Automatic cleaning device for semiconductor chip electrical test board card

Abstract

The utility model relates to an automatic cleaning device for a semiconductor chip electrical test board card. The automatic cleaning device comprises a box body, a conveying mechanism for conveying the board card, and a turnover mechanism, a cleaning mechanism and a dust collection mechanism which are arranged in the box body and are sequentially arranged from top to bottom, the turnover mechanism comprises a bracket, a locking assembly arranged on the bracket and used for fixing the board card, and a first driving assembly connected with the bracket and used for driving the bracket to turn over; the high-pressure air knife is horizontally arranged below the bracket and slides in a reciprocating mode in the horizontal direction, the second driving assembly is connected with the high-pressure air knife and used for driving the high-pressure air knife to slide in a reciprocating mode, an air spraying opening of the high-pressure air knife faces the bracket, and the high-pressure air knife is communicated with an external air source. According to the board card cleaning device, the cleaning efficiency is improved, the labor cost is reduced, incomplete cleaning caused by the fact that the hand blocks airflow when the board card is held for purging is avoided, meanwhile, the situation that the hand is dirty and repeatedly pollutes the board card is avoided, and the cleaning effect on the board card is ensured.

Description

Technical Field

[0001] This utility model relates to an automatic cleaning device for semiconductor chip electrical test boards, which is applicable to the field of semiconductor chip processing technology. Background Technology

[0002] Electrical testing of semiconductor chips is a routine step in the semiconductor chip manufacturing process. By performing electrical tests on semiconductor chips, it is ensured that the chips meet the required design standards. Test boards are typically used for electrical testing. However, during the manufacturing process, these test boards can become contaminated with foreign matter such as flux, solder, and metal oxides generated during soldering and other processes. This results in many particulate or powdery contaminants remaining on the boards, which can adversely affect the electrical testing of the semiconductor chips. Therefore, test boards need to be cleaned after manufacturing.

[0003] Existing cleaning procedures are all done manually, with personnel manually operating high-pressure air guns to blow away foreign objects from the test boards. However, manual operation is inefficient and incurs additional labor costs. Furthermore, the operator needs to hold the test board while cleaning, and the hand inevitably obstructs the airflow, resulting in incomplete cleaning of the corners and edges of the board. Although personnel usually wear gloves to avoid contaminating the board with their hands, foreign objects from the board remain on the gloves during prolonged cleaning operations. When the operator puts the board back after cleaning, the foreign objects on the gloves will then contaminate the board, significantly affecting the cleanliness of the board and consequently the accuracy of subsequent electrical tests. Utility Model Content

[0004] To address the shortcomings of the existing technology, this invention proposes an automatic cleaning device for semiconductor chip electrical test boards.

[0005] The technical solution adopted by this utility model is: an automatic cleaning device for semiconductor chip electrical test boards, including a box, a conveying mechanism for conveying boards, a flipping mechanism, a cleaning mechanism and a dust collection mechanism arranged in sequence from top to bottom inside the box.

[0006] The flipping mechanism includes a bracket, a locking component mounted on the bracket for securing a card, and a first drive component connected to the bracket for driving the bracket to flip. The bracket has a first working position and a second working position rotated 180° relative to the first working position. The locking component has a locked state for securing the card and an unlocked state for releasing the card. The flipping mechanism has at least three working states: when it is in the first working state, the bracket is in the first working position and the locking component is in the unlocked state; when the flipping mechanism is in the second working state, the bracket remains in the first working position and the locking component is in the locked state; when the flipping mechanism is in the third working state, the bracket is in the second working position and the locking component remains in the locked state. The cleaning mechanism includes a high-pressure air knife horizontally mounted below the bracket and sliding back and forth in the horizontal direction, and a second drive component connected to the high-pressure air knife for driving its back and forth sliding. The nozzle of the high-pressure air knife faces the bracket, and the high-pressure air knife is connected to an external air source. The flipping mechanism initially operates in its first state. After the circuit board to be processed is conveyed to the flipping mechanism via the conveying mechanism, the flipping mechanism enters its second state. The locking component secures the circuit board to the bracket. Then, the first drive component drives the bracket to flip, causing the flipping mechanism to enter its third state. At this point, the bracket rotates the circuit board 180°, so that the surface of the circuit board faces the cleaning mechanism below. Subsequently, the second drive component drives the high-pressure air knife to slide back and forth. While sliding back and forth, the high-pressure air knife sprays high-pressure airflow onto the surface of the circuit board, blowing away any remaining foreign matter. The blown-away foreign matter falls into the dust collection mechanism below, thus achieving automatic cleaning of the circuit board. This not only improves cleaning efficiency but also reduces the labor costs required for the cleaning process. Furthermore, the cleaning process does not require manual operation, preventing hands from obstructing the high-pressure airflow and ensuring thorough cleaning of the circuit board surface. It also avoids re-contamination of the circuit board when manually handling or placing it after cleaning, ensuring the cleaning effect.

[0007] Furthermore, the locking assembly includes at least one pair of telescopic cylinders respectively fixed to the left and right sides of the bracket, and a clamping plate fixedly connected to the piston rod of the telescopic cylinder. When the locking assembly is in the locked state, the piston rod retracts and the clamping plate approaches the bracket, clamping the plate between the clamping plate and the bracket. When the locking assembly is in the unlocked state, the piston rod extends and the clamping plate moves away from the bracket. The clamping plate is driven to move up and down by the telescopic cylinders. When the plate is delivered to the bracket, the telescopic cylinders drive the clamping plate to move down and press against the plate, pressing the plate firmly onto the bracket, thus fixing the plate.

[0008] Furthermore, the first drive assembly includes a rotating shaft horizontally disposed below the bracket and rotatably connected to the inner wall of the housing, and a first driver connected to the rotating shaft for driving its rotation. The bracket is fixedly connected to the rotating shaft. The first driver drives the rotating shaft to rotate, thereby causing the bracket to rotate around the rotating shaft, thus realizing the flipping of the bracket. Furthermore, the first driver is configured as a servo motor.

[0009] Furthermore, the second drive assembly includes a pair of slide rails horizontally disposed below the bracket, at least one pair of slide blocks slidably connected to the pair of slide rails, and a second driver for driving the at least one pair of slide blocks to slide. The two ends of the high-pressure air knife are fixedly connected to the at least one pair of slide blocks. The second driver drives the pair of slide blocks to slide back and forth along the slide rails, thereby driving the high-pressure air knife to facilitate air cleaning of the circuit board surface.

[0010] Furthermore, the conveying mechanism includes a first conveying component disposed within the housing and capable of rotating synchronously with the bracket, and a second conveying component with one end connected to the first conveying component and the other end extending to the outside of the housing. The second conveying component conveys the card into the housing, and then the first conveying component conveys the card between the bracket and the clamping plate, so that the rotating mechanism can rotate the card.

[0011] Furthermore, the first conveying assembly includes a pair of first conveying rollers rotatably disposed on the front and rear sides of the bracket, and a first conveyor belt wound around the pair of first conveying rollers. The bracket is located within the space formed by the first conveyor belt. When the locking assembly is in the locked state, the first conveyor belt supporting the card and the card are clamped together on the bracket by clamping plates. The first conveying assembly, consisting of the first conveying rollers and the first conveyor belt, facilitates the support and transport of the card and prevents interference between the first conveying assembly and other moving parts.

[0012] Furthermore, the second conveying assembly includes at least one pair of second conveying rollers and a second conveyor belt wound around the at least one pair of second conveying rollers. A material inlet for the plates to pass through is provided on the side of the housing. One end of the second conveyor belt is close to one end of the first conveyor belt, and the other end of the second conveyor belt extends from the material inlet to the outside of the housing. The second conveying assembly, consisting of the second conveying rollers and the second conveyor belt, facilitates the conveying of plates into the housing. Furthermore, the second conveying assembly is easily connected to the transmission structure on the production line, allowing for the integration of automatic cleaning devices into the production line to achieve automated production cleaning.

[0013] Furthermore, the dust collection mechanism includes a dust hopper located below the cleaning mechanism and having openings at both the top and bottom, and a dust box located at the bottom opening of the dust hopper. The dust hopper is a frustum shape, wider at the top and narrower at the bottom. The dust hopper collects foreign objects that fall during cleaning into the dust box, making it convenient for operators to clean and also helping to maintain the cleanliness of the inside of the cleaning device, avoiding repeated contamination of the circuit boards.

[0014] Furthermore, the cleaning device also includes at least one dust removal component installed on the housing. The dust removal component includes a vent on the inner wall of the housing and a filter covering the vent and connected to an exhaust device. By using the dust removal component to vacuum and filter dust from the interior space of the housing, floating dust inside the housing is removed, further improving the cleanliness of the housing and ensuring a clean and tidy cleaning space, thereby improving the cleaning effect on the circuit boards.

[0015] Furthermore, at least two dust removal components are provided, with the two components located above the tilting mechanism and below the dust collection mechanism, respectively. By using at least two dust removal components to vacuum and clean the spaces above and below the housing, the cleanliness of the cleaning environment is further improved, ensuring a better cleaning effect on the circuit boards.

[0016] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0017] The automatic cleaning device for semiconductor chip electrical test boards of this utility model transports the boards through a conveying mechanism, and then a flipping mechanism fixes and flips the boards to facilitate air cleaning by the cleaning mechanism. In addition, a dust collection mechanism collects fallen foreign objects, realizing automatic cleaning of the test boards. This not only improves cleaning efficiency and reduces labor costs, but also avoids incomplete cleaning caused by hands blocking airflow when hand-held boards are air-cleaned, and also avoids repeated contamination of the boards by dirty hands, ensuring the cleaning effect of the boards. Attached Figure Description

[0018] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0019] Figure 1 This is a schematic diagram of the structure of one embodiment of the present utility model;

[0020] Figure 2 yes Figure 1 The internal structure diagram of the embodiment shown is shown.

[0021] Figure 3 yes Figure 1 The schematic diagram of the conveying mechanism and the tilting mechanism in the embodiment shown;

[0022] Figure 4 yes Figure 1 The schematic diagram of the cleaning mechanism and dust collection mechanism in the embodiment shown;

[0023] The annotations in the attached figures are explained as follows:

[0024] 1. Housing; 11. Feed inlet; 2. Conveying mechanism; 21. First conveying assembly; 211. First conveying roller; 212. First conveyor belt; 22. Second conveying assembly; 221. Second conveying roller; 222. Second conveyor belt; 3. Tilting mechanism; 31. Bracket; 32. Locking assembly; 321. Telescopic cylinder; 322. Clamping plate; 33. First drive assembly; 331. Rotating shaft; 332. First driver; 4. Cleaning mechanism; 41. High-pressure air knife; 42. Second drive assembly; 421. Slide rail; 422. Slide seat; 5. Dust collection mechanism; 51. Dust hopper; 52. Dust box; 6. Dust removal assembly; 61. Filter. Detailed Implementation

[0025] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] In the description of this utility model, it should be noted that the terms "up," "down," "front," "back," "left," and "right" used to describe directions are defined according to the normal setting direction of the cleaning device. Specifically, when the cleaning device is normally set, the side facing the ground is "down," and vice versa; the material receiving direction of the plate is "front," and vice versa; when a person is facing forward, the person's left side is "left," and vice versa. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0027] Reference Appendix Figure 1-4 The automatic cleaning device for semiconductor chip electrical test boards in this embodiment includes a housing 1, a conveying mechanism 2 for conveying boards, a flipping mechanism 3, a cleaning mechanism 4, and a dust collection mechanism 5 arranged sequentially from top to bottom inside the housing 1.

[0028] The flipping mechanism 3 includes a bracket 31, a locking component 32 disposed on the bracket 31 for fixing the circuit board, and a first driving component 33 connected to the bracket 31 for driving the bracket 31 to flip. The bracket 31 has a first working position and a second working position rotated 180° relative to the first working position. The locking component 32 has a locked state for fixing the circuit board and an unlocked state for releasing the circuit board. The flipping mechanism 3 has at least three working states. When it is in the first working state, the bracket 31 is in the first working position and the locking component 32 is in the unlocked state; when... When the flipping mechanism 3 is in the second working state, the bracket 31 remains in the first working position and the locking component 32 is in the locked state; when the flipping mechanism 3 is in the third working state, the bracket 31 is in the second working position and the locking component 32 remains in the locked state; the cleaning mechanism 4 includes a high-pressure air knife 41 horizontally disposed below the bracket 31 and sliding back and forth in the horizontal direction, and a second driving component 42 connected to the high-pressure air knife 41 and used to drive it to slide back and forth. The air nozzle of the high-pressure air knife 41 is disposed facing the bracket 31, and the high-pressure air knife 41 is connected to an external air source. The flipping mechanism 3 is initially in the first working state. After the board to be processed is transported to the flipping mechanism 3 by the conveying mechanism 2, the flipping mechanism 3 enters the second working state. The board is fixed to the bracket 31 by the locking component 32. Then, the bracket 31 is driven to flip by the first driving component 33, so that the flipping mechanism 3 enters the third working state. At this time, the bracket 31 drives the board to flip 180°, so that the surface of the board faces the cleaning mechanism 4 below. Then, the high-pressure air knife 41 is driven to slide back and forth by the second driving component 42. While sliding back and forth, the high-pressure air knife 41 sprays high-pressure airflow onto the surface of the board, blowing away the foreign objects remaining on the board. The blown-away foreign objects will fall into the dust collection mechanism 5 below, thereby realizing automatic cleaning of the board. This not only improves the cleaning efficiency, but also reduces the labor cost required for the cleaning process. Moreover, the cleaning process does not require manual operation, which not only prevents the hands from blocking the high-pressure airflow and ensures thorough cleaning of the board surface, but also avoids re-contamination of the board when manually picking up or placing the cleaned board, ensuring the cleaning effect.

[0029] In a more preferred embodiment, the locking assembly 32 includes at least one pair of telescopic cylinders 321 respectively fixed to the left and right sides of the bracket 31, and a clamping plate 322 fixedly connected to the piston rod of the telescopic cylinders 321. When the locking assembly 32 is in the locked state, the piston rod retracts and the clamping plate 322 moves closer to the bracket 31, clamping the plate between the clamping plate 322 and the bracket 31. When the locking assembly 32 is in the unlocked state, the piston rod extends and the clamping plate 322 moves away from the bracket 31. The clamping plate 322 is driven to move up and down by the telescopic cylinders 321. When the plate is delivered to the bracket 31, the telescopic cylinders 321 drive the clamping plate 322 to move down and press against the plate, pressing the plate onto the bracket 31 to fix the plate.

[0030] In a more preferred embodiment, the first drive assembly 33 includes a rotating shaft 331 horizontally disposed below the bracket 31 and rotatably connected to the inner wall of the housing 1, and a first driver 332 connected to the rotating shaft 331 and used to drive its rotation. The bracket 31 is fixedly connected to the rotating shaft 331. The first driver 332 drives the rotating shaft 331 to rotate, thereby causing the bracket 31 to rotate around the rotating shaft 331, thus realizing the flipping of the bracket 31. Furthermore, the first driver 332 is configured as a servo motor.

[0031] In a more preferred embodiment, the second drive assembly 42 includes a pair of slide rails 421 horizontally disposed below the bracket 31, at least a pair of slide blocks 422 slidably connected to the pair of slide rails 421, and a second driver for driving the at least pair of slide blocks 422 to slide. The second driver is not shown in the figures and can be a drive structure that can drive the slide blocks to slide, such as a telescopic cylinder or a motor-driven screw structure. Both ends of the high-pressure air knife 41 are fixedly connected to the at least pair of slide blocks 422. The second driver drives the pair of slide blocks 422 to slide back and forth along the slide rails 421, thereby driving the high-pressure air knife 41 to facilitate air cleaning of the board surface.

[0032] In a more preferred embodiment, the conveying mechanism 2 includes a first conveying component 21 disposed inside the housing 1 and capable of rotating synchronously with the bracket 31, and a second conveying component 22 with one end connected to the first conveying component 21 and the other end extending to the outside of the housing 1. The second conveying component 22 conveys the card into the housing 1, and then the first conveying component 21 conveys the card between the bracket 31 and the clamping plate 322, so that the rotating mechanism 3 can rotate the card.

[0033] In a more preferred embodiment, the first conveying assembly 21 includes a pair of first conveying rollers 211 rotatably disposed on the front and rear sides of the bracket 31, and a first conveyor belt 212 wound around the pair of first conveying rollers 211. The bracket 31 is located within the space formed by the first conveyor belt 212. When the locking assembly 32 is in the locked state, the first conveyor belt supporting the card and the card are clamped together on the bracket 31 by the clamping plate 322. The first conveying assembly 21, consisting of the first conveying rollers 211 and the first conveyor belt 212, facilitates the support and conveying of the card and prevents the first conveying assembly 21 from interfering with other moving parts.

[0034] In a more preferred embodiment, the second conveying assembly 22 includes at least one pair of second conveying rollers 221 and a second conveyor belt 222 wound around the at least one pair of second conveying rollers 221. A material inlet 11 for the passage of plates and cards is provided on the side of the housing 1. One end of the second conveyor belt 222 is close to one end of the first conveyor belt 212, and the other end of the second conveyor belt 222 extends from the material inlet 11 to the outside of the housing 1. The second conveying assembly 22, consisting of the second conveying rollers 221 and the second conveyor belt 222, facilitates the conveying of plates and cards into the housing 1. Furthermore, the second conveying assembly 22 can be easily connected to the transmission structure on the production line, facilitating the integration of an automatic cleaning device into the production line for automated production cleaning.

[0035] In a more preferred embodiment, the dust collection mechanism 5 includes a dust hopper 51 located below the cleaning mechanism 4 and having openings at both the top and bottom, and a dust box 52 located at the lower opening of the dust hopper 51. The dust hopper 51 is a frustum shape, wider at the top and narrower at the bottom. Foreign objects that fall during cleaning are collected in the dust box 52 through the dust hopper 51, facilitating cleaning by operators and maintaining the cleanliness of the cleaning device's interior, thus preventing repeated contamination of the circuit boards.

[0036] In a more preferred embodiment, the cleaning device further includes at least one dust removal component 6 disposed on the housing 1. The dust removal component 6 includes a vent (not shown in the figures) opened on the inner wall of the housing 1 and a filter 61 covering the vent and connected to an exhaust device. The dust removal component 6 performs dust extraction and filtration on the internal space of the housing 1, removing floating dust from the housing 1, further improving the cleanliness of the housing 1, ensuring a clean and tidy cleaning space, and thus improving the cleaning effect on the circuit boards.

[0037] In a more preferred embodiment, at least two dust removal components 6 are provided, and the at least two dust removal components 6 are respectively located above the flipping mechanism 3 and below the dust collection mechanism 5. By using at least two dust removal components 6 to vacuum and clean the space above and below the housing 1, the cleanliness of the cleaning environment is further improved, and the cleaning effect on the circuit boards is further ensured.

[0038] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0039] The automatic cleaning device for semiconductor chip electrical test boards of this utility model transports the boards through a conveying mechanism, and then a flipping mechanism fixes and flips the boards to facilitate air cleaning by the cleaning mechanism. In addition, a dust collection mechanism collects fallen foreign objects, realizing automatic cleaning of the test boards. This not only improves cleaning efficiency and reduces labor costs, but also avoids incomplete cleaning caused by hands blocking airflow when hand-held boards are air-cleaned, and also avoids repeated contamination of the boards by dirty hands, ensuring the cleaning effect of the boards.

[0040] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the protection scope of this utility model.

Claims

1. An automatic cleaning device for semiconductor chip electrical test boards, characterized in that: It includes a housing (1), a conveying mechanism (2) for conveying the card, a flipping mechanism (3), a cleaning mechanism (4) and a dust collection mechanism (5) arranged in the housing (1) from top to bottom. The flipping mechanism (3) includes a bracket (31), a locking component (32) disposed on the bracket (31) and used to fix the board, and a first driving component (33) connected to the bracket (31) and used to drive the bracket (31) to flip. The bracket (31) has a first working position and a second working position that is flipped 180° relative to the first working position. The locking component (32) has a locked state that fixes the board and an unlocked state that releases the board. The flipping mechanism (3) has at least three working states. When it is in the first working state, the bracket (31) is in the first working position and the locking component (32) is in the unlocked state. When the flipping mechanism (3) is in the second working state, the bracket (31) maintains the first working position and the locking component (32) is in the locked state. When the flipping mechanism (3) is in the third working state, the bracket (31) is in the second working position and the locking component (32) maintains the locked state. The cleaning mechanism (4) includes a high-pressure air knife (41) horizontally disposed below the bracket (31) and sliding back and forth in the horizontal direction, and a second drive assembly (42) connected to the high-pressure air knife (41) and used to drive it to slide back and forth. The air nozzle of the high-pressure air knife (41) is disposed facing the bracket (31), and the high-pressure air knife (41) is connected to an external air source.

2. The automatic cleaning device for semiconductor chip electrical test boards according to claim 1, characterized in that: The locking assembly (32) includes at least one pair of telescopic cylinders (321) fixed to the left and right sides of the bracket (31) respectively, and a clamping plate (322) fixedly connected to the piston rod of the telescopic cylinder (321). When the locking assembly (32) is in the locked state, the piston rod retracts and the clamping plate (322) moves closer to the bracket (31) so that the plate is clamped between the clamping plate (322) and the bracket (31). When the locking assembly (32) is in the unlocked state, the piston rod extends and the clamping plate (322) moves away from the bracket (31).

3. The automatic cleaning device for semiconductor chip electrical test boards according to claim 1, characterized in that: The first drive assembly (33) includes a rotating shaft (331) arranged horizontally below the bracket (31) and rotatably connected to the inner wall of the housing (1), and a first driver (332) connected to the rotating shaft (331) and used to drive its rotation. The bracket (31) is fixedly connected to the rotating shaft (331).

4. The automatic cleaning device for semiconductor chip electrical test boards according to claim 1, characterized in that: The second drive assembly (42) includes a pair of slide rails (421) arranged horizontally below the bracket (31), at least a pair of slide blocks (422) slidably connected to the pair of slide rails (421), and a second driver for driving the at least a pair of slide blocks (422) to slide. The two ends of the high-pressure air knife (41) are fixedly connected to the at least a pair of slide blocks (422).

5. The automatic cleaning device for semiconductor chip electrical test boards according to claim 2, characterized in that: The conveying mechanism (2) includes a first conveying component (21) disposed inside the box (1) and capable of rotating synchronously with the bracket (31), and a second conveying component (22) with one end connected to the first conveying component (21) and the other end extending to the outside of the box (1).

6. The automatic cleaning device for semiconductor chip electrical test boards according to claim 5, characterized in that: The first conveying assembly (21) includes a pair of first conveying rollers (211) rotatably disposed on the front and rear sides of the bracket (31) and a first conveyor belt (212) wound around the pair of first conveying rollers (211). The bracket (31) is located in the space formed by the first conveyor belt (212). When the locking assembly (32) is in the locked state, the first conveyor belt supporting the plate and the plate are clamped together on the bracket (31) by the clamping plate (322).

7. The automatic cleaning device for semiconductor chip electrical test boards according to claim 5, characterized in that: The second conveying assembly (22) includes at least one pair of second conveying rollers (221) and a second conveyor belt (222) wound around the at least one pair of second conveying rollers (221). The side of the box (1) is provided with a material port (11) for the plate to pass through. One end of the second conveyor belt (222) is close to one end of the first conveyor belt (212), and the other end of the second conveyor belt (222) passes through the material port (11) to the outside of the box (1).

8. The automatic cleaning device for semiconductor chip electrical test boards according to claim 1, characterized in that: The dust collection mechanism (5) includes a dust collection hopper (51) located below the cleaning mechanism (4) and having openings at both the top and bottom, and a dust box (52) located at the bottom of the dust collection hopper (51). The dust collection hopper (51) is a frustum shape with a larger top and a smaller bottom.

9. The automatic cleaning device for semiconductor chip electrical test boards according to claim 1, characterized in that: The cleaning device also includes at least one dust removal component (6) disposed on the housing (1), the dust removal component (6) including a vent opened on the inner wall of the housing (1) and a filter (61) covering the vent and connected to the air extraction device.

10. The automatic cleaning device for semiconductor chip electrical test boards according to claim 9, characterized in that: At least two dust removal components (6) are provided, and at least two dust removal components (6) are located above the flipping mechanism (3) and below the dust collection mechanism (5), respectively.

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