Wafer heating disc structure capable of being rapidly installed

Abstract

The utility model provides a wafer heating disc structure capable of being rapidly installed, comprising a heating main body of a disc structure, the bottom surface of the heating main body is vertically provided with a positive pole rod and a negative pole rod which are connected with a heating pipe, and a positioning rod used for limiting the vertical position and the horizontal angle of the heating main body, and the positioning rod is longer than the positive pole rod and the negative pole rod. The heating body comprises a top plate and a bottom plate, a wavy heating groove is formed in the bottom face of the top plate, and a heating pipe is arranged in the heating groove. According to the utility model, the heating plate can be conveniently mounted and can be uniformly heated.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically to a wafer heating plate structure that can be quickly installed. Background Technology

[0002] In semiconductor manufacturing, especially in the deposition reaction during wafer fabrication, it is often necessary to preheat or maintain the wafer and chamber space at the temperature required for the deposition reaction. Most semiconductor deposition equipment uses heating plates to preheat the wafer. However, because the deposition reaction is mostly carried out under vacuum conditions, the vacuum environment has poor thermal conductivity due to the lack of a heat-conducting medium. This often makes it impossible to quickly preheat the wafer to the required temperature, or to preheat the wafer uniformly before the deposition reaction.

[0003] Therefore, a heating plate is needed that can heat the wafer radially uniformly. Utility Model Content

[0004] In view of this, the problem to be solved by this utility model is to provide a wafer heating plate structure that can be installed quickly.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] A wafer heating plate structure that can be quickly installed includes a heating body with a disc structure. The bottom surface of the heating body is vertically provided with a positive pole and a negative pole connected to a heating tube, and a positioning rod for defining the vertical position and horizontal angle of the heating body. The lower end of the positioning rod is provided with a positioning protrusion.

[0007] Furthermore, a positioning hole is formed on the bottom surface of the positioning rod.

[0008] Furthermore, the positioning rod, positive electrode rod, and negative electrode rod are arranged in a triangular pattern.

[0009] Furthermore, the lower end of the positioning rod is provided with a first support platform, and the upper ends of the positive pole and the negative pole are both provided with a second support platform.

[0010] Furthermore, the heating body includes a top plate and a bottom plate, and a wavy heating groove is formed on the bottom surface of the top plate, with heating tubes arranged inside the heating groove.

[0011] Furthermore, the top plate is connected to the bottom plate via flanges.

[0012] Furthermore, a sealing baffle is provided at the connection points between the positive electrode rod, the negative electrode rod, and the positioning rod and the heating body.

[0013] Furthermore, the lower ends of the positive and negative poles are respectively provided with power connection plugs for connecting to the power source.

[0014] Furthermore, the power connection plug is a round rod structure.

[0015] The advantages and positive effects of this utility model are:

[0016] By setting up a positive electrode rod, a negative electrode rod, and a positioning rod arranged in a triangular pattern, with positioning holes and positioning protrusions on the positioning rods, the vertical position of the heating body and the angle of the chip direction can be limited, so that the heating body can be accurately positioned and moved smoothly during installation, and the connection of the power connector can be stable, achieving fast and accurate installation.

[0017] By incorporating corrugated heating tubes within the heating element, the heating uniformity of the heating element is improved. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is an overall structural diagram of a wafer heating plate structure that can be quickly installed according to this utility model;

[0020] Figure 2 This is a structural diagram of the heating tube inside a wafer heating plate structure that can be quickly installed according to this utility model;

[0021] In the diagram: 1. Heating body; 101. Heating tube; 2. Positive electrode rod; 201. Power connection rod; 202. Second support platform; 3. Negative electrode rod; 301. Sealing baffle; 4. Positioning rod; 401. Positioning protrusion; 402. Positioning hole; 403. First support platform. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] This utility model provides a wafer heating plate structure that can be quickly installed, such as... Figure 1 and Figure 2 As shown, the heating body 1 includes a disc-shaped structure. In actual use, a wafer is placed on the top surface of the heating body 1 and heated. The heating body 1 includes a top plate and a bottom plate. A heating groove is formed on the bottom surface of the top plate, and heating tubes 101 are arranged in the heating groove. The bottom plate is installed on the bottom surface of the top plate to seal the heating groove and fix the heating tubes 101. In one embodiment of this application, the heating groove is arranged in a horizontal wave shape, and the heating tubes 101 are installed along the heating groove, which can improve the uniformity of heating.

[0026] A positive electrode 2 and a negative electrode 3 are vertically arranged on the bottom surface of the heating body 1. The positive electrode 2 and the negative electrode 3 are electrically connected to both ends of the heating tube 101, respectively. A power connection plug 201 is provided at the bottom end of the positive electrode 2 and the negative electrode 3, and the power connection plug 201 is connected to a power supply socket to provide high-voltage electrical energy to the heating tube 101. In one embodiment of this application, the power connection plug 201 is a round rod structure.

[0027] Because the surface temperature of the heating plate is high during heating, the positive electrode 2 and the negative electrode 3 are lengthened to prevent the operating temperature of the heating plate from affecting other circuit devices. The specific lengths of the positive electrode 2 and the negative electrode 3 are determined based on the experience of the operators.

[0028] To improve the stability of the heating plate during installation, a positioning rod 4 is vertically installed on the bottom surface of the heating body 1. The positioning rod 4 is longer than the positive electrode rod 2 or the negative electrode rod 3. A positioning protrusion 401 is provided at the lower end of the positioning rod 4. The positioning protrusion 401 limits the installation angle of the heating body 1, which can improve the accuracy and stability of the position of the positive electrode rod 2 and the negative electrode rod 3 during the installation of the heating plate. In one embodiment of this application, the positioning rod 4, the positive electrode rod 2, and the negative electrode rod 3 are arranged in a triangle to stably support the heating body 1. Sealing baffles 301 are provided at the connection points of the positive electrode rod 2, the negative electrode rod 3, and the positioning rod 4 with the heating body 1 to improve the sealing of the internal cavity of the heating body 1 and prevent hot air leakage.

[0029] To further improve the stability of the positive pole 2 and negative pole 3 during installation, a positioning hole 402 is provided through the bottom surface of the positioning rod 4. This includes a mounting groove that mates with the positioning rod 4, and a vertical rod is installed within the mounting groove. During installation, when the positioning hole 402 mates with the vertical rod, it limits the vertical position of the positioning rod 4, and the positioning protrusion 401 on the positioning rod 4 limits the horizontal angle of the positioning rod 4.

[0030] The positioning hole 402 and the positioning protrusion 401 together define the horizontal and vertical angles of the heating body 1 during installation. The positioning hole 402 can also improve the stability during installation.

[0031] The lower end of the positioning rod 4 is provided with a first support platform 403, and the upper ends of the positive electrode rod 2 and the negative electrode rod 3 are each provided with a second support platform 202. The first support platform 403 and the second support platform 202 together support the heating body 1, so that the heating body 1 is in a horizontal state after installation. In one embodiment of this application, the first support platform 403 and the second support platform 202 are protruding annular structures, and the outer edge of the positioning protrusion 401 extends out of the side wall of the first support platform 403.

[0032] The working principle and process of this utility model are as follows:

[0033] When installing the heating plate, place the heating body 1 horizontally, align the power connection rods 201 at the lower end of the positive pole 2 and negative pole 3 with the corresponding power supply ports, align the positioning holes 402 with the corresponding vertical rods, and lower the heating plate horizontally.

[0034] Since the positioning rod 4 is longer than the positive rod 2 or the negative rod 3, the positioning hole 402 takes priority in engaging with the corresponding vertical rod, and the positioning protrusion 401 engages with the corresponding slot to limit the vertical position and horizontal angle of the heating body 1. The heating body 1 continues to be lowered, and the positive rod 2 and the negative rod 3 move down smoothly until the first support platform 403 and the second support platform 202 contact the corresponding support surface, completing the connection of the power connection rod 201 with the corresponding power supply socket, and realizing the installation and power supply of the heating plate.

[0035] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made within the scope of this utility model should still fall within the scope of this patent.

Claims

1. A wafer heating plate structure that can be quickly installed, characterized in that, The heating body (1) includes a disc structure. The bottom surface of the heating body (1) is vertically provided with a positive electrode rod (2) and a negative electrode rod (3) connected to the heating tube (101), and a positioning rod (4) for defining the vertical position and horizontal angle of the heating body (1). The positioning rod (4) is longer than the positive electrode rod (2) and the negative electrode rod (3). The lower end of the positioning rod (4) is provided with a positioning protrusion (401).

2. The wafer heating plate structure that can be quickly installed according to claim 1, characterized in that, The bottom surface of the positioning rod (4) has a positioning hole (402) that passes through the positioning rod (4).

3. The wafer heating plate structure that can be quickly installed according to claim 1, characterized in that, The positioning rod (4), positive pole (2), and negative pole (3) are arranged in a triangular pattern.

4. The wafer heating plate structure that can be quickly installed according to claim 1, characterized in that, The lower end of the positioning rod (4) is provided with a first support platform (403), and the upper ends of the positive pole (2) and the negative pole (3) are both provided with a second support platform (202).

5. The wafer heating plate structure that can be quickly installed according to claim 1, characterized in that, The heating body (1) includes a top plate and a bottom plate. A wave-shaped heating groove is opened on the bottom surface of the top plate, and heating tubes (101) are arranged in the heating groove.

6. The wafer heating plate structure for quick installation according to claim 5, characterized in that, The top plate is connected to the bottom plate by a flange.

7. The wafer heating plate structure that can be quickly installed according to claim 1, characterized in that, The positive electrode rod (2), negative electrode rod (3) and positioning rod (4) are all provided with sealing baffles (301) at the connection points with the heating body (1).

8. The wafer heating plate structure that can be quickly installed according to claim 1, characterized in that, The lower ends of the positive pole (2) and the negative pole (3) are respectively provided with power connection plugs (201) for connecting to the power source.

9. The wafer heating plate structure that can be quickly installed according to claim 8, characterized in that, The power connection plug (201) has a round rod structure.

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