Filtering device for electro-coppering tank

Abstract

The utility model discloses a filtering device for an electroplating copper tank. Comprising a shell, a partition plate, a plurality of filter element seats, a fixed rod and a filter element, wherein the partition plate is arranged in the shell and divides an accommodating space in the shell into a filter cavity and a liquid storage cavity; the filter element seats are arranged on the partition plate; one end of the fixed rod is connected with the filter element seats; the locking device is connected with the other end of the fixing rod and used for limiting the movement of the filter element, a plurality of flow guide holes communicated with the liquid storage cavity are formed in the fixing rod, the filter cavity is connected with a liquid inlet pipe, and the liquid storage cavity is connected with a liquid outlet pipe; the filter element comprises a first filter layer and a second filter layer which are arranged in a stacked mode, the aperture of the first filter layer is 5-50 micrometers, the aperture of the second filter layer is 0.1-1 micrometer, and the second filter layer is arranged close to the fixing rod. According to the filtering device for the electro-coppering tank provided by the utility model, the filter element adopts a multi-layer structure and gradient design, so that the filtering effect can be effectively improved, and the service life of the filter element can be prolonged.

Description

Technical Field

[0001] This utility model relates to the technical field of electroplating solution filtration devices, specifically to a filtration device for an electroplating copper tank. Background Technology

[0002] The electroplating solution needs to be filtered during use to remove impurities and ensure the stability of the copper plating tank and the quality of the product.

[0003] Currently, filters typically have a cylindrical outer shell with a support plate at the bottom of the inner cavity. Multiple filter elements are fixed on the support plate, and the electroplating solution is purified by filtering through these filter elements. Each filter element has a cap at both ends, one of which has a central hole serving as an outlet. This cap with the central hole is connected to a short pipe, which acts as the liquid outlet pipe. Inside the filter element is a filter screen. Liquid permeates from the surface of the filter element inward, while impurities are trapped on the surface of the filter screen. The electroplating solution that permeates to the core of the filter element is discharged through the liquid outlet pipe.

[0004] In the existing technology, the filter screen of the filter element is a single layer or a simple multi-layer structure, with a small filtration area, low filtration efficiency, and no gradient design, resulting in low filtration effect and short lifespan, requiring frequent replacement.

[0005] Therefore, it is necessary to provide a new filtering structure to solve the above-mentioned technical problems. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a filter device for electroplating copper tanks. The filter element adopts a multi-layer structure and gradient design, which can effectively improve the filtration effect and extend the service life of the filter element.

[0007] The technical solution of this utility model is as follows:

[0008] A filtration device for an electroplating copper bath includes a housing, a partition disposed within the housing and dividing the housing space into a filtration chamber and a storage chamber, a plurality of filter element seats disposed on the partition, a fixing rod connected at one end to the filter element seats, a filter element supported on the filter element seats and sleeved outside the fixing rod, and a locking device connected to the other end of the fixing rod and used to restrict the movement of the filter element. The fixing rod has a plurality of guide holes communicating with the storage chamber. The filtration chamber is connected to an inlet pipe, and the storage chamber is connected to an outlet pipe. The filter element includes a first filter layer and a second filter layer stacked together. The pore size of the first filter layer is 5-50 μm, and the pore size of the second filter layer is 0.1-1 μm. The second filter layer is disposed close to the fixing rod.

[0009] Furthermore, the first filter layer is formed by winding filter cotton.

[0010] Furthermore, the second filter layer is a carbon core.

[0011] Furthermore, the second filter layer is folded.

[0012] Furthermore, the other end of the fixing rod has a connecting thread, and the locking device is a locking nut.

[0013] Compared with the prior art, the filtration device for copper plating tanks provided by this utility model has the following advantages:

[0014] I. The filtration device for copper plating tanks provided by this utility model includes a first filter layer and a second filter layer stacked together. The pore sizes of the first filter layer and the second filter layer are different, resulting in different filtration accuracies. The first filter layer has a large pore size and low filtration accuracy; the second filter layer has a small pore size and high filtration accuracy. The second filter layer is attached to a fixed rod. After the electroplating solution enters the filtration chamber of the housing, it first undergoes primary filtration and purification through the first filter layer, trapping larger impurity particles on its surface. This prevents large particles from clogging the smaller pore size of the second filter layer. The electroplating solution after primary filtration then permeates into the second filter layer to trap small particulate impurities, reducing quality problems caused by impurities adhering to the surface of the plated parts. This filtration device, by designing the filter element with a gradient density design, achieves a filtration accuracy of 0.1-1μm after two stages of filtration. The high filtration accuracy of the electroplating solution prevents filter clogging, reduces filter replacement frequency, and minimizes surface roughness caused by impurities in the electroplating solution, thus improving product quality.

[0015] II. The filtration device for electroplating copper tanks provided by this utility model has a second folded filter layer, which increases the filtration area and improves the filtration efficiency compared to a planar filter screen structure. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the filter device for the electroplating copper tank of this utility model. Detailed Implementation

[0018] To enable those skilled in the art to better understand the technical solutions in the embodiments of this utility model, and to make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be further described below in conjunction with the accompanying drawings.

[0019] It should be noted that the descriptions of these embodiments are for the purpose of aiding understanding of the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the filtration device for copper plating tank of this utility model. The filtration device for copper plating tank of this utility model includes a housing 1, a partition 2 disposed inside the housing 1, a plurality of filter element seats 3 disposed on the partition 2, a fixing rod 4 connected at one end to the filter element seat, a filter element 5 supported on the filter element seat and sleeved outside the fixing rod, and a locking device 6 connected to the other end of the fixing rod 4 and used to restrict the movement of the filter element.

[0021] Specifically, the housing 1 includes a cylinder 11 and a cover 12 detachably connected to the cylinder. The cover is used to install or replace the filter element. When the filter device is in normal operation, the cover 12 is fixedly connected to the cylinder 11.

[0022] The partition 2 divides the space inside the shell 1 into a filter chamber 13 and a liquid storage chamber 14. The filter element 5 is installed in the filter chamber, and the filter chamber 13 is connected to the inlet pipe 15. The liquid storage chamber 14 is connected to the outlet pipe 16. The electroplating solution in the electroplating tank enters the filter chamber through the inlet pipe for filtration. The filtered electroplating solution enters the liquid storage chamber and is transported to the electroplating tank through the outlet pipe to achieve recycling.

[0023] The filter element holder 3 is mounted on the partition plate 2 and is made of PP material. The fixing rod 4 is connected to the filter element holder 3 and is also made of PP material. In this invention, the fixing rod 4 is a hollow structure, with one end connected to the filter element holder communicating with the liquid storage chamber 14. The filtered electroplating solution is discharged into the liquid storage chamber through a pipe formed in the center of the fixing rod 4. Specifically, the side wall of the fixing rod 4 is provided with multiple guide holes 41, and the guide holes 41 communicate with the liquid storage chamber. The other end of the fixing rod 4 is a sealed structure with connecting threads 42 on the outside. The locking device is a locking nut, which is connected to the fixing rod to keep the filter element stable during operation.

[0024] In this invention, the filter element 5 includes a first filter layer 51 and a second filter layer 52 stacked together. The pore size of the first filter layer is 5-50 μm, with a filtration accuracy of 5-50 μm. The pore size of the second filter layer is 0.1-1 μm, with a filtration accuracy of 0.1-1 μm. The second filter layer 52 is positioned close to the fixing rod 4. The electroplating solution first undergoes primary filtration through the first filter layer 51 with a larger pore size, where large particles in the electroplating solution are trapped. Then, it undergoes secondary filtration through the second filter layer 52 with a smaller pore size, further trapping small particles in the electroplating solution, thus achieving two-stage gradient filtration. By designing the filter screen with a gradient density structure, the filtration accuracy can reach 0.1-1 μm after two-stage filtration. This high filtration accuracy of the electroplating solution not only prevents filter screen clogging and reduces the frequency of filter screen replacement but also reduces surface roughness caused by impurities in the electroplating solution, thereby improving product quality.

[0025] In this embodiment, the first filter layer 51 is formed by winding filter cotton, and the second filter layer 52 is a carbon core. Preferably, the second filter layer 52 is designed to be folded, which increases the filtration area and thus improves the filtration efficiency.

[0026] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations made to these embodiments without departing from the principles and spirit of this utility model still fall within the protection scope of this utility model.

Claims

1. A filter device for an electroplating copper bath, characterized in that, The device includes a housing, a partition disposed within the housing and dividing the housing space into a filtration chamber and a storage chamber, a plurality of filter element seats disposed on the partition, a fixing rod connected at one end to the filter element seats, a filter element supported on the filter element seats and sleeved on the fixing rod, and a locking device connected to the other end of the fixing rod and used to restrict the movement of the filter element. The fixing rod has a plurality of guide holes communicating with the storage chamber. The filtration chamber is connected to an inlet pipe, and the storage chamber is connected to an outlet pipe. The filter element includes a first filter layer and a second filter layer stacked together. The pore size of the first filter layer is 5-50 μm, and the pore size of the second filter layer is 0.1-1 μm. The second filter layer is disposed close to the fixing rod.

2. The filtration device for copper plating tank according to claim 1, characterized in that, The first filter layer is formed by winding filter cotton.

3. The filtration device for copper plating tank according to claim 1, characterized in that, The second filter layer is a carbon core.

4. The filtration device for copper plating tank according to claim 3, characterized in that, The second filter layer is folded.

5. The filtration device for copper plating tank according to claim 1, characterized in that, The other end of the fixing rod has a connecting thread, and the locking device is a locking nut.

Images