Side ultrasonic fingerprint sensor bonding structure, fingerprint module and electronic equipment

Abstract

The embodiment of the utility model provides a side ultrasonic fingerprint sensor bonding structure, a fingerprint module and electronic equipment. The bonding structure is used for bonding the side ultrasonic fingerprint sensor to a side frame of the electronic equipment, and the sound velocity of the bonding structure ranges from 1.6 microns / ns to 2.8 microns / ns. According to the side ultrasonic fingerprint sensor bonding structure provided by the embodiment of the invention, the side ultrasonic fingerprint sensor is bonded to the side frame of the electronic equipment, so that the use effect of the side ultrasonic fingerprint sensor can be improved.

Description

Technical Field

[0001] This application relates to the field of ultrasonic fingerprint technology, and in particular to a side ultrasonic fingerprint sensor bonding structure, fingerprint module, and electronic device. Background Technology

[0002] Currently, side-mounted fingerprint detection technology is increasingly being used, for example, by employing side-mounted fingerprint sensors. Among related technologies, side-mounted capacitive fingerprint sensors are commonly used. However, side-mounted capacitive fingerprint sensors have drawbacks, leading to the development of side-mounted ultrasonic fingerprint sensors, which offer the possibility of side-mounted ultrasonic fingerprint detection in electronic devices. However, side-mounted ultrasonic fingerprint sensors typically need to be fixed to the side frame of the electronic device and use ultrasonic signals for fingerprint detection. The stacked structure through which the ultrasonic signal is transmitted has a significant impact on fingerprint detection. Therefore, to improve the detection performance of side-mounted ultrasonic fingerprint detection, it is necessary to improve the fixing structure between the side-mounted ultrasonic fingerprint sensor and the side frame. Utility Model Content

[0003] This application provides a side-mounted ultrasonic fingerprint sensor bonding structure, a fingerprint module, and an electronic device.

[0004] According to a first aspect of the embodiments of this application, a side ultrasonic fingerprint sensor bonding structure is provided, characterized in that the bonding structure is used to bond the side ultrasonic fingerprint sensor to the side frame of an electronic device, and the sound velocity range of the bonding structure is 1.6um / ns to 2.8um / ns.

[0005] In some optional embodiments, the adhesive structure includes a first adhesive layer, a support layer, and a second adhesive layer, wherein the first adhesive layer and the second adhesive layer are located on opposite sides of the support layer in the thickness direction.

[0006] In some optional embodiments, the adhesive structure satisfies at least one of the following conditions:

[0007] The sound velocity range of the first adhesive layer is 2.3 μm / ns to 2.8 μm / ns;

[0008] The sound velocity range of the second adhesive layer is 2.3 μm / ns to 2.8 μm / ns;

[0009] The sound velocity range of the support layer is 2.0 μm / ns to 2.7 μm / ns;

[0010] The thickness of the first adhesive layer ranges from 15µm to 40µm;

[0011] The thickness of the second adhesive layer ranges from 15µm to 40µm;

[0012] The total thickness of the first adhesive layer and the second adhesive layer ranges from 30 μm to 70 μm;

[0013] The thickness of both the first adhesive layer and the second adhesive layer is 20 μm;

[0014] The support layer is a non-metallic support layer;

[0015] The thickness of the support layer ranges from 45µm to 150µm;

[0016] The thickness of the support layer is 60 μm;

[0017] The first adhesive layer includes at least one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the first adhesive layer is a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive layer;

[0018] The second adhesive layer includes at least one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the second adhesive layer is a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive layer.

[0019] In some optional embodiments, the support layer is a PET support layer with a thickness ranging from 45um to 75um; or, the support layer is a PI support layer with a thickness ranging from 50um to 150um.

[0020] In some optional embodiments, the first adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer, the first sub-adhesive layer and the second sub-adhesive layer being spaced apart on the same side in the thickness direction of the support layer; the first sub-adhesive layer is used to bond to the ultrasonic fingerprint chip in the side ultrasonic fingerprint sensor, and the second sub-adhesive layer is used to bond to the circuit board in the side ultrasonic fingerprint sensor.

[0021] In some optional embodiments, the adhesive structure is a single adhesive layer, and the single adhesive layer is one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the single adhesive layer is a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive.

[0022] In some optional embodiments, the sound velocity of the monolayer adhesive layer ranges from 2.3 μm / ns to 2.8 μm / ns.

[0023] In some optional embodiments, the single-layer adhesive layer is a DAF adhesive layer with a thickness ranging from 15 μm to 40 μm; or, the single-layer adhesive layer is a UV adhesive layer with a thickness ranging from 75 μm to 105 μm.

[0024] In some optional embodiments, the sound velocity of the monolayer adhesive layer ranges from 1.6 μm / ns to 2.0 μm / ns.

[0025] In some optional embodiments, the single-layer adhesive layer is an OCA adhesive layer with a thickness ranging from 15µm to 40µm; or, the single-layer adhesive layer is a silicone adhesive layer with a thickness ranging from 75µm to 105µm.

[0026] According to a second aspect of the embodiments of this application, an ultrasonic fingerprint module is provided, comprising: a side ultrasonic fingerprint sensor, and an adhesive structure as described in any one of the first aspects, wherein the side ultrasonic fingerprint sensor is adhered to the adhesive structure; the adhesive structure is further configured to adhere to a side frame of an electronic device to adhere the side ultrasonic fingerprint sensor to the side frame of the electronic device.

[0027] In some optional embodiments, the side ultrasonic fingerprint sensor includes: an ultrasonic fingerprint chip and a circuit board; the ultrasonic fingerprint chip and the circuit board are electrically connected through a conductive adhesive layer, and the ultrasonic fingerprint chip is bonded to the adhesive structure; or, the ultrasonic fingerprint chip and the circuit board are electrically connected through bonding wires, and both the ultrasonic fingerprint chip and the circuit board are bonded to the adhesive structure.

[0028] According to a third aspect of the embodiments of this application, an electronic device is provided, the electronic device comprising: a side frame, a side ultrasonic fingerprint sensor, and an adhesive structure as described in any one of the first aspects, wherein the side ultrasonic fingerprint sensor is adhered to the side frame through the adhesive structure; or, the electronic device comprising: a side frame, and a side ultrasonic fingerprint module as described in any one of the second aspects, wherein the side ultrasonic fingerprint sensor in the side ultrasonic fingerprint module is adhered to the side frame through the adhesive structure in the side ultrasonic fingerprint module.

[0029] The side ultrasonic fingerprint sensor bonding structure in this embodiment has a sound velocity range of 1.6 μm / ns to 2.8 μm / ns. Using such a bonding structure to bond the side ultrasonic fingerprint sensor to the side frame of the electronic device results in good interface acoustic impedance matching. The ultrasonic signal transmission through this bonding structure and the side frame has good signal penetration performance and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance. Therefore, using the bonding structure in this application as the fixing structure between the side ultrasonic fingerprint sensor and the side frame can better meet the requirements of side ultrasonic fingerprint detection and improve the performance of the side ultrasonic fingerprint sensor. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0031] Figure 1A The diagram shows some examples of adhesive structures in this application, as well as schematic diagrams of the adhesive side ultrasonic fingerprint sensor and side frame thereon.

[0032] Figure 1B The following are schematic diagrams illustrating adhesive structures of other examples in this application, as well as the adhesive side ultrasonic fingerprint sensor and side frame thereon.

[0033] Figure 1C The following are schematic diagrams illustrating adhesive structures of some examples in this application, as well as the adhesive side ultrasonic fingerprint sensor and side frame thereon.

[0034] Figure 1D The following are schematic diagrams illustrating adhesive structures of some examples in this application, as well as the adhesive side ultrasonic fingerprint sensor and side frame thereon.

[0035] Figure 1E The following are schematic diagrams illustrating adhesive structures of some examples in this application, as well as the adhesive side ultrasonic fingerprint sensor and side frame thereon.

[0036] Figure 2A A schematic diagram of a side ultrasonic fingerprint sensing module, representing some examples of those in this application, is shown.

[0037] Figure 2B Schematic diagrams of side ultrasonic fingerprint sensing modules, representing some other examples of those in this application, are shown.

[0038] Figure 2C A schematic diagram of a side ultrasonic fingerprint sensing module, representing some of the examples in this application, is shown.

[0039] Figure 2D Schematic diagrams of side ultrasonic fingerprint sensing modules, which are some of the examples in this application, are shown.

[0040] Figure 2E Schematic diagrams of side ultrasonic fingerprint sensing modules, which are some of the examples in this application, are shown.

[0041] Figure 3A Schematic diagrams of some examples of electronic devices in this application are shown.

[0042] Figure 3B Schematic diagrams of other examples of electronic devices in this application are shown.

[0043] Figure 3C Schematic diagrams of some of the electronic devices described in this application are shown.

[0044] Figure 3D Schematic diagrams of some of the electronic devices described in this application are shown.

[0045] Figure 3E Schematic diagrams of some of the electronic devices described in this application are shown.

[0046] Explanation of reference numerals in the attached figures:

[0047] 100, Adhesive structure; 110, First adhesive layer; 111, First sub-adhesive layer; 112, Second sub-adhesive layer; 120, Second adhesive layer; 130, Support layer; 200, Side ultrasonic fingerprint sensor; 2100, Substrate; 210, Ultrasonic fingerprint chip; 2101, First electrode; 2102, Second electrode; 2103, Acoustic layer; 220, Circuit board; 230, Conductive adhesive layer; 240, Bonding wire; 250, Side ultrasonic fingerprint module; 300, Electronic device; 310, Side frame; H1, Thickness of support layer; H2, Thickness of second adhesive layer; H3, Thickness of first adhesive layer; H, Thickness of single-layer adhesive bonding structure. Detailed Implementation

[0048] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0049] Currently, side-mounted fingerprint detection technology is increasingly being used, for example, by employing side-mounted fingerprint sensors. Among related technologies, side-mounted fingerprint sensors typically employ capacitive fingerprint sensors. However, capacitive fingerprint sensors have drawbacks. For instance, they rely on capacitance detection, utilizing the difference in capacitance between the fingerprint ridges and valleys in the detection area. This requires the sensor to be as close as possible to the finger surface, generally within 200µm. To ensure the mechanical reliability of electronic devices (including but not limited to mobile phones), this is usually achieved by creating openings in the side bezel.

[0050] Side-mounted capacitive fingerprint sensors have drawbacks, leading to the development of side-mounted ultrasonic fingerprint sensors, which enable ultrasonic fingerprint detection on the side of electronic devices. Side-mounted ultrasonic fingerprint sensors use ultrasonic signals for fingerprint detection. Ultrasonic signals have high penetrability, so the distance requirement to the finger surface is not usually too stringent (1mm is generally considered acceptable). They also eliminate the need for openings in the side bezel of electronic devices, balancing mechanical reliability and waterproofing, thus possessing significant market value.

[0051] However, since side-mounted ultrasonic fingerprint sensors are typically fixed to the side frame of electronic devices and use ultrasonic signals for fingerprint detection, the unique diffraction effect and interface acoustic impedance matching characteristics of ultrasonic signals cause the stacked structure through which the ultrasonic signal is transmitted to have a significant impact on fingerprint detection (e.g., affecting fingerprint clarity and accuracy). Therefore, in order to improve the detection effect of side-mounted ultrasonic fingerprint sensors, it is necessary to improve the fixing structure between the side-mounted ultrasonic fingerprint sensor and the side frame.

[0052] According to a first aspect of the embodiments of this application, referring to... Figure 1A , Figure 1B , Figure 1C , Figure 1D , Figure 1E As shown, this application provides a side ultrasonic fingerprint sensor bonding structure 100, which is used to bond a side ultrasonic fingerprint sensor 200 to the side frame 310 of an electronic device 300. The sound velocity range of the bonding structure 100 is 1.6 μm / ns to 2.8 μm / ns.

[0053] It should be understood that the side ultrasonic fingerprint sensor bonding structure 100 in this embodiment has a sound velocity range of 1.6 μm / ns to 2.8 μm / ns. By using such a bonding structure 100 to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300, the interface acoustic impedance matching is good, the ultrasonic signal transmission through the bonding structure and the side frame has good signal penetration performance and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance. Therefore, using the bonding structure in this application as the fixing structure between the side ultrasonic fingerprint sensor and the side frame can better meet the requirements of side ultrasonic fingerprint detection and improve the use effect of the side ultrasonic fingerprint sensor.

[0054] In this application, the side ultrasonic fingerprint sensor bonding structure 100 (hereinafter referred to as bonding structure 100) can be used for bonding between the side ultrasonic fingerprint sensor 200 and the side frame 310 of the electronic device 300. For example, the bonding structure 100 may include a first side and a second side opposite to each other along the thickness direction. The side ultrasonic fingerprint sensor 200 can be bonded to the first side of the bonding structure 100 and bonded to the side frame 310 through the second side of the bonding structure 100.

[0055] It is understood that since the adhesive structure 100 in this application can perform interface acoustic impedance matching well, it can also be regarded as a matching layer between the side ultrasonic fingerprint sensor 200 and the side frame 310.

[0056] The side-mounted ultrasonic fingerprint sensor 200 can adopt any structure, and this application does not impose specific limitations. Optionally, such as Figures 1A to 1E As shown, the side-mounted ultrasonic fingerprint sensor 200 may include an ultrasonic fingerprint chip 210 and a circuit board 220, with the ultrasonic fingerprint chip 210 and the circuit board 220 electrically connected. The ultrasonic fingerprint chip 210 and the circuit board 220 may be electrically connected in any feasible manner.

[0057] In some alternative embodiments, refer to Figure 1A and Figure 1D As shown, the ultrasonic fingerprint chip 210 and the circuit board 220 can be electrically connected through the conductive adhesive layer 230. Any conductive adhesive layer can be used; for example, the conductive adhesive layer 230 can be at least one of, but not limited to, ACF (Anisotropic Conductive Film), ACA (Anisotropic Conductive Adhesive), silver powder-filled conductive adhesive, and copper powder-filled conductive adhesive. In some examples, an ACF conductive adhesive layer can be selected. Optionally, when the ultrasonic fingerprint chip 210 and the circuit board 220 are electrically connected through the conductive adhesive layer 230, the ultrasonic fingerprint chip 210 can be adhered to the adhesive structure 100, allowing the side ultrasonic fingerprint sensor 200 to be adhered to the side frame 310 of the electronic device 300.

[0058] In some alternative embodiments, refer to Figure 1B , Figure 1C and Figure 1EAs shown, the ultrasonic fingerprint chip 210 and the circuit board 220 can be electrically connected via bonding wire 240. Optionally, when the ultrasonic fingerprint chip 210 and the circuit board 220 are electrically connected via bonding wire 240, both the ultrasonic fingerprint chip 210 and the circuit board 220 can be bonded to the bonding structure 100, allowing the side ultrasonic fingerprint sensor 200 to be bonded to the side frame 310 of the electronic device 300. It should be understood that by bonding both the ultrasonic fingerprint chip 210 and the circuit board 220 to the bonding structure 100, both the ultrasonic fingerprint chip 210 and the circuit board 220 can be bonded to the side frame 310 of the electronic device 300, thereby better ensuring the bonding stability of the ultrasonic fingerprint sensor 200 and the stability of the electrical connection of the bonding wire 240. The bonding wire 240 can be implemented as any feasible electrical connection wire, and no specific limitation is made here.

[0059] Alternatively, in other embodiments, when using bonding wire 240 to achieve electrical connection, the ultrasonic fingerprint chip 210 can be bonded to the bonding structure 100, while the circuit board 220 is not bonded to the bonding structure 100 and is fixed by other structures, as long as the requirements can be met.

[0060] It is understood that the conductive adhesive layer 230 or the bonding wire 240 can be achieved through different electrical connection processes, and any choice can be made as needed in this application.

[0061] The ultrasonic fingerprint chip 210 in this application can adopt any structure, and no limitations are imposed here. In some optional embodiments, such as Figures 1A to 1E As shown, the ultrasonic fingerprint chip 210 may include a first electrode 2101, an acoustic layer 2103, and a second electrode 2102. The ultrasonic fingerprint chip 210 may also include a substrate 2100, on which the first electrode 2101, acoustic layer 2103, and second electrode 2102 may be stacked, and various circuit structures of the ultrasonic fingerprint chip 210 may be arranged; for example, it may be a silicon substrate or a glass substrate. The acoustic layer 2103 can be used to transmit and receive ultrasonic signals. One of the first electrode 2101 and the second electrode 2102 may be a cathode and the other an anode, one may be a bottom electrode and the other a top electrode, for example... Figures 1A to 1EIn this embodiment, the first electrode 2101 can be used as the cathode and the second electrode 2102 as the anode, or the first electrode 2101 can be used as the bottom electrode and the second electrode 2102 as the top electrode. Optionally, the second electrode 2102 can be used to be excited by an applied excitation signal to excite the acoustic layer 2103 to emit ultrasonic signals, and the first electrode 2101 can be used to receive the ultrasonic detection signal generated between the second electrode 2102 and the first electrode 2101 when the returned ultrasonic signal acts on the acoustic layer 2103. Optionally, the acoustic layer can be a piezoelectric material layer, which generates ultrasonic signal emission and reception based on the piezoelectric effect (the piezoelectric material layer may include, but is not limited to, at least one of PVDF (polyvinylidene difluoride), lead zirconate titanate, and lithium niobate; the PVDF material may include PVDF, PVDF copolymers, etc.).

[0062] The circuit board 220 in this application can be any type of circuit board. For example, the circuit board 220 can be an FPC (Flexible Printed Circuit) or a PCB (Printed Circuit Board). The circuit board 220 can be electrically connected to an external circuit (such as a controller in an electronic device) for transmitting power and signals to the ultrasonic fingerprint chip 210, etc. For example, in some optional embodiments, the ultrasonic fingerprint chip 210 can send the received ultrasonic detection signal to the controller in the electronic device through the circuit board 220, so that the controller can generate a fingerprint image based on the ultrasonic detection signal for fingerprint detection; in other optional embodiments, the ultrasonic fingerprint chip 210 can process the received ultrasonic detection signal to obtain a fingerprint image, and then send the fingerprint image to the controller in the electronic device, so that the controller can directly perform fingerprint detection based on the fingerprint image. For example, an external circuit (such as a controller in an electronic device) can send control signals, configuration signals, etc. to the ultrasonic fingerprint chip 210 through the circuit board 220. For example, the circuit board 220 can obtain power from an external circuit. The circuit board 220 can be electrically connected to the ultrasonic fingerprint chip 210 to provide power to the ultrasonic fingerprint chip 210 so that the ultrasonic fingerprint chip 210 can work normally. Based on the obtained power, the ultrasonic fingerprint chip 210 can apply an excitation signal (which can be a voltage signal) to the second electrode 2102 so that the acoustic layer 2103 can emit or receive ultrasonic signals to facilitate fingerprint detection.

[0063] It should be understood that the principle and optional structure of the side ultrasonic fingerprint sensor 200 can also be understood according to relevant technologies, which will not be elaborated here. This solution can be implemented using a side ultrasonic fingerprint sensor of any structure.

[0064] Optionally, the electronic device 300 can be a terminal device, such as, but not limited to, a mobile phone, a tablet, etc., or other devices besides terminal devices. The side frame 310 of the electronic device 300 can be made of any material, such as a metal side frame, including but not limited to a frame of a single metal, a side frame of multiple metal layers, or an alloy side frame. The specific material can be selected as needed. For example, taking an alloy side frame as an example, it can be an aluminum alloy side frame or a titanium alloy side frame. Such a side frame 310 helps to ensure the structural stability of the electronic device 300. Alternatively, in other embodiments, the side frame 310 of the electronic device 300 can also be made of other non-metallic materials, as long as they can meet the usage requirements of the electronic device.

[0065] In this embodiment, the sound velocity range of the adhesive structure 100 can refer to the speed range of ultrasonic wave transmission within the adhesive structure 100. The sound velocity range of the adhesive structure 100 provided in this embodiment is 1.6 μm / ns to 2.8 μm / ns. Using an adhesive structure 100 within this range, the side-mounted ultrasonic fingerprint sensor 200 is bonded to the side frame 310 of the electronic device 300. This results in good interface acoustic impedance matching, good signal penetration of the ultrasonic signal through the adhesive structure and the side frame, and low signal attenuation, thereby effectively improving the side-mounted ultrasonic fingerprint detection performance.

[0066] It should be understood that for some side frames 310 that are metal side frames (such as alloy side frames), the bonding structure 100 of this solution is more suitable for bonding the side ultrasonic fingerprint sensor 200 to the side frame 310. This is because the sound velocity range of metal side frames is generally about 5um / ns, which is relatively large and the acoustic impedance is also relatively large. The bonding structure 100 of the sound velocity range in this application can help to achieve interface acoustic impedance matching.

[0067] Within the aforementioned selectable sound velocity range (i.e., 1.6 μm / ns to 2.8 μm / ns), the sound velocity of the adhesive structure 100 can be selected as needed. For example, in some examples, the sound velocity of the adhesive structure 100 can be selected as 1.6 μm / ns, 1.7 μm / ns, 1.8 μm / ns, 1.9 μm / ns, 2.0 μm / ns, 2.1 μm / ns, 2.2 μm / ns, 2.3 μm / ns, 2.4 μm / ns, 2.5 μm / ns, 2.6 μm / ns, 2.7 μm / ns, 2.8 μm / ns, etc.

[0068] The adhesive structure 100 in this application can be a single layer or multiple layers of adhesive, which can be selected as needed, and there is no limitation here.

[0069] The adhesive layer in the bonding structure 100 of this application can be made of any material, as long as it meets the above-mentioned sound velocity range requirements. For example, in some optional embodiments, the adhesive layer can be at least one of DAF (Die Attach Film), UV (Ultraviolet Rays) adhesive (also known as UV-curing adhesive, shadowless adhesive, etc.), OCA (Optically Clear Adhesive), and silicone adhesive, or a mixture of at least two of DAF, UV, OCA, and silicone adhesives.

[0070] It should be understood that the adhesive structure 100 in this application uses the above-mentioned type of adhesive layer, which can effectively achieve bonding and can easily meet the sound velocity range requirements of this application (i.e., 1.6um / ns to 2.8um / ns). Thus, by using the adhesive structure 100 in this application to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300, the interface acoustic impedance matching degree is good, the ultrasonic signal transmission through the adhesive structure and the side frame has good signal penetration performance and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance.

[0071] The thickness of the adhesive structure 100 in this application can be designed according to actual needs, and is not limited here.

[0072] The following describes some optional side ultrasonic fingerprint sensor bonding structures 100 in this application.

[0073] In some alternative embodiments, refer to Figure 1A , Figure 1B , Figure 1C As shown, the adhesive structure 100 may include a first adhesive layer 110, a support layer 130, and a second adhesive layer 120, with the first adhesive layer 110 and the second adhesive layer 120 located on both sides of the support layer 130 in the thickness direction.

[0074] The adhesive structure 100 that can be used in this application includes a first adhesive layer 110, a support layer 130, and a second adhesive layer 120. This allows the adhesive structure 100 to achieve double-sided bonding through the first adhesive layer 110 and the second adhesive layer 120 located on both sides of the support layer 130 in the thickness direction. The support layer 130 can also support the adhesive structure 100, thereby improving its strength. Furthermore, the support layer 130 can reinforce the side ultrasonic fingerprint sensor 200, improving the structural stability of the adhesive structure 100 in bonding the side ultrasonic fingerprint sensor 200 to the side frame 310.

[0075] The sound velocity range of the adhesive structure 100, the first adhesive layer 110, the support layer 130 and the second adhesive layer 120 in this application all meet the requirement of 1.6 μm / ns to 2.8 μm / ns, and can be selected as needed.

[0076] Within the aforementioned selectable range (i.e., 1.6 μm / ns to 2.8 μm / ns), the sound velocity range of the support layer 130 can be selected as needed. For example, in some optional embodiments, the sound velocity range of the support layer 130 can be 2.0 μm / ns to 2.7 μm / ns. Using an adhesive structure 100 with such a preferred sound velocity range for the support layer 130, the side ultrasonic fingerprint sensor is bonded to the side frame of the electronic device. This results in good interface acoustic impedance matching, good signal penetration performance of the ultrasonic signal transmitted through the adhesive structure and the side frame, and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance. Therefore, using the adhesive structure in this application as the fixing structure between the side ultrasonic fingerprint sensor and the side frame can better meet the requirements of side ultrasonic fingerprint detection.

[0077] Within the aforementioned preferred sound velocity range (i.e., 2.0 μm / ns to 2.7 μm / ns), the sound velocity of the support layer 130 can be selected as needed. For example, in some examples, the sound velocity of the support layer 130 can be selected as 2.0 μm / ns, 2.05 μm / ns, 2.1 μm / ns, 2.15 μm / ns, 2.2 μm / ns, 2.25 μm / ns, 2.3 μm / ns, 2.35 μm / ns, 2.4 μm / ns, 2.45 μm / ns, 2.5 μm / ns, 2.55 μm / ns, 2.6 μm / ns, 2.65 μm / ns, 2.7 μm / ns, etc.

[0078] The support structure 130 can be implemented as a support layer of any material. For example, in some optional embodiments, a non-metallic support layer can be selected. The non-metallic support layer can include, but is not limited to, any suitable solid organic support layer (such as organic polymer), solid inorganic support layer, non-metallic elemental support layer, etc. Compared with a metallic support layer, the use of a non-metallic support layer in this application is more conducive to achieving interface acoustic impedance matching.

[0079] Understandably, copper foil adhesive is typically used for under-display ultrasonic fingerprint sensors. However, due to significant differences between the side frame 310 (such as an alloy side frame or other metal side frame) and the screen, the copper foil adhesive may not perform well when used for side frame bonding of the ultrasonic fingerprint sensor 200. One reason for this is that when using an alloy side frame, the sound velocity of the side frame 310 is much higher than that of the screen (for example, the equivalent sound velocity of some screens is about 2um / ns to 3um / ns, but the sound velocity of the alloy side frame is basically 5um / ns). In addition, the internal grains are coarse. If the traditional copper foil adhesive is used for under-display bonding, the signal penetration performance of the ultrasonic signal in the stacked layers of the side frame 310 may be insufficient, resulting in significant signal attenuation, which is not conducive to achieving interface acoustic impedance matching. The bonding structure 100 in this solution uses a non-metallic support layer and its sound velocity range is within 1.6um / ns to 2.7um / ns (preferably 2.0um / ns to 2.7um / ns). This avoids the problems associated with copper foil adhesive and facilitates interface acoustic impedance matching. The better the interface acoustic impedance matching, the better the signal penetration performance of the ultrasonic signal transmitted through the bonding structure and the side frame, and the lower the signal attenuation. This effectively improves the performance of side ultrasonic fingerprint detection.

[0080] The thickness of the support layer 130 can be selected as needed. In some optional embodiments, the thickness of the support layer 130 can range from 45µm to 150µm. Within this optional range, the thickness of the support layer 130 is neither too thin nor too thick, providing a good support effect and ensuring that the adhesive structure 100 is neither too thin nor too thick, thus guaranteeing the strength of the adhesive structure 100. The support layer 130 can effectively reinforce the side ultrasonic fingerprint sensor 200, improve the structural stability of the adhesive structure 100 in bonding the side ultrasonic fingerprint sensor 200 to the side frame 310, and enable the adhesive structure 100 to achieve a better interface acoustic impedance matching effect. This allows for better signal penetration and lower signal attenuation of the ultrasonic signal transmitted through the adhesive structure and side frame, thereby effectively improving the side ultrasonic fingerprint detection performance and better meeting the requirements of side ultrasonic fingerprint detection. For example... Figure 1A , Figure 1B , Figure 1CAs shown, H1 indicates the thickness of the support layer 130. Within the aforementioned thickness range of the support layer 130 (i.e., 45um to 150um), the thickness H1 of the support layer 130 can be selected as needed. For example, in some examples, the thickness of the support layer 130 can be selected as 45mm, 50um, 55um, 60um, 65um, 70um, 75um, 80um, 85um, 90um, 95um, 100mm, 105um, 110um, 115um, 120um, 125um, 130um, 135um, 140um, 145um, 150um, etc.

[0081] In an optional example, the thickness of the support layer 130 can be 60um, which can well satisfy the requirements of both thinness and support.

[0082] In some examples, the support layer 130 can be a PET (Polyethylene terephthalate) support layer. That is, the support layer 130 can be made of PET material. PET support layers have advantages such as excellent environmental performance, wear and scratch resistance, strong corrosion resistance, good heat resistance, and high cost-effectiveness. They also provide good support. Furthermore, PET support layers can easily meet the sound velocity range requirements (i.e., 1.6 μm / ns to 2.8 μm / ns) and the preferred sound velocity range (i.e., 2.0 μm / ns to 2.7 μm / ns). This results in good interface acoustic impedance matching when the adhesive structure 100 made of PET support layer is used to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300. The ultrasonic signal transmission through this adhesive structure and the side frame has good signal penetration performance and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance and better meeting the needs of side ultrasonic fingerprint detection.

[0083] Optionally, when the support layer 130 is a PET support layer, its thickness can range from 45µm to 75µm, that is, 60±15µm. This selectable thickness range ensures that the PET support layer is neither too thick nor too thin, providing good support. It also ensures that the adhesive structure 100 is neither too thin nor too thick, guaranteeing its strength. The support layer 130 effectively reinforces the side-mounted ultrasonic fingerprint sensor 200, improving the structural stability of the adhesive structure 100 in bonding the side-mounted ultrasonic fingerprint sensor 200 to the side frame 310. Furthermore, it allows the adhesive structure 100 to achieve good interfacial acoustic impedance matching, resulting in better signal penetration and lower signal attenuation through the adhesive structure and side frame. This effectively improves the side-mounted ultrasonic fingerprint detection performance and better meets the requirements of side-mounted ultrasonic fingerprint detection. Within the aforementioned range of PET support layer thickness, the thickness of support layer 130 can be selected as needed. For example, in some examples, the thickness of the PET support layer can be selected as 45mm, 48um, 50um, 53um, 55um, 58um, 60um, 62um, 65um, 68um, 70um, 72um, 75um, etc.

[0084] In other examples, the support layer 130 can be a PI (Polyimide) support layer. That is, the support layer 130 can be made of PI material. The PI support layer has good high and low temperature resistance, electrical insulation properties, chemical resistance, and mechanical properties, and also has good support performance. In addition, the PI support layer can easily meet the sound velocity range requirements (i.e., 1.6 μm / ns to 2.8 μm / ns) and the preferred sound velocity range (i.e., 2.0 μm / ns to 2.7 μm / ns). This makes it possible to use a PET support layer to make an adhesive structure 100 to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300. The interface acoustic impedance matching is good, the ultrasonic signal transmission through the adhesive structure and the side frame has good signal penetration performance, and the signal attenuation is low. This can effectively improve the side ultrasonic fingerprint detection performance and better meet the requirements of side ultrasonic fingerprint detection.

[0085] Optionally, when the support layer 130 is a PI support layer, its thickness can range from 50µm to 150µm. This selectable thickness range ensures that the PI support layer is neither too thick nor too thin, providing good support. It also ensures that the adhesive structure 100 is neither too thin nor too thick, guaranteeing its strength and achieving good interfacial acoustic impedance matching. This support layer 130 effectively reinforces the side-mounted ultrasonic fingerprint sensor 200, improving the structural stability of the adhesive structure 100 in bonding the side-mounted ultrasonic fingerprint sensor 200 to the side frame 310. Furthermore, it achieves good interfacial acoustic impedance matching, resulting in better signal penetration and lower signal attenuation through the adhesive structure and side frame. This effectively improves the side-mounted ultrasonic fingerprint detection performance and better meets the requirements of side-mounted ultrasonic fingerprint detection. Within the aforementioned range of PI support layer thickness, the thickness of support layer 130 can be selected as needed. For example, in some examples, the thickness of the PI support layer can be selected as 50mm, 55um, 60um, 65um, 70um, 75um, 80um, 85um, 90um, 95um, 100um, 105mm, 110um, 115um, 120um, 125um, 130um, 135um, 140um, 145um, 150um, etc.

[0086] In this application, the first adhesive layer 110 and the second adhesive layer 120 can both be made of any suitable material, and the materials used for the two can be the same or different, depending on the need.

[0087] Optionally, the first adhesive layer 110 may include at least one of DAF (Die Attach Film) adhesive layer, UV (Ultraviolet Rays) adhesive layer (also known as UV curing adhesive, shadowless adhesive, etc.), OCA (Optically Clear Adhesive) adhesive layer, and silicone adhesive layer; or, the first adhesive layer 110 may be a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive.

[0088] It should be understood that the first adhesive layer 110 of the adhesive structure 100 in this application adopts the above-mentioned type of adhesive layer, which can effectively achieve bonding and can easily meet the sound velocity range requirements of this application (i.e., 1.6um / ns to 2.8um / ns). Thus, by using the adhesive structure 100 in this application to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300, the interface acoustic impedance matching degree is better, the ultrasonic signal transmission through the adhesive structure and the side frame has better signal penetration performance and lower signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance.

[0089] It is understandable that the first adhesive layer 110 can be a single layer of the above-mentioned adhesive layers or a multi-layered adhesive layer, depending on the requirements. The mixed adhesive layer can be a single-layer structure.

[0090] Optionally, the second adhesive layer 120 may include at least one of DAF (Die Attach Film), UV (Ultraviolet Rays) adhesive (also known as UV curing adhesive, shadowless adhesive, etc.), OCA (Optically Clear Adhesive) adhesive, and silicone adhesive, or the second adhesive layer 120 may be a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive.

[0091] It should be understood that the second adhesive layer 120 of the adhesive structure 100 in this application adopts the above-mentioned type of adhesive layer, which can effectively achieve bonding and can easily meet the sound velocity range requirements of this application (i.e., 1.6um / ns to 2.8um / ns). Thus, by using the adhesive structure 100 in this application to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300, the interface acoustic impedance matching degree is better, the ultrasonic signal transmission through the adhesive structure and the side frame has better signal penetration performance and lower signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance.

[0092] It is understandable that the second adhesive layer 120 can be a single layer of the above-mentioned adhesive layers or a multi-layered adhesive layer, depending on the requirements. The mixed adhesive layer can be a single-layer structure.

[0093] For example, in one example, the first adhesive layer 110 can be a DAF adhesive layer, and the second adhesive layer 120 can be a DAF adhesive layer; in another example, the first adhesive layer 110 can be a DAF adhesive layer, and the second adhesive layer 120 can be a UV adhesive layer; in yet another example, the first adhesive layer 110 can be a DAF adhesive layer, and the second adhesive layer 120 is a stack of DAF and UV adhesive layers; in yet another example, the first adhesive layer 110 can be a DAF adhesive layer, and the second adhesive layer 120 is a stack of DAF and UV adhesive layers; in yet another example, the first adhesive layer 110 can be a DAF adhesive layer, and the second adhesive layer 120 is a mixed adhesive layer of DAF and UV adhesive layers; in yet another example, the first adhesive layer 110 can be an OCA adhesive layer, and the second adhesive layer 120 can be a silicone adhesive layer. Other cases can be selected as needed, and will not be elaborated here.

[0094] In this application, the first adhesive layer 110 and the second adhesive layer 120 can both use any suitable sound velocity, and the sound velocities of the two can be the same or different, which can be selected as needed, and there is no restriction here.

[0095] In some optional embodiments, the sound velocity range of the first adhesive layer 110 can be 2.3 μm / ns to 2.8 μm / ns. It should be understood that the sound velocity range of the first adhesive layer 110 of the adhesive structure 100 in the embodiments of this application is 2.3 μm / ns to 2.8 μm / ns. By using such an adhesive structure 100 to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300, the interface acoustic impedance matching is good, the ultrasonic signal transmission through the adhesive structure and the side frame has good signal penetration performance and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance and better meeting the requirements of side ultrasonic fingerprint detection. Within the aforementioned selectable sound velocity range (i.e., 2.3 μm / ns to 2.8 μm / ns), the sound velocity of the adhesive structure 100 can be selected as needed. For example, in some examples, the sound velocity of the first adhesive layer 110 can be selected as 2.3 μm / ns, 2.35 μm / ns, 2.4 μm / ns, 2.45 μm / ns, 2.5 μm / ns, 2.55 μm / ns, 2.6 μm / ns, 2.65 μm / ns, 2.7 μm / ns, 2.75 μm / ns, 2.8 μm / ns, and so on.

[0096] Optionally, when the sound velocity range of the first adhesive layer 110 is 2.3 μm / ns to 2.8 μm / ns, the first adhesive layer 110 can be a DAF adhesive layer, a UV adhesive layer, a stack of UV adhesive layer and DAF adhesive layer, or a mixed adhesive layer of UV adhesive and DAF adhesive.

[0097] In some optional embodiments, the sound velocity range of the second adhesive layer 120 can be 2.3 μm / ns to 2.8 μm / ns.

[0098] In some optional embodiments, the sound velocity range of the second adhesive layer 120 can be 2.3 μm / ns to 2.8 μm / ns. It should be understood that the sound velocity range of the second adhesive layer 120 of the adhesive structure 100 in this embodiment is 2.3 μm / ns to 2.8 μm / ns. Using such an adhesive structure 100 to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300 results in good interface acoustic impedance matching. The ultrasonic signal transmission through this adhesive structure and the side frame exhibits good signal penetration performance and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance and better meeting the requirements of side ultrasonic fingerprint detection. Within the aforementioned selectable sound velocity range (i.e., 2.3 μm / ns to 2.8 μm / ns), the sound velocity of the adhesive structure 100 can be selected as needed. For example, in some examples, the sound velocity of the second adhesive layer 120 can be selected as 2.3 μm / ns, 2.35 μm / ns, 2.4 μm / ns, 2.45 μm / ns, 2.5 μm / ns, 2.55 μm / ns, 2.6 μm / ns, 2.65 μm / ns, 2.7 μm / ns, 2.75 μm / ns, 2.8 μm / ns, and so on.

[0099] Optionally, when the sound velocity range of the second adhesive layer 120 is 2.3 μm / ns to 2.8 μm / ns, the second adhesive layer 120 can be a DAF adhesive layer, a UV adhesive layer, a stack of UV adhesive layer and DAF adhesive layer, or a mixed adhesive layer of UV adhesive and DAF adhesive.

[0100] In some alternative embodiments, the sound velocity range of the first adhesive layer 110 can be 1.6 μm / ns to 2.0 μm / ns. Within this range, 1.6 μm / ns, 1.65 μm / ns, 1.7 μm / ns, 1.75 μm / ns, 1.8 μm / ns, 1.85 μm / ns, 1.9 μm / ns, 1.95 μm / ns, 2.0 μm / ns, etc., can be selected. Optionally, when the sound velocity range of the first adhesive layer 110 is 1.6 μm / ns to 2.0 μm / ns, the first adhesive layer 110 can be an OCA adhesive layer, a silicone adhesive layer, a stack of OCA adhesive layers and silicone adhesive layers, or a mixed adhesive layer of OCA adhesive and silicone.

[0101] In some alternative embodiments, the sound velocity range of the second adhesive layer 120 can be 1.6 μm / ns to 2.0 μm / ns. Within this range, 1.6 μm / ns, 1.65 μm / ns, 1.7 μm / ns, 1.75 μm / ns, 1.8 μm / ns, 1.85 μm / ns, 1.9 μm / ns, 1.95 μm / ns, 2.0 μm / ns, etc., can be selected. Optionally, when the sound velocity range of the second adhesive layer 120 is 1.6 μm / ns to 2.0 μm / ns, the second adhesive layer 120 can be an OCA adhesive layer, a silicone adhesive layer, a stack of OCA adhesive layers and silicone adhesive layers, or a mixed adhesive layer of OCA adhesive and silicone.

[0102] In this application, the first adhesive layer 110 and the second adhesive layer 120 can both adopt any suitable thickness, and the thickness of the two can be the same or different, which can be selected as needed, and there is no restriction here.

[0103] In some optional embodiments, the thickness of the first adhesive layer 110 ranges from 15µm to 40µm. Within this optional range, the thickness of the first adhesive layer 110 is neither too thin nor too thick, providing a good bonding effect and ensuring that the adhesive structure 100 is neither too thin nor too thick, thus guaranteeing the bonding effect of the adhesive structure 100. This allows the adhesive structure 100 to achieve a better interface acoustic impedance matching effect, resulting in better signal penetration performance and lower signal attenuation of the ultrasonic signal transmitted through the adhesive structure and side frame. This effectively improves the performance of side ultrasonic fingerprint detection and better meets the requirements of side ultrasonic fingerprint detection. For example... Figure 1A , Figure 1B , Figure 1C As shown, H3 indicates the thickness of the first adhesive layer 110. Within the aforementioned thickness range of the first adhesive layer 110 (i.e., 15um to 40um), the thickness H3 of the first adhesive layer 110 can be selected as needed. For example, in some examples, the thickness of the first adhesive layer 110 can be selected as 15mm, 18um, 20um, 22um, 25um, 28um, 30um, 32um, 35um, 38um, 40um, etc.

[0104] In some optional embodiments, the thickness of the second adhesive layer 120 ranges from 15µm to 40µm. Within this optional range, the thickness of the second adhesive layer 120 is neither too thin nor too thick, providing a good bonding effect and ensuring that the adhesive structure 100 is neither too thin nor too thick, thus guaranteeing the bonding effect of the adhesive structure 100. This allows the adhesive structure 100 to achieve a better interface acoustic impedance matching effect, resulting in better signal penetration performance and lower signal attenuation of the ultrasonic signal transmitted through the adhesive structure and side frame. This effectively improves the performance of side ultrasonic fingerprint detection and better meets the requirements of side ultrasonic fingerprint detection. For example... Figure 1A , Figure 1B , Figure 1C As shown, H2 indicates the thickness of the second adhesive layer 120. Within the aforementioned thickness range of the second adhesive layer 120 (i.e., 15µm to 40µm), the thickness H2 of the second adhesive layer 120 can be selected as needed. For example, in some examples, the thickness of the second adhesive layer 120 can be selected as 15µm, 18µm, 20µm, 22µm, 25µm, 28µm, 30µm, 32µm, 35µm, 38µm, 40µm, etc.

[0105] In some optional embodiments, the total thickness of the first adhesive layer 110 and the second adhesive layer 120 ranges from 30µm to 70µm, that is, 50±20µm. With such a total thickness of the first adhesive layer 110 and the second adhesive layer 120, the adhesive structure 100 is neither too thin nor too thick, ensuring the bonding effect of the adhesive structure 100. This allows the adhesive structure 100 to achieve better interfacial acoustic impedance matching, resulting in better signal penetration performance and lower signal attenuation of the ultrasonic signal transmitted through the adhesive structure and side frame. This effectively improves the performance of side-mounted ultrasonic fingerprint detection and better meets the requirements of side-mounted ultrasonic fingerprint detection. For example... Figure 1A , Figure 1B , Figure 1C As shown, H3 indicates the thickness of the first adhesive layer 110, and H2 indicates the thickness of the second adhesive layer 120. The total thickness of the first adhesive layer 110 and the second adhesive layer 120 is H3 + H2. Within the range of the total thickness of the first adhesive layer 110 and the second adhesive layer 120, the total thickness of the first adhesive layer 110 and the second adhesive layer 120 can be selected as 30um, 40um, 50um, 60um, or 70um.

[0106] For example, in some examples, the thickness of the first adhesive layer 110 is 15 μm, the thickness of the second adhesive layer 120 is 15 μm, and the total thickness of the first adhesive layer 110 and the second adhesive layer 120 is 30 μm; in other examples, the thickness of the first adhesive layer 110 is 20 μm, the thickness of the second adhesive layer 120 is 20 μm, and the total thickness of the first adhesive layer 110 and the second adhesive layer 120 is 40 μm; in still other examples, the thickness of the first adhesive layer 110 is 20 μm, the thickness of the second adhesive layer 120 is 30 μm, and the total thickness of the first adhesive layer 110 and the second adhesive layer 120 is 50 μm; in still other examples, the thickness of the first adhesive layer 110 is 20 μm, the thickness of the second adhesive layer 120 is 40 μm, and the total thickness of the first adhesive layer 110 and the second adhesive layer 120 is 60 μm; in still other examples, the thickness of the first adhesive layer 110 is 40 μm, the thickness of the second adhesive layer 120 is 30 μm, and the total thickness of the first adhesive layer 110 and the second adhesive layer 120 is 70 μm. Other options can be selected as needed, and will not be elaborated here.

[0107] In one example, the thickness of the first adhesive layer 110 and the thickness of the second adhesive layer 120 are both 20 μm. This thickness can well satisfy both the thinness and the bonding effect.

[0108] In some alternative embodiments, when the adhesive structure 100 bonds the side ultrasonic fingerprint sensor 200 and the side frame 310 of the electronic device 300, the first adhesive layer 110 may be bonded to the side ultrasonic fingerprint sensor 200 and the second adhesive layer 120 may be bonded to the side frame 310, thereby effectively fixing the side ultrasonic fingerprint sensor 200 to the electronic device 300.

[0109] In some alternative embodiments, such as Figure 1C As shown, the first adhesive layer 110 includes a first sub-adhesive layer 111 and a second sub-adhesive layer 112, which are spaced apart and located on the same side in the thickness direction of the support layer 130. The first sub-adhesive layer 111 is used to bond with the ultrasonic fingerprint chip 210 in the side ultrasonic fingerprint sensor 200, and the second sub-adhesive layer 112 is used to bond with the circuit board 220 in the side ultrasonic fingerprint sensor 200.

[0110] It should be understood that in the optional adhesive structure 100 described above in this application, the first adhesive layer 110 includes a first sub-adhesive layer 111 and a second sub-adhesive layer 112, which are used to bond the ultrasonic fingerprint chip 210 and the circuit board 220, respectively. This adhesive structure 100 can effectively bond both the ultrasonic fingerprint chip 210 and the circuit board 220 of the side ultrasonic fingerprint sensor 200 to the side frame 310, and the support layer 130 can reinforce both the ultrasonic fingerprint chip 210 and the circuit board 220, effectively improving the bonding stability. In addition, since the first sub-adhesive layer 111 and the second sub-adhesive layer 112 are spaced apart on the support layer 130, the first adhesive layer 110 can save material in the space between the first sub-adhesive layer 111 and the second sub-adhesive layer 112, thereby reducing the cost of the adhesive structure 100 while ensuring the bonding effect.

[0111] Optionally, the first sub-adhesive layer 111 and the second sub-adhesive layer 112 can have the same thickness or different thicknesses. Optionally, the first sub-adhesive layer 111 and the second sub-adhesive layer 112 can satisfy the thickness range of the first adhesive layer 110 mentioned above, that is, 15um to 40um. The first sub-adhesive layer 111 and the second sub-adhesive layer 112 can have the same sound velocity or different sound velocities, and this application does not limit this.

[0112] For example, refer to Figure 1CAs shown, the side ultrasonic fingerprint sensor 200 includes an ultrasonic fingerprint chip 210 and a circuit board 220. The circuit board 220 can be an FPC circuit board. The ultrasonic fingerprint chip 210 and the circuit board 220 are electrically connected through bonding wires 240. The ultrasonic fingerprint chip 210 can be bonded to the first sub-adhesive layer 111 of the first adhesive layer 110, and the circuit board 220 can be bonded to the second sub-adhesive layer 112 of the first adhesive layer 110. The support layer 130 effectively reinforces the stability of the bonded structure. The second adhesive layer 120 can be bonded to the side frame 310. Thus, the side ultrasonic fingerprint sensor 200 can be effectively bonded to the side frame 310 through the optional bonding structure 100.

[0113] In some optional embodiments, when the ultrasonic fingerprint chip 210 and the circuit board 220 are electrically connected using a conductive adhesive layer 230, the support layer 130 of the adhesive structure 100 can be made of any material. In some optional embodiments, when the ultrasonic fingerprint chip 210 and the circuit board 220 are electrically connected using a bonding wire 240, the support layer 130 of the adhesive structure 100 can be a support layer with good solderability.

[0114] Optionally, the second adhesive layer 120 and the support layer 130 of the adhesive structure 100 can be bonded after the side ultrasonic fingerprint sensor 200 is bonded to the first adhesive layer 110. For example, in some processes of bonding the side ultrasonic fingerprint sensor 200 to the side frame 310 (or the process of bonding the side ultrasonic fingerprint module 250 to the side frame 310), the circuit board 220 (such as an FPC circuit board) can be bonded to the first sub-adhesive layer 111 of the adhesive structure 100, and the ultrasonic fingerprint chip 210 can be bonded to the second sub-adhesive layer 112 of the adhesive structure 100, so that the support layer 130 reinforces the circuit board 220 and the ultrasonic fingerprint chip 210. Then, the second adhesive layer 120 can be bonded to the side frame 310, and the support layer 130 can be bonded to the second adhesive layer 120 to form a complete adhesive structure 100. Optionally, the steps of bonding the circuit board 220 (such as an FPC circuit board) to the first sub-adhesive layer 111 of the bonding structure 100 and bonding the ultrasonic fingerprint chip 210 to the second sub-adhesive layer 112 of the bonding structure 100 can be performed before the circuit soldering stage of the circuit board 220 (such as soldering by reflow soldering). Therefore, by using a support layer 130 with better solderability, the performance of the bonding structure 100 after the circuit structure on the circuit board 220 is soldered can be guaranteed. Of course, this is only an example and is not intended to limit the technical solution of this application.

[0115] It should be understood that the above describes some optional structures and related parameters of the adhesive structure 100, including the first adhesive layer 110, the support layer 130, and the second adhesive layer 120. In other optional solutions of this application, the adhesive structure 100 can also be a single-layer structure, that is, a single-layer adhesive layer, which is illustrated here.

[0116] In some optional embodiments, the adhesive structure 100 is a single adhesive layer, and the single adhesive layer is one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the single adhesive layer is a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive layer.

[0117] It should be understood that the single-layer adhesive structure 100 in this application uses the above-mentioned type of adhesive layer, which can effectively achieve bonding and easily meet the sound velocity range requirements of this application (i.e., 1.6um / ns to 2.8um / ns). As a result, when the side ultrasonic fingerprint sensor 200 is bonded to the side frame 310 of the electronic device 300 using the adhesive structure 100 in this application, the interface acoustic impedance matching is good, the ultrasonic signal transmission through the adhesive structure and the side frame has good signal penetration performance and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance.

[0118] In some optional embodiments, the sound velocity range of the single-layer adhesive bonding structure 100 can be 2.3 μm / ns to 2.8 μm / ns. It should be understood that the sound velocity range of the single-layer adhesive bonding structure 100 in this embodiment is 2.3 μm / ns to 2.8 μm / ns. Using such an adhesive structure 100 to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300 results in good interface acoustic impedance matching. The ultrasonic signal transmission through this adhesive structure and the side frame exhibits good signal penetration and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance and better meeting the requirements of side ultrasonic fingerprint detection. Within the aforementioned selectable sound velocity range (i.e., 2.3 μm / ns to 2.8 μm / ns), the sound velocity of the single-layer adhesive bonding structure 100 can be selected as needed. For example, in some examples, the sound velocity of the single-layer adhesive bonding structure 100 can be selected as 2.3 μm / ns, 2.35 μm / ns, 2.4 μm / ns, 2.45 μm / ns, 2.5 μm / ns, 2.55 μm / ns, 2.6 μm / ns, 2.65 μm / ns, 2.7 μm / ns, 2.75 μm / ns, 2.8 μm / ns, etc.

[0119] Optionally, when the sound velocity range of the single-layer adhesive bonding structure 100 is 2.3 μm / ns to 2.8 μm / ns, the single-layer adhesive layer can be a DAF adhesive layer, a UV adhesive layer, or a mixture of UV adhesive and DAF adhesive.

[0120] In some optional embodiments, the single-layer adhesive bonding structure 100 can be a DAF adhesive layer with a thickness ranging from 15µm to 40µm. Within this optional range, the thickness of the single-layer DAF adhesive bonding structure 100 is neither too thin nor too thick, providing a good bonding effect. This allows the bonding structure 100 to achieve a better interface acoustic impedance matching effect, resulting in better signal penetration performance and lower signal attenuation of the ultrasonic signal transmitted through the bonding structure and side frame. This effectively improves the performance of side-side ultrasonic fingerprint detection and better meets the requirements of side-side ultrasonic fingerprint detection. For example... Figure 1D , Figure 1E As shown, H indicates the thickness of the single-layer adhesive bonding structure 100. Within the thickness range of the single-layer adhesive bonding structure 100 (i.e., 15µm to 40µm), the thickness of the single-layer adhesive can be selected as needed. For example, in some examples, the thickness H of the single-layer adhesive bonding structure 100 can be selected as 15µm, 18µm, 20µm, 22µm, 25µm, 28µm, 30µm, 32µm, 35µm, 38µm, 40µm, etc.

[0121] In some alternative embodiments, the single-layer adhesive bonding structure 100 can be a UV adhesive layer with a thickness ranging from 75µm to 105µm, i.e., 90±15µm. Within this optional range, the thickness of the single-layer UV adhesive bonding structure 100 is neither too thin nor too thick, providing a good bonding effect. This allows the bonding structure 100 to achieve a better interface acoustic impedance matching effect, resulting in better signal penetration performance and lower signal attenuation of the ultrasonic signal transmitted through the bonding structure and side frame. Consequently, it can effectively improve the performance of side ultrasonic fingerprint detection and better meet the requirements of side ultrasonic fingerprint detection. Within the thickness range of the single-layer adhesive bonding structure 100 (i.e., 75um to 105um), the thickness of the single-layer adhesive layer can be selected as needed. For example, in some examples, the thickness of the single-layer adhesive bonding structure 100 can be selected as 75mm, 78um, 80um, 82um, 85um, 88um, 90um, 92um, 95um, 98um, 100um, 102um, 105um, etc.

[0122] In some alternative embodiments, the sound velocity range of the single-layer adhesive bonding structure 100 is 1.6 μm / ns to 2.0 μm / ns. It should be understood that the sound velocity range of the single-layer adhesive bonding structure 100 in this embodiment is 1.6 μm / ns to 2.0 μm / ns. Using such an adhesive structure 100 to bond the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300 results in good interface acoustic impedance matching. The ultrasonic signal transmission through this adhesive structure and the side frame exhibits good signal penetration and low signal attenuation, thereby effectively improving the side ultrasonic fingerprint detection performance and better meeting the requirements of side ultrasonic fingerprint detection. Within the aforementioned selectable sound velocity range (i.e., 1.6 μm / ns to 2.0 μm / ns), the sound velocity of the single-layer adhesive bonding structure 100 can be selected as needed. For example, in some examples, the sound velocity of the single-layer adhesive bonding structure 100 can be selected as 1.6 μm / ns, 1.65 μm / ns, 1.7 μm / ns, 1.75 μm / ns, 1.8 μm / ns, 1.85 μm / ns, 1.9 μm / ns, 1.95 μm / ns, 2.0 μm / ns, etc.

[0123] Optionally, when the sound velocity range of the single-layer adhesive bonding structure 100 is 1.6 μm / ns to 2.0 μm / ns, the single-layer adhesive layer can be an OCA adhesive layer, a silicone adhesive layer, or a mixture of OCA adhesive and silicone adhesive layer.

[0124] In some optional embodiments, the single-layer adhesive bonding structure 100 can be an OCA adhesive layer with a thickness ranging from 60µm to 80µm, i.e., 70±10µm. Within this optional range, the thickness of the single-layer OCA adhesive bonding structure 100 is neither too thin nor too thick, providing a good bonding effect. This allows the bonding structure 100 to achieve a better interface acoustic impedance matching effect, resulting in better signal penetration performance and lower signal attenuation of the ultrasonic signal transmitted through the bonding structure and side frame. Consequently, it can effectively improve the performance of side ultrasonic fingerprint detection and better meet the requirements of side ultrasonic fingerprint detection. Within the thickness range of the single-layer adhesive bonding structure 100 (i.e., 60um to 80um), the thickness of the single-layer adhesive layer can be selected as needed. For example, in some examples, the thickness of the single-layer adhesive bonding structure 100 can be selected as 60mm, 61um, 62um, 63um, 64um, 65um, 66um, 67um, 68um, 69um, 70um, 71mm, 72um, 73um, 74um, 75um, 76um, 77um, 78um, 79um, 80um, etc.

[0125] In some alternative embodiments, the single-layer adhesive bonding structure 100 can be a silicone adhesive layer with a thickness ranging from 35µm to 55µm, i.e., 45±10µm. Within this optional range, the thickness of the single-layer silicone adhesive bonding structure 100 is neither too thin nor too thick, providing a good bonding effect. This allows the bonding structure 100 to achieve a better interface acoustic impedance matching effect, resulting in better signal penetration performance and lower signal attenuation of the ultrasonic signal transmitted through the bonding structure and side frame. Consequently, it can effectively improve the performance of side ultrasonic fingerprint detection and better meet the requirements of side ultrasonic fingerprint detection. Within the thickness range of the single-layer adhesive bonding structure 100 (i.e., 35um to 55um), the thickness of the single-layer adhesive layer can be selected as needed. For example, in some examples, the thickness of the single-layer adhesive bonding structure 100 can be selected as 35mm, 36um, 37um, 38um, 39um, 40um, 41um, 42um, 43um, 44um, 45um, 46mm, 47um, 48um, 49um, 50um, 51um, 52um, 53um, 54um, 55um, etc.

[0126] The side ultrasonic fingerprint sensor bonding structure 100 in this application will be described below with several example embodiments. It should be understood that the following examples are not intended to limit this application in any way.

[0127] <Example Example 1>

[0128] Reference Figure 1A As shown, this application provides a side ultrasonic fingerprint sensor bonding structure 100, which is used to bond a side ultrasonic fingerprint sensor 200 to the side frame 310 of an electronic device 300. The sound velocity range of the bonding structure is 1.6 μm / ns to 2.8 μm / ns.

[0129] Optionally, refer to Figure 1A As shown, the adhesive structure 100 includes a first adhesive layer 110, a support layer 130, and a second adhesive layer 120, with the first adhesive layer 110 and the second adhesive layer 120 located on both sides of the support layer 130 in the thickness direction.

[0130] Optionally, the sound velocity range of the first adhesive layer 110 is 2.3 μm / ns to 2.8 μm / ns.

[0131] Optionally, the sound velocity range of the second adhesive layer 120 is 2.3 μm / ns to 2.8 μm / ns.

[0132] Optionally, the sound velocity range of the support layer 130 is 2.0 μm / ns to 2.7 μm / ns.

[0133] Optionally, the thickness of the first adhesive layer 110 ranges from 15µm to 40µm;

[0134] Optionally, the thickness of the second adhesive layer 120 ranges from 15µm to 40µm;

[0135] Optionally, the total thickness of the first adhesive layer 110 and the second adhesive layer 120 ranges from 30 μm to 70 μm;

[0136] Optionally, the thickness of the first adhesive layer 110 and the thickness of the second adhesive layer 120 are both 20 μm.

[0137] Optionally, the first adhesive layer 110 is a DAF adhesive layer.

[0138] Optionally, the second adhesive layer 120 is a DAF adhesive layer.

[0139] Optionally, the support layer 130 is a PET support layer with a thickness ranging from 45um to 75um, or the support layer 130 is a PI support layer with a thickness ranging from 50um to 150um.

[0140] Optionally, the thickness of the support layer 130 ranges from 45 μm to 150 μm, and preferably, the thickness of the support layer 130 is 60 μm.

[0141] Optionally, the side ultrasonic fingerprint sensor 200 includes an ultrasonic fingerprint chip 210 and a circuit board 220 connected by a conductive adhesive layer 230 (such as an ACF conductive adhesive layer). The ultrasonic fingerprint chip 210 is bonded to a first adhesive layer 110 of the adhesive structure 100, and a second adhesive layer 120 of the adhesive structure 100 is used to bond to the side frame 310 of the electronic device 300.

[0142] <Example Example 2>

[0143] Example 2 is structurally similar to Example 1, except that, referring to... Figure 1B As shown, in Example Embodiment 2, the ultrasonic fingerprint chip 210 and circuit board 220 of the side ultrasonic fingerprint sensor 200 are connected by bonding wires. Both the ultrasonic fingerprint chip 210 and the circuit board 220 can be bonded to the first adhesive layer 110 of the bonding structure 100, and the first adhesive layer 110 is an integral adhesive layer.

[0144] <Example 3>

[0145] Example 3 is structurally similar to Example 2, except that, referring to... Figure 1CAs shown, in Example Embodiment 3, the ultrasonic fingerprint chip 210 and circuit board 220 of the side ultrasonic fingerprint sensor 200 are connected by bonding wires. Both the ultrasonic fingerprint chip 210 and the circuit board 220 can be bonded to the first adhesive layer 110 of the bonding structure 100. The first adhesive layer 110 is a separate adhesive layer, that is:

[0146] In Example 3, refer to Figure 1C As shown, the first adhesive layer 110 includes a first sub-adhesive layer 111 and a second sub-adhesive layer 112. The first sub-adhesive layer 111 and the second sub-adhesive layer 112 are spaced apart and located on the same side in the thickness direction of the support layer 130. The first sub-adhesive layer 111 is used to bond with the ultrasonic fingerprint chip 210 in the side ultrasonic fingerprint sensor 200, and the second sub-adhesive layer 112 is used to bond with the circuit board 220 in the side ultrasonic fingerprint sensor 200.

[0147] <Example Example 4>

[0148] Reference Figure 1D As shown, this application provides a side-mounted ultrasonic fingerprint sensor bonding structure 100, which is used to bond a side-mounted ultrasonic fingerprint sensor 200 to the side frame 310 of an electronic device 300. The sound velocity range of the bonding structure is 1.6 μm / ns to 2.8 μm / ns. The bonding structure 100 is a single-layer adhesive layer.

[0149] Optionally, the single-layer adhesive bonding structure 100 is one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the single-layer adhesive bonding structure 100 is a mixed adhesive layer of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone.

[0150] Optionally, the sound velocity of the single-layer adhesive layer is in the range of 2.3 μm / ns to 2.8 μm / ns, the single-layer adhesive layer is a DAF adhesive layer and the thickness ranges from 15 μm to 40 μm, or the single-layer adhesive layer is a UV adhesive layer and the thickness ranges from 75 μm to 105 μm.

[0151] Optionally, the sound velocity range of the single-layer adhesive layer is 1.6 μm / ns to 2.0 μm / ns, the single-layer adhesive layer is an OCA adhesive layer and the thickness ranges from 60 μm to 80 μm, or the single-layer adhesive layer is a silicone adhesive layer and the thickness ranges from 35 μm to 55 μm.

[0152] Optionally, the side ultrasonic fingerprint sensor 200 includes an ultrasonic fingerprint chip 210 and a circuit board 220 connected by a conductive adhesive layer 230 (such as an ACF conductive adhesive layer). The ultrasonic fingerprint chip 210 is bonded to an adhesive structure 100, which is also used to bond to the side frame 310 of the electronic device 300.

[0153] <Example 5>

[0154] Example 5 is structurally similar to Example 4, the difference being that, referring to... Figure 1E As shown, in Example Embodiment 5, the ultrasonic fingerprint chip 210 and circuit board 220 of the side ultrasonic fingerprint sensor 200 are connected by bonding wires. Both the ultrasonic fingerprint chip 210 and the circuit board 220 can be bonded to the bonding structure 100, and the bonding structure 100 is an integral adhesive layer.

[0155] It should be noted that the above example embodiments 1 to 5 are only some optional examples in this application and are not intended to limit the embodiments of this application.

[0156] Optionally, when the side ultrasonic fingerprint sensor bonding structure 100 in this embodiment is not bonded between the side ultrasonic fingerprint sensor 200 and the side frame 310, the bonding surfaces on both sides of the side ultrasonic fingerprint sensor bonding structure 100 can be covered with release films respectively. For example, one side of the bonding surface is covered with a light release film, and the other side of the bonding surface is covered with a heavy release film.

[0157] For example, in some optional embodiments, when bonding the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300, the release film covering one side of the adhesive surface of the bonding structure 100 can be removed first, and the exposed adhesive surface of the bonding structure 100 can be bonded to the side ultrasonic fingerprint sensor 200. Then, a debubbling process is performed to remove air bubbles between the adhesive surface of the bonding structure 100 and the side ultrasonic fingerprint sensor 200. Next, the release film covering the other side of the adhesive surface of the bonding structure 100 is removed, and the exposed adhesive surface of the other side of the bonding structure 100 is bonded to the side frame 310. Another debubbling process is performed to remove air bubbles between the adhesive surface of the other side of the bonding structure 100 and the side frame 310. This allows the side ultrasonic fingerprint sensor 200 to be bonded to the side frame 310 via the bonding structure 100. Optionally, the above debubbling process can be omitted, as long as the requirements are met.

[0158] For example, in some alternative embodiments, when bonding the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300, the release film covering one side of the adhesive surface of the bonding structure 100 can be removed first, and the exposed adhesive surface of the bonding structure 100 can be bonded to the side frame 310. Then, a debubbling process is performed to remove air bubbles between the adhesive surface of the bonding structure 100 and the side frame 310. Next, the release film covering the other side of the adhesive surface of the bonding structure 100 is removed, and the exposed adhesive surface of the other side of the bonding structure 100 is bonded to the side ultrasonic fingerprint sensor 200. Another debubbling process is performed to remove air bubbles between the other adhesive surface of the bonding structure 100 and the side ultrasonic fingerprint sensor 200. This allows the side ultrasonic fingerprint sensor 200 to be bonded to the side frame 310 via the bonding structure 100. Optionally, the above debubbling process can be omitted, as long as the requirements are met.

[0159] It should be noted that the adhesive structure 100 in this application can be a standalone product, or the adhesive structure 100 can be combined with the side ultrasonic fingerprint sensor 200 to form a side ultrasonic fingerprint module 250 as a product (which can be combined). Figures 2A-2E (For further understanding, see the relevant content).

[0160] In some embodiments, one side of the adhesive structure 100 can be first adhered to the side ultrasonic fingerprint sensor 200, and the whole assembly can be used as a side ultrasonic fingerprint module 250. In use, the other side of the adhesive structure 100 can be adhered to the side frame 310 of the electronic device 300 so that the electronic device 300 can realize the side ultrasonic fingerprint function.

[0161] It should be understood that the above description is only some optional embodiments of the side ultrasonic fingerprint sensor bonding structure scheme of the present application, and is not a limitation on the embodiments of the present application.

[0162] According to a second aspect of the embodiments of this application, referring to... Figure 2A , Figure 2B , Figure 2C , Figure 2D , Figure 2E As shown, a side ultrasonic fingerprint module 250 is provided, including: a side ultrasonic fingerprint sensor 200, and an adhesive structure 100 as described in any of the first aspects, wherein the side ultrasonic fingerprint sensor 200 is adhered to the adhesive structure 100; the adhesive structure 100 is also used to adhere to the side frame 310 of the electronic device 300, so as to adhere the side ultrasonic fingerprint sensor 200 to the side frame 310 of the electronic device 300.

[0163] In some alternative embodiments, refer to Figure 2A , Figure 2DAs shown, the side ultrasonic fingerprint sensor 200 includes: an ultrasonic fingerprint chip 210 and a circuit board 220; the ultrasonic fingerprint chip 210 and the circuit board 220 are electrically connected through a conductive adhesive layer 230, and the ultrasonic fingerprint chip 210 is bonded to the adhesive structure 100; or, refer to Figure 2B , Figure 2C , Figure 2E As shown, the ultrasonic fingerprint chip 210 and the circuit board 220 are electrically connected by bonding wires 240, and both the ultrasonic fingerprint chip 210 and the circuit board 220 are bonded to the bonding structure 100.

[0164] According to the third aspect of the embodiments of this application, referring to Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E As shown, an electronic device 300 is provided, including: a side frame 310, a side ultrasonic fingerprint sensor 200, and a side ultrasonic fingerprint sensor bonding structure 100 as described in any of the first aspects, wherein the side ultrasonic fingerprint sensor 200 is bonded to the side frame 310 through the bonding structure 100.

[0165] In other embodiments, the electronic device 300 provided in this application may include a side frame 310 and a side ultrasonic fingerprint module 250 as described in the second aspect, wherein the side ultrasonic fingerprint sensor 200 in the side ultrasonic fingerprint module 250 is bonded to the side frame 310 via an adhesive structure 100 in the side ultrasonic fingerprint module 250. The principle of such alternative embodiments is similar to the aforementioned electronic device embodiments, and they can also be combined... Figures 3A-3E Understanding (i.e., the side ultrasonic fingerprint module 250 may include) Figures 3A-3E The side ultrasonic fingerprint sensor 200 and the adhesive structure 100 are included, so they will not be described in detail here.

[0166] It should be understood that the side ultrasonic fingerprint module 250 and the electronic device 300 have been described in the previous embodiment of the side ultrasonic fingerprint sensor bonding structure 100, and can be understood in the same way as above, so they will not be repeated here.

[0167] It is understood that the above descriptions of various aspects of the embodiments of this application are merely optional exemplary descriptions of the technical solutions of the embodiments of this application, and are not intended to limit the embodiments of this application in any way.

[0168] The optional embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the embodiments of the present application are not limited thereto. It should be noted that, for the convenience of explaining the embodiments of the present application, the various drawings of the embodiments of the present application are not necessarily drawn to scale, and are only used to facilitate the explanation of the technical solution, and are not intended to limit the embodiments of the present application in any way. Within the scope of the technical concept of the embodiments of the present application, various simple modifications can be made to the technical solutions of the embodiments of the present application. The various technical features included in the different embodiments of the present application can be combined and / or separated in any suitable manner. In order to avoid unnecessary repetition, the embodiments of the present application will not describe the various possible combinations separately. However, these simple modifications and combinations should also be regarded as the content disclosed in the embodiments of the present application, and all fall within the protection scope of the embodiments of the present application.

[0169] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". It should be noted that the concepts of "first", "second", etc., mentioned in this application are only used to distinguish different devices, modules, or units, and are not intended to limit the order of functions performed by these devices, modules, or units or their interdependencies. It should be noted that the modifications "a" and "a plurality" mentioned in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless explicitly indicated in the context, they should be understood as "one or more".

[0170] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A side-mounted ultrasonic fingerprint sensor bonding structure, characterized in that, The adhesive structure is used to attach the side ultrasonic fingerprint sensor to the side frame of the electronic device, and the sound velocity of the adhesive structure is in the range of 1.6um / ns to 2.8um / ns.

2. The adhesive structure according to claim 1, characterized in that, The adhesive structure includes a first adhesive layer, a support layer, and a second adhesive layer, with the first adhesive layer and the second adhesive layer located on opposite sides of the support layer in the thickness direction.

3. The adhesive structure according to claim 2, characterized in that, The adhesive structure satisfies at least one of the following conditions: The sound velocity range of the first adhesive layer is 2.3 μm / ns to 2.8 μm / ns; The sound velocity range of the second adhesive layer is 2.3 μm / ns to 2.8 μm / ns; The sound velocity range of the support layer is 2.0 μm / ns to 2.7 μm / ns; The thickness of the first adhesive layer ranges from 15µm to 40µm; The thickness of the second adhesive layer ranges from 15µm to 40µm; The total thickness of the first adhesive layer and the second adhesive layer ranges from 30µm to 70µm; The thickness of both the first adhesive layer and the second adhesive layer is 20 μm; The support layer is a non-metallic support layer; The thickness of the support layer ranges from 45µm to 150µm; The thickness of the support layer is 60 μm; The first adhesive layer includes at least one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the first adhesive layer is a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive layer; The second adhesive layer includes at least one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the second adhesive layer is a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive layer.

4. The adhesive structure according to claim 2, characterized in that, The support layer is a PET support layer with a thickness ranging from 45um to 75um; or, The support layer is a PI support layer with a thickness ranging from 50um to 150um.

5. The adhesive structure according to any one of claims 2-4, characterized in that, The first adhesive layer includes a first sub-adhesive layer and a second sub-adhesive layer, the first sub-adhesive layer and the second sub-adhesive layer being spaced apart on the same side in the thickness direction of the support layer; The first sub-adhesive layer is used to bond with the ultrasonic fingerprint chip in the side ultrasonic fingerprint sensor, and the second sub-adhesive layer is used to bond with the circuit board in the side ultrasonic fingerprint sensor.

6. The adhesive structure according to claim 1, characterized in that, The adhesive structure is a single-layer adhesive layer, and the single-layer adhesive layer is one of DAF adhesive layer, UV adhesive layer, OCA adhesive layer, and silicone adhesive layer, or the single-layer adhesive layer is a mixture of at least two of DAF adhesive, UV adhesive, OCA adhesive, and silicone adhesive layer.

7. The adhesive structure according to claim 6, characterized in that, The sound velocity range of the single-layer adhesive layer is 2.3 μm / ns to 2.8 μm / ns.

8. The adhesive structure according to claim 6 or 7, characterized in that, The single-layer adhesive layer is a DAF adhesive layer, and its thickness ranges from 15um to 40um; or, The single-layer adhesive is a UV adhesive, and its thickness ranges from 75um to 105um.

9. The adhesive structure according to claim 6, characterized in that, The sound velocity range of the single-layer adhesive layer is 1.6 μm / ns to 2.0 μm / ns.

10. The adhesive structure according to claim 6 or 9, characterized in that, The single-layer adhesive layer is an OCA adhesive layer, and its thickness ranges from 60um to 80um; or, The single-layer adhesive is a silicone adhesive layer with a thickness ranging from 35µm to 55µm.

11. A side-mounted ultrasonic fingerprint module, characterized in that, include: A side-mounted ultrasonic fingerprint sensor and an adhesive structure as described in any one of claims 1-10, wherein the side-mounted ultrasonic fingerprint sensor is adhered to the adhesive structure; The adhesive structure is also used to bond to the side frame of the electronic device, so as to bond the side ultrasonic fingerprint sensor to the side frame of the electronic device.

12. The side-mounted ultrasonic fingerprint module according to claim 11, characterized in that, The side-mounted ultrasonic fingerprint sensor includes: an ultrasonic fingerprint chip and a circuit board; The ultrasonic fingerprint chip and the circuit board are electrically connected through a conductive adhesive layer, and the ultrasonic fingerprint chip is bonded to the adhesive structure. or, The ultrasonic fingerprint chip and the circuit board are electrically connected by bonding wires, and both the ultrasonic fingerprint chip and the circuit board are bonded to the bonding structure.

13. An electronic device, characterized in that, The electronic device includes: a side frame, a side ultrasonic fingerprint sensor, and an adhesive structure as described in any one of claims 1-10, wherein the side ultrasonic fingerprint sensor is adhered to the side frame via the adhesive structure; or, The electronic device includes: a side frame and a side ultrasonic fingerprint module as described in any one of claims 11-12, wherein the side ultrasonic fingerprint sensor in the side ultrasonic fingerprint module is bonded to the side frame through an adhesive structure in the side ultrasonic fingerprint module.

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