Copper bar clamp, copper bar forming mechanism and copper bar edge milling device

Abstract

The utility model discloses a copper bar clamp, a copper bar forming mechanism and a copper bar edge milling device. The copper bar clamp comprises a die, a positioning assembly and a stamping assembly, and the die is at least provided with a first positioning face and a second positioning face which are used for positioning a copper bar; the positioning assembly movably pushes the copper bar to be attached to the first positioning face and the second positioning face. The first positioning face is provided with a cavity, the position of the stamping assembly corresponds to that of the cavity, the stamping assembly is movably matched with the cavity to conduct stamping forming on the copper bar, and the clamping state is kept. Integrated forming and positioning can be achieved, follow-up edge milling operation is facilitated, and the uniformity of copper bar machining can be better.

Description

Technical Field

[0001] This utility model relates to copper busbar processing, specifically to copper busbar clamps, copper busbar forming mechanisms, and copper busbar milling devices. Background Technology

[0002] Currently, the copper busbar processing process requires first shaping the copper busbar, and then removing it and milling its edges. This method can easily cause positioning errors during the milling process, resulting in poor uniformity among multiple copper busbars after processing. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a copper busbar clamp, a copper busbar forming mechanism and a copper busbar milling device, which can be integrated for forming and positioning, facilitate subsequent milling operations and improve the uniformity of copper busbar processing.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A copper busbar clamp, comprising a mold, a positioning component, and a stamping component, wherein the mold has at least a first positioning surface and a second positioning surface for positioning the copper busbar; the positioning component moves to push the copper busbar to fit against the first positioning surface and the second positioning surface; the first positioning surface has a cavity, and the position of the stamping component corresponds to the cavity, thereby stamping the copper busbar into shape by moving the stamping component to cooperate with the cavity and keeping it in a clamped state.

[0005] As a further improvement of this utility model, the first positioning surface and the second positioning surface at least position the copper busbar in a first direction and a second direction, and the first direction and the second direction form an included angle.

[0006] As a further improvement of this utility model, the included angle between the first direction and the second direction is 80°~90°.

[0007] As a further improvement of this utility model, the stamping assembly is provided with a first mating surface and a second mating surface at positions corresponding to the first positioning surface and the second positioning surface, and when the stamping assembly stamps the copper busbar, the first positioning surface and the second positioning surface respectively cooperate with the first mating surface and the second mating surface to restrict the copper busbar from shifting.

[0008] This utility model also provides a copper busbar forming mechanism, including the copper busbar clamp described in any one of the above.

[0009] As a further improvement of this utility model, the copper busbar forming mechanism further includes a support platform and a driving component. The support surface of the support platform is set at the mold position for placing the copper busbar. The driving component is connected to the support platform to drive the support platform to reciprocate. During the movement, the support platform cooperates with the first positioning surface or the second positioning surface to restrict the movement of the copper busbar. When the support platform moves to the position away from the copper busbar, the copper busbar is allowed to fall and be unloaded.

[0010] As a further improvement of this utility model, the support platform has a pushing surface, which pushes the falling copper busbar to the discharge position when the support platform reciprocates.

[0011] As a further improvement of this utility model, the pushing surface is an inclined surface, and the guiding surface is formed by the support surface tilting downward.

[0012] This utility model also provides a copper busbar milling device, including a milling mechanism and a copper busbar clamp as described in any one of the above. The position of the milling mechanism corresponds to the position of the copper busbar and is used to mill the copper busbar when the stamping assembly clamps the copper busbar in the cavity.

[0013] This utility model also provides a copper busbar milling device, including a milling mechanism and a copper busbar forming mechanism as described in any one of the above. The position of the milling mechanism corresponds to the position of the copper busbar and is used to mill the copper busbar when the stamping assembly clamps the copper busbar in the cavity.

[0014] The beneficial effects of this utility model are that the copper busbar is positioned by the first and second positioning surfaces of the mold in conjunction with the positioning components, and then the stamping components are used in conjunction with the cavity to stamp and form the copper busbar and keep it in a clamped state. The copper busbar can be milled without removing it, which can improve the positioning deviation problem during the milling process and improve the uniformity of multiple copper busbars after processing. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the clamp of this utility model;

[0016] Figure 2 This is a top view of the fixture structure of this utility model;

[0017] Figure 3 for Figure 2 Enlarged view of part A in the image.

[0018] Reference numerals: 1. Mold; 11. First positioning surface; 111. Cavity; 12. Second positioning surface; 2. Positioning component; 3. Stamping component; 31. First mating surface; 32. Second mating surface; 4. Support platform; 5. Drive component; 6. Pushing surface. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the embodiments shown in the accompanying drawings.

[0020] Reference Figure 1-3As shown, this embodiment provides a copper busbar clamp, including a mold 1, a positioning component 2, and a stamping component 3. The mold 1 has at least a first positioning surface 11 and a second positioning surface 12 for positioning the copper busbar. The positioning component 2 pushes the copper busbar to fit against the first positioning surface 11 and the second positioning surface 12 by moving it. The first positioning surface 11 has a cavity 111. The position of the stamping component 3 corresponds to the cavity 111. The stamping component 3 moves to cooperate with the cavity 111 to stamp and form the copper busbar and keep it in a clamped state.

[0021] The stamping assembly 3 can be driven by a cylinder or hydraulically to form a movable fit with the mold 1. When the copper busbar is placed on the mold 1, the positioning assembly 2 actively pushes the copper busbar to fit tightly with the first positioning surface 11 and the second positioning surface 12 to achieve the initial positioning of the copper busbar. Then, the stamping assembly 3 moves towards the cavity 111. While stamping the copper busbar, it maintains the clamping force on the copper busbar, so that the copper busbar is not easy to be displaced during the subsequent milling process, effectively improving the positioning deviation problem and improving the processing uniformity.

[0022] To further improve the stability of the copper busbar positioning, in one optional scheme, the first positioning surface 11 and the second positioning surface 12 at least position the copper busbar in a first direction and a second direction, and the first direction and the second direction form an angle.

[0023] The first positioning surface 11 and the second positioning surface 12 are distributed at a preset angle on the mold 1, respectively limiting the different sides of the copper busbar along the first direction and the second direction, forming a multi-directional positioning constraint. Compared with single-direction positioning, it can reduce the possibility of the copper busbar shifting along the non-positioning direction during processing, further improve the positioning effect, and provide a more reliable positioning basis for subsequent forming and milling processing.

[0024] Further optimization can be achieved by choosing the following method: the angle between the first direction and the second direction is 80°~90°.

[0025] The setting of this included angle range can ensure that the first positioning surface 11 and the second positioning surface 12 form an effective positioning constraint, and will not cause difficulties in copper busbar installation due to the included angle being too small or decrease in positioning stability due to the included angle being too large. Among them, a 90° included angle can form a vertical positioning, which is suitable for the processing requirements of most rectangular copper busbars. An angle between 80° and 90° can be flexibly adjusted according to the specific shape of the copper busbar and processing requirements, thereby improving the adaptability of the device.

[0026] In some options, the stamping assembly 3 is provided with a first mating surface 31 and a second mating surface 32 at the positions corresponding to the first positioning surface 11 and the second positioning surface 12. When the stamping assembly 3 stamps the copper busbar, the first positioning surface 11 and the second positioning surface 12 respectively cooperate with the first mating surface 31 and the second mating surface 32 to restrict the copper busbar from shifting.

[0027] The first mating surface 31 and the second mating surface 32 are integrally formed with the stamping assembly 3. Their shapes are adapted to the shapes of the first positioning surface 11 and the second positioning surface 12. When the stamping assembly 3 presses down to clamp the copper busbar, the first mating surface 31 and the first positioning surface 11 form a clamping on one side of the copper busbar, and the second mating surface 32 and the second positioning surface 12 form a clamping on the other side of the copper busbar. The copper busbar is constrained from both the upper and lower sides and the horizontal direction at the same time, further limiting the offset space of the copper busbar, improving the positioning accuracy, and providing a more stable clamping effect for forming and milling.

[0028] Based on the structure of the copper busbar clamp described above, in one optional embodiment, this utility model also provides a copper busbar forming mechanism, including any of the copper busbar clamps described above.

[0029] The copper busbar clamp is installed on the frame of the forming mechanism by bolting or welding. With the positioning and forming functions of the copper busbar clamp, the copper busbar forming process and the positioning process are integrated, eliminating the need for separate positioning fixtures, simplifying the processing flow. At the same time, the formed copper busbar remains clamped, which facilitates direct connection to the subsequent milling process and improves processing efficiency.

[0030] To achieve automatic unloading and conveying of copper busbars, in some options, the copper busbar forming mechanism also includes a support platform 4 and a drive component 5. The support surface of the support platform 4 is set at the position corresponding to the mold 1 for placing the copper busbar. The drive component 5 is connected to the support platform 4 to drive the support platform 4 to reciprocate. During the movement, the support platform 4 cooperates with the first positioning surface 11 or the second positioning surface 12 to restrict the movement of the copper busbar. When the support platform 4 moves to the position away from the copper busbar, the copper busbar is dropped and unloaded.

[0031] The support platform 4 is slidably connected to the frame via a slide rail. The drive component 5 can be a power element such as a motor or cylinder. Its output end is connected to the support platform 4 via a coupling or hinge. Before processing, the copper busbar is placed on the support surface of the support platform 4. The support surface cooperates with the first positioning surface 11 or the second positioning surface 12 to support and limit the copper busbar from the bottom, reducing the shaking during the processing. After processing, the drive component 5 drives the support platform 4 to move away from the copper busbar. The support surface detaches from the copper busbar, and the copper busbar falls under the action of gravity to achieve unloading. There is no need for manual material handling, which improves the degree of automation in processing.

[0032] Specifically, it can be further optimized. The support platform 4 has a pushing surface 6. When the support platform 4 moves back and forth, the pushing surface 6 pushes the falling copper busbar to the discharge position.

[0033] The pushing surface 6 is located on one side of the support platform 4, forming a continuous structure with the support surface. After the support platform 4 completes the unloading action, it is reset under the drive of the drive component 5. At this time, the pushing surface 6 contacts the fallen copper busbar and pushes the copper busbar to the preset discharge position in the reciprocating motion of the support platform 4, realizing the automatic conveying of the copper busbar, avoiding the copper busbar from falling and accumulating, reducing the workload of manual sorting, and improving the continuity of the processing flow.

[0034] In some options, the push surface 6 is an inclined surface, and the guide surface is formed by the support surface tilting downwards.

[0035] The inclined push surface 6 uses the combined force of gravity and the thrust of the support platform 4 to guide the copper busbar to slide along the inclined surface to the discharge position. Compared with the flat push surface 6, it can reduce the friction between the copper busbar and the push surface 6, avoid the copper busbar from getting stuck, and improve the smoothness of conveying. At the same time, the setting of the inclination angle can guide the copper busbar to be arranged in an orderly manner, further improving the discharge effect.

[0036] Based on the above-mentioned copper busbar clamp, in one optional embodiment, the present invention also provides a copper busbar milling device, including a milling mechanism and any of the above-mentioned copper busbar clamps, wherein the position of the milling mechanism corresponds to the position of the copper busbar, and is used to mill the copper busbar when the stamping assembly 3 clamps the copper busbar in the cavity 111.

[0037] The milling mechanism is fixedly installed on one side of the copper busbar fixture via a bracket. The position of its milling cutter is precisely aligned with the part of the copper busbar to be milled. After the copper busbar is positioned and clamped by the copper busbar fixture, it can be directly milled by the milling mechanism without the need for transfer. This reduces the positioning deviation caused by transferring the copper busbar, improves the milling accuracy, and integrates the forming and milling processes, shortens the processing cycle, and improves production efficiency.

[0038] In some options, the present invention also provides a copper busbar milling device, including a milling mechanism and any of the above-mentioned copper busbar forming mechanisms, wherein the position of the milling mechanism corresponds to the position of the copper busbar, and is used to mill the copper busbar when the stamping assembly 3 clamps the copper busbar in the cavity 111.

[0039] After the copper busbar is formed and clamped in the forming mechanism, it is transported through the support platform 4 of the forming mechanism or kept in a clamped state. The milling mechanism can then mill the copper busbar, realizing integrated processing of forming, unloading, conveying and milling. This further simplifies the production process, reduces the space occupied by the equipment, and maintains the positioning accuracy of the copper busbar throughout the process, improving the uniformity of batch processing.

[0040] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A copper busbar clamp, characterized in that, The device includes a mold, a positioning component, and a stamping component. The mold has at least a first positioning surface and a second positioning surface for positioning copper busbars. The positioning component moves to push the copper busbars to fit against the first positioning surface and the second positioning surface. The first positioning surface has a cavity. The position of the stamping component corresponds to the cavity. The stamping component moves to cooperate with the cavity to stamp and form the copper busbars and keep them in a clamped state.

2. The copper busbar clamp according to claim 1, characterized in that, The first positioning surface and the second positioning surface provide positioning for the copper busbar in at least a first direction and a second direction, and the first direction and the second direction form an included angle.

3. The copper busbar clamp according to claim 2, characterized in that, The angle between the first direction and the second direction is 80°~90°.

4. The copper busbar clamp according to claim 2 or 3, characterized in that, The stamping assembly has a first mating surface and a second mating surface at positions corresponding to the first positioning surface and the second positioning surface. When the stamping assembly stamps the copper busbar, the first positioning surface and the second positioning surface cooperate with the first mating surface and the second mating surface respectively to restrict the copper busbar from shifting.

5. A copper busbar forming mechanism, characterized in that, Includes the copper busbar clamp as described in any one of claims 1-4.

6. The copper busbar forming mechanism according to claim 5, characterized in that, It also includes a support platform and a drive component. The support surface of the support platform is set at the position corresponding to the mold and is used to place the copper busbar. The drive component is connected to the support platform to drive the support platform to reciprocate. During the movement, the support platform cooperates with the first positioning surface or the second positioning surface to restrict the movement of the copper busbar. When the support platform moves to the position away from the copper busbar, the copper busbar is allowed to fall and be unloaded.

7. The copper busbar forming mechanism according to claim 6, characterized in that, The support platform has a pushing surface, which pushes the falling copper busbar to the discharge position when the support platform reciprocates.

8. The copper busbar forming mechanism according to claim 7, characterized in that, The pushing surface is an inclined surface, and the guide surface is formed by the downward tilt of the supporting surface.

9. A copper busbar milling device, characterized in that, It includes a milling mechanism and a copper busbar clamp as described in any one of claims 1-4, wherein the position of the milling mechanism corresponds to the position of the copper busbar and is used to mill the copper busbar when the stamping assembly clamps the copper busbar in the cavity.

10. A copper busbar milling device, characterized in that, It includes a milling mechanism and a copper busbar forming mechanism as described in any one of claims 5-8, wherein the position of the milling mechanism corresponds to the position of the copper busbar and is used to mill the copper busbar when the stamping assembly clamps the copper busbar in the cavity.

Images