Wafer testing device

Abstract

The utility model provides a wafer testing device, comprising a bearing platform configured to be capable of circumferential rotation and horizontal displacement, the bearing platform bearing a wafer from the bottom surface of the wafer; the working table is arranged above the bearing table at intervals, a working opening for exposing a wafer below the working table is formed in the working table, the probe seat, the optical fiber, the first visual system and the second visual system are arranged around the working opening, and the probe seat and the optical fiber are both configured to be capable of performing small-amplitude displacement movement relative to the wafer. The first visual system is configured to move up and down relative to the wafer, and the second visual system is configured to be adjustable in angle so as to align to a to-be-tested point on the wafer. According to the utility model, postures of the wafer in the X-axis direction, the Y-axis direction and the axial direction are adjusted through the bearing platform, and the probe seat and the optical fiber are adjusted in a small range to match point locations to be tested on the wafer, so that the wafer position correction time is greatly saved, and the test speed and the test efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, specifically, it demonstrates a wafer testing device. Background Technology

[0002] A wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Various chips can be fabricated on wafers, transforming them into products with specific functions. During wafer fabrication, the wafer is typically fixed on a wafer testing machine, and the optical and electrical properties of each chip on the wafer are tested individually. In related technologies, the wafer is placed on a worktable, and the probes of the wafer testing equipment inspect the chips on the wafer. Due to the uneven positioning of the chips on the wafer, the probes need to be constantly moved and their positions adjusted. Conventional lead screw-driven movement methods are not only inaccurate but also result in slow testing speeds and low testing efficiency. Utility Model Content

[0003] The purpose of this invention is to provide a wafer testing device that is simple and practical in structure, has high testing efficiency, and a high degree of automation.

[0004] The technical solution is as follows:

[0005] A wafer testing apparatus, comprising:

[0006] The support stage is configured to rotate circumferentially and move horizontally, and the support stage supports the wafer from the bottom surface of the wafer;

[0007] A worktable is spaced above a support platform and has working openings that expose the wafer below. Around the working openings are probe holders, optical fibers, a first vision system, and a second vision system. The probe holders and optical fibers are configured to make small displacement movements relative to the wafer. The first vision system is configured to make vertical displacement movements relative to the wafer. The second vision system is configured to have an adjustable angle to align with the test points on the wafer.

[0008] Optionally, a suction cup is provided on the top of the support stage for adsorbing the wafer. The design of the suction cup can meet the fixing requirements of wafers of various models and specifications, and the fixing effect is very stable and reliable without damaging the wafer.

[0009] The support platform is mounted on a rotating platform, which is located on the Y-axis displacement module and can move along the displacement direction of the Y-axis displacement module. The Y-axis displacement module is located on the X-axis displacement module and can move along the displacement direction of the X-axis displacement module. In this way, the X-axis displacement module, the Y-axis displacement module, and the rotating platform can respectively achieve positional adjustments of the wafer in the X-axis, Y-axis, and axial directions.

[0010] Optionally, the probe holder is connected to a first vertical fine-tuning cylinder group via an adapter. The first vertical fine-tuning cylinder group is located on the first XY-axis fine-tuning group, which is located on the worktable. In this way, the position of the probe holder in the X-axis, Y-axis, and Z-axis directions can be adjusted by the first XY-axis fine-tuning group and the first vertical fine-tuning cylinder group, respectively.

[0011] The probe holder achieves a small-amplitude displacement relative to the wafer in a horizontal orientation. This ensures that the test probes on the probe holder are always in a vertical position and precisely in contact with the test points on the wafer.

[0012] Optionally, the optical fiber is connected to a second vertical fine-tuning cylinder group via a clamping assembly. The second vertical fine-tuning cylinder group is located on the second XY-axis fine-tuning group, which is located on the worktable. Thus, the position of the optical fiber in the X, Y, and Z axes can be adjusted using the second XY-axis fine-tuning group and the second vertical fine-tuning cylinder group, respectively.

[0013] The optical fiber achieves a small-amplitude displacement relative to the wafer in an inclined or vertical orientation. This ensures that the optical fiber is close to the test point on the wafer in an inclined or vertical orientation.

[0014] Optionally, the second vision system is connected to a rotating module, which is mounted on a third vertical fine-tuning cylinder via a side bracket. The third vertical fine-tuning cylinder is mounted on a worktable via a support. Thus, the third vertical fine-tuning cylinder and the rotating module can respectively achieve changes in the vertical position and angle of the second vision system.

[0015] Optionally, the first vision system is vertically mounted and supported on a worktable via a gantry. The first vision system is used to locate the position of the corresponding chip on the wafer.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: the posture adjustment of the wafer in three directions (X-axis, Y-axis, and axial direction) is realized by the support stage, and the chip position on the wafer is located by the first vision system. The test points on the wafer are matched by small-amplitude adjustment of the probe holder and optical fiber, which greatly saves the wafer position calibration time, thereby improving the test speed and test efficiency. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a wafer testing device according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the workbench portion of an embodiment of the present invention;

[0019] Figure 3This is a schematic diagram of the support platform portion of an embodiment of the present utility model;

[0020] The relevant markings in the attached diagram are as follows: 1-Bearing platform, 2-Workbench, 3-Probe mount, 4-Fiber optic cable, 5-First vision system, 6-Second vision system, 11-Bearing suction cup, 12-Rotating platform, 13-Y-axis displacement module, 14-X-axis displacement module, 21-Working port, 31-Adapter, 32-First vertical fine-tuning cylinder group, 33-First XY-axis fine-tuning group, 41-Clamping group, 42-Second vertical fine-tuning cylinder group, 43-Second XY-axis fine-tuning group, 51-Gantry frame, 61-Rotating module, 62-Side frame, 63-Third vertical fine-tuning cylinder, 64-Bracket. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] This utility model provides a wafer testing device to solve the technical problems mentioned in the background art. For example... Figure 1 , Figure 2 and Figure 3 As shown, specifically, it mainly includes a support stage 1 and a worktable 2. The support stage 1 is configured to rotate circumferentially and move horizontally. In other words, the support stage 1 can not only rotate circumferentially, but also move horizontally along the X and Y axes. The support stage 1 supports and places the test wafer on the bottom surface of the wafer. The worktable 2 is spaced above the support platform 1. A circular working opening 21 is formed in the center of the worktable 2's surface, exposing the wafer placed on the support platform 1. Around the working opening 21 are arranged a probe holder 3, an optical fiber 4, a first vision system 5, and a second vision system 6. In this embodiment, the probe holder 3 and the optical fiber 4 face each other. The first vision system 5 is mounted on the worktable 2 above the working opening 21 via a gantry 51, and the second vision system 6 is positioned close to the probe holder 3. Specifically, the probe holder 3 and the optical fiber 4 are configured to allow for small-amplitude displacement relative to the wafer, enabling them to flexibly match the chip positions on the wafer. The first vision system 5 is configured to allow for vertical displacement relative to the wafer, primarily used to locate the corresponding chip positions on the wafer. The second vision system 6 is configured with an adjustable angle to align with the test point on the wafer to which the probe holder has moved. The first vision system 5 and the second vision system 6 are conventional camera acquisition systems.

[0023] Test principle: The wafer's orientation is adjusted along the X, Y, and axial directions using a support stage. A first vision system locates the chip position on the wafer, and the probe holder and optical fiber are adjusted slightly to match the test points on the wafer. A second vision system collects the optical fiber data. The probes on the probe holder are used to detect the chip on the wafer. After powering on the chip, the dark field curve of the chip is tested. A standard beam emitted from the optical fiber is incident on the photosensitive surface of the chip, and the chip's light field data is tested after powering on. Then, it is determined whether the pass / fail conditions are met.

[0024] In this embodiment, a suction cup 11 is provided on the top of the support stage 1 for negative pressure adsorption of the wafer. The design of the suction cup can meet the fixing requirements of wafers of various models and specifications, and the fixing effect is very stable and reliable without damaging the wafer.

[0025] The support platform 1 is mounted on the rotating platform 12, which is mounted on the Y-axis displacement module 13 and can move along the displacement direction of the Y-axis displacement module 13. The Y-axis displacement module 13 is mounted on the X-axis displacement module 14 and can move along the displacement direction of the X-axis displacement module 14. In this way, the X-axis displacement module, the Y-axis displacement module, and the rotating platform can respectively achieve positional adjustments of the wafer in the X-axis, Y-axis, and axial directions.

[0026] In this embodiment, the probe holder 3 is connected to the first vertical fine-tuning cylinder group 32 via an adapter 31. The first vertical fine-tuning cylinder group 32 is located on the first XY-axis fine-tuning group 33, which is located on the worktable 2. The first XY-axis fine-tuning group 33 is a conventional manual or automatic fine-tuning platform. Thus, the position of the probe holder in the X, Y, and Z axes can be adjusted by the first XY-axis fine-tuning group and the first vertical fine-tuning cylinder group, respectively.

[0027] The probe holder 3 achieves a small-amplitude displacement relative to the wafer in a horizontal orientation. This ensures that the probes on the probe holder can always maintain a vertical orientation and accurately align with the test points on the wafer.

[0028] In this embodiment, the optical fiber 4 is connected to the second vertical fine-tuning cylinder group 42 via a clamping assembly 41. There are two optical fibers 4, one inclined and one vertical. The second vertical fine-tuning cylinder group 42 is located on the second XY-axis fine-tuning group 43, which is located on the worktable 2. The second XY-axis fine-tuning group 43 is a conventional manual or automatic fine-tuning platform. Thus, the position of the optical fiber in the X, Y, and Z axes can be adjusted respectively through the second XY-axis fine-tuning group and the second vertical fine-tuning cylinder group.

[0029] Among them, optical fiber 4 achieves a small displacement relative to the wafer in an inclined or vertical orientation. This ensures that the optical fiber is close to the test point on the wafer in an inclined or vertical orientation.

[0030] In this embodiment, the second vision system 6 is connected to a rotating module 61. The rotating module 61 is mounted on a third vertical fine-tuning cylinder 63 via a side bracket 62. The third vertical fine-tuning cylinder 63 is mounted on the worktable 2 via a bracket 64. Thus, the third vertical fine-tuning cylinder and the rotating module can respectively achieve changes in the vertical position and angle of the second vision system, ensuring it accurately faces the fiber optic illumination end.

[0031] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A wafer testing device, characterized in that, include: The support platform (1) is configured to be able to rotate circumferentially and be able to move horizontally, and the support platform (1) supports the wafer from the bottom surface of the wafer; The worktable (2) is spaced above the support platform (1) and has a working port (21) that exposes the wafer below. The worktable (21) is surrounded by a probe holder (3), an optical fiber (4), a first vision system (5), and a second vision system (6). The probe holder (3) and the optical fiber (4) are configured to make small displacement movements relative to the wafer. The first vision system (5) is configured to make up-down displacement movements relative to the wafer. The second vision system (6) is configured to have an adjustable angle to align with the test point on the wafer.

2. The wafer testing apparatus according to claim 1, characterized in that, The top of the support platform (1) is provided with a support suction cup (11) for adsorbing the wafer.

3. The wafer testing apparatus according to claim 2, characterized in that, The support platform (1) is located on the rotating platform (12), the rotating platform (12) is located on the Y-axis displacement module (13) and can move along the displacement direction of the Y-axis displacement module (13), the Y-axis displacement module (13) is located on the X-axis displacement module (14) and can move along the displacement direction of the X-axis displacement module (14).

4. The wafer testing apparatus according to claim 1, characterized in that, The probe holder (3) is connected to the first vertical fine-tuning cylinder group (32) via an adapter (31). The first vertical fine-tuning cylinder group (32) is located on the first XY axis fine-tuning group (33), which is located on the worktable (2).

5. A wafer testing apparatus according to claim 4, characterized in that, The probe holder (3) achieves a small displacement relative to the wafer in a horizontal orientation.

6. A wafer testing apparatus according to claim 1, characterized in that, The optical fiber (4) is connected to the second vertical fine-tuning cylinder group (42) through a clamping group (41). The second vertical fine-tuning cylinder group (42) is located on the second XY axis fine-tuning group (43), which is located on the worktable (2).

7. A wafer testing apparatus according to claim 6, characterized in that, The optical fiber (4) achieves small-amplitude displacement relative to the wafer in an inclined or vertical orientation.

8. A wafer testing apparatus according to claim 1, characterized in that, The second vision system (6) is connected to the rotating module (61), which is mounted on the third vertical fine-tuning cylinder (63) via a side frame (62). The third vertical fine-tuning cylinder (63) is mounted on the worktable via a bracket (64).

9. A wafer testing apparatus according to claim 1, characterized in that, The first vision system (5) is set vertically and is mounted on the workbench (2) via a gantry (51).

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