Wafer fixing device for wafer back detection equipment

Abstract

The utility model relates to a wafer fixing device used for wafer back detection equipment. The wafer fixing device comprises an installation platform which is provided with an installation hole used for placing a wafer; the bearing mechanism is used for bearing the edge of the wafer; the elastic clamping mechanism comprises a sliding rail, a first sliding block, a second sliding block, a clamping assembly, a transmission assembly, an elastic assembly and a driving assembly, the driving assembly can drive the transmission assembly to slide relative to the sliding rail and drive the clamping assembly to slide relative to the sliding rail through the elastic assembly, and the elastic assembly has a preset pressing distance; the sensor assembly comprises a first sensor and a first blocking piece, the first blocking piece is driven by the transmission assembly to slide together, and through cooperation of the first sensor and the first blocking piece, after the elastic assembly reaches a preset pressing distance, the driving assembly can be stopped, so that the clamping force borne by the wafer is kept unchanged; and the abnormity that the wafer is not tightly clamped or damaged is avoided.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection equipment technology, and in particular to a wafer fixing device used in wafer backside inspection equipment. Background Technology

[0002] During wafer fabrication, surface treatments are required, such as thinning the back side of the wafer. Back-side thinning can significantly reduce the overall thickness of the wafer, but it inevitably contaminates the wafer surface, necessitating inspection of the back side.

[0003] Wafer back-side inspection equipment needs to inspect as much of the wafer's back side as possible, so it often uses edge clamping or edge aperture adsorption to fix the wafer. Currently, most existing back-side inspection equipment uses cylinders or torque motor modules for radial clamping. Torque motors, under lower clamping force requirements, can stall or overshoot, leading to unstable torque control and problems such as unstable wafer clamping or wafer damage. Edge aperture adsorption, on the other hand, carries the risk of insufficient adsorption force, causing wafer displacement and chipping during operation. Utility Model Content

[0004] Therefore, it is necessary to provide a wafer fixing device for use in existing wafer backside inspection equipment to address the problem that existing wafer backside inspection equipment has difficulty clamping wafers.

[0005] A wafer fixing device used in a wafer backside inspection apparatus includes:

[0006] The mounting platform has mounting holes for placing wafers;

[0007] A receiving mechanism is connected to the mounting platform, and a portion of the receiving mechanism is located within the mounting hole for receiving the edge of the wafer;

[0008] An elastic clamping mechanism includes a slide rail fixed to the mounting platform, a first slider and a second slider slidably connected to the slide rail, a clamping assembly fixed to the second slider, a transmission assembly fixed to the first slider, an elastic component disposed between the clamping assembly and the transmission assembly, and a driving assembly fixed to the mounting platform. The slide rail extends toward the mounting hole, and the driving assembly is tractably connected to the transmission assembly.

[0009] A sensor assembly, comprising a first sensor fixed to the clamping assembly and electrically connected to the driving assembly, and a first baffle fixed to the transmission assembly, the first baffle having a first blocking end spaced apart from the first sensor along the extension direction of the slide rail.

[0010] In one embodiment, the transmission assembly includes a first connector fixed to the first slider and a first push block fixed to the first connector, the drive assembly is tractably connected to the first push block, and the first baffle is fixed to the first push block; the clamping assembly includes a second connector fixed to the second slider, a second push block fixed to the second connector, and a wafer push block fixed to the second connector, the first sensor is fixed to the second connector; and the elastic component is disposed between the first push block and the second push block.

[0011] In one embodiment, the elastic component includes an adjusting bolt and an elastic element disposed between the first push block and the second push block, the adjusting bolt being rotatably connected to the second push block and screwed to the first push block.

[0012] In one embodiment, the clamping assembly further includes a limiting member, the limiting member including a connecting portion fixed to the second push block and a limiting portion connected to the connecting portion, the limiting portion being located on the side of the first push block away from the second push block.

[0013] In one embodiment, the first baffle has a plurality of spaced-apart waist-shaped holes, the extension direction of which is the same as the extension direction of the slide rail, and the first baffle is fixed to the first push block through the waist-shaped holes.

[0014] In one embodiment, the mounting platform has a groove communicating with the mounting hole, and the elastic clamping mechanism is disposed in the groove.

[0015] In one embodiment, the sensor assembly further includes a second sensor fixed to the mounting platform and a second baffle fixed to the transmission assembly, the second baffle having a second blocking end spaced apart from the second sensor along the slide rail direction.

[0016] In one embodiment, the receiving mechanism includes a plurality of horizontal adjustment frames and a plurality of receiving plates fixed to the installation platform. The horizontal adjustment frames are respectively adjustablely connected to the receiving plates to adjust the levelness of the receiving plates.

[0017] In one embodiment, the receiving plate includes a plate body and a receiving protrusion fixed to the plate body, the plate body being located outside the mounting hole and the receiving protrusion being located inside the mounting hole.

[0018] In one embodiment, the bottom of the receiving bump has an optical path avoidance slope that extends outwardly from the mounting hole. The wafer fixing device, as described above, is fixed to the device body.

[0019] The wafer fixing device of this application has a drive assembly that drives a transmission assembly to slide relative to a slide rail and an elastic assembly that drives a clamping assembly to slide relative to the slide rail. When the clamping assembly contacts the wafer placed in the mounting hole, the clamping assembly stops sliding, while the transmission assembly continues to slide under the drive assembly, thereby compressing the elastic assembly and increasing the clamping force on the wafer until the elastic assembly is compressed by a preset clamping distance, at which point the clamping force on the wafer reaches its optimal state. At this point, the first stop plate moves to the first sensor and blocks it, triggering the sensor and controlling the drive assembly to stop working. The transmission assembly stops sliding, and the compression distance of the elastic assembly remains unchanged, thus maintaining a constant clamping force on the wafer. Through the cooperation of the first sensor and the first stop plate, feedback can be sent to the drive assembly to ensure that the elastic assembly stops sliding of the transmission assembly and clamping assembly after reaching the preset clamping distance. This controls the clamping force provided by the elastic assembly to be in its optimal state, thereby preventing abnormalities such as insufficient wafer clamping or wafer damage. Attached Figure Description

[0020] Figure 1 A perspective view of a wafer fixing device used in a wafer backside inspection apparatus provided in one embodiment of this application;

[0021] Figure 2 This is a top perspective view illustrating the elastic clamping mechanism of the wafer holding device used in the wafer backside inspection equipment according to the above embodiments of this application;

[0022] Figure 3 A bottom perspective view is shown of the elastic clamping mechanism of the wafer fixing device used in the wafer backside inspection equipment according to the above embodiments of this application;

[0023] Figure 4 This is a perspective view of the receiving mechanism of the wafer fixing device used in the wafer backside inspection equipment according to the above embodiments of this application;

[0024] Figure 5 This is a perspective view of the receiving plate of the receiving mechanism of the wafer fixing device used in the wafer backside inspection equipment according to the above embodiments of this application.

[0025] Reference numerals: 10. Mounting platform; 11. Slide groove; 20. Receiving mechanism; 21. Horizontal adjustment frame; 22. Receiving plate; 221. Plate body; 222. Receiving protrusion; 223. Optical path avoidance slope; 30. Elastic clamping mechanism; 311. Slide rail; 312. First slider; 313. Second slider; 32. Clamping assembly; 321. Second connector; 322. Second push block; 323. Wafer push block; 324. 3241. Limiting component; 3242. Connecting part; 3243. Limiting part; 33. Transmission assembly; 331. First connecting component; 332. First push block; 34. Elastic assembly; 341. Adjusting bolt; 342. Elastic component; 35. Drive assembly; 41. First sensor; 42. First baffle; 421. First blocking end; 422. Waist-shaped hole; 43. Second sensor; 44. Second baffle; 441. Second blocking end. Detailed Implementation

[0026] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] To address the problem that existing wafer backside inspection equipment has difficulty clamping wafers, this application provides a wafer fixing device for use in wafer backside inspection equipment. This wafer fixing device can control the magnitude of the clamping force and can use sensors to provide feedback on the clamping force, so as to avoid abnormalities such as wafers not being clamped tightly or being damaged.

[0033] Specifically, please refer to Figure 1 and Figure 2The wafer fixing device of this application may include a mounting platform 10, a receiving mechanism 20, an elastic clamping mechanism 30, and a sensor assembly. The mounting platform 10 has a mounting hole for placing the wafer. The receiving mechanism 20 is connected to the mounting platform 10, and part of the receiving mechanism 20 is located in the mounting hole for receiving the edge of the wafer. The elastic clamping mechanism 30 may include a slide rail 311, a first slider 312, a second slider 313, a clamping assembly 32, an elastic assembly 34, a transmission assembly 33, and a drive assembly 35. The slide rail 311 is fixed to the mounting platform 10 and extends toward the mounting hole. The first slider 312 and the second slider 313 are slidably connected to the slide rail 311. The clamping assembly 32 is fixed to the second slider 313, the transmission assembly 33 is fixed to the first slider 312, the elastic assembly 34 is disposed between the clamping assembly 32 and the transmission assembly 33, and the driving assembly 35 is tractably connected to the transmission assembly 33 to drive the transmission assembly 33 to slide relative to the slide rail 311 and, through the elastic assembly 34, drive the clamping assembly 32 to slide relative to the slide rail 311. The elastic assembly 34 has a preset clamping distance, which can be set according to the clamping force required to clamp the wafer. When the elastic assembly 34 reaches the preset clamping distance, the clamping force of the elastic assembly 34 exactly reaches the most suitable clamping force required to clamp the wafer. The sensor assembly includes a first sensor 41 and a first baffle 42. The first sensor 41 is fixed to the clamping assembly 32, and the first baffle 42 is fixed to the transmission assembly 33. The first baffle 42 has a first blocking end 421, which is spaced apart from the first sensor 41 along the extending direction of the slide rail 311. When the first baffle 42 is driven to slide together by the transmission assembly 33, the first blocking end 421 forms a first blocking path. The first sensor 41 is located at the end of the first blocking path, and the length of the first blocking path is set to be equal to the preset pressing distance. Thus, when the elastic component 34 reaches the preset pressing distance, the first baffle 42 reaches the end of the first blocking path, blocking the first sensor 41 and triggering it. The first sensor 41 is electrically connected to the drive assembly 35. When the first sensor 41 is triggered, it can control the drive assembly 35 to stop, keeping the elastic component 34 at the preset pressing distance.

[0034] Understandably, the drive assembly 35 can drive the transmission assembly 33 to slide into the mounting hole, and through the elastic assembly 34, drive the clamping assembly 32 to slide into the mounting hole. When the clamping assembly 32 contacts the wafer placed in the mounting hole, the clamping assembly 32 stops sliding, and the transmission assembly 33 is driven by the drive assembly 35 to continue sliding, thereby compressing the elastic assembly 34, so that the clamping force on the wafer continues to increase until the elastic assembly 34 is compressed by a preset clamping distance, and the clamping force on the wafer reaches the most suitable state. At this time, the first baffle 42 moves together to the end of the first blocking path and blocks the first sensor 41, causing the first sensor 41 to be triggered, and controlling the drive assembly 35 to stop working. The transmission assembly 33 stops sliding, and the distance that the elastic assembly 34 is compressed remains unchanged, so that the clamping force on the wafer remains unchanged.

[0035] In this way, through the cooperation of the first sensor 41 and the first baffle 42, feedback can be sent to the drive component 35 to ensure that the elastic component 34 stops sliding of the transmission component 33 and the clamping component 32 after reaching the preset clamping distance. The clamping force provided by the elastic component 34 can be controlled to be in the most suitable state, thereby avoiding abnormalities such as failure to clamp the wafer or damage to the wafer.

[0036] More specifically, such as Figure 2 As shown, in some embodiments, the transmission assembly 33 includes a first connector 331 and a first pusher 332. The first connector 331 is fixed to the first slider 312, and the first pusher 332 is fixed to the first connector 331. The drive assembly 35 is tractably connected to the first pusher 332 and can drive the entire transmission assembly 33 to slide via the first pusher 332. The first baffle 42 is fixed to the first pusher 332 and can slide together with it. The clamping assembly 32 includes a second connector 321, a second pusher 322, and a wafer pusher 323. The second connector 321 is fixed to the second slider 313, the second pusher 322 is fixed to the second connector 321, and the wafer pusher 323 is fixed to the second connector 321. The first sensor 41 is fixed to the second connector 321 and can slide together with the second connector 321. The elastic component 34 is disposed between the first push block 332 and the second push block 322. When the first push block 332 is driven by the driving component 35, the first push block 332 can squeeze the elastic component 34. The second push block 322 is subjected to the force of the elastic component 34, which can drive the second connector 321 to slide, so that the wafer push block 323 pushes the wafer, so that the wafer abuts against the edge of the mounting hole, thereby clamping the wafer.

[0037] When the wafer pusher 323 is not in contact with the wafer, the first baffle 42 and the first sensor 41 move together with the first pusher 332 and the second connector 321, maintaining a certain distance. When the wafer pusher 323 contacts the wafer, the distance between the first sensor 41 and the first baffle 42 gradually shortens until the elastic component 34 reaches a preset compression position. At this point, the first baffle 42 triggers the first sensor 41, thereby controlling the motor to stop. In this way, the clamping force required for the wafer does not change with the position of the elastic clamping component 32, eliminating the need to readjust the clamping force based on the position of the elastic clamping component 32.

[0038] Optionally, in some embodiments, the drive component 35 can be implemented as a push-pull motor, which can push the first connector 331 into the mounting hole or pull the first connector 331 away from the mounting hole. This push-pull motor is small in size, has a high response speed, overcomes the problem of traditional torque motors being unable to control torque magnitude, and can output a stable push-pull force.

[0039] More preferably, such as Figure 2 As shown, in some embodiments, the elastic component 34 includes an adjusting bolt 341 and an elastic element 342. The elastic element 342 is disposed between the first push block 332 and the second push block 322. The adjusting bolt 341 is rotatably connected to the second push block 322 and screwed to the first push block 332. By adjusting the adjusting bolt 341, the distance between the compression push block and the first connecting member 331 can be adjusted to adjust the pre-clamping force of the elastic element 342, thereby changing the preset clamping distance of the elastic element 342. When the distance between the compression push block and the first connecting member 331 increases, the pre-clamping force of the elastic element 342 increases, the clamping force on the wafer increases, and the preset clamping distance of the elastic component 34 decreases; when the distance between the compression push block and the first connecting member 331 decreases, the pre-clamping force of the elastic element 342 decreases, the clamping force on the wafer decreases, and the preset clamping distance of the elastic component 34 increases. By combining the positions of the first sensor 41 and the first baffle 42, the preset pressing distance of the elastic component 34 can be adjusted.

[0040] Alternatively, in some embodiments, the elastic element 342 may generally be implemented as a compression spring that is sleeved on the thread of the adjusting bolt 341.

[0041] Preferably, such as Figure 3As shown, in some embodiments, the clamping assembly 32 further includes a limiting member 324, which includes a connecting portion 3241 fixed to the second push block 322 and a limiting portion 3242 connected to the connecting portion 3241. The limiting portion 3242 is located on the side of the first push block 332 away from the second push block 322. When the first push block 332 is driven backward by the driving assembly 35, the first push block 332 slides backward and, through the limiting portion 3242 and the connecting portion 3241, drives the second push block 322 to slide backward together, thereby driving the entire clamping assembly 32 to slide backward to release the wafer.

[0042] In particular, such as Figure 2 As shown, in some embodiments, the first baffle 42 has a plurality of spaced-apart oblong holes 422, the extending direction of which is the same as the extending direction of the slide rail 311. The first baffle 42 is fixed to the first push block 332 through the oblong holes 422. The oblong holes 422 can be used to adjust the installation position of the first baffle 42, thereby adjusting the distance between the first blocking end 421 of the first baffle 42 and the first sensor 41.

[0043] Preferably, such as Figure 1 As shown, in some embodiments, the mounting platform 10 has a groove 11 communicating with the mounting hole, the slide rail 311 is fixed in the groove 11, and the elastic clamping mechanism 30 is disposed in the groove 11. This arrangement, by placing the elastic clamping mechanism 30 in the groove 11, makes the wafer clamping device more compact, reducing the device's size and load.

[0044] In particular, such as Figure 2 As shown, in some embodiments, the sensor assembly further includes a second sensor 43 and a second baffle 44. The second sensor 43 is fixed to the mounting platform 10, and the second baffle 44 is fixed to the transmission assembly 33 and can be driven by the transmission assembly 33 to slide together. The second baffle 44 has a second blocking end 441, which is spaced apart from the second sensor 43 along the extension direction of the slide rail 311. When the second baffle 44 is driven by the transmission assembly 33 to slide together, the second blocking end 441 can form a second blocking path, and the second sensor 43 is located at the starting point of the second blocking path. The second sensor 43 can be electrically connected to a robotic arm. When the transmission assembly 33 retracts to release the wafer, the second baffle 44 is driven back, blocking the second sensor 43 and triggering it. The robotic arm receives the signal output by the second sensor 43 and can remove the wafer. In this way, after completing the back-side inspection of the wafer, the robotic arm can automatically remove the wafer, achieving automated control.

[0045] Furthermore, such as Figure 1 and Figure 4 As shown, in some embodiments, the receiving mechanism 20 may include multiple horizontal adjustment frames 21 and multiple receiving plates 22. The multiple horizontal adjustment frames 21 are respectively fixed to the mounting platform 10. The horizontal adjustment frames 21 are respectively adjustablely connected to the receiving plates 22. The horizontal adjustment frames 21 can adjust the level of each receiving plate 22 to keep each receiving plate 22 at the same level, so that the back side of the wafer is on a horizontal plane, thereby ensuring the accuracy of the test results.

[0046] Preferably, such as Figure 1 , Figure 4 and Figure 5 As shown, in some embodiments, the receiving plate 22 includes a plate body 221 and a receiving bump 222 fixed to the plate body 221. The plate body 221 is located outside the mounting hole, and the receiving bump 222 is located inside the mounting hole. The receiving bump 222 is used to receive the wafer. By utilizing the relatively small receiving bump 222, the back side of the wafer can be exposed as much as possible to meet the requirement of maximizing the detection range of the wafer's surface.

[0047] More preferably, such as Figure 4 As shown, in some embodiments, the bottom of the receiving protrusion 222 has a light path avoidance slope 223, which extends outward from the mounting hole at an angle. The light path avoidance slope 223 is used to avoid the light path of the dark field light source, making the dark field detection imaging clearer.

[0048] Furthermore, this application also provides a wafer backside inspection device for inspecting the backside of a wafer. The backside inspection device may include a main body and a wafer fixing device as described above, the wafer fixing device being fixed to the main body. By utilizing the wafer fixing device, the backside inspection device can securely hold the wafer during backside inspection, avoiding the risk of wafer displacement or chipping.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer fixing device used in a wafer backside inspection equipment, characterized in that, The application relates to a wafer clamping device, which comprises the following components: a mounting platform, which is provided with a mounting hole for placing a wafer; a receiving mechanism, which is connected to the mounting platform and partially located in the mounting hole for receiving the edge of the wafer; an elastic clamping mechanism, which comprises a sliding rail fixed to the mounting platform, a first sliding block and a second sliding block slidably connected to the sliding rail respectively, a clamping assembly fixed to the second sliding block, a transmission assembly fixed to the first sliding block, an elastic assembly arranged between the clamping assembly and the transmission assembly, and a driving assembly fixed to the mounting platform, wherein the sliding rail extends towards the mounting hole, and the driving assembly is drivingly connected to the transmission assembly; a sensor assembly, which comprises a first sensor fixed to the clamping assembly and electrically connected to the driving assembly, and a first baffle fixed to the transmission assembly and having a first shielding end spaced apart from the first sensor along the extension direction of the sliding rail. The transmission assembly comprises a first connecting piece fixed to the first sliding block and a first push block fixed to the first connecting piece, the driving assembly is drivingly connected to the first push block, and the first baffle is fixed to the first push block; the clamping assembly comprises a second connecting piece fixed to the second sliding block, a second push block fixed to the second connecting piece, and a wafer push block fixed to the second connecting piece, and the first sensor is fixed to the second connecting piece; and the elastic assembly is arranged between the first push block and the second push block.

2. The wafer fixing device used for the wafer back surface inspection apparatus according to claim 1, wherein The elastic assembly comprises an adjusting screw and an elastic piece, the elastic piece is arranged between the first push block and the second push block, the adjusting screw is rotatably connected to the second push block and is screwed to the first push block.

3. The wafer fixing device used for the wafer back surface inspection apparatus according to claim 2, wherein The clamping assembly further comprises a limiting piece, which comprises a connecting part fixed to the second push block and a limiting part connected to the connecting part, and the limiting part is located on the side of the first push block away from the second push block.

4. The wafer fixing device used for the wafer back surface inspection apparatus according to claim 2, wherein The first baffle is provided with a plurality of waist-shaped holes arranged at intervals, the extension direction of the waist-shaped holes is the same as the extension direction of the sliding rail, and the first baffle is fixed to the first push block through the waist-shaped holes.

5. The wafer fixing device used for the wafer backside inspection apparatus according to claim 2, wherein The mounting platform is provided with a sliding groove communicating with the mounting hole, and the elastic clamping mechanism is arranged in the sliding groove.

6. The wafer fixing device used for the wafer back surface inspection apparatus according to any one of claims 1 to 5, wherein The sensor assembly further comprises a second sensor fixed to the mounting platform and a second baffle fixed to the transmission assembly, and the second baffle has a second shielding end spaced apart from the second sensor along the direction of the sliding rail.

7. The wafer fixing device used for the wafer back surface inspection apparatus according to any one of claims 1 to 5, wherein The receiving mechanism comprises a plurality of horizontal adjusting frames fixed to the mounting platform and a plurality of receiving plates, the horizontal adjusting frames are adjustably connected to the receiving plates respectively to adjust the levelness of the receiving plates.

8. The wafer fixing device used for the wafer back surface inspection apparatus according to any one of claims 1 to 5, wherein The receiving plate comprises a plate body and a receiving protrusion fixed to the plate body, the plate body is located outside the mounting hole, and the receiving protrusion is located in the mounting hole.

9. The wafer fixing device used for the wafer back surface inspection apparatus according to claim 8, wherein The bottom of the receiving protrusion is provided with a light path avoiding inclined surface, which extends outwardly and obliquely from the mounting hole.

10. The wafer fixing device used for the wafer back surface inspection apparatus according to claim 9, wherein ​

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