IPM lead frame and packaging module

Abstract

According to the IPM lead frame and the packaging module, each frame unit comprises a first base island area and a second base island area which are spaced, a plurality of base islands are sequentially arranged in the first base island area and the second base island area in the length direction of the frame unit at intervals, a plurality of pins are sequentially arranged on the two sides of the frame unit in the length direction at intervals, and the number of the pins on the two sides is different; in the first base island area, a plurality of base islands are connected through first connecting ribs, and the rest of the base islands are respectively connected with a pin positioned on one side of the frame unit; in the second base island area, a plurality of base islands are connected through second connecting ribs, and the rest of the base islands are respectively connected with a pin positioned on the other side of the frame unit; the packaging module comprises an injection molding body and an IPM lead frame packaged in the injection molding body, and a chip is bonded on the IPM lead frame. According to the utility model, the structural stability and the electrical isolation effect of the layout in a compact space are realized, and the asymmetric pin layout arrangement is adopted, so that the integrated packaging of the power module is facilitated, and the power module can adapt to two packaging appearances of SOP23 and DIP23.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology and relates to integrated circuit packaging, specifically to an IPM lead frame and packaging module. Background Technology

[0002] For current integrated power modules, multiple chips are carried by a multi-base island lead frame and encapsulated in a plastic housing, which can greatly reduce device size and parasitic impedance, becoming an important development direction to replace discrete devices. Currently, an IPM (Intelligent Power Module) with an SOP23 / DIP23 package can integrate three half-bridges. Its lead frame is typically single-row or double-row, which significantly limits packaging efficiency and fails to reflect the frame's utilization rate. Simply increasing the number of rows based on existing layouts may increase structural instability and cause problems such as incomplete molding during encapsulation, resulting in poor packaging. Therefore, the frame design is not simply about increasing the number of rows; it needs to consider structural strength, mold flow, and other factors. Utility Model Content

[0003] To address the shortcomings of the aforementioned prior art, this application provides an IPM lead frame and packaging module, which rationally arranges the connection relationships between the base island and the connections and pins, achieving structural stability and electrical isolation in a compact / limited space. It also adopts an asymmetrical pin layout, which is beneficial for the integrated packaging of power modules and can be adapted to both SOP23 and DIP23 package forms.

[0004] To achieve the above objectives, the present invention employs the following technology:

[0005] An IPM lead frame includes frame units arrayed on a frame body. Further, it includes three rows of multi-column frame units.

[0006] The frame unit includes a first base island region and a second base island region spaced apart along the width direction. Multiple base islands are sequentially spaced apart along the length direction of the frame unit in both the first and second base island regions. Multiple pins are sequentially spaced apart along the length direction on both sides of the frame unit, and the number of pins on both sides is different.

[0007] Within the first base island area, several base islands are connected by a first connecting rib, and the remaining base islands are each connected to a pin located on one side of the frame unit.

[0008] Within the second base island area, several base islands are connected by a second connecting rib, and the remaining base islands are each connected to a pin located on the other side of the frame unit;

[0009] The first connecting rib and the second connecting rib are spaced apart. The first connecting rib and each pin are connected to the main frame body, and the second connecting rib is connected to a pin on the other side of the frame unit.

[0010] Furthermore, within the first base island region, several base islands are recessed downwards to a first depth, and within the second base island region, several base islands are recessed downwards to a second depth. Even further, the first depth is less than or equal to the second depth.

[0011] Furthermore, in the first base island area, a first base island, a fourth base island, a second base island, a fifth base island, a third base island, and a sixth base island are arranged sequentially at intervals along the length of the frame unit. The first base island, the second base island, and the third base island are connected to the first connecting bar. In the second base island area, a seventh base island, an eighth base island, a ninth base island, a tenth base island, an eleventh base island, and a twelfth base island are arranged sequentially at intervals along the length of the frame unit. The eighth base island, the tenth base island, and the twelfth base island are connected to the second connecting bar.

[0012] Furthermore, on one side of the frame unit, there are sequentially spaced pins: first pin, second pin, third pin, fourth pin, fifth pin, sixth pin, seventh pin, eighth pin, ninth pin, tenth pin, eleventh pin, twelfth pin, thirteenth pin, fourteenth pin, fifteenth pin, and sixteenth pin. The fourth base island is connected to the fifth pin, the fifth base island is connected to the tenth pin, the sixth base island is connected to the fifteenth pin, and the sixteenth pin is connected to the first connecting rib. On the other side of the frame unit, there are sequentially spaced pins: twenty-third pin, twenty-second pin, twenty-first pin, twenty-second pin, nineteenth pin, eighteenth pin, and seventeenth pin. The seventh base island is connected to the twenty-third pin, the ninth base island is connected to the twenty-first pin, the eleventh base island is connected to the eighteenth pin, and the twelfth base island is connected to the seventeenth pin.

[0013] Furthermore, the first, second, and third base islands are recessed to a first depth, while the seventh, eighth, ninth, tenth, eleventh, and twelfth base islands are recessed to a second depth.

[0014] Furthermore, each base island in the second base island region has a ring of overflow groove structure around its perimeter to prevent solder from overflowing into the wire bonding area and causing a short circuit.

[0015] A package module is formed by an IPM lead frame, comprising an injection molded body and an IPM lead frame encapsulated within the injection molded body. Within the injection molded body, the front side of the IPM lead frame faces the pin side, and the front side is the side for bonding chips.

[0016] The beneficial effects of this utility model are as follows:

[0017] 1. The frame unit has a reasonable layout of the base island and the connection relationship of the pins, which realizes the structural stability and electrical isolation effect in a compact space. The asymmetrical pin layout is adopted, which is conducive to the integrated packaging of power modules and can be adapted to both SOP23 and DIP23 package forms.

[0018] 2. Depending on the type of chip bonded to the base island, some base islands are recessed to different depths. The second base island area for bonding power chips is closer to the heat sink mounting position, which improves the heat dissipation performance of the product. The first base island area for bonding IC chips is recessed relatively shallowly, which can effectively prevent leakage problems in the packaging and facilitate the flow of molding compound during the injection molding process.

[0019] 3. The overflow groove structure design prevents solder or glue from contaminating the bonding area of ​​the solder wire / lead wire, which could lead to short circuits, thus improving product quality and reliability.

[0020] 4. It adopts a large-size 3-row frame layout, which can significantly improve production efficiency, reduce material and labor costs, and thus enhance product competitiveness compared to the current single-row / double-row frames. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the lead frame structure according to an embodiment of this application.

[0022] Figure 2 This is a schematic diagram of the frame unit structure of an embodiment of this application.

[0023] Figure 3 This is a schematic diagram of the package module structure in the SOP23 package form according to an embodiment of this application.

[0024] Figure 4 This is a schematic diagram of the package module structure in the form of DIP23 according to an embodiment of this application. Detailed Implementation

[0025] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0026] This application provides an IPM lead frame, such as Figure 1As shown, the system includes frame units 2 arrayed on a frame body 1. The frame body 1 has anti-fooling holes 3, injection molding channels 4, and positioning holes 5. The injection molding channels 4 are located on both sides of each column of frame units 2. The anti-fooling holes 3 and positioning holes 5 are located on both sides of the length of the frame body 1. Preferably, the frame units 2 are arranged in a 3-row, multi-column configuration. Compared to the current single-row and double-row configurations, this improves the material utilization rate of the frame and reduces the frame cost. Furthermore, it improves packaging efficiency during subsequent packaging processes, directly or indirectly reducing the use of packaging consumables such as nitrogen, molding compound, and solder balls, thereby lowering packaging costs and enhancing product competitiveness.

[0027] like Figure 2 As shown, the frame unit 2 includes a first base island region and a second base island region spaced apart along the width direction. Multiple base islands are arranged sequentially and spaced apart along the length direction of the frame unit 2 in both the first base island region and the second base island region. Multiple pins are arranged sequentially and spaced apart along the length direction on both sides of the frame unit 2, and the number of pins on both sides is different. For example, there are 16 pins on one side and 7 pins on the other side, for a total of 23 pins, which can be packaged in the form of SOP23 or DIP23.

[0028] In the first base island region, several base islands are connected by a first connecting rib 61, and the remaining base islands in the first base island region are each connected to a pin located on one side of the frame unit 2. In the second base island region, several base islands are connected by a second connecting rib 62, and the remaining base islands in the second base island region are each connected to a pin located on the other side of the frame unit 2. The first connecting rib 61 and the second connecting rib 62 are spaced apart. The first connecting rib 61 and each pin are connected to the frame body 1, and the second connecting rib 62 is connected to a pin on the other side of the frame unit 2. Several base islands in the first base island region are recessed downward to a first depth, and several base islands in the second base island region are recessed downward to a second depth. Preferably, the first depth is less than or equal to the second depth. By setting the base islands to be recessed downward, the heat dissipation effect of the chips bonded to different base islands can be improved.

[0029] Specifically, such as Figure 2As shown, in the first base island region, a first base island B1, a fourth base island B4, a second base island B2, a fifth base island B5, a third base island B3, and a sixth base island B6 are sequentially spaced along the length of the frame unit 2. The first base islands B1, B2, and B3 are connected to the first connecting rib 61, which is arranged along the length of the frame unit 2 on the side of the first base island region adjacent to the second base island region. The fourth base islands B4, B5, and B6 are spaced apart from the first connecting rib 61. The second base island… Each island area is provided with a seventh base island B7, an eighth base island B8, a ninth base island B9, a tenth base island B10, an eleventh base island B11, and a twelfth base island B12 at intervals along the length of the frame unit 2. The eighth base island B8, the tenth base island B10, and the twelfth base island B12 are connected to the second connecting bar 62. The second connecting bar 62 is arranged along the length of the frame unit 2 on the side of the second base island area adjacent to the first base island area. The seventh base island B7, the ninth base island B9, the eleventh base island B11 and the second connecting bar 62 are arranged at intervals.

[0030] The first base island (B1), second base island (B2), and third base island (B3) are recessed to a first depth. The seventh base island (B7), eighth base island (B8), ninth base island (B9), tenth base island (B10), eleventh base island (B11), and twelfth base island (B12) are recessed to a second depth. The fourth base island (B4), fifth base island (B5), and sixth base island (B6) are not recessed. This recessed structure design of the base islands ensures a smooth surface for the molded package when encapsulating multiple chips of different thicknesses and effectively avoids issues such as missing traces.

[0031] Preferably, each base island in the second base island region has a ring of overflow groove structure 7 formed around its periphery to prevent solder from overflowing into the wire bonding area and causing a short circuit.

[0032] When applied to packaging, the aforementioned number and location of base islands allow for the compatible placement of three single-bridge circuits. As optional applications, base islands B1, B2, and B3 can be used to mount driver IC chips; base islands B4, B5, and B6 can be used to mount diode chips; and base islands B7, B8, B9, B10, B11, and B12 can be used to mount power chips and FRD chips.

[0033] Specifically, such as Figure 2As shown, on one side of frame unit 2, there are sequentially spaced pins A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, A12, A13, A14, A15, and A16. The fourth base island B4 is connected to the fifth pin A5, the fifth base island B5 is connected to the tenth pin A10, and the sixth base island B6 is connected to... Pin 15 A15 and pin 16 A16 are connected to the first connecting rib 61; on the other side of frame unit 2, pins 23 A23, 22 A22, 21 A21, 20 A20, 19 A19, 18 A18 and 17 A17 are arranged in sequence at intervals. The seventh base island B7 is connected to the 23rd pin A23, the ninth base island B9 is connected to the 21st pin A21, the eleventh base island B11 is connected to the 18th pin A18, and the twelfth base island B12 is connected to the 17th pin A17.

[0034] This example provides a packaged module formed by encapsulating the IPM lead frame as described in the previous embodiments. It includes an injection-molded body and an IPM lead frame encapsulated within the injection-molded body. Specifically, the packaged module is obtained by molding using an SOP23 package or a DIP23 package, such as... Figures 3-4 As shown, during encapsulation, within the injection molding body, the front side of the IPM lead frame faces the pin side, which is the side used for bonding the chip.

[0035] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. An IPM lead frame, comprising frame units (2) arrayed on a frame body (1), characterized in that, The frame unit (2) includes a first base island region and a second base island region spaced apart along the width direction. Multiple base islands are arranged sequentially along the length direction of the frame unit (2) in both the first base island region and the second base island region. Multiple pins are arranged sequentially along the length direction on both sides of the frame unit (2), and the number of pins on both sides is different. Several base islands are connected by a first connecting rib (61) within the first base island area, and the remaining base islands are respectively connected to a pin located on one side of the frame unit (2); Several base islands in the second base island area are connected by the second connecting rib (62), and the remaining base islands are respectively connected to a pin located on the other side of the frame unit (2); The first connecting rib (61) and each pin are connected to the frame body (1), and the second connecting rib (62) is connected to a pin on the other side of the frame unit (2).

2. The IPM lead frame according to claim 1, characterized in that, Within the first base island region, several base islands are recessed downward to a first depth, and within the second base island region, several base islands are recessed downward to a second depth, wherein the first depth is less than or equal to the second depth.

3. The IPM lead frame according to claim 2, characterized in that, The first base island area is provided with a first base island (B1), a fourth base island (B4), a second base island (B2), a fifth base island (B5), a third base island (B3), and a sixth base island (B6) at intervals along the length direction of the frame unit (2). The first base island (B1), the second base island (B2), and the third base island (B3) are connected to the first connecting bar (61). The second base island area is provided with the seventh base island (B7), the eighth base island (B8), the ninth base island (B9), the tenth base island (B10), the eleventh base island (B11), and the twelfth base island (B12) in sequence along the length direction of the frame unit (2). The eighth base island (B8), the tenth base island (B10), and the twelfth base island (B12) are connected to the second connecting bar (62).

4. The IPM lead frame according to claim 3, characterized in that, The frame unit (2) has a first pin (A1), a second pin (A2), a third pin (A3), a fourth pin (A4), a fifth pin (A5), a sixth pin (A6), a seventh pin (A7), an eighth pin (A8), a ninth pin (A9), a tenth pin (A10), an eleventh pin (A11), a twelfth pin (A12), a thirteenth pin (A13), a fourteenth pin (A14), a fifteenth pin (A15), and a sixteenth pin (A16) arranged sequentially on one side. The fourth base island (B4) is connected to the fifth pin (A5), the fifth base island (B5) is connected to the tenth pin (A10), the sixth base island (B6) is connected to the fifteenth pin (A15), and the sixteenth pin (A16) is connected to the first connecting rib (61). On the other side of the frame unit (2), there are 23rd pin (A23), 22nd pin (A22), 21st pin (A21), 20th pin (A20), 19th pin (A19), 18th pin (A18), and 17th pin (A17) spaced apart in sequence. The 7th base island (B7) is connected to the 23rd pin (A23), the 9th base island (B9) is connected to the 21st pin (A21), the 11th base island (B11) is connected to the 18th pin (A18), and the 12th base island (B12) is connected to the 17th pin (A17).

5. The IPM lead frame according to claim 3, characterized in that, The first base island (B1), the second base island (B2), and the third base island (B3) are recessed to the first depth, while the seventh base island (B7), the eighth base island (B8), the ninth base island (B9), the tenth base island (B10), the eleventh base island (B11), and the twelfth base island (B12) are recessed to the second depth.

6. The IPM lead frame according to claim 1, characterized in that, A ring of overflow channels is formed around each base island within the second base island area (7).

7. The IPM lead frame according to claim 1, characterized in that, The frame unit (2) has 3 rows and multiple columns.

8. The IPM lead frame according to claim 1, characterized in that, The frame body (1) is provided with anti-fool hole (3), injection flow channel (4) and positioning hole (5). The injection flow channel (4) is located on both sides of each column of frame unit (2). The anti-fool hole (3) and positioning hole (5) are set on both sides of the length direction of the frame body (1).

9. A packaging module, characterized in that, Includes an injection molded body and an IPM lead frame as described in any one of claims 1-8 encapsulated within the injection molded body.

10. The packaging module according to claim 9, characterized in that, Within the injection molded body, the front side of the IPM lead frame faces the pin side, which is the side used for bonding the chip.

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