Chip type simulation load box

Abstract

The utility model discloses a chip type simulation load box which comprises a box body and a simulation load assembly arranged in the box body. The key points are that the simulation load assembly comprises a pedestal arranged on the box body, a simulation load, a heat conduction plate connected with the pedestal and used for limiting the simulation load on the pedestal, and a water-cooling heat dissipation assembly matched with the simulation load; the water-cooling heat dissipation assembly comprises a water-cooling head connected with the heat conduction plate, a water inlet pipe and a water outlet pipe, wherein the water inlet pipe and the water outlet pipe are matched with the water-cooling head. The utility model has the beneficial effects that the load of chips such as a GPU (Graphics Processing Unit) in the specific working process can be simulated, and whether the water cooling system of the machine room meets the design requirement or not is detected; and a water leakage detection line and a water pan are arranged, so that liquid leakage at the water cooling head can be detected and treated in time, and a control circuit below is prevented from being influenced.

Description

Technical Field

[0001] This utility model relates to the field of server auxiliary equipment technology, specifically to a chip-type simulated load cell. Background Technology

[0002] During the construction of a data center, it's crucial to consider the heat dissipation requirements of the equipment within to prevent performance degradation due to overheating caused by insufficient cooling capacity after completion. After the water cooling system is built, the installation of equipment requires time. If problems with the water cooling system's heat dissipation capacity are discovered after installation, it's difficult to improve, potentially leading to the equipment's final performance failing to meet design requirements. Summary of the Invention

[0003] The technical problem to be solved by this utility model is to provide a chip-type simulated load box, which simulates the load of the equipment to be installed after the heat dissipation system of the computer room is built, so as to test the heat dissipation capacity of the heat dissipation system of the computer room.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a chip-type analog load box, including a box body and an analog load assembly disposed in the box body. The key is that the analog load assembly includes a base disposed on the box body, an analog load, a heat-conducting plate connected to the base and limiting the analog load on the base, and a water-cooling heat dissipation assembly matched with the analog load. The water-cooling heat dissipation assembly includes a water-cooling head connected to the heat-conducting plate and an inlet pipe and an outlet pipe matched with the water-cooling head.

[0005] Furthermore, an insulation board is provided inside the box, and two sets of simulated load components are provided on the insulation board. The water inlet pipe is connected to the water inlet of the two water cooling heads through the first connecting pipe and the matching connector, and the water outlet pipe is connected to the water outlet of the two water cooling heads through the second connecting pipe and the matching connector.

[0006] Furthermore, multiple sets of the insulation board and the simulated load assembly located on the insulation board are arranged along the length of the box. The box is provided with an inlet water separator communicating with each inlet pipe and an outlet water separator connected to each outlet pipe.

[0007] Furthermore, both the inlet water separator and the outlet water separator are equipped with flow sensors and temperature and pressure sensors.

[0008] Furthermore, an installation plate is provided inside the box, and the heat insulation plate is disposed on the installation plate.

[0009] Furthermore, a leakage detection line is provided in the middle of the mounting plate.

[0010] Furthermore, a water receiving tray is provided below the mounting plate, and a drain hole is provided on the mounting plate.

[0011] Furthermore, the water receiving tray is slidably limited within the box, and a positioning pin is provided at the inner end of the water receiving tray.

[0012] Furthermore, the simulated load is a PTC ceramic heating element.

[0013] Furthermore, a connection plate for installing control circuitry is provided at the bottom of the housing.

[0014] The beneficial effects of this utility model are: it can simulate the load of chips such as GPUs during specific working processes and detect whether the water cooling system in the computer room meets the design requirements; it is equipped with a leakage detection line and a water receiving tray, so that when leakage occurs at the water cooling head, it can be detected and dealt with in time to avoid affecting the control circuit below. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the chip-type analog load box of this utility model;

[0016] Figure 2 This is a schematic diagram of the connection of the analog load assembly on the insulation board in the chip-type analog load box of this utility model;

[0017] Figure 3 This is a schematic diagram of the water receiving tray in the chip-type analog load box of this utility model.

[0018] In the attached diagram, 1. Housing, 2. Base, 3. Simulated load, 4. Heat conduction plate, 5. Water cooling head, 6. Inlet pipe, 7. Outlet pipe, 8. Insulation plate, 9. First connecting pipe, 10. Second connecting pipe, 11. Inlet water separator, 12. Outlet water separator, 13. Flow sensor, 14. Temperature and pressure sensor, 15. Mounting plate, 16. Leakage detection line, 17. Water receiving tray, 18. Positioning pin, 19. Connecting plate. Detailed Implementation

[0019] See appendix Figure 1-3 This utility model provides a chip-type simulated load box, including a simulated server chassis housing 1 and simulated load components disposed within the housing 1.

[0020] The front panel of the housing 1 is equipped with a display screen, a rotary switch for controlling the power of each heating module, indicator lights, a device switch, and an emergency stop switch (not shown in the figure), which are used to display and set various parameters or control related components.

[0021] See appendix Figure 2The aforementioned simulated load assembly includes a base 2 mounted on the housing 1, a simulated load 3, and a heat-conducting plate 4 connected to the base 2 and constraining the simulated load 3 on the base 2. In this embodiment, the simulated load 3 uses a PTC ceramic heating element with a power of 1500W. A temperature sensor for detecting the temperature of the simulated load 3 is also provided on the base 2. A limiting groove is provided on the base 2 for placing and constraining the PTC ceramic heating element.

[0022] To ensure that the simulated load 3 operates at a preset temperature and to test the performance of the computer room's water cooling system, a water cooling heat dissipation component was provided for the simulated load 3. The water cooling heat dissipation component includes a water cooling head 5 connected to a heat conduction plate 4, and an inlet pipe 6 and an outlet pipe 7 that are matched with the water cooling head 5.

[0023] The water cooling system in the computer room includes a water pump, water tank, water cooling device, heat dissipation device, and supporting control circuitry that supply coolant to the water cooling head 5. The water cooling system communicates with the load cell to adjust the pump speed and coolant temperature, ensuring the simulated load 3 operates within a preset temperature range. It also monitors the cooling and heat dissipation capabilities of the computer room's water cooling system.

[0024] To prevent the simulated load 3 from directly contacting the housing 1, an insulation plate 8 is installed inside the housing 1, and the base 2 is fixed on the insulation plate 8. Two sets of simulated load components are installed on the insulation plate 8. The water inlet pipe 6 is connected to the water inlet of the two water cooling heads 5 through the first connecting pipe 9 and the matching connector (such as a T-connector). The water outlet pipe 7 is connected to the water outlet of the two water cooling heads 5 through the second connecting pipe 10 and the matching connector (such as a T-connector).

[0025] Two sets of simulated load components on the insulation plate 8 form a heating module. Under the control of the control circuit, the power of each heating module can be adjusted independently. K-type thermocouples are installed at the inlet and outlet of the water-cooling head 5, which is matched with one of the simulated loads in the heating module, to collect the liquid temperature at the inlet and outlet in real time.

[0026] See appendix Figure 1 and 2 To achieve the preset load power, multiple sets of insulation panels 8 and simulated load components located on the insulation panels 8 are arranged along the length of the housing 1. In this embodiment, four sets are provided. Because multiple sets of simulated load components are provided, an inlet water separator 11 connected to each inlet pipe 6 and an outlet water separator 12 connected to each outlet pipe 7 are provided inside the housing 1. Flow sensors 13 and temperature and pressure sensors 14 are provided on both the inlet water separator 11 and the outlet water separator 12 to monitor flow rate, temperature, and pressure. The inlet water separator 11 and the outlet water separator 12 are connected to the water cooling system through matching pipes.

[0027] The flow sensor 13 is used to measure the flow rate of water entering or leaving the water distributor. By monitoring the water velocity and flow rate, the water intake status of the cooling system can be understood, and it can be determined whether there are any problems such as blockage in the water inlet pipe.

[0028] Temperature and pressure sensors 14 are used to measure the pressure of water flow at different stages. The temperature and pressure sensor 14 at the inlet end monitors whether the inlet pressure is normal, ensuring sufficient pressure to drive the water flow through the entire system; it also monitors the inlet water temperature to help understand the initial temperature of the water source. The temperature and pressure sensor 14 at the outlet end reflects the pressure changes after the water flows through the entire water system (including components such as the GPU), helping to determine if there are blockages or other conditions causing abnormal pressure; it also monitors the outlet water temperature to reflect the temperature changes after the water flows through the entire system (especially after passing through a simulated heat source).

[0029] After passing through the flow sensor 13 and the temperature and pressure sensor 14, the external water inlet is distributed to multiple simulated loads 3 by the water distributor. Then, it is collected again by the water outlet distributor and finally flows out after passing through the temperature and pressure sensor 14 and the flow sensor 13.

[0030] An installation plate 15 is provided inside the housing 1, and all the aforementioned insulation plates 8 are installed on the installation plate 15.

[0031] See appendix Figure 1 and 3 Because water-cooled heat dissipation components are used, there is a possibility of leakage. Therefore, a leakage detection line 16 is provided in the middle of the mounting plate 15. A water receiving tray 17 is provided below the mounting plate 15, and a leakage hole is provided on the mounting plate 15. The water receiving tray 17 is slidably limited in the limiting groove of the housing 1 for easy removal and placement. A positioning pin 18 is provided at the inner end of the water receiving tray 17, and a positioning sleeve that cooperates with the positioning pin 18 is provided inside the housing 1. The positioning pin 18 and the positioning sleeve cooperate to achieve the positioning of the water receiving tray 17 inside the housing 1.

[0032] A connection plate 19 for mounting the control circuit is located at the bottom of the enclosure 1. The control circuit can control the operation of one or more analog loads 3, their power during operation, and the acquisition of various signals. The control circuit has an RS485 interface and an ambient temperature sensor, through which operating parameters are reported and ambient temperature is acquired.

[0033] The working process of this utility model device is as follows: Turn on the equipment switch to power on all devices, start the water cooling system in the computer room, and adjust the power of the corresponding heating module using a rotary switch. During this process, parameters such as current, voltage, power, inlet and outlet water pressure, and temperature will be displayed in real time on the screen on the front panel of the load box. Simultaneously, testing personnel can analyze the heat dissipation and cooling operation of the water cooling system in the computer room based on the operation of the load box to determine whether the design requirements are met.

[0034] Finally, it is necessary to note that the above content is only used to help understand the technical solution of the present invention and should not be construed as a limitation on the scope of protection of the present invention; any non-essential improvements and adjustments made by those skilled in the art based on the above content of the present invention are all within the scope of protection claimed by the present invention.

Claims

1. A chip-type analog load box, comprising a box body (1) and an analog load assembly disposed within the box body (1), characterized in that: The simulated load assembly includes a base (2) disposed on the housing (1), a simulated load (3), a heat-conducting plate (4) connected to the base (2) and limiting the simulated load (3) on the base (2), and a water-cooling heat dissipation assembly matched with the simulated load (3). The water-cooling heat dissipation assembly includes a water-cooling head (5) connected to the heat-conducting plate (4) and an inlet pipe (6) and an outlet pipe (7) matched with the water-cooling head (5).

2. The chip-type analog load cell according to claim 1, characterized in that: An insulation board (8) is provided inside the housing (1), and two sets of simulated load components are provided on the insulation board (8). The water inlet pipe (6) is connected to the water inlet of the two water cooling heads (5) through the first connecting pipe (9) and the matching connector. The water outlet pipe (7) is connected to the water outlet of the two water cooling heads (5) through the second connecting pipe (10) and the matching connector.

3. The chip-type analog load cell according to claim 2, characterized in that: The insulation board (8) and the simulated load assembly located on the insulation board (8) are arranged in multiple sets along the length direction of the box (1). The box (1) is provided with an inlet water separator (11) that communicates with each inlet pipe (6) and an outlet water separator (12) that is connected to each outlet pipe (7).

4. The chip-type analog load cell according to claim 3, characterized in that: A flow sensor (13) and a temperature and pressure sensor (14) are provided on both the inlet water separator (11) and the outlet water separator (12).

5. The chip-type analog load cell according to claim 3, characterized in that: An installation plate (15) is provided inside the housing (1), and the heat insulation plate (8) is disposed on the installation plate (15).

6. The chip-type analog load cell according to claim 5, characterized in that: A leakage detection line (16) is provided in the middle of the mounting plate (15).

7. The chip-type analog load box according to claim 6, characterized in that: A water receiving tray (17) is provided below the mounting plate (15), and a water leakage hole is provided on the mounting plate (15).

8. The chip-type analog load box according to claim 7, characterized in that: The water receiving tray (17) is slidably limited within the box body (1), and a positioning pin (18) is provided at the inner end of the water receiving tray (17).

9. The chip-type analog load cell according to claim 1, characterized in that: The simulated load (3) is a PTC ceramic heating element.

10. The chip-type analog load cell according to any one of claims 1-9, characterized in that: A connection plate (19) for installing control circuitry is provided at the bottom of the housing (1).

Images