Chip taking tool for hot plate module
By designing a hot plate module wafer retrieval tool, and utilizing a sliding connection and blade-shaped groove wall structure, the problem of waiting for cooling during wafer retrieval was solved, achieving safe and efficient wafer retrieval and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2026-04-03
AI Technical Summary
In the semiconductor industry, wafers need to be cooled to a safe temperature after being removed from a high-temperature hot plate, resulting in low production efficiency.
A hot plate module wafer retrieval tool was designed, including a motherboard, a first clamp, and a second clamp. Through sliding connection and blade-shaped groove wall structure, it enables safe and rapid wafer retrieval.
Wafers can be safely removed without waiting for the hot plate to cool down, improving production efficiency.
Smart Images
Figure CN224084034U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor wafer technology, and in particular to a hot plate module wafer picking tool. Background Technology
[0002] In the semiconductor industry's wafer fabrication process, wafers often need to be heated to high temperatures of 100°C to 200°C. When equipment malfunctions, the wafers need to be manually removed from the hot plate.
[0003] For the safety of operators, it is currently necessary to wait until the wafer cools down to about 60°C and is safely removed before raising it to the process temperature.
[0004] The hot plate cooling process takes a long time, often around 2 to 3 hours. Adding the time for restart monitoring, it takes another 4 hours, significantly impacting production capacity. Utility Model Content
[0005] In order to solve the above-mentioned technical problems, or at least partially solve the above-mentioned technical problems, this utility model provides a hot plate module chip removal tool.
[0006] This application provides a hot plate module wafer picking tool, which may include: a motherboard, the motherboard including a first surface and a second surface opposite to each other; a first caliper and a second caliper, the first caliper being disposed on the first surface, the first caliper and the second caliper being disposed opposite each other in the extending direction of the motherboard, the first caliper having a first slot with the opening of the first slot facing the second caliper, the second caliper being disposed on the first surface and slidably connected to the motherboard, the second caliper having a second slot with the opening of the second slot facing the first caliper, the second caliper being slidable toward or away from the first caliper, the first slot including a first slot wall away from the first surface, the second slot including a second slot wall away from the first surface; wherein, the second caliper includes a first position and a second position, when the second caliper is in the first position, the distance between the first slot wall and the second slot wall is less than the diameter of the wafer, and the distance between the bottom of the first slot and the bottom of the second slot is greater than the diameter of the wafer, when the second caliper is in the second position, the distance between the first slot wall and the second slot wall is greater than the diameter of the wafer.
[0007] It should be noted that during the use of the hot plate module wafer retrieval tool, the second clamp is initially in the second position. Then, the first and second clamps are extended above the wafer via the motherboard and lowered so that they are located on the outer periphery of the wafer. The second clamp then moves from the second position to the first position, causing the wafer to be inserted into the first and second slots. The first and second slots can hold the wafer. The motherboard is then lifted to detach the wafer from the hot plate, and the wafer is then removed by moving the motherboard. Throughout the process, the distance between the operator and the hot plate is relatively large, preventing injury. At the same time, wafer retrieval via the hot plate module tool does not require waiting for the hot plate to cool down to 60°C, which helps to increase production capacity.
[0008] In some embodiments of this application, the first slot includes a first slot wall away from the first surface, and the thickness of the first slot wall gradually decreases in the direction from the first caliper toward the second caliper; and / or, the second slot includes a second slot wall away from the first surface, and the thickness of the second slot wall gradually decreases in the direction from the second caliper toward the first caliper.
[0009] In some embodiments of this application, the hot plate module pick-up tool further includes: a passive sliding sleeve, which is slidably sleeved on the circumferential outer side of the motherboard, and the second clamp is disposed on the passive sliding sleeve.
[0010] In some embodiments of this application, the hot plate module pick-up tool further includes: an active sliding sleeve, which is slidably fitted on the circumferential outer side of the motherboard and located on the side of the second caliper away from the first caliper; and a connecting rod, one end of which is connected to the active sliding sleeve and the other end of which is connected to the passive sliding sleeve.
[0011] In some embodiments of this application, the active sliding sleeve includes an elastic buckle, and the motherboard is provided with a slot that cooperates with the elastic buckle.
[0012] In some embodiments of this application, the hot plate module wafer removal tool further includes: a protective plate, the protective plate being disposed on the first surface, the protective plate being located between the first clamp and the second clamp, the extension direction of the protective plate intersecting the extension direction of the motherboard; wherein, the protective plate includes a first end and a second end opposite to each other in its extension direction, the first end being a first flange folded toward the hot plate, the second end being a second flange folded toward the hot plate, and both the first flange and the second flange being located on the circumferential outer side of the wafer.
[0013] In some embodiments of this application, the hot plate module pick-up tool further includes: an auxiliary plate, the auxiliary plate being located on one side of the second surface of the main board, the auxiliary plate being engaged with the circumferential edge of the hot plate, the auxiliary plate having a through-hole, the length direction of the through-hole being consistent with the extension direction of the main board; the main board including a guide pin, the guide pin being disposed on the second surface, the guide pin extending into the through-hole and being movable along the length direction of the through-hole.
[0014] In some embodiments of this application, the auxiliary plate includes a first extension plate, a guide plate, and a second extension plate connected sequentially in a first direction. The strip hole is disposed on the guide plate. The free ends of the first extension plate and the free ends of the second extension plate are disposed opposite to each other and are engaged with the edge of the hot plate. The first direction intersects with the extension direction of the main plate.
[0015] In some embodiments of this application, the strip hole includes a locking hole section, an upward lifting hole section, and a downward sinking hole section; a locking boss is provided on the circumferential outer side of the guide pin, the locking boss is located on the side of the strip hole away from the second surface, and the radial dimension of the locking boss is greater than the radial dimension of the locking hole section, and smaller than the radial dimensions of the upward lifting hole section and the downward sinking hole section.
[0016] In some embodiments of this application, the guide pin includes a first guide pin and a second guide pin, which are spaced apart in the extension direction of the motherboard. Attached Figure Description
[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 A schematic diagram of a hot plate module chip removal tool provided in some embodiments of this application;
[0020] Figure 2 This is a schematic diagram of a protection plate provided in some embodiments of this application;
[0021] Figure 3 A schematic diagram of a hot plate module chip removal tool provided in other embodiments of this application;
[0022] Figure 4 for Figure 3 A schematic diagram of the hot plate module's chip removal tool from another angle;
[0023] Figure 5 for Figure 4 A schematic diagram of the auxiliary plate shown;
[0024] Figure 6 for Figure 4 A schematic diagram of the first guide pin shown.
[0025] Figure label:
[0026] 100. Hot plate module chip removal tool;
[0027] 110. Mainboard; 111. First surface; 112. Second surface; 113. Handheld section; 114. Transition section; 115. Functional section;
[0028] 120. First caliper; 121. First caliper slot; 1211. First slot wall;
[0029] 130. Second caliper; 131. Second caliper slot; 1311. Second slot wall;
[0030] 140. Passive sliding sleeve;
[0031] 150. Active sliding sleeve; 151. Flexible snap-fit;
[0032] 170. Protective plate; 171. First flange; 172. Second flange;
[0033] 180. Auxiliary plate; 181. Strip hole; 1811. First lifting hole section; 1812. First sinking hole section; 1813. Second lifting hole section; 1814. Second sinking hole section; 1815. Locking hole section; 182. First extension plate; 1821. Third flange; 1822. First locking protrusion; 183. Second extension plate; 1831. Fourth flange; 1832. Second locking protrusion; 184. Guide plate;
[0034] 191. First guide pin; 192. Second guide pin; 193. Locking boss; 1931. Guide slope. Detailed Implementation
[0035] To better understand the above-mentioned objectives, features, and advantages of this utility model, the solution of this utility model will be further described below. It should be noted that, unless otherwise specified, the embodiments of this utility model and the features thereof can be combined with each other.
[0036] Many specific details are set forth in the following description in order to provide a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of the present invention, and not all embodiments.
[0037] In the semiconductor industry's wafer fabrication process, wafers often need to be heated to high temperatures of 100°C to 200°C. When equipment malfunctions, the wafers need to be manually removed from the hot plate.
[0038] For the safety of operators, it is currently necessary to wait until the wafer cools down to about 60°C and is safely removed before raising it to the process temperature.
[0039] The hot plate cooling process takes a long time, often around 2 to 3 hours. Adding the time for restart monitoring, it takes another 4 hours, significantly impacting production capacity.
[0040] To resolve the above technical issues, please refer to Figure 1 This application provides a hot plate module chip removal tool 100, which may include a motherboard 110, a first clamp 120 and a second clamp 130.
[0041] Specifically, the motherboard 110 is formed in the shape of a long strip. It should be noted that the hot plate usually has a relatively complex structure, and the channel space for picking up the chip is mostly a long and narrow space. Setting the motherboard 110 in the shape of a long strip makes it easier to insert the motherboard 110 into the chip picking space. The motherboard 110 includes a first surface 111 and a second surface 112. During the use of the hot plate module chip picking tool 100, the first surface 111 faces the hot plate.
[0042] Among them, the motherboard 110 in its extension direction (e.g. Figure 1 The M direction shown may include a handheld section 113, a transition section 114, and a functional section 115. The handheld section 113 is used to provide a handheld position for the user. A first surface 111 is formed on the functional section 115. One end of the transition section 114 is connected to the functional section 115, and the other end extends in a direction away from the hot plate and is connected to the handheld section 113. In this way, the distance between the handheld section 113 and the hot plate can be increased, thereby improving the safety factor of the operator during operation.
[0043] The first caliper 120 is disposed on the first surface 111. The first caliper 120 and the second caliper 130 are disposed opposite each other in the extension direction of the motherboard 110. The first caliper 120 is provided with a first slot 121, the opening of the first slot 121 facing the second caliper 130. The second caliper 130 is disposed on the first surface 111 and slidably connected to the motherboard 110. The second caliper 130 is provided with a second slot 131, the opening of the second slot 131 facing the first caliper 120. The second caliper 130 can slide in a direction toward or away from the first caliper 120. The first slot 121 includes a first slot wall 1211 away from the first surface 111, and the second slot 131 includes a second slot wall 1311 facing away from the first surface 111.
[0044] The second clamp 130 includes a first position and a second position. When the second clamp 130 is in the first position, the distance between the first groove wall 1211 and the second groove wall 1311 is less than the diameter of the wafer, and the distance between the bottom of the first groove 121 and the bottom of the second groove 131 is greater than the diameter of the wafer. When the second clamp 130 is in the second position, the distance between the first groove wall 1211 and the second groove wall 1311 is greater than the diameter of the wafer.
[0045] The distance between the first groove wall 1211 and the second groove wall 1311 refers to the distance between the end edge of the first groove wall 1211 facing the second groove wall 1311 and the end edge of the second groove wall 1311 facing the first groove wall 1211.
[0046] In the specific implementation process, both the first slot 121 and the second slot 131 can be formed as arc-shaped slots that match the wafer.
[0047] It should be noted that during the use of the hot plate module wafer pick-up tool 100, the second clamp 130 is initially in the second position. Then, the first clamp 120 and the second clamp 130 are extended above the wafer via the motherboard 110. Afterward, they are lowered so that the first clamp 120 and the second clamp 130 are located on the outer periphery of the wafer. Then, the second clamp 130 moves from the second position to the first position, so that the wafer is inserted into the first slot 121 and the second slot 131, allowing the first slot 121 and the second slot 131 to support the wafer. Then, the motherboard 110 is lifted to remove the wafer from the hot plate. Finally, the wafer is removed by moving the motherboard 110. Throughout the process, the distance between the operator and the hot plate is relatively far, so there is no risk of injury. At the same time, the wafer pick-up tool 100 achieves wafer pickup without waiting for the hot plate to cool down to 60°C, which helps to improve production capacity.
[0048] In some embodiments of this application, the thickness of the first slot wall 121 gradually decreases in the direction from the first slot 121 to the second slot 131, that is, the first slot wall 1211 is formed as a blade-shaped structure with the blade facing the second slot 131. It should be noted that the gap between the hot plate and the wafer is generally between 0.1 mm and 0.2 mm. By setting the first slot wall 1211 as a blade-shaped structure, it is convenient for the first slot wall 1211 to extend into the space between the wafer and the hot plate.
[0049] Furthermore, in the direction of the second clamp 130 toward the first clamp 120, the thickness of the second slot wall 1311 gradually decreases. By forming both the first slot wall 1211 and the second slot wall 1311 into blade-shaped structures, it is convenient for the first slot wall 1211 and the second slot wall 1311 to extend between the wafer and the hot plate, thereby enabling the first slot 121 and the second slot 131 to support the wafer, and thus enabling the hot plate module wafer picking tool 100 to pick up and place the wafer.
[0050] Please refer to some embodiments of this application. Figure 1 The hot plate module pick-up tool 100 may also include a passive sliding sleeve 140, which is slidably fitted on the circumferential outer side of the functional segment 115 of the motherboard 110. The second caliper 130 is disposed on the passive sliding sleeve 140. Thus, the second caliper 130 and the motherboard 110 are slidably connected by setting the passive sliding sleeve 140.
[0051] The second caliper 130 can be fixed to the passive sliding sleeve 140 by bolts.
[0052] Please refer to some embodiments of this application. Figure 1 The hot plate module pick-up tool 100 may also include an active sliding sleeve 150 and a connecting rod. The active sliding sleeve 150 is slidably sleeved on the circumferential outer side of the handheld section 113 and is located on the side of the second caliper 130 away from the first caliper 120. One end of the connecting rod is connected to the active sliding sleeve 150 and the other end is connected to the passive sliding sleeve 140.
[0053] Therefore, by setting the active sliding sleeve 150 and the connecting rod, the second caliper 130 can be driven to slide toward or away from the first caliper 120 in the hand-held section 113, which facilitates the operation of the operator and allows the operator's hand to stay away from the hot plate throughout the entire process.
[0054] Please refer to some embodiments of this application. Figure 1The active sliding sleeve 150 may also include a spring clip 151, and the motherboard 110 is provided with a slot that cooperates with the spring clip 151. It should be noted that when the second clamp 130 is in the first position, the spring clip 151 extends into the slot, fixing the position of the active sliding sleeve 150 and the handheld section 113, thereby fixing the second clamp 130 and the functional section 115. This ensures that the position between the first clamp 120 and the second clamp 130 remains unchanged during the wafer clamping process of the hot plate module wafer picker 100, thus ensuring the stability of the hot plate module wafer picker 100 in clamping the wafer.
[0055] Specifically, the active sliding sleeve 150 may include a sliding sleeve body and an elastic buckle 151. The sliding sleeve body is sleeved on the circumferential outer side of the handheld section 113. The elastic buckle 151 is formed as a spring sheet structure. One end of the spring sheet structure is connected to the outer surface of the sliding sleeve body, and the other end is provided with a locking protrusion. The sliding sleeve body is provided with a locking hole opposite to the locking groove. When the second caliper 130 is in the second position, the locking protrusion, the locking hole, and the locking groove are opposite to each other. The locking protrusion passes through the locking hole and the locking groove in sequence to fix the position of the active sliding sleeve 150 and the motherboard 110 bracket, thereby fixing the position between the second caliper 130 and the motherboard 110.
[0056] Furthermore, there can be multiple elastic buckles 151, which are spaced apart circumferentially on the sliding body. There are also multiple slots and multiple holes, with each slot and hole corresponding to one elastic buckle 151.
[0057] In the specific implementation process, there can be two elastic buckles 151, and the two elastic buckles 151 are set opposite each other in the width direction of the handheld section 113.
[0058] In some embodiments of this application, please refer to Figure 2 And refer to Figure 1 The hot plate module pick-up tool 100 may also include a protective plate 170, which is disposed on the first surface 111 and located between the first clamp 120 and the second clamp 130. The extension direction of the protective plate 170 (e.g.) Figure 2 The N direction shown intersects with the extension direction of the motherboard 110.
[0059] The protective plate 170 includes a first end and a second end opposite to each other in its extension direction. The first end is a first flange 171 folded toward the hot plate, and the second end is a second flange 172 folded toward the hot plate. Both the first flange 171 and the second flange 172 are located on the circumferential outer side of the wafer.
[0060] Specifically, the extension direction of the protection board 170 is perpendicular to the extension direction of the motherboard 110.
[0061] Furthermore, during the operation of the hot plate module wafer removal tool 100, the connection position between the main board 110 and the protection board 170 is located above the center area of the hot plate. The first flange 171, the first clamp 120, the second flange 172, and the second clamp 130 are sequentially arranged around the circumferential outer side of the wafer to achieve protection of the wafer in four directions, further preventing damage to the wafer during the movement of the wafer.
[0062] Furthermore, the first flange 171 can be lengthened to provide greater protection for the wafer, and the second flange 172 can also be lengthened to provide greater protection for the wafer.
[0063] For other embodiments of this application, please refer to Figure 3 and Figure 4 Without using the protection plate 170, the hot plate module pick-up tool 100 may also include an auxiliary plate 180. The auxiliary plate 180 is located on the side of the second surface 112 of the main board 110. The auxiliary plate 180 is engaged with the circumferential edge of the hot plate. The auxiliary plate 180 has a strip hole 181 that penetrates through it. The length direction of the strip hole 181 is consistent with the extension direction of the main board 110. The main board 110 includes a guide pin, which is located on the second surface 112. Specifically, the guide pin is fixed on the second surface 112, extends into the strip hole 181, and can move along the length direction of the strip hole 181.
[0064] It should be noted that the length direction of the slot 181 is consistent with the extension direction of the motherboard 110. That is, the length direction of the slot 181 is consistent with the extension direction of the motherboard 110. The guide pin can move in the length direction of the slot 181. In the specific operation, the hot plate module wafer pick-up tool 100 is moved above the hot plate and then lowered so that the auxiliary plate 180 is engaged with the circumferential edge of the hot plate. In this way, since the guide pin extends into the slot 181, the shaking of the motherboard 110 can be restricted, so that the motherboard 110 can only move along the direction of the slot 181, thus fixing the wafer's travel path and further avoiding the situation where the wafer collides with the hot plate channel space.
[0065] Specifically, the auxiliary plate 180 includes a first direction (e.g.) Figure 3 The first extension plate 182, the guide plate 184, and the second extension plate 183 are connected in sequence in the K direction shown in the figure. The strip hole 181 is provided on the guide plate 184. The free ends of the first extension plate 182 and the free ends of the second extension plate 183 are arranged opposite to each other and are engaged with the edge of the hot plate.
[0066] Specifically, the free end of the first extension plate 182 is formed as a third flange 1821 folded toward the hot plate, and the free end of the second extension plate 183 is formed as a fourth flange 1831 folded toward the hot plate. The third flange 1821 and the fourth flange 1831 are arranged opposite to each other to snap the hot plate together.
[0067] The third flange 1821 has a first locking protrusion 1822 on the side facing the fourth flange 1831. The first locking protrusion 1822 is spaced apart from the free end of the third flange 1821. In the specific implementation process, the first locking protrusion 1822 abuts against the upper surface of the hot plate, and the free end of the third flange 1821 abuts against the circumferential outer side of the hot plate, thereby limiting the hot plate in two directions. The free end of the fourth flange 1831 has a second locking protrusion 1832. The second locking protrusion 1832 is spaced apart from the free end of the fourth flange 1831. The first locking protrusion 1822 abuts against the upper surface of the hot plate, and the free end of the fourth flange 1831 abuts against the circumferential outer side of the hot plate.
[0068] Therefore, by setting the third flange 1821 and the fourth flange 1831, and cooperating with the first clamp 120 and the second clamp 130, a protective structure is defined in the circumference of the wafer to prevent damage to the wafer during movement.
[0069] The first direction intersects with the extension direction of the motherboard 110. In specific implementation, the first direction is set perpendicular to the extension direction of the motherboard 110.
[0070] In some embodiments of this application, please refer to Figure 5 and Figure 6 The strip hole 181 may include a locking hole section 1815 and an upward lifting hole section. A locking boss 193 is provided on the circumferential outer side of the guide pin. The locking boss 193 is located on the side of the strip hole 181 away from the second surface 112. The radial dimension of the locking boss 193 is greater than the radial dimension of the locking hole section 1815 and smaller than the radial dimension of the upward lifting hole section. That is to say, the locking boss 193 can pass through the upward lifting hole section but cannot pass through the locking hole section 1815.
[0071] In the specific implementation process, since the main board 110 is located on the lower side of the auxiliary board 180, the guide pin can first extend into the strip hole 181 through the lifting hole section, so that the locking boss 193 is located on the side of the strip hole 181 away from the second surface 112. Then, the main board 110 is moved so that the guide pin enters the locking hole section 1815, thereby realizing the sliding connection between the main board 110 and the auxiliary board 180.
[0072] Furthermore, the strip hole 181 may also include a recessed hole section, which is located on the side of the lifting hole section near the first caliper 120. The radial dimension of the recessed hole section is greater than the radial dimension of the locking boss 193, that is, the locking boss 193 can pass through the recessed hole section.
[0073] It should be noted that when the main board 110 and the auxiliary board 180 are positioned by the locking boss 193 of the guide pin, the main board 110 is relatively high, and the first caliper 120 and the second caliper 130 cannot clamp the wafer. By setting a recessed hole section, when the main board 110 moves above the wafer, the guide pin moves to the recessed hole section, and the locking boss 193 can descend through the recessed hole section, that is, the height of the main board 110 decreases, causing the first caliper 120 and the second caliper 130 to descend. Then the second caliper 130 moves from the second position to the first position. At this time, the part of the guide pin away from the main board 110 is located in the lifting hole section. Then the main board 110 is lifted so that the locking boss 193 of the guide pin passes through the strip hole 181. Then the main board 110 is moved so that the guide pin engages with the locking hole section 1815, so that the guide plate 180 can drive the main board 110 to lift up, realizing wafer pickup.
[0074] In some embodiments of this application, the guide pin may include a first guide pin 191 and a second guide pin 192. The first guide pin 191 and the second guide pin 192 are spaced apart in the extension direction of the motherboard 110. In this way, by setting the first guide pin 191 and the second guide pin 192, the rotation of the motherboard 110 can be avoided.
[0075] The first guide pin 191 and the second guide pin 192 can have different dimensions to avoid incorrect installation during the installation process.
[0076] It is understandable that the strip hole 181 is provided with a first upward hole section 1811 and a first downward hole section 1812 that cooperate with the first guide pin 191, and the strip hole 181 is also provided with a second upward hole section 1813 and a second downward hole section 1814 that cooperate with the second guide pin 192.
[0077] In some embodiments of this application, please refer to Figure 6 The side surface of the first guide pin 191 facing away from the hot plate can be formed as a guide slope 1931, so that when the main board 110 is raised, the first guide pin 191 extends from the first lifting hole section 1811 into the strip hole 181 and is lowered from the first sinking hole section 1812.
[0078] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0079] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.
[0080] In the description of the embodiments of this utility model, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Additionally, the character " / " in this utility model generally indicates that the preceding and following related objects have an "or" relationship.
[0081] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after the connection. Furthermore, the directional terms mentioned in the embodiments of this utility model, such as "inner" and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this utility model, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.
[0082] In the description of embodiments of this utility model, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0083] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A hot plate module chip removal tool, characterized in that, include: The motherboard includes opposing first and second surfaces; A first caliper and a second caliper are provided. The first caliper is disposed on the first surface and is disposed opposite to the first caliper in the extension direction of the motherboard. The first caliper has a first slot with its opening facing the second caliper. The second caliper is disposed on the first surface and is slidably connected to the motherboard. The second caliper has a second slot with its opening facing the first caliper. The second caliper can slide in a direction toward or away from the first caliper. The first slot includes a first slot wall away from the first surface, and the second slot includes a second slot wall away from the first surface. The second caliper includes a first position and a second position. When the second caliper is in the first position, the distance between the first slot wall and the second slot wall is less than the diameter of the wafer, and the distance between the bottom of the first slot and the bottom of the second slot is greater than the diameter of the wafer. When the second caliper is in the second position, the distance between the first slot wall and the second slot wall is greater than the diameter of the wafer.
2. The hot plate module chip removal tool according to claim 1, characterized in that, In the direction from the first caliper toward the second caliper, the thickness of the first groove wall gradually decreases. And / or, in the direction of the second caliper toward the first caliper, the thickness of the second groove wall gradually decreases.
3. The hot plate module chip removal tool according to claim 1, characterized in that, Also includes: A passive sliding sleeve is slidably fitted onto the circumferential outer side of the motherboard, and the second clamp is disposed on the passive sliding sleeve.
4. The hot plate module chip removal tool according to claim 3, characterized in that, Also includes: An active sliding sleeve is slidably fitted around the circumferential outer side of the motherboard and is located on the side of the second caliper away from the first caliper. A connecting rod, one end of which is connected to the active sliding sleeve and the other end of which is connected to the passive sliding sleeve.
5. The hot plate module chip removal tool according to claim 4, characterized in that, The active sliding sleeve includes an elastic buckle, and the main board is provided with a slot that cooperates with the elastic buckle.
6. The hot plate module chip removal tool according to claim 1, characterized in that, Also includes: A protective plate is disposed on the first surface, the protective plate is located between the first caliper and the second caliper, and the extending direction of the protective plate intersects with the extending direction of the main board; The protective plate includes a first end and a second end opposite to each other in its extension direction. The first end is a first flange folded toward the hot plate, and the second end is a second flange folded toward the hot plate. Both the first flange and the second flange are located on the circumferential outer side of the wafer.
7. The hot plate module chip removal tool according to claim 1, characterized in that, Also includes: An auxiliary plate is located on one side of the second surface of the main board. The auxiliary plate is snapped into the circumferential edge of the hot plate. The auxiliary plate has a strip-shaped hole that penetrates through the auxiliary plate. The length direction of the strip-shaped hole is consistent with the extension direction of the main board. The motherboard includes a guide pin disposed on the second surface, the guide pin extending into the strip hole and movable along the length direction of the strip hole.
8. The hot plate module chip removal tool according to claim 7, characterized in that, The auxiliary plate includes a first extension plate, a guide plate, and a second extension plate connected in sequence in a first direction. The strip hole is provided on the guide plate. The free ends of the first extension plate and the free ends of the second extension plate are arranged opposite to each other and are engaged with the edge of the hot plate. Wherein, the first direction intersects with the extension direction of the motherboard.
9. The hot plate module chip removal tool according to claim 7, characterized in that, The strip-shaped hole includes a positioning hole section, an upward lifting hole section, and a downward sinking hole section; The guide pin has a locking boss on its circumferential outer side. The locking boss is located on the side of the strip hole away from the second surface. The radial dimension of the locking boss is greater than the radial dimension of the locking hole section, and smaller than the radial dimensions of the lifting hole section and the sinking hole section.
10. The hot plate module chip removal tool according to claim 7, characterized in that, The guide pin includes a first guide pin and a second guide pin, which are spaced apart in the extension direction of the motherboard.