Wafer sorting machine suction nozzle cleaning device and wafer sorting machine

Abstract

The utility model provides a suction nozzle cleaning device of a wafer sorting machine and the wafer sorting machine, and relates to the technical field of wafer processing. A suction nozzle cleaning device of a wafer sorting machine comprises a cleaning unit and a vibrator. And the cleaning unit is arranged on a loading plate of the iron ring loading device. The number of the vibrators is two, and the two vibrators are arranged on two material taking frames of the chip conveying device respectively. The cleaning unit comprises a driving part and a cleaning assembly, and the cleaning assembly can stretch out towards the inner side under the driving of the driving part. In the working process, the iron ring loading device moves, the cleaning assembly is made to be aligned with a suction nozzle arranged on the material taking frame, then the driving piece acts to drive the cleaning assembly to move towards the inner side, and therefore the suction nozzle makes contact with cleaning cloth of the cleaning assembly, the suction nozzle and the cleaning cloth move relatively under the action of the vibrator, and the effect of automatically cleaning the suction nozzle is achieved; therefore, the service life and the picking capability of the suction nozzle are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field, concretely is a kind of wafer sorting machine suction nozzle cleaning device and wafer sorting machine. BACKGROUND

[0002] The information disclosed in the background of the present application is only intended to increase the understanding of the overall background of the present application, and is not necessarily regarded as acknowledging or implicitly suggesting that the information constitutes prior art known to those skilled in the art.

[0003] Wafer refers to the silicon wafer used for the manufacture of silicon semiconductor integrated circuits, which is called wafer due to its circular shape, and a plurality of chip units are formed on the wafer surface, which is called die. In the process of manufacturing semiconductor chips, different bins of dies need to be selected and binned by a wafer sorting machine. However, due to the large number of dies, the suction nozzle of the wafer sorting machine is used frequently, which can cause the surface of the suction nozzle to be dirty, thereby affecting the normal operation of the suction nozzle or contaminating the dies. INVENTION CONTENTS

[0004] To solve the above problems, the wafer sorting machine suction nozzle cleaning device provided by the present application can automatically clean the suction nozzle, thereby increasing the service life and picking ability of the suction nozzle. Meanwhile, the wafer sorting machine applying the wafer sorting machine suction nozzle cleaning device is also provided, and the same technical effect is achieved, which will not be described here.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A wafer sorting machine suction nozzle cleaning device, comprising a cleaning unit and a vibrator;

[0007] The cleaning unit is arranged on the loading plate of the iron ring loading device;

[0008] The number of vibrators is two, and the two vibrators are arranged on the two material taking racks of the chip conveying device;

[0009] The cleaning unit comprises a driving member and a cleaning assembly, and the cleaning assembly can be extended inwardly under the driving of the driving member.

[0010] Further, the cleaning assembly comprises a mounting plate, a first clamping plate, a cleaning cloth and a second clamping plate in sequence away from the driving member, the first clamping plate is provided with a support ring, the second clamping plate is provided with a relief hole for accommodating the support ring, the middle part of the cleaning cloth protrudes from the side of the second clamping plate away from the first clamping plate to form a cleaning area under the support of the support ring, and the edge part of the cleaning cloth is clamped and fixed between the first clamping plate and the second clamping plate.

[0011] Further, the cleaning cloth is made of non-woven fabric.

[0012] Further, the cleaning assembly is provided with an air nozzle, and the air outlet of the air nozzle faces the cleaning area of the cleaning cloth.

[0013] Further, the upper end of the first clamping plate is provided with a horizontal plate, and the air nozzle is fixedly arranged on the horizontal plate in a detachable manner.

[0014] Further, the fixed side of the driving member is fixedly connected with the side surface of the loading plate of the iron ring loading device through a connecting plate.

[0015] Further, the driving member is a slide table air cylinder.

[0016] Further, the vibrator is a transducer.

[0017] Further, the transducer is arranged on the inner side surface of the material taking frame, a limiting plate is arranged on the outer side surface of the material taking frame, the transducer is fixedly connected with the material taking frame through a bolt, a limiting groove is arranged on the side surface of the side of the limiting plate away from the material taking frame, and the limiting groove is matched with the head of the bolt to limit the rotation of the bolt.

[0018] A wafer sorting machine comprises a chip conveying device and iron ring loading devices located on both sides of the chip conveying device, a cleaning unit is arranged on the loading plate of at least one of the iron ring loading devices, and a vibrator is arranged on each of the two material taking frames of the chip conveying device.

[0019] The wafer sorting machine provided by the present application has the following beneficial effects:

[0020] The wafer sorting machine suction nozzle cleaning device and the wafer sorting machine provided by the present application are characterized in that a cleaning assembly and a driving member for driving the cleaning assembly to move inward are arranged on the loading plate of the iron ring loading device, a vibrator for driving the material taking frame to vibrate is arranged on the material taking frame, when working, the iron ring loading device is driven to move by the driving device of the wafer sorting machine, the cleaning assembly is aligned with the suction nozzle arranged on the material taking frame, then the driving member is actuated to drive the cleaning assembly to move inward, so that the suction nozzle is in contact with the cleaning cloth of the cleaning assembly, and the suction nozzle and the cleaning cloth are relatively moved under the action of the vibrator, thereby realizing the effect of automatically cleaning the suction nozzle. The wafer sorting machine suction nozzle cleaning device and the wafer sorting machine provided by the present application can effectively remove foreign matters blocked in the suction nozzle, reduce the alarm caused by the reduction of vacuum flow rate due to the dirt of the suction nozzle, reduce the labor cost and the process time, and improve the equipment utilization rate. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1An installation structure of a nozzle cleaning device of a wafer handler Figure 1 ;

[0022] Figure 2 An installation structure of a nozzle cleaning device of a wafer handler Figure 2 ;

[0023] Figure 3 For Figure 2 the enlarged structure diagram of part A in the figure

[0024] Figure 4 The installation structure diagram of the cleaning unit

[0025] Figure 5 The perspective structure diagram of the cleaning unit

[0026] Figure 6 The front view of the cleaning unit

[0027] Figure 7 The exploded view of the cleaning unit

[0028] Figure 8 The perspective structure diagram of the chip conveying device installed with the vibrator

[0029] Figure 9 For Figure 8 the enlarged structure diagram of part B in the figure

[0030] Figure 10 The installation structure diagram of the vibrator

[0031] In the figure: 1, chip conveying device; 11, motor; 12, swing frame; 13, material taking frame; 14, elastic sheet; 15, nozzle; 16, upper pressing plate; 161, first screw; 17, lower pressing plate; 171, second screw

[0032] 2, iron ring loading device; 21, loading plate

[0033] 3, material box

[0034] 4, cleaning unit; 41, sliding table cylinder; 411, cylinder body; 412, sliding table; 42, cleaning assembly; 421, installation plate; 422, first clamping plate; 4221, support ring; 4222, cross plate; 423, cleaning cloth; 4231, cleaning area; 424, second clamping plate; 4241, avoiding hole; 43, connecting plate; 44, third screw; 45, fourth screw; 46, air nozzle

[0035] 51, transducer; 52, limiting plate; 521, limiting groove; 53, bolt DETAILED DESCRIPTION

[0036] In order to make the technical personnel in the technical field better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described in detail below in combination with the drawings in the embodiments of the present application, and the described embodiments are only some of the embodiments of the present application, not all the embodiments. All other embodiments obtained by the technical personnel in the art without creative labor on the basis of the embodiments of the present application shall belong to the protection scope of the present application.

[0037] For the convenience of understanding, the coordinate system is defined as shown in the drawings Figure 1 , and the left-right direction is transverse, the front-rear direction is longitudinal, and the up-down direction is vertical.

[0038] Embodiment one

[0039] In order to facilitate the understanding of the wafer sorting machine nozzle cleaning device provided in the present application, the wafer sorting machine is briefly introduced.

[0040] As shown in the drawings Figure 1 , Figure 2 and Figure 3 , the wafer sorting machine includes a chip conveying device 1 and an iron ring loading device 2 located on the left and right sides of the chip conveying device 1 (according to the coordinate system shown in the drawings Figure 1 ). Two iron ring loading devices 2 are symmetrically arranged about the chip conveying device 1. The iron ring loading device 2 is used to load a magazine 3, and two sets of iron ring loading devices 2 are driven by a set of driving device (not shown in the drawings) to move in the vertical plane. The chip conveying device 1 includes a motor 11 and a swing frame 12 arranged on the power output shaft of the motor 11, two ends of the swing frame 12 are respectively provided with a material taking frame 13, the lower end of the material taking frame 13 is fixedly connected with the swing frame 12 through an elastic sheet 14, and the upper end of the material taking frame 13 is provided with a nozzle 15. When working, the motor 11 drives the swing frame 12 to swing, and the chip on one side of the magazine 3 is conveyed to the other side of the magazine 3 through the nozzle 15.

[0041] For example, as shown in the drawings Figure 3As shown, the outer side of the lower end of the material taking frame 13 (the inner side is the side opposite to the two material taking frames 13) is provided with an upper pressing plate 16, and the upper pressing plate 16 is fixedly connected with the material taking frame 13 through a first screw 161. The outer side of the swing frame 12 (the inner side is the side close to the motor 11) is provided with a lower pressing plate 17, and the lower pressing plate 17 is fixedly connected with the swing frame 12 through a second screw 171. The upper end of the elastic sheet 14 is clamped and fixed between the upper pressing plate 16 and the material taking frame 13, and the upper end of the elastic sheet 14 is provided with a first through hole for accommodating the first screw 161. The lower end of the elastic sheet 14 is clamped and fixed between the lower pressing plate 17 and the swing frame 12, and the lower end of the elastic sheet 14 is provided with a second through hole for accommodating the second screw 171.

[0042] As shown in Figure 1 and Figure 2 A wafer sorting machine suction nozzle cleaning device includes a cleaning unit 4 and a vibrator.

[0043] The number of the cleaning unit 4 can be one or two. If the number of the cleaning unit 4 is one, it is fixedly arranged on the loading plate 21 of one iron ring loading device 2 in a detachable manner. If the number of the cleaning unit 4 is two, two cleaning units 4 are respectively fixedly arranged on the loading plates 21 of two iron ring loading devices 2 in a detachable manner.

[0044] As a specific embodiment, the number of the cleaning unit 4 in the embodiment is one, and it is fixedly arranged on the loading plate 21 of the iron ring loading device 2 located on the left side (according to the coordinate system) in a detachable manner. Figure 1

[0045] The number of the vibrator is two, and two vibrators are respectively arranged on the two material taking frames 13 of the chip conveying device 1.

[0046] As shown in Figure 4 The cleaning unit 4 includes a driving member and a cleaning assembly 42. The fixed side of the driving member is fixedly connected with the side surface of the loading plate 21 of the iron ring loading device 2 through a connecting plate 43, and the cleaning assembly 42 is fixedly connected with the moving side of the driving member in a detachable manner. The cleaning assembly 42 can be extended inwards (the inner side is the side opposite to the two iron ring loading devices 2) or retracted outwards (the inner side is the side opposite to the two iron ring loading devices 2) under the driving of the driving member.

[0047] ​As a specific embodiment, the driving member in the embodiment is a slide cylinder 41, and the rod end of the piston rod of the slide cylinder 41 is directed to the inner side (the side opposite to the loading device 2 is the inner side). One end of the connecting plate 43 is fixedly connected to the side of the loading plate 21 of the loading device 2 through a third screw 44, and the other end of the connecting plate 43 is fixedly connected to the cylinder body 411 of the slide cylinder 41 through a fourth screw 45. The cleaning assembly 42 is fixedly arranged on the slide table 412 of the slide cylinder 41 in a detachable manner.

[0048] As shown in Figure 5 , Figure 6 and Figure 7 , the cleaning assembly 42 comprises a mounting plate 421, and the mounting plate 421 is fixedly connected to the slide table 412 of the slide cylinder 41 through a fifth screw. The side of the mounting plate 421 away from the slide cylinder 41 is sequentially provided with a first clamping plate 422, a cleaning cloth 423 and a second clamping plate 424 in a direction away from the slide cylinder 41. The first clamping plate 422 is fixedly connected to the mounting plate 421 through a sixth screw, and the first clamping plate 422 is provided with a support ring 4221 extending away from the mounting plate 421 perpendicularly to the first clamping plate 422. The support ring 4221 is in a cylindrical tube structure with both ends open, and the end of the support ring 4221 directed to the first clamping plate 422 is fixedly connected to the first clamping plate 422 by welding. The second clamping plate 424 is provided with a avoiding hole 4241 for accommodating the support ring 4221, and the middle part of the cleaning cloth 423 protrudes from the side of the second clamping plate 424 away from the first clamping plate 422 to form a cleaning area 4231 under the support of the support ring 4221. The second clamping plate 424 is fixedly connected to the first clamping plate 422 through a seventh screw, and the edge part of the cleaning cloth 423 is clamped and fixed between the first clamping plate 422 and the second clamping plate 424.

[0049] When the slide cylinder 41 drives the cleaning assembly 42 to extend inwardly, the suction nozzle 15 is in contact with the cleaning area 4231 of the cleaning cloth 423.

[0050] As a specific embodiment, the cleaning cloth 423 in the embodiment is made of non-woven fabric.

[0051] As a specific embodiment, the vibrator in the embodiment is a transducer 51 with higher vibration frequency.

[0052] AsFigure 8 、 Figure 9 and Figure 10 As shown in

[0053] Further, as shown in Figure 5 、 Figure 6 and Figure 7 The cleaning assembly 42 is provided with an air nozzle 46, and the air outlet of the air nozzle 46 faces the cleaning area 4231 of the cleaning cloth 423.

[0054] As a specific embodiment, the upper end of the first clamping plate 422 is provided with a horizontal plate 4222 extending to the side of the second clamping plate 424 perpendicular to the first clamping plate 422, and the air nozzle 46 is fixedly arranged on the horizontal plate 4222 in a detachable manner, and the air outlet of the air nozzle 46 is located directly above the cleaning area 4231 of the cleaning cloth 423.

[0055] A wafer sorting machine comprises a chip conveying device 1 and an iron ring loading device 2 located on both sides of the chip conveying device 1, at least one loading plate 21 of the iron ring loading device 2 is provided with a cleaning unit 4, and the two loading plates of the chip conveying device 1 are respectively provided with a vibrator.

[0056] The structure of the cleaning unit 4 and the vibrator has been described above, and will not be repeated here.

[0057] Embodiment two

[0058] The transducer 51 is fixedly connected with the material taking frame 13 by means of adhesive bonding. The remaining structure is the same as that of embodiment one.

[0059] The other embodiments obtained by the skilled in the art on the basis of the embodiments provided in the present application through means such as combination, splitting, recombination, etc. of the embodiments of the present application do not exceed the protection scope of the present application.

[0060] The above detailed description of the embodiments of the present application, the purpose, technical solutions and beneficial effects of the embodiments of the present application have been described in detail, and the above is only a specific embodiment of the present application, and is not used to limit the protection scope of the embodiments of the present application, that is, on the basis of the embodiments of the present application, any modification, equivalent replacement, improvement, etc. should be included in the protection scope of the embodiments of the present application.

Claims

1. A nozzle cleaning device for a wafer sorting machine, characterized in that: Includes a cleaning unit (4) and a vibrator; The cleaning unit (4) is mounted on the loading plate (21) of the iron ring loading device (2); The number of vibrators is two, and the two vibrators are respectively set on the two pick-up racks (13) of the chip transfer device (1); The cleaning unit (4) includes a drive and a cleaning component (42), and the cleaning component (42) can extend inward under the drive of the drive.

2. The wafer sorting machine nozzle cleaning device according to claim 1, characterized in that: The cleaning assembly (42) includes, in sequence along the direction away from the driving member, a mounting plate (421), a first clamping plate (422), a cleaning cloth (423), and a second clamping plate (424). The first clamping plate (422) is provided with a support ring (4221), and the second clamping plate (424) is provided with a clearance hole (4241) for accommodating the support ring (4221). The middle part of the cleaning cloth (423) protrudes from the side of the second clamping plate (424) opposite to the first clamping plate (422) under the support of the support ring (4221) to form a cleaning area (4231). The edge part of the cleaning cloth (423) is clamped and fixed between the first clamping plate (422) and the second clamping plate (424).

3. The wafer sorting machine nozzle cleaning device according to claim 2, characterized in that: The cleaning cloth (423) is made of non-woven fabric.

4. The wafer sorting machine nozzle cleaning device according to claim 2, characterized in that: The cleaning component (42) is provided with an air nozzle (46), and the air outlet of the air nozzle (46) faces the cleaning area (4231) of the cleaning cloth (423).

5. The wafer sorting machine nozzle cleaning device according to claim 4, characterized in that: The upper end of the first clamping plate (422) is provided with a horizontal plate (4222), and the air nozzle (46) is fixedly mounted on the horizontal plate (4222) in a detachable manner.

6. The wafer sorting machine nozzle cleaning device according to claim 1, characterized in that: The fixed side of the drive component is fixedly connected to the side of the loading plate (21) of the iron ring loading device (2) via a connecting plate (43).

7. The wafer sorting machine nozzle cleaning device according to claim 1, characterized in that: The driving component is a slide cylinder (41).

8. The wafer sorting machine nozzle cleaning device according to claim 1, characterized in that: The vibrator described uses a transducer (51).

9. A wafer sorting machine nozzle cleaning device according to claim 8, characterized in that: The transducer (51) is disposed on the inner side of the material picker (13), and a limiting plate (52) is disposed on the outer side of the material picker (13). The transducer (51) is fixedly connected to the material picker (13) by bolts (53). A limiting groove (521) is disposed on the side of the limiting plate (52) facing away from the material picker (13). The limiting groove (521) cooperates with the head of the bolt (53) to restrict the rotation of the bolt (53).

10. A wafer sorting machine, comprising a chip conveying device (1) and iron ring loading devices (2) located on both sides of the chip conveying device (1), characterized in that: At least one of the iron ring loading devices (2) is provided with a cleaning unit (4) as described in any one of claims 1-9 on its loading plate (21), and the chip transfer device (1) is provided with two pickers and vibrators as described in any one of claims 1-9 respectively.

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