Alloy resistor

Abstract

The utility model discloses an alloy resistor, which comprises an alloy sheet, a base material, a first solder mask layer, a second solder mask layer, two first electrodes and two second electrodes, the first solder mask layer and the base material are respectively positioned on two sides of the alloy sheet, the second solder mask layer is positioned above the first solder mask layer, and the first electrodes are positioned above the second solder mask layer. The second electrode is correspondingly positioned above the first electrode; the distance between the two second electrodes is larger than the distance between the two first electrodes. The alloy resistor provided by the utility model is provided with a plurality of solder mask layers and a plurality of electrodes, so that the electrode spacing of a product can be effectively increased under the condition that the resistance values of the product are the same, and the application range of the large bonding pad spacing of the product can be better met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to alloy resistance technical field, specifically related to a kind of alloy resistance of low resistance (1~3mΩ), wide electrode spacing (1.4~1.8mm). BACKGROUND

[0002] Compared with other types of resistors, alloy resistors have low temperature coefficient, high stability and oxidation resistance, making them more and more widely used in electronic circuits. The smaller the resistance value of conventional alloy resistors, the smaller the electrode spacing. Using small resistance value alloy resistors, the corresponding application pad spacing needs to be matched, making the application range of low resistance alloy resistors narrower. Low resistance, wide electrode spacing alloy resistors can meet more extensive application scenarios, and market demand is also increasing.

[0003] In the prior art, alloy is etched to obtain a resistance body semi-finished product with a certain resistance value, and then single product is obtained through subsequent anti-soldering, electroplating, cutting and barrel plating. The solder pad spacing used is the size of the corresponding electrode width.

[0004] However, since the electrode spacing of the resistance body is affected by the resistivity and thickness of the material, the electrode spacing of the product is also fixed when the size of the product is fixed. According to the calculation formula of resistance: R=ρ*L / S (in the formula, R is resistance value; ρ is resistivity; L is resistance body length; S is resistance body cross-sectional area), under the condition that the thickness and width of the product are fixed, the smaller the resistance value of the product, the smaller the effective resistance length, so the electrode spacing of the product is narrower, so the application range of the product is narrower. Alloy resistors in the prior art cannot achieve low resistance while ensuring wide electrode spacing.

[0005] As disclosed in patent application No. 2022108875824, a resistance structure and its manufacturing method are provided, which sets the metal layer as a first metal region and a second metal region, and the second metal region is located in the non-electrode region of the first metal region, thereby reducing the thickness while ensuring the product resistance value. But the thickness of the electrode of the resistor prepared by this patent is higher than that of the second metal region, and the total thickness of the product will be affected by the thickness of the second metal region. And the total thickness of the metal region at the non-electrode of the resistor does not change, and the effective resistance length of the resistor does not change, and the spacing between the two electrodes is also fixed, which cannot widen the electrode spacing of the resistor.

[0006] For example, in the patent with application number 2022114027146, a sheet alloy resistor and its preparation method are proposed. The different resistance requirements of the resistor body are realized by punching, and then the heat dissipation sheet is covered on the alloy to effectively increase the product heat dissipation. However, the patent uses the punching method, and the cost of related equipment and fixtures is high. Moreover, under the premise that the resistance of the resistor remains unchanged, the related dimensions of the effective resistance area remain unchanged, so the spacing between the two electrodes also does not change, making it difficult to meet the wide electrode spacing requirement of the resistor.

[0007] For example, in the patent with application number 2017112990487, a high-precision low-TCR (temperature coefficient of resistance) resistor is obtained by printing a mask layer on the resistance area and then covering a protective layer on the surface of the mask layer. However, the original size of the alloy and the protective layer in this patent does not change, making it difficult to realize a resistor with a wider electrode spacing.

[0008] For example, in the patent with application number 2015104222674, a micro resistor is disclosed. The first electrode contact and the second electrode contact do not directly contact the protective layer, and the protective layer contacts the solder ball or solder layer. The actual electrode spacing of the product is determined by the distance between the two outermost solder balls or solder layers. The solder layer covers the electrode contact, and the protective layer contacts the solder layer, so the electrode spacing is not actually widened. At the same time, the solder layer in this patent will shrink the end of the protective layer inward, further reducing the electrode spacing.

[0009] The disclosure of the above background technology is only used to assist in understanding the concept and technical solution of the present utility model, and it does not necessarily belong to the prior art of the present application. In the absence of explicit evidence that the above content has been disclosed before the filing date of the present application, the above background technology should not be used to evaluate the novelty and inventiveness of the present application. Utility model content

[0010] Therefore, in order to overcome the defects of the prior art, the purpose of the present utility model is to provide an alloy resistor with low resistance (1-3 mΩ) and wide electrode spacing (1.4-1.8 mm).

[0011] In order to achieve the above purpose, the present utility model adopts the following technical solutions:

[0012] An alloy resistor includes an alloy sheet, a substrate, a first anti-solder layer, a second anti-solder layer, two first electrodes, and two second electrodes. The first anti-solder layer and the substrate are located on both sides of the alloy sheet, the second anti-solder layer is located above the first anti-solder layer, and the second electrodes correspond to the first electrodes. The spacing between the two second electrodes is greater than the spacing between the two first electrodes.

[0013] According to some preferred embodiments of the present invention, the distance between the two second electrodes is 1.4 to 1.8 mm.

[0014] According to some preferred embodiments of the present invention, the distance between the two first electrodes is 0.8 to 1.2 mm.

[0015] According to some preferred embodiments of the present invention, the two first electrodes are respectively located at two ends of the first solder resist layer.

[0016] According to some preferred embodiments of the present invention, the top surface of the first electrode is higher than the top surface of the first solder resist layer.

[0017] According to some preferred embodiments of the present invention, the top surface of the second solder resist layer is higher than the top surface of the first electrode.

[0018] According to some preferred embodiments of this invention, the length of the second solder resist layer is greater than the length of the first solder resist layer; the end of the second solder resist layer covers the ends of the two first electrodes that are close to each other. That is, the second solder resist layer covers the first electrodes to widen the electrode spacing of the product.

[0019] According to some preferred embodiments of the present invention, the two second electrodes are respectively located at two ends of the second solder resist layer and are in direct contact with the ends of the second solder resist layer. Specifically, the ends of the second solder resist layer are embedded in the second electrodes and located between the first electrode and the second electrode.

[0020] According to some preferred embodiments of the present invention, the top surface of the second electrode is higher than the top surface of the second solder resist layer.

[0021] According to some preferred embodiments of the present invention, a third solder resist layer is included; the third solder resist layer is located above the second solder resist layer and between the two second electrodes. The length of the third solder resist layer is less than the distance between the two second electrodes.

[0022] The first solder resist layer in this invention is used to determine the length of the effective resistance area of ​​the product, which is used to determine the resistance value of the resistor body and prevent oxidation or damage to the alloy area; the second solder resist layer is used to widen the distance between the two electrodes of the product to achieve the target electrode spacing; the third solder resist layer is used to cover the solder resist damage caused by the repair knife edge and prevent alloy abnormalities and oxidation in the repair area.

[0023] According to some preferred embodiments of the present invention, the top surface of the third solder resist layer is lower than the top surface of the second electrode.

[0024] According to some preferred embodiments of the present invention, the length of the third solder resist layer is less than the length of the second solder resist layer.

[0025] According to some preferred embodiments of the present invention, the distance between the two second electrodes is greater than the length of the third solder resist layer.

[0026] According to some preferred embodiments of the present invention, the distance between the end of the third solder resist layer and the end of the second electrode is 0.2 to 0.4 mm.

[0027] According to some preferred embodiments of the present invention, the resistance of the alloy resistor is 1 to 3 mΩ.

[0028] In this invention, length is defined as the value along the length of the alloy resistor product as seen from its cross-sectional view.

[0029] Due to the adoption of the above technical solutions, the advantages of this utility model compared with the prior art are as follows: The alloy resistor of this utility model has multiple layers of solder resist and multiple electrodes. Under the condition of the same product resistance value, it can effectively increase the electrode spacing of the product and better meet the applicable range of large pad spacing of the product. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the cross-sectional structure of the low-resistance, wide-electrode-spacing alloy resistor in an embodiment of this utility model.

[0032] The reference numerals in the attached drawings are: substrate-1, alloy sheet-2, first solder resist layer-3, second solder resist layer-4, third solder resist layer-5, first electrode-6, and second electrode-7. Detailed Implementation

[0033] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0034] This invention discloses an alloy resistor with low resistance (1-3 mΩ) and wide electrode spacing (1.4-1.8 mm), comprising an alloy sheet, a substrate, a first solder resist layer, a second solder resist layer, two first electrodes, and two second electrodes. The first solder resist layer and the substrate are located on opposite sides of the alloy sheet, the second solder resist layer is located above the first solder resist layer, and the second electrodes are correspondingly located above the first electrodes. The spacing between the two second electrodes is greater than the spacing between the two first electrodes. The distance between the two second electrodes is 1.4-1.8 mm; the distance between the two first electrodes is 0.8-1.2 mm. The alloy sheet has a pre-defined circuit pattern.

[0035] Two first electrodes are located at opposite ends of the first solder resist layer. The top surface of the first electrode is higher than the top surface of the first solder resist layer. The top surface of the second solder resist layer is higher than the top surface of the first electrode. The length of the second solder resist layer is greater than the length of the first solder resist layer; the ends of the second solder resist layer cover the ends of the two first electrodes that are close to each other. Two second electrodes are located at opposite ends of the second solder resist layer. The top surface of the second electrode is higher than the top surface of the second solder resist layer. That is, the second solder resist layer covers the first electrode, and the second solder resist layer is in direct contact with the second electrode (the ends of the second solder resist layer are embedded in the second electrode), in order to widen the actual electrode spacing of the product to the target value.

[0036] Further, it includes a third solder resist layer; the third solder resist layer is located above the second solder resist layer and between the two second electrodes. The length of the third solder resist layer is less than the distance between the two second electrodes. The top surface of the third solder resist layer is lower than the top surface of the second electrode. The length of the third solder resist layer is less than the length of the second solder resist layer. The distance between the two second electrodes is greater than the length of the third solder resist layer. The distance between the end of the third solder resist layer and the end of the second electrode is 0.2–0.4 mm.

[0037] In this invention, the length is defined from the cross-sectional diagram of the alloy resistor product (attached). Figure 1 Looking at the product, the values ​​along the length of the alloy resistor are as follows: The first solder resistive layer is used to determine the length of the effective resistance area of ​​the product, which is used to determine the resistance value of the resistor body and prevent oxidation or damage to the alloy area; the second solder resistive layer is used to widen the distance between the two electrodes of the product to achieve the target electrode spacing; the third solder resistive layer is used to cover the solder resistive damage caused by the repair knife edge and prevent alloy abnormalities and oxidation in the repair area.

[0038] Example 1

[0039] like Figure 1As shown, the low-resistance, wide-electrode-spacing alloy resistor in this embodiment includes an alloy sheet 2, a substrate 1, a first solder resist layer 3, a second solder resist layer 4, a third solder resist layer 5, two first electrodes 6, and two second electrodes 7. The two first electrodes 6 are located at the two ends of the first solder resist layer 3, and the second solder resist layer 4 is located above the first solder resist layer 3, with the end of the second solder resist layer 4 covering the ends of the two first electrodes 6 that are close to each other. The two second electrodes 7 are located at the two ends of the second solder resist layer 4 and are in direct contact with the ends of the second solder resist layer. Specifically, the end of the second solder resist layer is embedded within the second electrodes, located between the first and second electrodes, to widen the actual electrode spacing of the product to the target value. The third solder resist layer 5 is located above the second solder resist layer 4, and the second electrodes 7 are located above the first electrodes 6. That is, the first solder resist layer 3, the second solder resist layer 4, and the third solder resist layer 5 are stacked sequentially.

[0040] Specifically, the first solder resist layer 3, the second solder resist layer 4, and the third solder resist layer 5 are formed by printing solder resist ink for the first time, the second time, and the third time, respectively; the first electrode 6 and the second electrode 7 are formed by copper plating twice. In detail, the process involves the first solder resist, the first copper plating, the second solder resist, the second copper plating, and the third solder resist in sequence.

[0041] Alloy sheet 2 and substrate 1 are bonded together, and alloy sheet 2 has a set circuit pattern. First solder resist layer 3 and first electrode 6 are located above alloy sheet 2. First solder resist layer 3, second solder resist layer 4, third solder resist layer 5, two first electrodes 6 and two second electrodes 7 are all located on the side of alloy sheet 2 away from substrate 1.

[0042] The distance between the two second electrodes 7 is greater than the distance between the two first electrodes 6. The distance between the two first electrodes 6 is 1.2 mm; the distance between the two second electrodes 7 is 1.8 mm. The thickness of the first electrode 6 is 0.06 mm; the thickness of the second electrode 7 is 0.06 mm.

[0043] The length of the second solder resist layer 4 is greater than the length of the first solder resist layer 3; the length of the third solder resist layer 5 is less than the length of the second solder resist layer 4 and less than the distance between the two second electrodes 7; the distance between the end of the third solder resist layer 5 and the end of the second electrode 7 is 0.3 mm.

[0044] The top surface of the first electrode 6 is higher than the top surface of the first solder resist layer 3; the top surface of the second solder resist layer 4 is higher than the top surface of the first electrode 6; the top surface of the second electrode 7 is higher than the top surface of the second solder resist layer 4; and the top surface of the third solder resist layer 5 is lower than the top surface of the second electrode 7.

[0045] The alloy resistor with the above structure, characterized by low resistance and wide electrode spacing, has a resistance of 1.5mΩ and an electrode spacing of 1.8mm.

[0046] Example 2

[0047] The low-resistance, wide-electrode-spacing alloy resistor in this embodiment has a structure basically the same as that in Embodiment 1, except that the resistance of the alloy resistor in this embodiment is 1mΩ and the electrode spacing is 1.6mm. The distance between the two first electrodes 6 is 0.8mm; the distance between the two second electrodes 7 is 1.6mm. The thickness of the first electrode 6 is 0.05mm; the thickness of the second electrode 7 is 0.08mm. The distance between the end of the third solder resist layer 5 and the end of the second electrode 7 is 0.2mm.

[0048] The low-resistance, wide-electrode-spacing alloy resistor in this embodiment employs a three-stage solder resistive process and a two-stage electroplating process. While ensuring that the product resistance meets the requirements (1-3mΩ), the electrode spacing of the product can be widened (1.4-1.8mm), which better meets the applicable range of large pad spacing for the product.

[0049] Current methods for manufacturing low-resistance alloy resistors primarily involve increasing the alloy thickness to create resistors with wider electrode spacing. While this achieves low resistance, the increased thickness hinders miniaturization and thinning. Ultra-thin precision alloy resistors, however, have specific thickness requirements, necessitating that the raw material alloy be relatively thin. In designing low-resistance products, the resistance can only be reduced by decreasing the effective resistive element length and the electrode spacing. However, typical applications require soldering with wide-pitch pads to achieve the same pad spacing and size as high-resistance products, necessitating wider electrode spacing. Therefore, the product's inherent resistance and spacing settings contradict its actual application conditions. In other words, using the same alloy material to widen the electrode spacing requires a thicker alloy, which contradicts the design principles of ultra-thin precision alloy resistors. The structure of the alloy resistor product in this utility model can achieve the target resistance value by adjusting the product structure while ensuring that the alloy thickness remains unchanged. After achieving the target resistance value, a second electrode is formed by a second solder resist ink printing and a second electrode copper plating. The second solder resist layer covers the first electrode and is in direct contact with the second electrode (the end of the second solder resist layer is embedded in the second electrode). This not only achieves the design target value of low resistance value, but also effectively widens the electrode spacing of the product to meet the requirements of large pad spacing.

[0050] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

[0051] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

Claims

1. An alloy resistor, characterized in that, It includes an alloy sheet, a substrate, a first solder resist layer, a second solder resist layer, two first electrodes, and two second electrodes. The first solder resist layer and the substrate are located on opposite sides of the alloy sheet, the second solder resist layer is located above the first solder resist layer, and the second electrodes are located above the first electrodes. The distance between the two second electrodes is greater than the distance between the two first electrodes.

2. The alloy resistor according to claim 1, characterized in that, The distance between the two second electrodes is 1.4 to 1.8 mm.

3. The alloy resistor according to claim 1, characterized in that, The distance between the two first electrodes is 0.8 to 1.2 mm.

4. The alloy resistor according to claim 1, characterized in that, The two first electrodes are located at the two ends of the first solder resist layer, respectively.

5. The alloy resistor according to claim 1, characterized in that, The top surface of the first electrode is higher than the top surface of the first solder resist layer.

6. The alloy resistor according to claim 1, characterized in that, The top surface of the second solder resist layer is higher than the top surface of the first electrode.

7. The alloy resistor according to claim 1, characterized in that, The length of the second solder resist layer is greater than the length of the first solder resist layer; the end of the second solder resist layer covers the end of the two first electrodes that are close to each other.

8. The alloy resistor according to claim 1, characterized in that, The two second electrodes are located at the two ends of the second solder resist layer, respectively.

9. The alloy resistor according to claim 1, characterized in that, The top surface of the second electrode is higher than the top surface of the second solder resist layer.

10. The alloy resistor according to claim 1, characterized in that, It includes a third solder resist layer; the third solder resist layer is located above the second solder resist layer and between the two second electrodes.

11. The alloy resistor according to claim 10, characterized in that, The top surface of the third solder resist layer is lower than the top surface of the second electrode.

12. The alloy resistor according to claim 10, characterized in that, The length of the third solder resist layer is less than the length of the second solder resist layer.

13. The alloy resistor according to claim 10, characterized in that, The distance between the two second electrodes is greater than the length of the third solder resist layer.

14. The alloy resistor according to claim 13, characterized in that, The distance between the end of the third solder resist layer and the end of the second electrode is 0.2 to 0.4 mm.

15. The alloy resistor according to any one of claims 1-14, characterized in that, The resistance of the alloy resistor is 1 to 3 mΩ.

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