Optical lens base material slicing processing device

Abstract

The utility model discloses an optical lens base material slicing processing device, relates to the technical field of optical lens processing, and comprises a base, a ball screw and an arc-shaped frame, both sides of the base are provided with sliding chutes, the outer sides of the sliding chutes are provided with sliding blocks, the outer side of the base is provided with a cutting mechanism, and the arc-shaped frame is provided with an arc-shaped groove. The cutting mechanism moves on the outer side of the base, then the machining range is controlled according to the size of base metal, meanwhile, the cutting height is dynamically adjusted, positioning mechanisms are arranged on the left side and the right side of the base, the positioning mechanisms control the clamping range according to the size of the base metal, and then the base metal is positioned in an overhead mode. And cutting and chip removal treatment of the material is completed. In the using process, the two sets of first material supporting seats are displaced through the transversely-arranged threaded rods, then the distance between the two sets of first material supporting seats is adjusted according to the size of base metal, meanwhile, the mounting height of the second material supporting seats is adjusted, and then the base metal is subjected to suspended positioning.

Description

Technical Field

[0001] This utility model relates to the technical field of optical lens processing, and specifically to an optical lens master material slicing processing device. Background Technology

[0002] Lens matrix is ​​the prefabricated material used to manufacture optical lenses. Its structural design and processing methods directly affect the accuracy and performance of the final lens. Lens matrix is ​​usually a columnar structure, containing multiple parallel curved surfaces and flanges on both sides, which facilitates subsequent stretching and cutting processes.

[0003] Most existing clamping components used in biconvex lens cutting devices are not secure, which can cause the lens base material to loosen during the cutting process. In addition, a certain amount of dust is generated during the processing, and the processing device lacks a structure to clean the dust from the cutting of the base material during operation. Summary of the Invention

[0004] The purpose of this invention is to provide an optical lens master material slicing processing device to solve the above-mentioned defects caused by the prior art.

[0005] An optical lens substrate slicing processing device includes a base, a ball screw, and an arc-shaped frame. The base has grooves on both sides, with sliders positioned on the outer sides of the grooves. A cutting mechanism is located on the outer side of the base, allowing for displacement on the outer side of the base. This displacement controls the processing range based on the substrate dimensions and dynamically adjusts the cutting height. Positioning mechanisms are located on both the left and right sides of the base, controlling the clamping range based on the substrate dimensions to position the substrate in mid-air, thus completing the material cutting and chip removal process.

[0006] Preferably, the cutting mechanism includes a ball screw, a slider, a vertical support, an electric cylinder, a laser nozzle, an arc frame, and a brush rod. One side of the vertical support is connected to both ends of the brush rod. The vertical support is located on the outside of the base. The bottom end of the vertical support is connected to the slider. The outside of the slider is connected to the ball screw. The ball screw has a groove inside. The electric cylinder is located directly above the vertical support. The output end of the electric cylinder is connected to the arc frame. The laser nozzle is symmetrically arranged on the outside of the arc frame.

[0007] Preferably, the slider is connected to both sides of the brush rod via a vertical bracket at the top.

[0008] Preferably, the vertical support is connected to the top of the arc-shaped frame via an electric cylinder located at the top.

[0009] Preferably, the positioning mechanism includes a material support seat one, a rubber pad, a positioning hole, a material support seat two, and a threaded rod. The outer side of the material support seat one is connected to the rubber pad, and positioning holes are provided on both sides of the material support seat one. The material support seat two is provided on one side of the material support seat one, and the outer side of the material support seat two is fitted with a rubber pad. The threaded rod is symmetrically arranged on the outer side of the base, and the outer side of the threaded rod is connected to the bottom end of the material support seat one.

[0010] Preferably, the material support seat one is connected to both sides of the material support seat two through symmetrically arranged positioning holes.

[0011] Preferably, the material support is connected to the outer side of the base via symmetrically arranged threaded rods.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] 1. During use, the two sets of material support seats are displaced by the horizontally set threaded rod. Then, the distance between the two sets of material support seats is adjusted according to the size of the base material. At the same time, the installation height of the second material support seat is adjusted to suspend and position the base material. This facilitates the collection of dust generated during processing through the base. The brush rod at the bottom of the vertical support is used to collect the dust.

[0014] 2. The support is moved laterally by the ball screw, thereby precisely adjusting the cutting spacing. At the same time, the arc frame is moved vertically downward by the electric cylinder, thereby adjusting the height of the laser nozzle. The laser nozzles are symmetrically set to cut the base material, which facilitates the cutting of base materials of different widths. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall front view of the present utility model.

[0016] Figure 2 This is a schematic diagram of the front section structure of the base in this utility model.

[0017] Figure 3 This is a side view of the arc-shaped frame structure in this utility model.

[0018] Figure 4 This is a schematic diagram of the structure of the material support base in this utility model.

[0019] in:

[0020] 1. Base; 2. Slide groove; 3. Ball screw; 4. Slider; 5. Vertical support; 6. Electric cylinder; 7. Cutting mechanism; 8. Positioning mechanism; 9. Material support seat one; 10. Rubber pad; 11. Positioning hole; 12. Material support seat two; 13. Laser nozzle; 14. Arc frame; 15. Threaded rod; 16. Brush rod. Detailed Implementation

[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] like Figures 1 to 4 As shown, an optical lens substrate slicing processing device includes a base 1, a ball screw 3, and an arc frame 14. The base 1 has grooves 2 on both sides, and a slider 4 is provided on the outer side of each groove 2. A cutting mechanism 7 is provided on the outer side of the base 1. The cutting mechanism 7 moves on the outer side of the base 1, thereby controlling the processing range according to the size of the substrate and dynamically adjusting the cutting height. Positioning mechanisms 8 are provided on both the left and right sides of the base 1. The positioning mechanisms 8 control the clamping range according to the size of the substrate, thereby suspending and positioning the substrate to complete the material cutting and chip removal process.

[0023] In this embodiment, the cutting mechanism 7 includes a ball screw 3, a slider 4, a vertical support 5, an electric cylinder 6, a laser nozzle 13, an arc frame 14, and a brush rod 16. One side of the vertical support 5 is connected to both ends of the brush rod 16. The vertical support 5 is located on the outside of the base 1. The bottom end of the vertical support 5 is connected to the slider 4. The outside of the slider 4 is connected to the ball screw 3. The ball screw 3 has a sliding groove 2 inside. The electric cylinder 6 is located directly above the vertical support 5. The output end of the electric cylinder 6 is connected to the arc frame 14. The laser nozzle 13 is symmetrically arranged on the outside of the arc frame 14. The bottom end of the vertical support 5 is positioned by the slider 4, and the laser nozzle 13 is vertically controlled.

[0024] In this embodiment, the slider 4 is connected to both sides of the brush rod 16 via a vertical bracket 5 at the top. The slider 4 synchronously drives the brush rod 16 to move, thereby collecting and cleaning the dust.

[0025] In this embodiment, the vertical support 5 is connected to the top of the arc frame 14 via an electric cylinder 6 at its top. The electric cylinder 6 drives the arc frame 14 to make vertical displacement, thereby adjusting the displacement range of the laser nozzle 13.

[0026] In this embodiment, the positioning mechanism 8 includes a material support seat 9, a rubber pad 10, a positioning hole 11, a material support seat 12, and a threaded rod 15. The outer side of the material support seat 9 is connected to the rubber pad 10, and positioning holes 11 are provided on both sides of the material support seat 9. The material support seat 12 is provided on one side of the material support seat 9, and the outer side of the material support seat 12 is fitted with the rubber pad 10. The threaded rod 15 is symmetrically arranged on the outer side of the base 1, and the outer side of the threaded rod 15 is connected to the bottom end of the material support seat 9. The rubber pad 10 increases the friction for positioning the base material and prevents the base material from shaking during processing.

[0027] In this embodiment, the material support base 9 is connected to both sides of the material support base 12 through symmetrically arranged positioning holes 11, and the material support base 9 and the material support base 12 are docked and locked by the equally spaced positioning holes 11.

[0028] In this embodiment, the material support seat 9 is connected to the outer side of the base 1 through symmetrically arranged threaded rods 15. The position of the material support seat 9 is adjusted by the threaded rods 15, and the material support seat 9 is locked in place by a nut.

[0029] In practical applications, this optical lens substrate slicing processing device includes the following tasks:

[0030] Step 1: During use, first, according to the size of the base material, align the protruding part of the support seat 2 12 with the groove of the support seat 1 9. After adjusting the installation height of the support seat 2 12, insert the bolt into the positioning hole 11. Position the support seat 2 12 and the outer side of the support seat 1 9 using the bolt. Then, install the rubber pad 10 of the corresponding thickness on the outer side of the support seat 2 12 and the support seat 1 9. Use the rubber pad 10 to flexibly clamp the bottom and sides of the base material.

[0031] Step 2: Then, by pulling one of the material support seats 19, the material support seat 19 is moved to the outside of the threaded rod 15 to adjust the distance between the two sets of material support seats 19. Then, a nut is set on the outside of the threaded rod 15 to limit the connection between the material support seat 19 and the threaded rod 15. The material support seat 19 and the material support seat 2 12 limit the two sides of the base material. Then, the laser nozzle 13 of the corresponding specification is installed on both sides of the arc frame 14.

[0032] Step 3: The operator rotates the ball screw 3, which in turn moves the slider 4 and the vertical support 5 outside the groove 2, thereby adjusting the cutting range of the laser nozzle 13. Then, the height and focal length of the laser nozzle 13 are adjusted to focus the laser beam onto the material surface. Precise alignment is performed using alignment tools or software to ensure the cutting path matches the drawing. The electric cylinder 6 drives the arc frame 14 to move vertically downwards, adjusting the cutting height.

[0033] Step 4: During the cutting process, the dust generated during processing is collected by the base 1. When the vertical support 5 moves to the outside of the base 1, the brush rod 16 moves to the surface of the base 1 to clean the dust. The laser nozzle 13 performs a secondary cut on the base material during the resetting process to avoid insufficient cutting.

[0034] Therefore, the above-disclosed embodiments are merely illustrative in all respects and are not the only ones. All modifications within the scope of this utility model or its equivalents are included in this utility model.

Claims

1. An apparatus for slicing optical lens substrates, characterized in that: The system includes a base (1), a ball screw (3), and an arc frame (14). The base (1) has grooves (2) on both sides. A slider (4) is provided on the outside of the grooves (2). A cutting mechanism (7) is provided on the outside of the base (1). The cutting mechanism (7) moves on the outside of the base (1) to control the processing range according to the size of the base material and dynamically adjust the cutting height. Positioning mechanisms (8) are provided on both the left and right sides of the base (1). The positioning mechanisms (8) control the clamping range according to the size of the base material and position the base material in the air to complete the cutting and chip removal process.

2. The optical lens substrate slicing processing device according to claim 1, characterized in that: The cutting mechanism (7) includes a ball screw (3), a slider (4), a vertical support (5), an electric cylinder (6), a laser nozzle (13), an arc frame (14), and a brush rod (16). The vertical support (5) is connected to both ends of the brush rod (16) on one side. The vertical support (5) is located on the outside of the base (1). The bottom end of the vertical support (5) is connected to the slider (4). The outside of the slider (4) is connected to the ball screw (3). The ball screw (3) has a sliding groove (2) inside. The electric cylinder (6) is located directly above the vertical support (5). The output end of the electric cylinder (6) is connected to the arc frame (14). The laser nozzle (13) is symmetrically arranged on the outside of the arc frame (14).

3. The optical lens substrate slicing processing apparatus according to claim 2, characterized in that: The slider (4) is connected to both sides of the brush rod (16) via a vertical bracket (5) set at the top.

4. The optical lens substrate slicing processing apparatus according to claim 2, characterized in that: The vertical support (5) is connected to the top of the arc frame (14) via an electric cylinder (6) located at the top.

5. The optical lens substrate slicing processing apparatus according to claim 1, characterized in that: The positioning mechanism (8) includes a material support seat one (9), a rubber pad (10), a positioning hole (11), a material support seat two (12), and a threaded rod (15). The outer side of the material support seat one (9) is connected to the rubber pad (10). Positioning holes (11) are opened on both sides of the material support seat one (9). The material support seat two (12) is provided on one side of the material support seat one (9). The outer side of the material support seat two (12) is fitted with the rubber pad (10). The threaded rod (15) is symmetrically arranged on the outer side of the base (1). The bottom end of the material support seat one (9) is connected through the outer side of the threaded rod (15).

6. The optical lens substrate slicing processing apparatus according to claim 5, characterized in that: The material support seat one (9) is connected to both sides of the material support seat two (12) through symmetrically arranged positioning holes (11).

7. The optical lens substrate slicing processing apparatus according to claim 5, characterized in that: The material support seat (9) is connected to the outside of the base (1) by symmetrically arranged threaded rods (15).

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