High-precision laser ball mounter

Abstract

The utility model relates to a high-precision laser ball mounter, which is characterized in that a plurality of solder ball conveying channels are arranged, under the blowing action of a first blowing channel, solder balls can be quickly and forwards conveyed to a solder ball blanking channel in the solder ball conveying channels and are adsorbed by a solder ball adsorption plate, and then the solder balls are blown through a second blowing channel; by controlling the blowing time node of the second blowing channel 8, the spraying node of each solder ball blanking channel is accurate to 0.5 millisecond, high-speed controllable solder ball spraying is realized, the solder balls can be accurately implanted into the surface of a circuit board, a wafer or a chip, the production efficiency is improved, the production cost is reduced, and the production efficiency is improved. The solder ball reballing device is simple in structure, convenient to operate, capable of accurately controlling solder balls with the particle size of more than 0.05 mm to rebale, high in reballing efficiency, yield and accuracy, suitable for reballing elements of various shapes, models and sizes, low in processing cost and good in equipment operation stability.

Description

Technical Field

[0001] This utility model relates to the field of ball-planting machine technology, and in particular to a high-precision laser ball-planting machine. Background Technology

[0002] Modern electronic products are becoming increasingly sophisticated and complex. For certain precision components that require limited space, have low thermal requirements, and cannot be soldered into a furnace, ball bonding has become a bottleneck for the mass production of many high-tech precision products. In modern BGA ball bonding technology, many companies have begun to use laser processing technology to solve this problem. Traditional ball bonding techniques, such as stencil ball grid arrays, are not suitable for these products.

[0003] Therefore, the technology of individual solder ball placement has become an urgent need for the mass production of this type of product. Utility Model Content

[0004] The present invention aims to at least partially solve one of the problems existing in the existing related technologies. To this end, the present invention proposes a high-precision laser ball-planting machine.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A high-precision laser ball-mounting machine includes a base with multiple solder ball conveying channels spaced apart within the base. Each solder ball conveying channel has a solder ball dropping channel connected to its front end. The lower ends of each solder ball dropping channel converge to form a confluence port. A nozzle connected to the confluence port is located at the lower end of the base. A solder ball adsorption plate is also provided at the front end of each solder ball conveying channel. A first air blowing channel is connected to the rear end of each solder ball conveying channel. A second air blowing channel is connected to the upper end of each solder ball dropping channel. A vacuum channel is connected to the solder ball adsorption plate at a position corresponding to the front end of each solder ball conveying channel.

[0007] In some embodiments, a support plate is provided on one side of the base.

[0008] In some embodiments, a high-speed solenoid valve is provided on the support plate, and the first air blowing channel and the second air blowing channel are respectively connected to the high-speed solenoid valve.

[0009] In some embodiments, a vacuum valve communicating with a vacuum channel is also provided on the base.

[0010] In some embodiments, a vacuum valve digital display is also provided on the support plate.

[0011] In some embodiments, a solder ball storage bin for feeding multiple solder ball conveying channels is provided at the upper end of the base.

[0012] In some embodiments, the solder ball delivery channels are provided at intervals of three.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] By setting up multiple solder ball conveying channels, the solder balls are rapidly conveyed forward through the first air blowing channel to the solder ball dropping channel, where they are adsorbed by the solder ball adsorption plate. Then, they are blown through the second air blowing channel, thereby controlling the solder balls to enter the nozzle sequentially from the solder ball dropping channel for ejection. By controlling the blowing time of the second air blowing channel, the ejection node of each solder ball dropping channel is accurate to 0.5 milliseconds, achieving high-speed and controllable solder ball ejection. This allows the solder balls to be accurately implanted onto the surface of circuit boards, wafers, or chips. It can precisely control the implantation of solder balls with a particle size of 0.05mm or larger, resulting in high implantation efficiency, yield, and accuracy. It is suitable for implanting components of various shapes, models, and sizes, with low processing costs and good equipment operation stability. Attached Figure Description

[0015] Figure 1 This is one of the three-dimensional structural schematic diagrams of this utility model;

[0016] Figure 2 This is the second three-dimensional structural schematic diagram of the present invention;

[0017] Figure 3 This is a partial cross-sectional view of the present invention. Detailed Implementation

[0018] The following detailed description provides various embodiments or examples for implementing this utility model. Of course, these are merely embodiments or examples and are not intended to be limiting. Additionally, repeated reference numerals, such as repeated numbers and / or letters, may be used in different embodiments. These repetitions are for the purpose of simple and clear description of this utility model and do not represent a specific relationship between the different embodiments and / or structures discussed.

[0019] like Figures 1-3 A high-precision laser ball-mounting machine is shown, comprising a base 1, with multiple solder ball conveying channels 2 spaced apart within the base 1. A solder ball dropping channel 3 is connected to the front end of each solder ball conveying channel 2. The lower ends of each solder ball dropping channel 3 converge to form a confluence port 4. A nozzle 5 connected to the confluence port 4 is provided at the lower end of the base 1. A solder ball adsorption plate 6 is also provided at the front end of the solder ball conveying channel 2. A first air blowing channel 7 is connected to the rear end of the solder ball conveying channel 2. A second air blowing channel 8 is connected to the upper end of the solder ball dropping channel 3. A vacuum channel 9 is connected to the solder ball adsorption plate 6 at the position corresponding to the front end of the solder ball conveying channel 2.

[0020] According to the above structure, by setting multiple solder ball conveying channels 2, the solder balls are rapidly conveyed forward to the solder ball dropping channel 3 by the air blowing action of the first air blowing channel 7, and are adsorbed by the solder ball adsorption plate 6. Then, they are blown by the second air blowing channel 8, thereby controlling the solder balls to enter the nozzle 5 from the solder ball dropping channel 3 in sequence for ejection. By controlling the air blowing time of the second air blowing channel 8, the ejection node of each solder ball dropping channel 3 is accurate to 0.5 milliseconds, realizing high-speed and controllable ejection of solder balls. In this way, the solder balls can be accurately implanted onto the surface of circuit boards, wafers, or chips. It can accurately control the implantation of solder balls with a particle size of 0.05mm or larger. The implantation efficiency, yield, and accuracy are high. It is suitable for implanting components of various shapes, models, and sizes. The processing cost is low and the equipment has good operating stability.

[0021] In this invention, preferably, the solder ball conveying channel 2 is provided with three channels at intervals, that is, the solder ball dropping channel 3 is also provided with three channels. The lower ends of the three solder ball dropping channels 3 converge to form a confluence port 4, so that the solder balls in each solder ball conveying channel 2 can enter the nozzle 5 from the confluence port 4 for ejection.

[0022] In this invention, a support plate 21 is provided on one side of the base 1, through which the module can be installed on the equipment.

[0023] To prevent oxidation of the solder balls, inert gas is introduced into the first air blowing channel 7 and the second air blowing channel 8. In this embodiment, nitrogen is introduced into the first air blowing channel 7 and the second air blowing channel 8.

[0024] A high-speed solenoid valve 31 is provided on the support plate 21. The first air blowing channel 7 and the second air blowing channel 8 are respectively connected to the high-speed solenoid valve 31, and the first air blowing channel 7 and the second air blowing channel 8 are controlled by the high-speed solenoid valve 31.

[0025] Furthermore, a vacuum valve 41 communicating with the vacuum channel 9 is also provided on the base 1.

[0026] A vacuum valve digital display 51 is also provided on the support plate 21.

[0027] In this invention, a solder ball storage bin 61 for feeding multiple solder ball conveying channels 2 is provided at the upper end of the base 1.

[0028] Based on the accompanying drawings and the foregoing display and description of the basic principles, main features, and advantages of this utility model, those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-precision laser ball-planting machine, characterized in that: The device includes a base (1), in which multiple solder ball conveying channels (2) are arranged at intervals. A solder ball dropping channel (3) is connected to the front end of each solder ball conveying channel (2). The lower ends of each solder ball dropping channel (3) are connected to form a confluence port (4). A nozzle (5) connected to the confluence port (4) is provided at the lower end of the base (1). A solder ball adsorption plate (6) is also provided at the front end of the solder ball conveying channel (2). A first air blowing channel (7) is connected to the rear end of the solder ball conveying channel (2). A second air blowing channel (8) is connected to the upper end of the solder ball dropping channel (3). A vacuum channel (9) is connected to the solder ball adsorption plate (6) at the position corresponding to the front end of the solder ball conveying channel (2).

2. The high-precision laser ball-planting machine according to claim 1, characterized in that: A support plate (21) is provided on one side of the base (1).

3. A high-precision laser ball-planting machine according to claim 2, characterized in that: A high-speed solenoid valve (31) is provided on the support plate (21), and the first air blowing channel (7) and the second air blowing channel (8) are respectively connected to the high-speed solenoid valve (31).

4. A high-precision laser ball-planting machine according to claim 2, characterized in that: A vacuum valve (41) communicating with the vacuum channel (9) is also provided on the base (1).

5. A high-precision laser ball-planting machine according to claim 4, characterized in that: A vacuum valve digital display (51) is also provided on the support plate (21).

6. A high-precision laser ball-planting machine according to claim 1, characterized in that: A solder ball storage bin (61) for feeding multiple solder ball conveying channels (2) is provided at the upper end of the base (1).

7. A high-precision laser ball-planting machine according to claim 1, characterized in that: The solder ball conveying channel (2) is provided with three channels at intervals.

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