Fixing clamp for packaging C-shaped bent semiconductor structure

Abstract

The utility model is mainly used for the back section packaging process of a semiconductor chip, and relates to a fixing clamp for packaging a C-shaped bending semiconductor structure, which comprises a first clamping arm, a second clamping arm and an elastic piece, and the elastic piece is arranged between the first clamping arm and the second clamping arm and provides clamping force for mutual clamping of the end parts of the first clamping arm and the second clamping arm; the first clamping arm comprises a first C-shaped bending arm, the first C-shaped bending arm comprises a first included angle and a second included angle, the sum of the first included angle and the second included angle is 180 degrees, and the first clamping arm and the second clamping arm jointly clamp and fix a semiconductor to be packaged through the first fixing part. The fixing clamp is used for replacing a pressing block and a screw for jacking, a complex jig and a clamp do not need to be customized according to the size of the chip, and the chip cover plate can have constant clamping force through the fixing clamp. Meanwhile, by means of the first C-shaped bending arm and the second C-shaped bending arm, a semiconductor packaging mode in a special shape can be well fixed.

Description

Technical Field

[0001] This utility model relates to semiconductor packaging technology and is mainly applied to the back-end packaging stage of semiconductor packaging process, especially the fixing tool used in the sealing or capping process of semiconductor packaging. Background Technology

[0002] Gold-tin sealing or gold-tin capping processes are commonly used in the back-end packaging stage of semiconductor packaging processes, especially in the sealing or lid attach process. They are mainly used to ensure the airtightness and stability of the chip after packaging, prevent external moisture or other contaminants from entering the package, and protect the chip's function and performance.

[0003] In a typical gold-solder bonding process, a gravity block is designed to apply pressure based on the chip's shape, and a cover plate is used to lock it in place. Sufficient pressure is also applied above the cover plate to prevent defects such as solder voids or solder overflow at the solder joint. However, as the solder pad melts, the screws securing the cover plate can loosen, causing uneven stress and affecting solder flow, leading to voids or solder overflow at the solder joint. Furthermore, since the gravity block and the fixture for placing the chip need to be custom-made according to the chip size, different chip sizes require corresponding fixtures and gravity blocks, resulting in higher costs.

[0004] Therefore, in order to solve the above problems, a simple and convenient technical solution is needed. Utility Model Content

[0005] To address the aforementioned problems, this utility model proposes a fixing clamp for C-shaped bending semiconductor structure packaging, comprising a first clamping arm, a second clamping arm, and an elastic element. The elastic element is disposed between the first clamping arm and the second clamping arm, providing a clamping force for the ends of the first clamping arm and the second clamping arm to clamp each other. The first clamping arm includes a first C-shaped bending arm, which includes a first bending segment, a second bending segment, and a third bending segment connected in sequence. The end of the third bending segment is provided with a first fixing part. There is a first included angle between the first bending segment and the second bending segment, and a second included angle between the second bending end and the third bending segment. The sum of the first included angle and the second included angle is 180 degrees. The first clamping arm clamps and fixes the semiconductor to be packaged together with the second clamping arm through the first fixing part.

[0006] Furthermore, the first included angle and the second included angle are both 90 degrees.

[0007] Furthermore, the second clamping arm has a second C-shaped bending arm, the bending portion of the second C-shaped bending arm including a fourth bending segment, a fifth bending segment and a sixth bending segment connected in sequence, the end of the sixth bending segment is provided with a second fixing part, the first fixing part and the second fixing part clamp the semiconductor to be packaged.

[0008] Furthermore, a flexible pad is provided on the surface of the first fixing part that contacts the semiconductor to be packaged.

[0009] Furthermore, the other ends of the first clamping arm and the second clamping arm are provided with force-applying parts. After force is applied to the force-applying parts, the first fixing part of the first clamping arm separates from the second clamping arm.

[0010] Furthermore, the elastic element is a torsion spring.

[0011] Furthermore, the elastic element is detachably connected to either the first or second clamping arm.

[0012] Furthermore, fixing ears are provided at the positions where the elastic elements are installed on the first clamping arm and the second clamping arm, and the fixing ears are used to fix the elastic elements.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. By using a fixing clamp instead of pressure blocks and screws, there is no need to customize complex jigs and fixtures according to the chip size. The fixing clamp can provide a constant clamping force for the chip cover.

[0015] 2. The first C-shaped bending arm and the second C-shaped bending arm can effectively fix semiconductor packages with special shapes.

[0016] 3. The elastic element is detachable, and different elastic elements with different elastic forces can be replaced according to the clamping force. At the same time, it is also convenient to replace the aging or fatigued elastic elements. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the first embodiment of the present utility model.

[0019] Figure 2 This is a schematic diagram of another embodiment of the present invention. Detailed Implementation

[0020] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0021] In the following description, reference is made to the accompanying drawings, which depict several embodiments of the present application. It should be understood that other embodiments may also be used, and changes in mechanical composition, structure, electrical, and operation may be made without departing from the spirit and scope of this disclosure. The following detailed description should not be considered limiting, and the scope of the embodiments of the present application is defined only by the claims of the published patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present application. Spatially related terms, such as “upper,” “lower,” “left,” “right,” “below,” “below,” “lower part,” “above,” “upper part,” etc., may be used herein to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0022] Although the terms first, second, etc., are used in some instances herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another. For example, a first end may be referred to as a second end, and similarly, a second end may be referred to as a first end, without departing from the scope of the various described embodiments. Both first end and second end are descriptions of an end, but they are not the same end unless the context otherwise clearly indicates otherwise.

[0023] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, component, item, kind, and / or group, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition occur only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

[0024] Please refer to Figure 1 This utility model proposes a fixing clip for C-shaped bending semiconductor structure packaging, including a first clamping arm 1, a second clamping arm 2 and an elastic element 3. In this utility model, the elastic element 3 is a torsion spring, but it is not limited to this. Any elastic element 3 that can provide clamping force to the first clamping arm 1 and the second clamping arm 2 should be included in the protection scope of this utility model.

[0025] A fixing ear 31 is provided at the position where the elastic element 3 is installed on the first clamping arm 1 and the second clamping arm 2. The fixing ear 31 is used to fix the elastic element 3. The elastic element 3 is disposed between the first clamping arm 1 and the second clamping arm 2 and is detachably connected to the first clamping arm 1 or the second clamping arm 2, providing a clamping force for the ends of the first clamping arm 1 and the second clamping arm 2 to clamp each other. The first clamping arm 1 includes a first C-shaped bending arm 11. The first C-shaped bending arm 11 includes a first bending segment 111, a second bending segment 112 and a third bending segment 113 connected in sequence. A first fixing part 12 is provided at the end of the third bending segment 113. There is a first included angle between the first bending segment 111 and the second bending segment 112, and there is a second included angle between the second bending end 112 and the third bending segment 113. The sum of the first included angle and the second included angle is 180 degrees. The first clamping arm 1 clamps and fixes the semiconductor to be packaged together with the second clamping arm 2 through the first fixing part 12. Furthermore, the first included angle and the second included angle are both 90 degrees. A flexible pad (not shown in the figure) is provided on the surface of the first fixing part 12 that contacts the semiconductor to be packaged. The other ends of the first clamping arm 1 and the second clamping arm 2 are provided with force-applying parts 10 and 20. After applying force to the force-applying parts 10 and 20, the first fixing part 12 of the first clamping arm 1 separates from the second clamping arm 2.

[0026] Please refer to Figure 2 This is another embodiment of the present invention. In this embodiment, the other structures are the same as those in the first embodiment and will not be described in detail. In this embodiment, the second clamping arm 2 has a second C-shaped bending arm 21. The second C-shaped bending arm 21 includes a fourth bending segment 211, a fifth bending segment 212 and a sixth bending segment 213 connected in sequence. The end of the sixth bending segment 213 is provided with a second fixing part 22. The first fixing part 12 and the second fixing part 22 clamp the semiconductor to be packaged.

[0027] This invention utilizes a fixing clip to replace traditional clamping blocks and screws, eliminating the need for custom-made complex jigs and fixtures based on chip size. The fixing clip provides a constant clamping force on the chip cover, reducing jig manufacturing costs, simplifying operation, and significantly shortening chip fixing time. Furthermore, the bending section design effectively secures semiconductor packages with unique shapes. The elastic element is detachable, allowing for replacement with different elastic elements based on clamping force, and also facilitating the replacement of aged or fatigued elastic elements.

[0028] In this utility model, unless otherwise explicitly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] The above are preferred embodiments of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A fixing clamp for a C-bent semiconductor structure package comprising a first clamping arm, a second clamping arm and a resilient member, characterized in that, The elastic member is arranged between the first clamping arm and the second clamping arm to provide a clamping force for clamping the end portions of the first clamping arm and the second clamping arm to each other. The first clamping arm comprises a first C-shaped bending arm, which comprises a first bending section, a second bending section and a third bending section connected in sequence, and the end portion of the third bending section is provided with a first fixing portion, the first bending section and the second bending section form a first included angle, the second bending section and the third bending section form a second included angle, the first included angle and the second included angle are 180 degrees, and the first clamping arm is clamped and fixed to the second clamping arm by the first fixing portion to clamp the semiconductor to be packaged.

2. The fixing clamp for C-bent semiconductor structure package according to claim 1, characterized in that, The first included angle and the second included angle are 90 degrees respectively.

3. The fixing clamp for C-bent semiconductor structure package according to claim 1, characterized in that The second clamping arm comprises a second C-shaped bending arm, and the bending portion of the second C-shaped bending arm comprises a fourth bending section, a fifth bending section and a sixth bending section connected in sequence, and the end portion of the sixth bending section is provided with a second fixing portion, and the first fixing portion and the second fixing portion clamp the semiconductor to be packaged.

4. The fixing clamp for C-bending semiconductor structure package according to any one of claims 1-3, characterized in that, The first fixing portion is provided with a flexible pad on the surface in contact with the semiconductor to be packaged.

5. The fixing clamp for C-bent semiconductor structure package according to claim 1, wherein The other end of the first clamping arm and the second clamping arm is provided with a force applying portion, and the first fixing portion of the first clamping arm is separated from the second clamping arm after the force applying portion is applied with force.

6. The fixing clamp for C-bent semiconductor structure package according to claim 1, wherein The elastic member is a torsion spring.

7. The fixing clamp for C-bent semiconductor structure package according to claim 1, wherein, The elastic member is detachably connected with the first clamping arm or the second clamping arm.

8. The fixing clamp for C-bent semiconductor structure package according to claim 1, wherein, A fixing lug is arranged at the position where the first clamping arm and the second clamping arm are arranged with the elastic member, and the fixing lug is used to fix the elastic member.

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