Integrally-formed semiconductor packaging fixing clamp

Abstract

The utility model is mainly used for the back section packaging process of a semiconductor chip, and relates to an integrally formed semiconductor packaging fixing clamp, which comprises a first force arm, a second force arm and an elastic part which are integrally formed, and the elastic part extends inwards from the end parts of the first force arm and the second force arm to form an arc-shaped structure. The end parts of the first force arm and the second force arm are opposite to form an opening part which is used for clamping a semiconductor to be packaged. Therefore, the semiconductor to be packaged is clamped through the first force arm, the second force arm and the elastic part, a complex jig and a clamp do not need to be customized according to the size of a chip, the chip cover plate can have constant clamping force through the first force arm and the second force arm, production is facilitated, and use is easy.

Description

Technical Field

[0001] This utility model relates to semiconductor packaging technology and is mainly applied to the back-end packaging stage of semiconductor packaging process, especially the fixing tool used in the sealing or capping process of semiconductor packaging. Background Technology

[0002] Gold-tin sealing or gold-tin capping processes are commonly used in the back-end packaging stage of semiconductor packaging processes, especially in the sealing or lid attach process. They are mainly used to ensure the airtightness and stability of the chip after packaging, prevent external moisture or other contaminants from entering the package, and protect the chip's function and performance.

[0003] In a typical gold-solder bonding process, a gravity block is designed to apply pressure based on the chip's shape, and a cover plate is used to lock it in place. Sufficient pressure is also applied above the cover plate to prevent defects such as solder voids or solder overflow at the solder joint. However, as the solder pad melts, the screws securing the cover plate can loosen, causing uneven stress and affecting solder flow, leading to voids or solder overflow at the solder joint. Furthermore, since the gravity block and the fixture for placing the chip need to be custom-made according to the chip size, different chip sizes require corresponding fixtures and gravity blocks, resulting in higher costs.

[0004] Therefore, in order to solve the above problems, a simple and convenient technical solution is needed. Utility Model Content

[0005] To address the aforementioned issues, this invention proposes an integrally formed semiconductor packaging clamp, comprising an integrally formed first arm, a second arm, and an elastic portion. The elastic portion extends inward from the ends of the first and second arms to form an arc-shaped structure. The ends of the first and second arms are positioned opposite each other to form an opening portion, which is used to clamp the semiconductor to be packaged.

[0006] Furthermore, the integrated semiconductor package clamp is made of metal.

[0007] Furthermore, flexible pads are provided at the ends of the first and second lever arms.

[0008] Furthermore, the ends of the first and second lever arms are circular arc structures.

[0009] The beneficial effects of this utility model are as follows:

[0010] 1. The semiconductor to be packaged is held by the first and second lever arms, eliminating the need to customize complex jigs and fixtures according to the chip size. The chip cover can have a constant clamping force through the elastic force of the first and second lever arms and the elastic part.

[0011] 2. The integrated semiconductor packaging clamp of this utility model is simple to process, low in cost, easy to mass-produce quickly, and easy to use. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model.

[0014] Figure 2 This is a side view of an embodiment of the present invention.

[0015] Figure Labels

[0016] 1 First lever arm

[0017] 11 end

[0018] 2 Second lever arm

[0019] 21 end

[0020] 3. Elastic part

[0021] 31. Arc-shaped structure

[0022] 4 mouths Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0024] In the following description, reference is made to the accompanying drawings, which depict several embodiments of the present application. It should be understood that other embodiments may also be used, and changes in mechanical composition, structure, electrical, and operation may be made without departing from the spirit and scope of this disclosure. The following detailed description should not be considered limiting, and the scope of the embodiments of the present application is defined only by the claims of the published patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present application. Spatially related terms, such as “upper,” “lower,” “left,” “right,” “below,” “below,” “lower part,” “above,” “upper part,” etc., may be used herein to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0025] Although the terms first, second, etc., are used in some instances herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another. For example, a first end may be referred to as a second end, and similarly, a second end may be referred to as a first end, without departing from the scope of the various described embodiments. Both first end and second end are descriptions of an end, but they are not the same end unless the context otherwise clearly indicates otherwise.

[0026] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, component, item, kind, and / or group, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition occur only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

[0027] Please refer to Figure 1 and Figure 2 To address the aforementioned problems, this utility model proposes an integrally formed semiconductor packaging clamp, comprising an integrally formed first arm 1, a second arm 2, and an elastic portion 3. The elastic portion 3 is an arc-shaped structure 31 formed by the inward extension of the ends 11 and 12 of the first arm 1 and the second arm 2. The ends 11 and 21 of the first arm and the second arm form an opening 4 opposite each other, and the ends 11 and 12 of the first arm 1 and the second arm 2 are arc-shaped structures. The opening 4 is used to clamp the semiconductor to be packaged (not shown in the figure). In this embodiment, the integrally formed semiconductor packaging clamp is made of metal. The inherent elasticity of the metal itself enables the elastic portion to have clamping force for clamping the semiconductor to be packaged. Furthermore, flexible pads (not shown in the figure) can be easily provided on the ends 11 and 12 of the first arm 1 and the second arm 2.

[0028] When in use, the opening 4 is opened when the other end of the first lever arm 1 and the second lever arm 2 is applied, and the semiconductor to be packaged is clamped by the restoring force of the elastic part 3 so that the ends 11 and 12 of the first lever arm 1 and the second lever arm 2 clamp the semiconductor to be packaged.

[0029] This invention utilizes a clamp structure to replace the traditional clamping block and screw pressing, eliminating the need to customize complex jigs and fixtures according to chip size. Through the first lever arm, the second lever arm, and the elastic part, the chip cover can have a constant clamping force, reducing the cost of manufacturing jigs and making it easier for operators to operate. It also significantly shortens the time for fixing chips. At the same time, the structure of this invention is easy to manufacture and suitable for mass production. It is also more convenient to use than the traditional clamping block fixing.

[0030] In this utility model, unless otherwise explicitly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] The above are preferred embodiments of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A one-piece molded semiconductor package fixing clip, characterized in that, The integrated semiconductor package fixing clamp comprises a first force arm, a second force arm and an elastic part, the elastic part is formed in an arc structure by extending inward from the end of the first force arm and the second force arm, the end of the first force arm and the second force arm oppositely forms an opening part for clamping a semiconductor to be packaged.

2. The one-piece semiconductor package retainer of claim 1, wherein: The integrated semiconductor package fixing clamp is made of metal.

3. The one-piece semiconductor package retainer of claim 1, wherein: The end of the first force arm and the second force arm is provided with a flexible pad.

4. The one-piece semiconductor package retainer of claim 1 wherein: The end of the first force arm and the second force arm is in a circular arc structure.

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