Earphone and earphone equipment

Abstract

The embodiment of the utility model provides an earphone and earphone equipment, the earphone comprises an earphone body and a flexible circuit board, the earphone body comprises a shell, a mainboard and a charging module, and the mainboard and the charging module are both arranged in the shell; the flexible circuit board is arranged in the shell and comprises a main board connecting part, a bending part and a charging module connecting part which are sequentially connected in the first direction, the main board connecting part is electrically connected to the main board, the charging module is electrically connected to the charging module connecting part, and the main board connecting part and the charging module connecting part are arranged at an included angle; in the second direction forming the included angle with the first direction, the size of the mainboard connecting part and the size of the charging module connecting part are both larger than the size of the bending part, so that the size of the bending part is relatively small, the flexible circuit board is easy to bend at the bending part, the bending position of the flexible circuit board is relatively fixed, and the service life of the flexible circuit board is prolonged. And therefore, the risk of circuit damage caused by deflection of the bending position during assembly of the flexible circuit board can be reduced.

Description

Technical Field

[0001] This application relates to the field of headphone technology, and in particular to a headphone and headphone device. Background Technology

[0002] With the rapid development of headphone technology, the assembly efficiency and long-term stability of the headphone's internal structure have become key design considerations. In the internal structure of a headphone, flexible circuit boards serve as bridges connecting components such as the motherboard and charging module, allowing for better layout of these components within the headphone. However, in related technologies, flexible circuit boards can suffer circuit damage due to misalignment caused by bending during assembly. Utility Model Content

[0003] This application provides an earphone and an earphone device that can reduce the risk of circuit damage caused by the misalignment of the flexible circuit board during assembly due to bending.

[0004] In a first aspect, embodiments of this application provide an earphone, which includes an earphone body and a flexible circuit board. The earphone body includes a shell, a main board, and a charging module, both of which are disposed within the shell. The flexible circuit board is disposed within the shell and includes a main board connection portion, a bending portion, and a charging module connection portion connected sequentially along a first direction. The main board connection portion is electrically connected to the main board, and the charging module is electrically connected to the charging module connection portion. The main board connection portion and the charging module connection portion are arranged at an angle. Along a second direction that is at an angle to the first direction, the dimensions of both the main board connection portion and the charging module connection portion are larger than the dimensions of the bending portion.

[0005] In some embodiments, the size of the bend along the second direction is not less than 2.5 mm and not more than 4.5 mm.

[0006] In some embodiments, the flexible circuit board has a clearance area located at the connection between the charging module connection portion and the motherboard connection portion, and the clearance area and the bending portion are arranged sequentially along the second direction.

[0007] In some embodiments, the charging module connection portion has a first sub-avoidance area on the side near the motherboard connection portion, the bending portion has a second sub-avoidance area, and the motherboard connection portion has a third sub-avoidance area on the side near the charging module connection portion. The first sub-avoidance area, the second sub-avoidance area, and the third sub-avoidance area are interconnected and together form an avoidance area.

[0008] In some embodiments, the earphone also includes a reinforcement member disposed on the motherboard connector and avoiding the connection between the motherboard and the motherboard connector.

[0009] In some implementations, the reinforcement is located on the side of the motherboard connector away from the motherboard.

[0010] In some implementations, the motherboard connector and the motherboard are stacked.

[0011] In some implementations, the included angle formed by the motherboard connection portion and the charging module connection portion is not less than 80 degrees and not greater than 100 degrees.

[0012] In some embodiments, the charging module connection part is provided with a first positioning hole, the main board is provided with a second positioning hole, and the housing is provided with a positioning post, which passes through the first positioning hole and the second positioning hole.

[0013] Secondly, this utility model also provides an earphone device, which includes a charging cable and earphones according to any of the above embodiments. The charging cable is electrically connected to a charging module.

[0014] This invention provides an earphone and earphone device. The earphone includes an earphone body and a flexible circuit board. The earphone body includes a shell, a main board, and a charging module, both of which are disposed within the shell. The flexible circuit board is disposed within the shell and includes a main board connection portion, a bending portion, and a charging module connection portion connected sequentially along a first direction. The main board connection portion is electrically connected to the main board, and the charging module is electrically connected to the charging module connection portion. The main board connection portion and the charging module connection portion are arranged at an angle. Along a second direction, which is also at an angle to the first direction, the dimensions of both the main board connection portion and the charging module connection portion are larger than the dimensions of the bending portion. Thus, along the second direction, the dimensions of both the main board connection portion and the charging module connection portion are larger than the dimensions of the bending portion, making the dimensions of the bending portion relatively smaller than those of the main board connection portion and the charging module connection portion. This allows the flexible circuit board to bend easily at the bending portion, resulting in a more fixed bending position and helping to reduce the risk of circuit damage due to bending position displacement during assembly. Furthermore, the smaller size of the bend reduces the space occupied by the flexible circuit board within the housing, thus saving space. This smaller space also allows for more room for other components of the headphones, ultimately optimizing the overall internal structural layout. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1A schematic diagram of the structure of the earphone provided in this embodiment of the present invention is shown.

[0017] Figure 2 A schematic diagram of a portion of the structure of the earphone provided in this embodiment of the present invention is shown.

[0018] Figure 3 It shows Figure 2 A schematic diagram of part of the headphone structure from another perspective.

[0019] Figure 4 It shows Figure 3 A schematic diagram of the structure of a flexible circuit board.

[0020] Figure 5 It shows Figure 4 A schematic diagram of the structure of a flexible circuit board from another perspective.

[0021] Figure 6 It shows Figure 3 A schematic diagram of the motherboard structure.

[0022] Figure 7 A schematic diagram of the headphone device provided in an embodiment of the present invention is shown.

[0023] Figure 8 It shows Figure 7 A schematic diagram of the charging cable structure.

[0024] Explanation of icon numbers:

[0025] Earphone 10, Earphone Device 20, Charging Cable 30, Earphone Body 100, Shell 110, Main Board 120, Second Positioning Hole 121, Charging Module 130, First Mounting Bracket 131, First Pin Component 132, First Magnetic Attachment 133, Flexible Circuit Board 200, Avoidance Area 201, First Sub-Avoidance Area 202, Second Sub-Avoidance Area 203, Third Sub-Avoidance Area 204, Main Board Connector 210, Bending Part 220, Charging Module Connector 230, First Positioning Hole 231, Reinforcing Member 300, Elastic Connecting Piece 400, Shell 500, Connecting Module 600, Second Mounting Bracket 610, Second Pin Component 620, Second Magnetic Attachment 630, First Direction X, Second Direction Y. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0027] Where the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0028] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] Please see Figure 1 This utility model provides an earphone 10. The earphone 10 can be of various types, such as a bone conduction earphone or a headphone.

[0031] Please see Figure 1 , Figure 2 and Figure 4The earphone 10 may include an earphone body 100 and a flexible circuit board 200. The earphone body 100 may include a housing 110, a main board 120, and a charging module 130. Both the main board 120 and the charging module 130 may be disposed within the housing 110. The flexible circuit board 200 may be disposed within the housing 110. The flexible circuit board 200 may include a main board connection portion 210, a bending portion 220, and a charging module connection portion 230 connected sequentially along a first direction X. The main board connection portion 210 may be electrically connected to the main board 120, and the charging module 130 may be electrically connected to the charging module connection portion 230. The main board connection portion 210 and the charging module connection portion 230 may be arranged at an angle along a second direction Y (as shown in the figure) that is at an angle to the first direction X (as shown in the figure X direction). The dimensions L1 of the main board connection portion 210 and L2 of the charging module connection portion 230 are both larger than the dimension L3 of the bending portion 220. Thus, along the second direction Y, the dimensions L1 of the motherboard connection portion 210 and L2 of the charging module connection portion 230 are both larger than the dimension L3 of the bending portion 220. This makes the dimension L3 of the bending portion 220 smaller than the dimensions L1 of the motherboard connection portion 210 and L2 of the charging module connection portion 230. This makes it easier for the flexible circuit board 200 to bend at the bending portion 220, thereby making the bending position of the flexible circuit board 200 more fixed. This helps to reduce the risk of circuit damage caused by the bending position shift during assembly of the flexible circuit board 200.

[0032] Furthermore, since the size L3 of the bending portion 220 is small, the flexible circuit board 200 after bending occupies less space in the housing 110, which helps to save the space occupied by the flexible circuit board 200 in the housing 110.

[0033] Moreover, the flexible circuit board 200 occupies less space within the housing 110, which helps to provide more space for other components of the earphone 10, thereby helping to optimize the overall structural layout inside the earphone 10.

[0034] The housing 110 can provide physical protection for the internal components of the earphone 10 (such as the motherboard 120, charging module 130, flexible circuit board 200, etc.), which helps to reduce the impact of the external environment (such as dust, moisture, impact, etc.) on the internal components of the earphone 10.

[0035] The housing 110 can be designed to be completely sealed, which helps reduce the risk of dust entering the earphone 10 and thus helps extend the service life of the earphone 10.

[0036] The housing 110 provides mechanical support for various components inside the earphone 10, ensuring that each component (such as the motherboard 120, charging module 130, flexible circuit board 200, etc.) can be firmly fixed inside the housing 110, which helps to reduce the risk of various components inside the earphone 10 becoming loose or damaged due to external vibration or impact.

[0037] The motherboard 120 is the core component of the headphone 10. The motherboard 120 is responsible for connecting and coordinating the operation of various electronic components inside the headphone 10.

[0038] Please see Figure 2 and Figure 3 The charging module 130 may include a first mounting bracket 131 and a first pin component 132. The first mounting bracket 131 may be connected to the housing 110, and the first pin component 132 may be mounted on the first mounting bracket 131. The first pin component 132 may be made of metal and may be composed of a spring pin, a pin, or an elastic sheet. The first pin component 132 may be electrically connected to the charging module connection portion 230 and exposed outside the housing 110, so that the earphone 10 can be connected to an external power source through the first pin component 132 of the charging module 130.

[0039] The flexible circuit board 200 can be an FPC, or a printed circuit board made using a flexible substrate. The flexible circuit board 200 can be made using polyimide or polyester as the substrate.

[0040] The length direction of the flexible circuit board 200 can be a first direction X, and the width direction of the flexible circuit board 200 can be a second direction Y. The included angle between the first direction X and the second direction Y can be selected according to the design of the flexible circuit board 200. For example, the first direction X can be perpendicular to the second direction Y; for another example, the first direction X can be set at an acute angle to the second direction Y; for yet another example, the first direction X can be designed at an obtuse angle to the second direction Y. The charging module connection portion 230 and the motherboard connection portion 210 are located on opposite sides of the flexible circuit board 200, thereby facilitating the bending of the flexible circuit board 200.

[0041] The shape of the charging module connection part 230 can be designed according to the arrangement of the first pin component 132 in the first mounting bracket 131.

[0042] The charging module connection portion 230 of the flexible circuit board 200 is set at an angle to the motherboard connection portion 210, so that the bending portion 220 has a certain curved shape, so that the bending portion 220 can be better connected to the charging module connection portion 230 and the motherboard connection portion 210.

[0043] In some embodiments, along the second direction Y, the dimension L3 of the bending portion 220 ranges from not less than 2.5 mm to not more than 4.5 mm. Specifically, the dimension L3 of the bending portion 220 can be, but is not limited to, 2.5 mm, 2.7 mm, 2.9 mm, 3.0 mm, 3.1 mm, 3.3 mm, 3.5 mm, 4 mm, 4.3 mm, or 4.5 mm. Thus, the dimension L3 of the bending portion 220 is within the range of 2.5 mm to 4.5 mm, ensuring that the bending portion 220 has sufficient strength and flexibility, thereby enabling the flexible circuit board 200 to maintain good electrical performance and mechanical strength after bending.

[0044] In addition, the L3 dimension of the bending portion 220 is between 2.5mm and 4.5mm, ensuring that the bending portion 220 has good flexibility to withstand multiple bends, while avoiding offset and space waste caused by an excessively large L3 dimension of the bending portion 220.

[0045] Please see Figure 4 and Figure 5 In some embodiments, the flexible circuit board 200 may have a clearance area 201, which may be located at the connection between the charging module connection portion 230 and the motherboard connection portion 210. The clearance area 201 can provide additional space for other components of the earphone 10, making the layout of various components inside the earphone 10 more flexible, thereby helping to arrange the various components inside the earphone 10 more compactly.

[0046] The avoidance area 201 can be in the shape of a semicircle, trapezoid, or ellipse, and the size of the avoidance area 201 can be adjusted according to actual needs.

[0047] Both the clearance area 201 and the bending portion 220 are located at the connection between the charging module connection portion 230 and the motherboard connection portion 210, so that the clearance area 201 can provide a certain amount of space for the bending portion 220, allowing the flexible circuit board 200 to move freely within a limited space, and also reducing interference with other components (such as the earphone's rechargeable battery, microphone, antenna, etc.).

[0048] Furthermore, due to the limited internal space of the earphone 10, the various components of the earphone 10 will fit together quite tightly, and there may be slight dimensional differences between the components. The clearance area 201 can also provide a buffer for some tolerances during the assembly process of the various components, thereby further helping the various components inside the earphone 10 to fit together tightly.

[0049] The avoidance area 201 and the bending portion 220 can be arranged sequentially along the second direction Y. That is, the avoidance area 201 and the bending portion 220 can be arranged along the width of the flexible circuit board 200, so that the avoidance area 201 can be located on both sides or around the bending portion 220.

[0050] The avoidance area 201 can provide a certain amount of space for the bending part 220 to move. The avoidance area 201 is adjacent to the bending part 220, so that the avoidance area 201 provides additional space buffer for the bending part 220, allowing the bending part 220 to bend more freely within a limited space, and can be fine-tuned in multiple directions.

[0051] In some embodiments, the avoidance area 201 may include a first sub-avoidance area 202, a second sub-avoidance area 203, and a third sub-avoidance area 204. The first sub-avoidance area 202, the second sub-avoidance area 203, and the third sub-avoidance area 204 may be interconnected and together form the avoidance area 201. The charging module connection portion 230 may have a first sub-avoidance area 202 on the side near the motherboard connection portion 210, the bending portion 220 may have a second sub-avoidance area 203, and the motherboard connection portion 210 may have a third sub-avoidance area 204 on the side near the charging module connection portion 230.

[0052] The first sub-avoidance area 202 and the third sub-avoidance area 204 can provide additional space buffer for the connection between the charging module connection part 230 and the motherboard connection part 210, so that the charging module connection part 230 and the motherboard connection part 210 can maintain an appropriate distance during bending, avoiding direct physical contact, so that the charging module connection part 230 and the motherboard connection part 210 will not interfere with each other during the bending of the flexible circuit board 200.

[0053] The second sub-avoidance area 203 provides more room for movement for the bending portion 220. Specifically, the second sub-avoidance area 203 is located on both sides of the bending portion 220 along the second direction Y, ensuring that the bending portion 220 can bend more freely within a limited space and can be fine-tuned in multiple directions.

[0054] Please see Figure 2 and Figure 3 In some embodiments, the earphone 10 may also include a reinforcing member 300, the overall shape of which may be generally plate-shaped or block-shaped. The shape of the reinforcing member 300 may be adapted to the shape of the motherboard connection portion 210, so that the reinforcing member 300 can better cooperate with the motherboard connection portion 210.

[0055] The reinforcing member 300 can be disposed on the motherboard connection portion 210 and avoid the connection point between the motherboard 120 and the motherboard connection portion 210. Specifically, the reinforcing member 300 can be disposed on the surface of the motherboard connection portion 210. The reinforcing member 300 can avoid the connection point between the motherboard 120 and the motherboard connection portion 210. For example, the reinforcing member 300 can have mounting through holes that extend through both opposite sides of the reinforcing member 300, and these through holes can be used to accommodate conductive structures (such as conductive wires or conductive springs) between the motherboard 120 and the motherboard connection portion 210; or, for example, the conductive structures between the motherboard 120 and the motherboard connection portion 210 and the reinforcing member 300 are located on opposite sides of the motherboard connection portion 210. In this way, the reinforcing member 300 can provide additional support and protection for the motherboard connection portion 210 without affecting the electrical connection between the motherboard connection portion 210 and the motherboard 120.

[0056] In some embodiments, the reinforcement 300 may be located on the side of the motherboard connection portion 210 away from the motherboard 120. By placing the reinforcement 300 on the side of the motherboard connection portion 210 away from the motherboard 120, additional protection can be provided without interfering with the electrical connection between the motherboard connection portion 210 and the motherboard 120, allowing the reinforcement 300 to absorb and disperse the stress on the motherboard connection portion 210.

[0057] In some embodiments, the motherboard connector 210 and the motherboard 120 are stacked, that is, the motherboard connector 210 and the motherboard 120 can be arranged in parallel or approximately parallel, so that the arrangement of the motherboard connector 210 and the motherboard 120 is more regular, which helps to improve the space utilization inside the headphone 10, and thus helps to provide more usable space for other components of the headphone 10.

[0058] Please see Figure 4 In some embodiments, the included angle θ formed by the motherboard connection portion 210 and the charging module connection portion 230 is not less than 80 degrees and not greater than 100 degrees. For example, the included angle formed by the motherboard connection portion 210 and the charging module connection portion 230 can be, but is not limited to, 80 degrees, 82 degrees, 84 degrees, 86 degrees, 88 degrees, 90 degrees, 92 degrees, 94 degrees, 96 degrees, 98 degrees, or 100 degrees. Thus, the included angle formed by the motherboard connection portion 210 and the charging module connection portion 230 is between 80 degrees and 100 degrees, which helps to reduce the size of the flexible circuit board 200 in the first direction X after bending, so that the flexible circuit board 200 can better cooperate with the housing 110, the charging module 130, and the motherboard 120.

[0059] Please see Figure 3 and Figure 6In some embodiments, the motherboard 120 may be provided with an elastic connecting piece 400, and the motherboard 120 may be soldered to the elastic connecting piece 400. The motherboard 120 can abut against the motherboard connection portion 210 through the elastic connecting piece 400, so that the motherboard 120 is electrically connected to the motherboard connection portion 210, thereby helping to reduce the soldering process between the motherboard 120 and the motherboard connection portion 210.

[0060] Please see Figure 5 and Figure 6 In some embodiments, the charging module connection portion 230 may be provided with a first positioning hole 231, the motherboard 120 may be provided with a second positioning hole 121, and the housing 110 may be provided with a positioning post (not shown in the figure). The positioning post may pass through the first positioning hole 231 and the second positioning hole 121. The overall outline of the positioning post may be approximately cylindrical or cuboid. The shapes of the first positioning hole 231 and the second positioning hole 121 may be adapted to the shapes of the positioning post. The positioning post may be interference-fitted with the first positioning hole 231 and the second positioning hole 121. Thus, the positioning post passing through the first positioning hole 231 and the second positioning hole 121 helps reduce the risk of loosening or displacement of the motherboard 120 and the motherboard connection portion 210 during the use of the earphone 10, ensuring a stable connection between the motherboard 120 and the motherboard connection portion 210, thereby enhancing the overall reliability and performance stability of the earphone 10.

[0061] Furthermore, since the positioning pins pass through the first positioning hole 231 and the second positioning hole 121, the motherboard 120 and the motherboard connection part 210 can be quickly positioned by the positioning pins during the assembly of the earphone 10, which helps to improve the assembly efficiency of the earphone 10.

[0062] In some embodiments, the earphone body 100 may further include a rechargeable battery, which may be electrically connected to components such as the motherboard 120 and the charging module 130. The rechargeable battery may be a lithium-ion battery; or, the rechargeable battery may be a lithium-ion battery. The rechargeable battery may be disposed within the housing 110 to provide the electrical power required for the earphone 10 to operate.

[0063] Please see Figure 1 , Figure 7 and Figure 8 This invention also proposes an earphone device 20, which may include earphones 10 and a charging cable 30. The charging cable 30 is electrically connected to a charging module 130. When the earphones 10 need to be charged, the charging module 130 of the earphones 10 can be connected to an external power source through the charging cable 30; when the earphones 10 do not need to be charged, the earphones 10 are detached from the charging cable 30.

[0064] In some embodiments, the charging cable 30 includes a housing 500 and a connecting module 600, which can be installed inside the housing 500. When the charging cable 30 is electrically connected to the charging module 130, the connecting module 600 is also electrically connected to the charging module 130.

[0065] The connection module 600 includes a second mounting bracket 610 and a second pin component 620. The second mounting bracket 610 can be connected to the housing 500, and the second pin component 620 is mounted on the second mounting bracket 610. The second pin component 620 can be made of metal and can be composed of spring pins, PIN pins, or elastic sheets, etc. The second pin component 620 can be exposed outside the housing 500. When the earphone 10 needs to be charged, the second pin component 620 can be electrically connected to the first pin component 132.

[0066] In some embodiments, the first mounting bracket 131 may include a first magnetic member 133, which can be connected to the housing 110, and the first pin member 132 can be mounted on the first magnetic member 133. The second mounting bracket 610 may include a second magnetic member 630, which can be connected to the housing 500, and the second pin member 620 can be mounted on the second magnetic member 630. When the earphone 10 needs to be charged, the first magnetic member 133 and the second magnetic member 630 magnetically engage, and the first pin member 132 abuts against the second pin member 620, so that the first pin member 132 can be stably electrically connected to the second pin member 620.

[0067] There are multiple ways in which the first magnetic attractor 133 and the second magnetic attractor 630 can be magnetically attracted together. For example, the first magnetic attractor 133 and the second magnetic attractor 630 can be magnets with opposite magnetic poles, so that the first magnetic attractor 133 and the second magnetic attractor 630 can be magnetically attracted together.

[0068] For example, the first magnetic attractor 133 may include a first magnetic attracting part and a second magnetic attracting part connected together, with the magnetic poles of the first magnetic attracting part and the second magnetic attracting part having opposite magnetic poles. The second magnetic attractor 630 may include a third magnetic attracting part and a fourth magnetic attracting part connected together, with the magnetic poles of the third magnetic attracting part and the fourth magnetic attracting part having opposite magnetic poles. The magnetic poles of the first magnetic attracting part and the third magnetic attracting part are the same, and the magnetic poles of the second magnetic attracting part and the fourth magnetic attracting part are the same. The first magnetic attracting part and the fourth magnetic attracting part are magnetically engaged, and the second magnetic attracting part can be magnetically engaged with the third magnetic attracting part, thereby helping to improve the connection stability of the first magnetic attractor 133 and the second magnetic attractor 630. In addition, the arrangement of the magnetic poles can be used to prevent structural errors. For example, an attraction effect will only occur when the first magnetic attractor 133 and the second magnetic attractor 630 are brought close together with the correct magnetic pole direction, while the wrong direction will cause repulsion, thus prompting the user to adjust the orientation of the first magnetic attractor 133 or the second magnetic attractor 630.

[0069] In some embodiments, the surface of the first magnetic member 133 may be coated with an epoxy insulating layer, thereby helping to prevent a short circuit between the first lead member 132 and the first magnetic member 133. The surface of the second magnetic member 630 may also be coated with an epoxy insulating layer, thereby helping to prevent the risk of a short circuit between the second lead member 620 and the second magnetic member 630.

[0070] The specific structure of the earphone 10 is as described in the above embodiments. Since the earphone device 20 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0071] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0072] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An earphone, characterized in that, include: The earphone body includes a shell, a motherboard, and a charging module, wherein the motherboard and the charging module are both disposed within the shell; as well as A flexible circuit board is disposed within the housing. The flexible circuit board includes a motherboard connection portion, a bending portion, and a charging module connection portion connected sequentially along a first direction. The motherboard connection portion is electrically connected to the motherboard, and the charging module is electrically connected to the charging module connection portion. The motherboard connection portion and the charging module connection portion are arranged at an angle. Along a second direction that is at an angle to the first direction, the dimensions of both the motherboard connection portion and the charging module connection portion are larger than the dimensions of the bending portion.

2. The headphones as described in claim 1, characterized in that, Along the second direction, the size of the bent portion is not less than 2.5 mm and not more than 4.5 mm.

3. The headphones as described in claim 1, characterized in that, The flexible circuit board has a clearance area located at the connection between the charging module connection part and the motherboard connection part. The clearance area and the bending part are arranged sequentially along the second direction.

4. The headphones as described in claim 3, characterized in that, The charging module connection part has a first sub-avoidance area on the side near the motherboard connection part, the bending part has a second sub-avoidance area, and the motherboard connection part has a third sub-avoidance area on the side near the charging module connection part. The first sub-avoidance area, the second sub-avoidance area, and the third sub-avoidance area are interconnected and together form the avoidance area.

5. The headphones as described in any one of claims 1 to 4, characterized in that, The earphone also includes a reinforcing member, which is disposed on the motherboard connection portion and avoids the connection between the motherboard and the motherboard connection portion.

6. The headphones as described in claim 5, characterized in that, The reinforcing member is located on the side of the motherboard connection portion opposite to the motherboard.

7. The headphones as described in any one of claims 1 to 4, characterized in that, The motherboard connector and the motherboard are stacked together.

8. The headphones as described in any one of claims 1 to 4, characterized in that, The included angle formed by the motherboard connection part and the charging module connection part is not less than 80 degrees and not greater than 100 degrees.

9. The headphones as claimed in any one of claims 1 to 4, characterized in that, The charging module connection part is provided with a first positioning hole, the motherboard is provided with a second positioning hole, and the housing is provided with a positioning post, which passes through the first positioning hole and the second positioning hole.

10. A headphone device, characterized in that, include: The headphones according to any one of claims 1 to 9; as well as A charging cable that can be electrically connected to the charging module.

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