting column 3 is provided with a gas channel, one end of which is connected to the ventilation slot 411 and the other end of which is connected to the air source.

[0040] In some embodiments, to extract the gas introduced into the plasma cleaning equipment to the outside of the plasma cleaning equipment, the surface of the heat-conducting upper cover plate 2 facing the wafer receiving device 4 is provided with a suction groove 21, which is connected to a suction source. The suction source mentioned here can be a vacuum pump.

[0041] In some embodiments, in order to facilitate the connection between the air intake groove 21 and the suction source, the lifting column 3 is provided with an air extraction channel, one end of which is connected to the air intake groove 21 and the other end of which is connected to the suction source.

[0042] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A cooling tray for a plasma cleaning apparatus, characterized by, The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment. The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment. The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment. The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment.

2. A cooling tray for a plasma cleaning apparatus as defined in claim 1, wherein, The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment.

3. A cooling tray for a plasma cleaning apparatus as defined in claim 2, wherein, The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment. The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment. The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment.

5. The cooling plate for a plasma cleaning apparatus according to claim 1, wherein The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment.

6. A cooling plate for a plasma cleaning apparatus according to any one of claims 2 or 3, wherein The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment.

7. A cooling tray for a plasma cleaning apparatus as defined in claim 6, wherein, The utility model relates to a cooling disc for plasma cleaning equipment, which comprises a heat-conducting lower cover plate (1), a heat-conducting upper cover plate (2) provided with a mounting groove (22) in the shape of a D, a D-shaped cooling pipe (5) arranged in the mounting groove (22) and matching the shape of the mounting groove (22), and a lifting column (3) connected to the heat-conducting lower cover plate (1) and used for mounting the cooling disc on the plasma cleaning equipment. ​ 8. A cooling tray for a plasma cleaning apparatus as defined in claim 7, wherein, ​ 9. A cooling tray for a plasma cleaning apparatus as defined in claim 6, wherein, ​ 10. A cooling tray for a plasma cleaning apparatus as claimed in claim 9, wherein, ​

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