Pressure measuring structure

Abstract

The utility model relates to the technical field of testing equipment, and particularly discloses a pressure testing structure which is characterized in that a flow channel is arranged in a base; the pressure head assembly comprises a mounting part, a ballast part and a heating piece, the ballast part is located on the side, away from the base, of the mounting part, the heating piece and the mounting part are relatively fixed, and the heating piece is configured to generate heat for heating the chip; the first elastic piece is arranged between the base and the pressing head assembly, a closed cavity is defined by the first elastic piece, the base and the installation part, liquid metal is contained in the closed cavity, and the top face of the liquid metal makes contact with the base. According to the arrangement, the temperature requirement during high-power chip testing can be met.

Description

Technical Field

[0001] This utility model relates to the field of testing equipment technology, and in particular to a pressure testing structure. Background Technology

[0002] Three-temperature testing is an important part of chip testing. In order to simulate the working environment of the chip at different temperatures, a pressure head with temperature control function needs to be in contact with the chip surface to control the temperature of the chip testing area.

[0003] The principle of pressure head temperature control is that the heater inside the pressure head generates heat, which passes through the pressure head and the substrate, eventually reaching the flow channel in the substrate. A low-temperature refrigerant flows through the flow channel to remove the heat conducted from the pressure head. When the heat generated by the heater inside the pressure head is balanced with the heat removed by the flow channel, the temperature of the pressure head remains stable. When the pressure head comes into contact with the chip, the chip heats up, and the heat from the chip is transferred to the pressure head, causing the surface temperature of the pressure head to rise. After the internal temperature sensor detects the temperature rise, it reduces the heat output of the heater. The heat generated by the chip compensates for the reduced heat output of the heater. To maintain a stable pressure head temperature, the system's thermal balance must be maintained.

[0004] Current technology typically involves installing springs and guide structures between the pressure head and the substrate. However, the air layer created after the pressure head and substrate float and separate is a poor conductor of heat with extremely high thermal resistance. This results in minimal heat exchange between the pressure head and the flow channel. Consequently, when high-power chips generate significant heat, the heat cannot be transferred to the flow channel in a timely manner, ultimately leading to excessively high chip temperatures that fail to meet testing requirements.

[0005] Therefore, it is urgent to study a pressure testing structure to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a pressure testing structure to solve the problem that the existing technology cannot meet the testing requirements of high-power chips with large heat generation.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] The pressure testing structure includes:

[0009] The base has internal flow channels.

[0010] The pressure head assembly includes a mounting portion, a ballast portion, and a heating element. The ballast portion is located on the side of the mounting portion away from the base. The heating element is fixed relative to the mounting portion and is configured to generate heat for testing.

[0011] A first elastic element is disposed between the base and the pressure head assembly, and together with the base and the mounting portion, forms a sealed cavity. The sealed cavity contains liquid metal, and the top surface of the liquid metal is in contact with the base.

[0012] As an optional technical solution for the pressure testing structure, the base has a first expansion groove, which is connected to the sealed cavity and located above the sealed cavity. When the first elastic element is deformed, part of the liquid metal flows into the first expansion groove.

[0013] As an optional technical solution for the pressure testing structure, the first expansion slot has a plurality of slots, which are arranged at intervals on the base; and / or,

[0014] The diameter of the first expansion groove is smaller than the height of the first expansion groove.

[0015] As an optional technical solution for pressure testing structure, the pressure head assembly includes a bottom pressure head, and the mounting portion is formed on one side of the bottom pressure head facing the base; the first elastic member is cylindrical and is disposed between the bottom pressure head and the base.

[0016] As an optional technical solution for pressure testing structure, the axial section of the first elastic element includes a deformable part and connecting parts located on both sides of the deformable part. The two connecting parts are respectively fitted with the base and the bottom pressure head, and the two connecting parts move relative to each other through the deformable part.

[0017] As an optional technical solution for the pressure testing structure, the deformable part is V-shaped and the opening faces the center of the sealed cavity.

[0018] As an optional technical solution for the pressure testing structure, the pressure head assembly further includes a guide member, the base has a guide hole, the guide member is located in the guide hole and connected to the bottom pressure head; and / or,

[0019] The pressure testing structure also includes a second elastic element, which is sandwiched between the base and the bottom pressure head.

[0020] As an optional technical solution for the pressure testing structure, the pressure head assembly further includes an end pressure head, which is located on the side of the bottom pressure head away from the base. The heating element is located between the bottom pressure head and the end pressure head, and the side of the end pressure head away from the bottom pressure head forms the ballast portion.

[0021] As an optional technical solution for the pressure testing structure, the base has a liquid inlet and an air outlet, both of which are connected to the sealed cavity. The pressure testing structure also includes two sealing components, which are respectively inserted into and seal the liquid inlet and the air outlet.

[0022] As an optional technical solution for a pressure testing structure, the pressure testing structure has a plurality of pressure head assemblies and a plurality of first elastic elements, with the plurality of pressure head assemblies arranged at intervals on the base; the plurality of first elastic elements are arranged in a one-to-one correspondence with the plurality of pressure head assemblies.

[0023] This utility model has at least the following beneficial effects:

[0024] This utility model provides a pressure testing structure, which includes a base, a pressure head assembly, and a first elastic element. The base has a flow channel inside; the pressure head assembly includes a mounting part, a ballast part, and a heating element. The ballast part is located on the side of the mounting part away from the base, and the heating element is fixed relative to the mounting part and configured to generate heat for testing; the first elastic element is disposed between the base and the pressure head assembly, and together with the base and the mounting part, forms a sealed cavity containing liquid metal, the top surface of which contacts the base. The above configuration allows the pressure head assembly to shift relative to the base, ensuring good contact between the pressure plate and the chip. Furthermore, after the first elastic element deforms, the morphology of the liquid metal within the sealed cavity changes accordingly. The arrangement of the top surface of the liquid metal contacting the base allows heat from the pressure plate to enter the liquid metal from the bottom and then transfer to the base via the top, achieving excellent heat transfer. This meets the requirements of high-power chip testing where heat generation is significant. Heat is transferred to the flow channels of the base, cooling the chip and preventing it from overheating. Combined with the heating element, it can heat the chip, meeting the temperature requirements for high-power chip testing. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the pressure testing structure in an embodiment of the present invention;

[0027] Figure 2 This is a top view of the pressure testing structure in an embodiment of this utility model;

[0028] Figure 3 for Figure 2 Cross-sectional view along the AA direction;

[0029] Figure 4 for Figure 3 Enlarged view at point K;

[0030] Figure 5 for Figure 2 Cross-sectional view along the BB direction;

[0031] Figure 6 This is a schematic diagram of the pressure testing structure in an embodiment of the present invention.

[0032] In the picture:

[0033] 1000, Chip;

[0034] 100. Base; 110. First expansion slot; 120. Guide hole; 130. Cooling component;

[0035] 200, Indenter assembly; 210, Bottom indenter; 211, Mounting part; 212, Second expansion groove; 220, End indenter; 221, Ballast part; 230, Heating element; 240, Temperature sensor;

[0036] 300, First elastic element; 310, Deformable part; 320, Connecting part;

[0037] 400. Sealed cavity;

[0038] 500. Sealing components;

[0039] 600. Guide component; 610. Second elastic component. Detailed Implementation

[0040] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0041] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0042] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0043] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0044] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​not using relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0045] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0046] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0047] like Figures 1 to 6 As shown, this embodiment provides a pressure testing structure, which includes a base 100, a pressure head assembly 200, and a first elastic member 300. The base 100 has a flow channel inside. The pressure head assembly 200 includes a mounting portion 211, a pressure bearing portion 221, and a heating element 230. The pressure bearing portion 221 is located on the side of the mounting portion 211 away from the base 100. The heating element 230 is fixed relative to the mounting portion 211 and is configured to generate heat to heat the chip. The first elastic member 300 is disposed between the base 100 and the pressure head assembly 200, and together with the base 100 and the mounting portion 211, forms a sealed cavity 400. The sealed cavity 400 contains liquid metal, and the top surface of the liquid metal is in contact with the base 100. The flow channel is connected to an external cooling device to transfer heat away from the pressure testing structure to reduce the chip temperature. The liquid metal can be a gallium-based alloy or an indium-based alloy. Among them, the melting point of gallium-based alloys is about 15℃, and the thermal conductivity is about 30W / (m·K).

[0048] The above configuration allows the pressure head assembly 200 to shift relative to the base 100, ensuring good contact between the pressure section 221 and the chip 1000. Furthermore, after the first elastic element 300 deforms, the morphology of the liquid metal within the sealed cavity 400 changes accordingly. The arrangement of the top surface of the liquid metal contacting the base 100 allows heat from the pressure section 221 to enter the liquid metal through its bottom and then be transferred to the base 100 through its top, achieving better heat transfer and reducing the chip temperature. This meets the requirements of high-power chip 1000 testing due to its high heat generation. Heat is effectively transferred to the flow channels of the base 100, thus cooling the chip 1000. Combined with the heating element 230, this meets the temperature requirements for testing high-power chip 1000.

[0049] Combination Figure 3As shown, the base 100 has a first expansion groove 110, which communicates with and is located above the sealed cavity 400. When the first elastic member 300 is deformed, some liquid metal flows into the first expansion groove 110. In this embodiment, when the first elastic member 300 is not deformed, the opening of the first expansion groove 110 is located above the top surface of the liquid metal to facilitate effective heat transfer. After the sealed cavity 400 deforms, if the volume decreases, the first expansion groove 110 can accommodate the liquid metal, preventing excessive pressure inside the sealed cavity 400 due to liquid metal compression. It should be noted that the deformation process of the sealed cavity 400 is easier to achieve with compressed air than with compressed liquid metal, and can adapt to various shapes of the sealed cavity 400.

[0050] To accommodate the large deformation of the sealed cavity 400, in some embodiments, there are multiple first expansion grooves 110, which are spaced apart on the base 100. The arrangement of multiple first expansion grooves 110 can accommodate more liquid metal when the sealed cavity 400 undergoes large deformation.

[0051] The diameter of the first expansion groove 110 is smaller than its height. This shape limitation minimizes the area occupied on the lower surface of the base 100, ensuring effective heat transfer. For example, the diameter of the first expansion groove 110 is half its height.

[0052] For ease of assembly, in some embodiments, the base 100 has a liquid inlet and a vent, both of which are connected to the sealed cavity 400. The pressure testing structure also includes two sealing components 500, which are respectively inserted into and seal the liquid inlet and the vent. With the above structure, the structural components can be assembled first, and then liquid metal can be poured into the sealed cavity 400 through the liquid inlet. During this process, internal gas is discharged through the vent, and finally the liquid inlet and the vent are sealed by the two sealing components 500 respectively.

[0053] In some embodiments, the pressure head assembly 200 includes a bottom pressure head 210, with a mounting portion 211 formed on one side of the bottom pressure head 210 facing the base 100; a first elastic member 300 is cylindrical and surrounds the bottom pressure head 210 and the base 100. That is, the bottom pressure head 210 and the base 100 block the openings at both ends of the first elastic member 300. The above arrangement defines the shape of the sealed cavity 400, which has an overall columnar structure, simple structure, and is easy to process. Further, the mounting portion 211 of the bottom pressure head 210 is provided with a second expansion groove 212 with an opening facing the base 100, wherein the first elastic member 300 surrounds the outer periphery of the second expansion groove 212. The above arrangement further increases the volume of the sealed cavity 400 to accommodate greater deformation.

[0054] Specifically, the axial section of the first elastic element 300 includes a deformable portion 310 and connecting portions 320 located on both sides of the deformable portion 310. The upper connecting portion 320 is fitted with the base 100, and the lower connecting portion 320 is fitted with the bottom pressure head 210. The two connecting portions 320 move relative to each other through the deformable portion 310. Deformation is achieved through the deformable portion 310, and the connecting portions 320 are connected to the base 100 and the bottom pressure head 210, which facilitates assembly. At the same time, the fitting method helps to ensure the sealing of the sealed cavity 400.

[0055] To facilitate deformation, further, combined with Figure 4 As shown, the deformable portion 310 is V-shaped, with its opening facing the center of the sealed cavity 400. This arrangement allows the upper and lower sidewalls of the deformable portion 310 to easily bend and deform at the corners; simultaneously, the orientation of the opening helps to increase the volume of the sealed cavity 400, allowing it to hold more liquid metal, ensuring heat transfer while accommodating greater deformation. In other embodiments, the deformable portion 310 can also be wavy, extending vertically as a whole. It should be noted that the first elastic element 300 is made of an elastic material. Preferably, the first elastic element 300 is made of carbon spring steel, alloy spring steel, or stainless steel.

[0056] To avoid a large angular offset between the pressure head assembly 200 and the base 100, in some embodiments, combined with Figure 5 As shown, the pressure head assembly 200 also includes a guide member 600. The base 100 has a guide hole 120, and the guide member 600 is located in the guide hole 120 and connected to the bottom pressure head 210. The diameter of the guide hole 120 is slightly larger than the diameter of the guide member 600. The pressure testing structure also includes a second elastic member 610, which is sandwiched between the base 100 and the bottom pressure head 210. The second elastic member 610 provides elastic force to the bottom pressure head 210, preventing excessive force on the chip 1000; simultaneously, the bottom pressure head 210 can return to its original position relative to the base 100 when not subjected to other external forces.

[0057] In some embodiments, combined with Figure 5 and Figure 6As shown, the pressure head assembly 200 also includes an end pressure head 220, which is located on the side of the bottom pressure head 210 away from the base 100. A heating element 230 is located between the bottom pressure head 210 and the end pressure head 220. A pressure bearing portion 221 is formed on the side of the end pressure head 220 away from the bottom pressure head 210. This arrangement protects the heating element 230; simultaneously, heat is transferred to the chip 1000 through the end pressure head 220, resulting in more uniform heating of the chip 1000. The pressure head assembly 200 also includes a temperature sensor 240. The end pressure head 220 has a mounting hole, and the temperature sensor 240 is disposed in the mounting hole. The temperature sensor 240 is communicatively connected to the heating element 230 and is used to monitor the temperature of the chip 1000 in real time, thereby controlling the heat output of the heating element 230. The heating element 230 can be a heating wire.

[0058] During testing, a chip 1000 often has multiple test areas. To improve testing efficiency, in some embodiments, the pressure testing structure has several pressure head assemblies 200 and several first elastic members 300. The pressure head assemblies 200 are arranged at intervals on the base 100; the several first elastic members 300 are arranged in a one-to-one correspondence with the several pressure head assemblies 200. This arrangement allows multiple pressure head assemblies 200 to simultaneously press multiple test areas of the chip 1000, and each pressure head assembly 200 is independent of the others and does not affect them, thus improving testing efficiency and accuracy.

[0059] In other embodiments, a cooling element 130 is mounted on the upper side of the base 100, and a flow channel is disposed in the cooling element 130. The cooling element 130 is in contact with the upper wall of the base 100 to ensure effective heat transfer.

[0060] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A pressure testing structure, characterized in that, include: The base (100) has a flow channel inside; The pressure head assembly (200) includes a mounting portion (211), a ballast portion (221), and a heating element (230). The ballast portion (221) is located on the side of the mounting portion (211) away from the base (100). The heating element (230) is fixed relative to the mounting portion (211) and is configured to generate heat for testing. A first elastic element (300) is disposed between the base (100) and the pressure head assembly (200), and together with the base (100) and the mounting part (211), forms a sealed cavity (400). The sealed cavity (400) contains liquid metal, and the top surface of the liquid metal is in contact with the base (100).

2. The pressure testing structure according to claim 1, characterized in that, The base (100) has a first expansion groove (110), which is connected to the sealed cavity (400) and located above the sealed cavity (400). When the first elastic member (300) is deformed, a portion of the liquid metal flows into the first expansion groove (110).

3. The pressure testing structure according to claim 2, characterized in that, The first expansion slot (110) has a plurality of slots, and the plurality of first expansion slots (110) are arranged at intervals on the base (100); and / or, The diameter of the first expansion groove (110) is smaller than the height of the first expansion groove (110).

4. The pressure testing structure according to claim 1, characterized in that, The pressure head assembly (200) includes a bottom pressure head (210), and the mounting portion (211) is formed on one side of the bottom pressure head (210) facing the base (100); the first elastic member (300) is cylindrical and is disposed between the bottom pressure head (210) and the base (100).

5. The pressure testing structure according to claim 4, characterized in that, The axial section of the first elastic member (300) includes a deformable part (310) and connecting parts (320) located on both sides of the deformable part (310). The two connecting parts (320) are respectively fitted with the base (100) and the bottom pressure head (210), and the two connecting parts (320) move relative to each other through the deformable part (310).

6. The pressure testing structure according to claim 5, characterized in that, The deformable part (310) is V-shaped and the opening faces the center of the sealed cavity (400).

7. The pressure testing structure according to any one of claims 4-6, characterized in that, The pressure head assembly (200) further includes a guide (600), the base (100) has a guide hole (120), the guide (600) is located in the guide hole (120) and connected to the bottom pressure head (210); and / or, The pressure testing structure further includes a second elastic element (610), which is sandwiched between the base (100) and the bottom pressure head (210).

8. The pressure testing structure according to claim 7, characterized in that, The pressure head assembly (200) further includes an end pressure head (220), which is located on the side of the bottom pressure head (210) away from the base (100). The heating element (230) is located between the bottom pressure head (210) and the end pressure head (220). The side of the end pressure head (220) away from the bottom pressure head (210) forms the ballast portion (221).

9. The pressure testing structure according to any one of claims 1-6, characterized in that, The base (100) has a liquid inlet and an air outlet, both of which are connected to the sealed cavity (400). The pressure testing structure also includes two sealing components (500), which are respectively inserted into and seal the liquid inlet and the air outlet.

10. The pressure testing structure according to any one of claims 1-6, characterized in that, The pressure testing structure has a plurality of pressure head assemblies (200) and a plurality of first elastic elements (300), with the plurality of pressure head assemblies (200) arranged at intervals on the base (100); the plurality of first elastic elements (300) are arranged in a one-to-one correspondence with the plurality of pressure head assemblies (200).

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