Equipment capable of automatically measuring thickness of wafer

Abstract

The utility model relates to the field of wafer thickness measurement, in particular to a device capable of automatically measuring the thickness of a wafer. The utility model provides a device capable of automatically and rapidly switching wafers, facilitating rapid detection of the wafers and automatically measuring the thickness of the wafers. A device capable of automatically measuring the thickness of a wafer comprises a rack, a protective cover, a first supporting frame and the like, the upper side of the rack is connected with the protective cover, and the upper side of the left front portion of the rack is connected with the first supporting frame. According to the utility model, the first servo motor drives the rotary table to rotate, so that the wafer is located below the detection head, then the lead screw rotates to drive the detection table to move downwards, and detection is carried out through the detection head, thereby achieving the effects that the wafer can be automatically and rapidly switched, and the wafer can be conveniently and rapidly detected.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer thickness measurement field especially relates to a kind of equipment capable of automatically measuring wafer thickness. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafer as the core raw material of chip manufacturing, its quality and performance directly determine the reliability and stability of final chip product, therefore, fast, accurate and efficient detection of wafer is indispensable in the process of semiconductor manufacturing, but the current device is not convenient for the wafer to be detected to be switched quickly, it is inconvenient to realize fast detection, and the efficiency is low.

[0003] Therefore, a kind of equipment capable of automatically measuring wafer thickness for automatically switching wafer quickly and facilitating fast detection of wafer is needed. UTILITY MODEL CONTENT

[0004] In order to overcome the shortcomings of the current device, which is not convenient for the wafer to be detected to be switched quickly, it is inconvenient to realize fast detection, and the efficiency is low, the utility model provides a kind of equipment capable of automatically measuring wafer thickness for automatically switching wafer quickly and facilitating fast detection of wafer.

[0005] Technical scheme as follows: a kind of equipment capable of automatically measuring wafer thickness, including rack, protective cover, first support frame, CCD, second support frame, second servo motor, screw rod, detection table, rotating assembly and switching assembly, rack upper side is connected with protective cover, rack left front upper side is connected with first support frame, first support frame upper part is connected with CCD, rack rear upper side is connected with second support frame, second support frame upper side is connected with second servo motor, second servo motor output shaft is connected with screw rod, screw rod is rotatably connected with second support frame, screw rod is threadedly connected with detection table, detection table is connected with second support frame, rack middle part is equipped with the rotating assembly capable of switching quickly, detection table is equipped with the switching assembly capable of switching measurement position according to wafer size.

[0006] As preferred, rack front and rear two parts lower side are rotatably provided with left and right two movements.

[0007] As preferred, rack lower side is equipped with multiple support feet.

[0008] As preferred, rack lower part is rotatably provided with left and right two rotating doors.

[0009] As preferred, rotating assembly includes rotating table, first servo motor, support table, ceramic disc and wafer, rack middle upper part is connected with first servo motor, first servo motor output shaft is connected with rotating table, rotating table upper side is connected with support table, support table upper side is placed with ceramic disc, ceramic disc upper side is placed with multiple wafers.

[0010] Preferably, a switching assembly is also included. The switching assembly includes a third servo motor, a gear, a rotary track plate, a circular guide rail, and a detection head. The third servo motor is connected to the rear right side of the detection table, and a gear is connected to the output shaft of the third servo motor. A circular guide rail is connected to the lower side of the detection table, and a rotary track plate is rotatably and slidably connected to the circular guide rail. The gear and the rotary track plate mesh with each other. Multiple detection heads are slidably connected to the detection table, and a detection head is also connected to the middle of the detection table. All the sliding detection heads on the detection table are slidably engaged with the rotary track plate.

[0011] The beneficial effects of this utility model are as follows: 1. This utility model uses a first servo motor to drive the rotary table to rotate, so that the wafer is located below the detection head. Then, the screw rotates to drive the detection table to move downward, and the detection head is used for detection. This achieves the effect of automatically and quickly switching wafers, which facilitates the rapid detection of wafers.

[0012] 2. This utility model starts the third servo motor, which drives the gear to rotate, so that the gear meshes with the rotating track plate and drives the rotating track plate to rotate along the circular guide rail. This causes the detection head to move outward along the rotating track plate, achieving the effect of being able to switch the measurement position according to the size of the wafer, which is convenient to adjust according to the needs and is flexible in use. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a three-dimensional structural diagram of the second servo motor and lead screw components of this utility model.

[0015] Figure 3 This is a cross-sectional structural diagram of the ceramic disk and wafer components of this utility model.

[0016] Figure 4 This is a three-dimensional structural diagram of the third servo motor and gears of this utility model.

[0017] Figure 5 This is a three-dimensional structural diagram of the rotating track plate and circular guide rail components of this utility model.

[0018] Figure 6 This is a three-dimensional structural diagram of the testing platform and testing head of this utility model.

[0019] Reference numerals: 1_Frame, 2_Protective cover, 3_First support frame, 31_CCD, 4_Rotating stage, 5_First servo motor, 6_Support platform, 7_Ceramic disk, 8_Wafer, 9_Second support frame, 10_Second servo motor, 11_Lead screw, 12_Detection stage, 13_Third servo motor, 14_Gear, 15_Rotating track plate, 16_Circular guide rail, 17_Detection head. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] A device capable of automatically measuring wafer thickness, such as Figure 1 , Figure 2 and Figure 4 As shown, the assembly includes a frame 1, a protective cover 2, a first support frame 3, a CCD 31, a second support frame 9, a second servo motor 10, a lead screw 11, a detection table 12, a rotating assembly, and a switching assembly. The frame 1 has two rotatable casters on its lower front and rear sides for easy movement. The frame 1 has four support feet on its lower side for support. The lower part of the frame 1 has two rotating doors for easy opening and placement of tools. The protective cover 2 is connected to the upper side of the frame 1. The first support frame 3 is connected to the upper left front part of the frame 1, and the CCD 31 is connected to the upper part of the first support frame 3. The second support frame 9 is connected to the upper rear part of the frame 1, and the second servo motor 10 is connected to the upper part of the second support frame 9. The lead screw 11 is connected to the output shaft of the second servo motor 10 and is rotatably connected to the second support frame 9. The detection table 12 is threaded onto the lead screw 11 and is connected to the second support frame 9. A rotating assembly is located in the middle of the frame 1, and a switching assembly is located on the detection table 12.

[0022] like Figure 3 and Figure 4 As shown, the rotating assembly includes a rotary table 4, a first servo motor 5, a support platform 6, a ceramic disk 7, and wafers 8. The first servo motor 5 is connected to the upper part of the frame 1. The rotary table 4 is connected to the output shaft of the first servo motor 5. The support platform 6 is connected to the upper side of the rotary table 4. The ceramic disk 7 is placed on the upper side of the support platform 6. Seven wafers 8 are placed on the upper side of the ceramic disk 7.

[0023] like Figures 4-6As shown, it also includes a switching component, which includes a third servo motor 13, a gear 14, a rotary track plate 15, a circular guide rail 16, and a detection head 17. The third servo motor 13 is connected to the rear right side of the detection table 12. The gear 14 is connected to the output shaft of the third servo motor 13. The circular guide rail 16 is connected to the lower side of the detection table 12. The rotary track plate 15 is rotatably and slidably connected to the circular guide rail 16. The gear 14 and the rotary track plate 15 mesh with each other. Eight detection heads 17 are slidably connected to the detection table 12. Detection heads 17 are also connected to the middle of the detection table 12. All the sliding detection heads 17 on the detection table 12 are slidably engaged with the rotary track plate 15.

[0024] When using this equipment, first move the frame 1 to the wafer thickness measurement area and support it with support feet. Then, place the ceramic disk 7 containing the 4-inch wafer 8 on the rotary table 4. Next, use a CCD 31 to position the ceramic disk 7 according to the one-dimensional barcode on the ceramic disk 7 and send the rotation coordinates to the rotary table 4. Simultaneously, read the one-dimensional barcode information. Then, start the first servo motor 5 to rotate the rotary table 4 so that the wafer 8 is below the detection head 17. Then, turn off the first servo motor 5 and start the second servo motor 10 to rotate the lead screw 11, causing the detection table 12 to move downward under the action of the screw, which in turn moves the detection head 17 downward, so that the detection head 17 contacts the wafer 8 to measure the thickness of the wafer 8. After inspecting a wafer 8, the lead screw 11 rotates, causing the inspection stage 12 to move upward. Then, the first servo motor 5 drives the rotary table 4 to rotate, positioning the wafer 8 below the inspection head 17 for inspection. This allows for automatic and rapid switching of wafer 8 for quick inspection. When inspecting a 6-inch wafer 8, the third servo motor 13 is activated, driving the gear 14 to rotate. The gear 14 meshes with the rotating track plate 15, causing the rotating track plate 15 to rotate along the circular guide rail 16. This causes the inspection head 17 to move outward along the rotating track plate 15, allowing for switching of the measurement position according to the size of the wafer 8. This provides flexibility and allows for easy adjustment as needed.

[0025] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A device capable of automatically measuring wafer thickness, characterized in that, The device includes a frame (1), a protective cover (2), a first support frame (3), a CCD (31), a second support frame (9), a second servo motor (10), a lead screw (11), a testing table (12), a rotating assembly, and a switching assembly. The upper side of the frame (1) is connected to the protective cover (2). The upper left front part of the frame (1) is connected to the first support frame (3). The upper part of the first support frame (3) is connected to the CCD (31). The upper rear part of the frame (1) is connected to the second support frame (9). The upper part of the second support frame (9) is connected to the second servo motor (10). The output shaft of the second servo motor (10) is connected to the lead screw (11). The lead screw (11) is rotatably connected to the second support frame (9). The lead screw (11) is threadedly connected to the testing table (12). The testing table (12) is connected to the second support frame (9). The middle part of the frame (1) is equipped with a rotating assembly that can quickly switch the measurement position. The testing table (12) is equipped with a switching assembly that can switch the measurement position according to the size of the wafer (8).

2. The device for automatically measuring wafer thickness according to claim 1, characterized in that, The frame (1) has two rotatable casters on the lower sides of both the front and rear sides.

3. The device for automatically measuring wafer thickness according to claim 1, characterized in that, The frame (1) has multiple support feet on the lower side.

4. The device for automatically measuring wafer thickness according to claim 1, characterized in that, The lower part of the frame (1) is equipped with two rotating doors on the left and right.

5. The device for automatically measuring wafer thickness according to claim 1, characterized in that, The rotating assembly includes a rotary table (4), a first servo motor (5), a support platform (6), a ceramic disk (7), and wafers (8). The first servo motor (5) is connected to the upper part of the frame (1). The rotary table (4) is connected to the output shaft of the first servo motor (5). The support platform (6) is connected to the upper side of the rotary table (4). The ceramic disk (7) is placed on the upper side of the support platform (6). Multiple wafers (8) are placed on the upper side of the ceramic disk (7).

6. The device for automatically measuring wafer thickness according to claim 1, characterized in that, It also includes a switching component, which includes a third servo motor (13), a gear (14), a rotating track plate (15), a circular guide rail (16), and a detection head (17). The third servo motor (13) is connected to the rear right side of the detection table (12). The gear (14) is connected to the output shaft of the third servo motor (13). The circular guide rail (16) is connected to the lower side of the detection table (12). The rotating track plate (15) is rotatably and slidably connected to the circular guide rail (16). The gear (14) meshes with the rotating track plate (15). Multiple detection heads (17) are slidably connected to the detection table (12). Detection heads (17) are also connected to the middle of the detection table (12). The sliding detection heads (17) on the detection table (12) all slide in cooperation with the rotating track plate (15).

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