Wafer fixing device

Abstract

The utility model relates to a wafer fixing device, and the device comprises a bottom plate which comprises a top surface and a bottom surface which are opposite to each other, and the top surface is provided with a wafer placement region; each crank rocker structure comprises a first end and a second end which are opposite to each other, and the first ends of the two crank rocker structures are respectively fixed on the top surfaces of the two sides of the wafer placement area of the bottom plate; the two wafer pressing plates are respectively fixed at the second ends of the two crank rocker structures; and the driving structure is connected with the two crank rocker structures and is used for driving the second ends of the two crank rocker structures to move to the wafer placing area from the initial position above the top surface of the bottom plate in an arc shape, so that the lower surfaces of the two wafer pressing plates press the edge of the wafer placed in the wafer placing area. According to the wafer fixing device, the crank rocker structure, the wafer pressing plate and the driving structure are matched so that the wafer can be fixed in the wafer placing area of the bottom plate in a mechanical mode, and wafer vacuum loss or displacement caused by vacuum loss can be avoided.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and in particular to a wafer fixing device. Background Technology

[0002] During the wafer thinning or fabrication process, the original thickness of the wafer's edges is usually preserved to form a thicker retaining ring (such as a Taiko ring) to enhance the wafer's mechanical strength and effectively avoid the problem of the wafer being fragile or brittle as a whole during the thinning process.

[0003] Currently, the micro-stage fixing method for thinned wafers in visual inspection equipment typically uses vacuum adsorption, which is fixed by a vacuum adsorption fixing ring. Due to the small width of the fixing ring (generally around 3.5mm), the diameter of the vacuum adsorption holes in the micro-stage is also small, resulting in insufficient vacuum suction. Adjusting the vacuum level has little effect, and excessive force when manually moving the micro-stage can cause wafer displacement and loss of vacuum. Warped wafers cannot be directly adsorbed. Therefore, there is an urgent need for a wafer fixing device that can avoid wafer loss of vacuum or displacement caused by vacuum loss, and can ignore wafer warping. Utility Model Content

[0004] Based on this, this application provides a wafer fixing device that can prevent wafer vacuum loss or displacement caused by vacuum loss, and can ignore wafer warping.

[0005] This application provides a wafer fixing device, including:

[0006] A base plate, the base plate including opposing top and bottom surfaces, the top surface having a wafer placement area;

[0007] Two crank-rocker structures, each of which includes a first end and a second end opposite to each other, wherein the first ends of the two crank-rocker structures are respectively fixed to the top surfaces on both sides of the wafer placement area of ​​the base plate;

[0008] Two wafer pressure plates are respectively fixed to the second ends of the two crank-rocker structures;

[0009] A drive structure, connected to the two crank-rocker structures, is used to drive the second ends of the two crank-rocker structures to move in an arc shape from an initial position above the top surface of the base plate to the wafer placement area, so that the lower surfaces of the two wafer pressure plates press against the edges of the wafer placed in the wafer placement area.

[0010] In some embodiments of this application, the wafer placement area includes a central axis, and two crank rocker structures fixed to both sides of the wafer placement area are axially symmetrical with respect to the central axis.

[0011] In some embodiments of this application, the wafer platen includes opposing upper and lower surfaces, with the upper surface of the wafer platen being away from the top surface of the base plate.

[0012] In some embodiments of this application, when the driving structure drives the two crank rocker structures to move in an arc from an initial position above the top surface of the base plate to the wafer placement area, the upper surface of the wafer pressure plate is always parallel to the top surface of the base plate.

[0013] In some embodiments of this application, each of the wafer pressure plates includes a third end and a fourth end connected together, the lower surface of the third end being fixed to the surface of the second end of the crank rocker structure away from the top surface of the base plate, and the lower surfaces of the fourth ends of the two wafer pressure plates pressing against the edges of the wafers placed in the wafer placement area.

[0014] In some embodiments of this application, the fourth end of the wafer pressure plate is arc-shaped; the lower surface of the fourth end of the wafer pressure plate has a buffer pad.

[0015] In some embodiments of this application, each of the crank-rocker structures includes two bottom fixing blocks, two first support links, two second support links, a support crossbar, and two top fixing blocks, wherein...

[0016] The lower surfaces of the two bottom fixing blocks are fixed to the top surface outside the wafer placement area of ​​the base plate, and the line connecting the centers of the two bottom fixing blocks is parallel to the central axis. The bottom fixing blocks serve as the first end of the crank rocker structure.

[0017] One end of a first support link and a second support link are rotatably fixed to two sides of a corresponding bottom fixing block that are perpendicular to the central axis, and the first support link is rotatably fixed to the side of the bottom fixing block away from the other bottom fixing block.

[0018] The other side of the first support link and the corresponding second support link are rotatably fixed to two sides of the top fixing block that are perpendicular to the central axis. The top fixing block serves as the second end of the crank rocker structure.

[0019] The support crossbar is fixed to the side of the two second support links that is not in contact with the bottom fixing block.

[0020] In some embodiments of this application, fixing the lower surface of the third end of the wafer pressure plate to the surface of the second end of the crank rocker structure away from the top surface of the base plate includes fixing the lower surface of the third end of the wafer pressure plate to the surface of the top fixing block of the crank rocker portion away from the base plate.

[0021] In some embodiments of this application, the drive structure includes two drive components and two connecting components. The two drive components are respectively fixed in the base plate or on the top surface near the corresponding crank-rocker structure. One connecting component is used to connect the movable end of one drive component to one crank-rocker structure. When the movable end of the drive component moves, it drives the connecting component to move. The connecting component drives the second end of the corresponding crank-rocker structure to move in an arc from an initial position above the top surface of the base plate to the wafer placement area, so that the lower surfaces of the two wafer pressure plates press against the edge of the wafer placed in the wafer placement area. The drive component includes a cylinder, and the corresponding connecting component includes a connecting rod, or the drive component includes a motor, and the corresponding connecting component includes a gear or coupling.

[0022] In some embodiments of this application, when the driving component includes a cylinder and the corresponding connecting component includes a connecting rod, the wafer fixing device further includes two elastic components. One end of each of the two elastic components is fixed to the lower surface of a corresponding wafer pressure plate, and the other end is fixed to the top surface of the base plate. The elastic components are used to provide tensile force when the lower surfaces of the two wafer pressure plates press against the edge of the wafer placed in the wafer placement area.

[0023] The embodiments of this application may have, or at least have, the following advantages:

[0024] The wafer fixing device in this embodiment includes: a base plate, the base plate having opposing top and bottom surfaces, the top surface having a wafer placement area; two crank-rocker structures, each crank-rocker structure having opposing first and second ends, the first ends of the two crank-rocker structures being fixed to the top surfaces on both sides of the wafer placement area of ​​the base plate; two wafer pressure plates, respectively fixed to the second ends of the two crank-rocker structures; and a drive structure connected to the two crank-rocker structures, used to drive the second ends of the two crank-rocker structures to move in an arc shape from an initial position above the top surface of the base plate to the wafer placement area, so that the lower surfaces of the two wafer pressure plates press against the edge of the wafer placed in the wafer placement area. The wafer fixing device of this application, through the cooperation of the crank-rocker structure, wafer pressure plates, and drive structure, can mechanically fix the wafer to the wafer placement area of ​​the base plate, avoiding wafer vacuum loss or displacement caused by vacuum loss, ignoring wafer warping, reducing alarms, decreasing shift workload, and lowering the probability of wafer malfunction.

[0025] Details of one or more embodiments of this application are set forth in the following drawings and description. Other features, objects, and advantages of this application will become apparent from the specification, drawings, and claims. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a three-dimensional structural schematic diagram of a wafer fixing device provided in some embodiments of this application;

[0028] Figure 2 A three-dimensional structural diagram of a crank-rocker structure provided in some embodiments of this application;

[0029] Figure 3 A three-dimensional structural diagram of the crank rocker structure and wafer pressure plate provided in some embodiments of this application;

[0030] Figure 4 A bottom view of the wafer pressure plate provided in some embodiments of this application;

[0031] Figure 5 This is a top view of the base plate provided in some embodiments of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] Base plate - 101; Crank rocker structure - 102; Bottom fixing block - 103; First support connecting rod - 104; Second support connecting rod - 105; Top fixing block - 106; Support crossbar - 107; Wafer pressure plate - 108; Third end - 108a; Fourth end - 108b; Elastic component - 109; Spring fixing part - 110; Opening - 111;

[0034] Wafer placement area -10; First end -21; Second end -22. Detailed Implementation

[0035] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0037] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this application, the first element, part, region, layer, doping type, or portion discussed below may be referred to as a second element, part, region, layer, or portion.

[0038] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0039] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0040] The structure of the embodiments of this application should not be limited to the specific shape shown in the accompanying drawings, but includes shape deviations due to, for example, manufacturing techniques.

[0041] This application provides a wafer fixing device. Figure 1This is a three-dimensional structural schematic diagram of a wafer fixing device provided in some embodiments of this application.

[0042] refer to Figure 1 A wafer fixing device, comprising:

[0043] The base plate 101 includes a top surface and a bottom surface opposite each other, and the top surface has a wafer placement area 10;

[0044] Two crank-rocker structures 102, each crank-rocker structure 102 including opposing first ends 21 (reference) Figure 2 ) and second end 22 (reference) Figure 2 The first ends 21 of the two crank rocker structures 102 are respectively fixed to the top surfaces of the wafer placement area 10 on both sides of the base plate 101.

[0045] Two wafer pressure plates 108 are respectively fixed to the second ends 22 of two crank rocker structures 102;

[0046] The drive structure (not shown in the figure) is connected to two crank rocker structures 102 and is used to drive the second ends 22 of the two crank rocker structures 102 to move in an arc from the initial position A above the top surface of the base plate 101 to the wafer placement area 10, so that the lower surfaces of the two wafer pressure plates 108 press against the edge of the wafer placed in the wafer placement area 10.

[0047] Specifically, the base plate 101 serves as the supporting body of the wafer fixing device, and the base plate 101 can be a metal plate with a flat top surface. In some embodiments, the base plate 101 can be a micro stage of a visual inspection machine.

[0048] The top surface of the base plate 101 has a wafer placement area 10, which is the area used to place the wafer. In some embodiments, the wafer placement area 10 is a circular area, and the area of ​​the wafer placement area 10 is equal to or slightly larger than the area of ​​the wafer to be placed. After the wafer is fixed on the wafer placement area 10 of the base plate 101 by the wafer mounting device of this application, corresponding testing or processing can be performed.

[0049] In some embodiments, the wafer placement area 10 includes a central axis 11, and two crank rocker structures 102 fixed to both sides of the wafer placement area 10 are axially symmetrical with respect to the central axis 11.

[0050] In some embodiments, reference Figure 2 and Figure 3 Each crank-rocker structure 102 includes two bottom fixing blocks 103, two first support links 104, two second support links 105, a support crossbar 107, and two top fixing blocks 106, wherein...

[0051] The lower surfaces of the two bottom fixing blocks 103 are fixed to the base plate 101 (reference). Figure 1 The top surface outside the wafer placement area 10, and the line connecting the centers of the two bottom fixing blocks 103 is parallel to the central axis 11. The bottom fixing block 103 serves as the first end 21 of the crank rocker structure 102. In a specific example, the lower surfaces of the two bottom fixing blocks 103 are fixed to the top surface of the base plate 101 by screws.

[0052] One end of a first support link 104 and a second support link 105 are rotatably fixed to two sides of a corresponding bottom fixing block 103 perpendicular to the central axis 11. The first support link 104 is rotatably fixed to the side of the bottom fixing block 103 away from the other bottom fixing block 103. In a specific example, the first support link 104 and the second support link 105 may include opposing fifth and sixth ends. The bottom fixing block 103 has a first screw hole and a second screw hole penetrating the two sides of the bottom fixing block 103 perpendicular to the central axis 11. The fifth end of the first support link 104 has a third screw hole. The second support link 105... The fifth end of the rod 105 has a fourth screw hole. The side of the fifth end of the first support rod 104 is rotatably fixed to the side of the bottom fixing block 103 (the side of the bottom fixing block 103 away from the other bottom fixing block 103) by a first screw passing through the third screw hole and the first screw hole. That is, the fifth end of the first support rod 104 can rotate around the first screw. The side of the fifth end of the second support rod 105 is rotatably fixed to the side of the bottom fixing block 103 (the side of the bottom fixing block 103 close to the other bottom fixing block 103) by a second screw passing through the fourth screw hole and the second screw hole. That is, the fifth end of the second support rod 105 can rotate around the second screw.

[0053] The other ends of the first support link 104 and the corresponding second support link 105 are rotatably fixed to the two sides of the top fixing block 106 perpendicular to the central axis 11. The top fixing block 106 serves as the second end of the crank-rocker structure 102. In a specific example, the top fixing block 106 has a fifth screw hole and a sixth screw hole that penetrate the two sides of the top fixing block 106 perpendicular to the central axis 11. The sixth end of the first support link 104 has a seventh screw hole, and the sixth end of the second support link 105 has an eighth screw hole. The screw holes are connected by the seventh screw hole and the fifth screw hole. The third screw rotatably fixes the sixth end side of the first support link 104 to the side of the top fixing block 106 (the side of the top fixing block 106 away from the other top fixing block 106), that is, the sixth end of the first support link 104 can rotate around the third screw. The fourth screw passing through the eighth screw hole and the sixth screw hole rotatably fixes the sixth end side of the second support link 105 to the side of the top fixing block 106 (the side of the top fixing block 106 close to the other top fixing block 106), that is, the sixth end of the second support link 105 can rotate around the fourth screw.

[0054] The support crossbar 107 is fixed to the side of the two second support links 105 that is not in contact with the bottom fixing block 103.

[0055] With the aforementioned crank-rocker structure 102, driven by the drive unit, the second ends 22 of the two crank-rocker structures 102 can move smoothly from the initial position A above the top surface of the base plate 101 in an arc shape to the wafer placement area 10, so that the lower surfaces of the two wafer pressure plates 108 can smoothly press the edge of the wafer placed in the wafer placement area 10.

[0056] In some embodiments, the bottom fixing block 103, the first support link 104, the second support link 105, the support crossbar 107, and the top fixing block 106 can be made of metal or rigid and wear-resistant plastic.

[0057] Continue to refer to Figure 1 The wafer platen 108 includes an upper surface and a lower surface opposite each other, with the upper surface of the wafer platen 108 being away from the top surface of the base plate 101.

[0058] In some embodiments, when the drive structure drives the two crank rocker structures 102 to move in an arc from the initial position A above the top surface of the base plate 101 to the wafer placement area 10, the upper surface of the wafer pressure plate 108 is always parallel to the top surface of the base plate 101, which is beneficial for the wafer pressure plate 108 to stably and precisely press the edge of the wafer placed in the wafer placement area 10.

[0059] In some embodiments, reference Figure 4 In conjunction with references Figure 1Each wafer pressure plate 108 includes a third end 108a and a fourth end 108b connected to each other. The lower surface of the third end 108a is fixed to the surface of the second end 22 of the crank rocker structure 102 away from the top surface of the base plate 101. The lower surfaces of the fourth ends 108b of the two wafer pressure plates 108 respectively press against the edge of the wafer placed in the wafer placement area 10.

[0060] In some embodiments, continue to refer to Figure 4 The fourth end 108b of the wafer pressure plate 108 is arc-shaped to adapt to the shape of the wafer edge, so that the wafer can be evenly pressed by the wafer pressure plate 108. In some embodiments, the lower surface of the fourth end 108b of the wafer pressure plate 108 has a buffer pad, so that the wafer pressure plate 108 applies uniform force when pressing the wafer, and will not damage the wafer.

[0061] In some embodiments, reference Figure 3 and Figure 4 In conjunction with references Figure 1 and Figure 2 The lower surface of the third end 108a of the wafer pressure plate 108 is fixed to the surface of the second end 22 of the crank rocker structure 102 away from the top surface of the base plate 101, including: the lower surface of the third end 108a of the wafer pressure plate 108 is fixed to the surface of the top fixing block 106 of the crank rocker structure 102 away from the base plate 101. In a specific example, the lower surface of the third end 108a of the wafer pressure plate 108 is fixed to the surface of the top fixing block 106 of the crank rocker structure 102 away from the base plate 101 by screws.

[0062] In some embodiments, reference Figure 1 The drive structure (not shown in the figure) includes two drive components (not shown in the figure) and two connecting components (not shown in the figure). The two drive components are respectively fixed in the base plate 101 or on the top surface near the corresponding crank-rocker structure 102. One connecting component is used to connect the movable end of one drive component to one crank-rocker structure 102. When the movable end of the drive component moves, it drives the connecting component to move. The connecting component drives the second end 22 of the corresponding crank-rocker structure 102 to move in an arc from the initial position A above the top surface of the base plate 101 to the wafer placement area 10, so that the lower surfaces of the two wafer pressure plates 108 press against the edge of the wafer placed in the wafer placement area 10. It should be noted that, for ease of understanding and illustration, Figure 1 When the wafer clamping plate is in the initial position A, the wafer clamping plate is marked with 108. When the wafer clamping plate presses down on the edge of the wafer placed in the wafer placement area 10, the wafer clamping plate is marked with 108'.

[0063] In some embodiments, the driving component includes a cylinder, which may be disposed in the opening 111 of the base plate 101 (see reference). Figure 5In this configuration, the corresponding connecting component includes a connecting rod. One end of the connecting rod is movably connected to the movable end of the cylinder, and the other end of the connecting rod is movably connected to the support crossbar 107 of the crank-rocker structure 102. When the cylinder is pushed upward, the connecting rod drives the crank-rocker structure 102 to move upward in an arc. When the cylinder is lowered, the connecting rod drives the crank-rocker structure 102 to move downward in an arc. In some embodiments, the intake pipes of the two cylinders respectively connected to the two crank-rocker structures 102 are split into two equal distances by the main intake pipe, so that the two crank-rocker structures 102 can be controlled synchronously.

[0064] In some embodiments, when the driving component includes a cylinder and the corresponding connecting component includes a connecting rod, reference continues to the present. Figure 1 The wafer fixing device also includes two elastic components 109. One end of each elastic component 109 is fixed to the lower surface of a corresponding wafer pressure plate 108, and the other end is fixed to the top surface of the base plate 101. The elastic components 109 provide tensile force when the lower surfaces of the two wafer pressure plates 108 press against the edge of the wafer placed in the wafer placement area 10, so that the wafer pressure plates 108 can better press the wafer. In a specific example, the elastic components 109 are a set of springs with an outer diameter of about two millimeters. A spring fixing part 110 can be provided on the lower surface of the wafer pressure plate 108. One end of the spring is fixed to the spring fixing part 110, and the other end is fixed to the top surface of the base plate 101.

[0065] In some embodiments, the driving component includes a motor, and the corresponding connecting component includes a gear or a coupling. The gear (or coupling) connects the movable end of the motor to the fifth end of the first support link 104 or the second support link 105 in the crank rocker structure 102. When the motor rotates forward or in reverse, it drives the crank rocker structure 102 to move upward or downward in an arc shape through the gear or coupling.

[0066] In summary, the wafer fixing device of this application can mechanically fix the wafer to the wafer placement area of ​​the base plate through the cooperation of the crank rocker structure, the wafer pressure plate and the drive structure. This can prevent the wafer from losing vacuum or displacement caused by vacuum loss, ignore wafer warping, reduce alarms, reduce the workload of on-duty personnel and reduce the probability of wafer accidents.

[0067] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer fixing device characterized by comprising: The utility model relates to a wafer pressing device, comprising: a base plate comprising opposite top and bottom surfaces, the top surface having a wafer placement area; two crank rocker structures, each comprising opposite first and second ends, the first ends of the two crank rocker structures being fixed to the top surface on both sides of the wafer placement area of the base plate; two wafer pressing plates, each being fixed to the second end of a respective one of the two crank rocker structures; a driving structure connected to the two crank rocker structures for driving the second ends of the two crank rocker structures to move in an arc from an initial position above the top surface of the base plate to the wafer placement area, so that the lower surfaces of the two wafer pressing plates press against the edges of a wafer placed on the wafer placement area.

2. The wafer fixing device according to claim 1, wherein The wafer placement area comprises a central axis, and the two crank rocker structures fixed to both sides of the wafer placement area are axisymmetric with respect to the central axis.

3. The wafer fixing device according to claim 2, wherein The wafer pressing plates each comprise opposite upper and lower surfaces, and the upper surface of each wafer pressing plate is away from the top surface of the base plate.

4. The wafer fixing device according to claim 3, wherein When the driving structure drives the second ends of the two crank rocker structures to move in an arc from the initial position above the top surface of the base plate to the wafer placement area, the upper surface of each wafer pressing plate is always parallel to the top surface of the base plate.

5. The wafer fixing device according to claim 3 or 4, characterized by Each wafer pressing plate comprises connected third and fourth ends, the lower surface of the third end being fixed to a surface of the second end of the respective one of the two crank rocker structures away from the top surface of the base plate, and the lower surface of the fourth end of each wafer pressing plate pressing against the edge of a wafer placed on the wafer placement area.

6. The wafer fixing device according to claim 5, wherein The fourth end of each wafer pressing plate is in an arc shape, and the lower surface of the fourth end of each wafer pressing plate has a cushion pad.

7. The wafer fixing device according to claim 5, wherein Each crank rocker structure comprises two bottom fixing blocks, two first support links, two second support links, a support crossbar and two top fixing blocks, wherein the lower surfaces of the two bottom fixing blocks are fixed to the top surface outside the wafer placement area of the base plate, and the line connecting the centers of the two bottom fixing blocks is parallel to the central axis, and the bottom fixing blocks serve as the first ends of the crank rocker structures; one side surface of one end of each of the first and second support links is rotatably fixed to a respective one of the two bottom fixing blocks perpendicular to the central axis, and the first support link is rotatably fixed to the side of the bottom fixing block away from the other bottom fixing block; the other side surface of the other end of each of the first and second support links is rotatably fixed to a respective one of the two top fixing blocks perpendicular to the central axis, and the top fixing blocks serve as the second ends of the crank rocker structures; the support crossbar is fixed to the side surfaces of the two second support links not in contact with the bottom fixing blocks.

8. The wafer fixing device according to claim 7, wherein The fixing of the lower surface of the third end of each wafer pressing plate to a surface of the second end of the respective one of the two crank rocker structures away from the top surface of the base plate comprises fixing the lower surface of the third end of each wafer pressing plate to a surface of the top fixing block of the respective one of the two crank rocker structures away from the base plate.

9. The wafer fixing device according to claim 7, wherein The driving structure comprises two driving components and two connecting components, the two driving components are fixed on the bottom plate or the top surface near the corresponding crank rocker structure respectively, one connecting component is used to connect the movable end of one driving component with one crank rocker structure, when the movable end of the driving component moves, it drives the connecting component to move, the connecting component drives the second end of the corresponding crank rocker structure to move from the initial position above the top surface of the bottom plate to the wafer placement area in an arc shape, so that the lower surface of the two wafer pressing plates presses the edge of the wafer placed in the wafer placement area; The driving component comprises a cylinder, and the corresponding connecting component comprises a connecting rod, or the driving component comprises a motor, and the corresponding connecting component comprises a gear or a shaft coupling.

10. The wafer fixing device according to claim 9, wherein When the driving component comprises a cylinder and the corresponding connecting component comprises a connecting rod, the wafer fixing device further comprises two elastic components, one end of each elastic component is fixed on the lower surface of the corresponding wafer pressing plate, and the other end is fixed on the top surface of the bottom plate, the elastic component is used to provide tensile force when the lower surface of the two wafer pressing plates presses the edge of the wafer placed in the wafer placement area.

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