Eutectic welding structure of multi-chip integrated LED patch

Abstract

The utility model provides an eutectic welding structure of a multi-chip integrated LED patch, which comprises an LED welding circuit board, the LED welding circuit board comprises a substrate body, a plurality of supporting strips are arranged at the bottom of the substrate body, a bottom plate is arranged among the four supporting strips, and a welding groove is arranged in the bottom plate. The welding points are separated from the substrate body through the supporting strips and the bottom plate which are arranged under the substrate body, so that the LED patch body is separated from the welding points of the substrate, and the situation that heat is directly transmitted to the substrate body, the substrate body is heated unevenly, so that a welding layer is cracked or an interface is layered, the structural reliability is reduced, and the service life of the substrate is prolonged is avoided. Especially under a temperature cycle working condition, fatigue accumulation of a welding surface accelerates damage of a substrate body.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the eutectic welding technical field, concretely relates to a kind of eutectic welding structure of multi-chip integrated LED patch. BACKGROUND

[0002] Eutectic welding structure is a kind of interconnection technology that realizes the metallurgical connection between semiconductor device (such as LED chip) and substrate (such as ceramic substrate, metal substrate, etc.) by eutectic alloy material. The core is to use a specific proportion of metal alloy to occur eutectic reaction at eutectic temperature, form low-melting-point, high-thermal-conductivity, high-conductivity solid-state welding layer, so as to realize the mechanical fixation, electrical interconnection and high-efficiency heat dissipation between chip and substrate.

[0003] However, when connecting LED patch and substrate by eutectic welding, the welding point will appear high temperature, and the temperature difference of both sides of the substrate is large during the welding process, which is easy to cause cracks in the interior or surface of the substrate. UTILITY MODEL CONTENT

[0004] PURPOSE OF THE UTILITY MODEL

[0005] In view of the above technical problems, the utility model provides a kind of eutectic welding structure of multi-chip integrated LED patch to solve the technical problems mentioned in the background art.

[0006] TECHNICAL SCHEME

[0007] In order to achieve the above purpose, the utility model provides a kind of eutectic welding structure of multi-chip integrated LED patch, which comprises an LED welding circuit board, and the top of the LED welding circuit board is provided with an LED structure.

[0008] The LED welding circuit board comprises a substrate body, a support strip is arranged at the bottom of the substrate body, the number of the support strips is multiple, a bottom plate is arranged between four support strips, and a welding groove is formed in the inside of the bottom plate.

[0009] Preferably, side edge strips are arranged at both sides of the top of the substrate body, the number of the side edge strips is multiple, the side edge strips are arranged in U shape, and heat dissipation grooves are formed between the side edge strips and the substrate body.

[0010] Preferably, a fitting strip is arranged at the inside of the side edge strip, an auxiliary groove is formed at the inside of the fitting strip, and a plug hole is formed in the inside of the substrate body.

[0011] Preferably, the LED structure comprises an LED patch body, and pin bodies are arranged at the bottom of the LED patch body, and the number of the pin bodies is two.

[0012] Preferably, the needle body penetrates the auxiliary groove, the insertion hole and the welding groove, and a welding point is arranged between the needle body and the welding groove.

[0013] Advantages

[0014] Compared with the prior art, the technical scheme of the utility model has the following advantages:

[0015] The support strip and the bottom plate arranged directly below the substrate body separate the welding point from the substrate body, so that the welding point of the LED patch body and the substrate is separated, direct heat transfer to the substrate body is avoided, non-uniform heating of the substrate body is avoided, cracking or interface delamination of the welding layer is avoided, and the structural reliability is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a perspective view of the utility model;

[0017] Fig. 2 It is a perspective view of the LED welding circuit board of the utility model;

[0018] Fig. 3 It is a perspective view of the LED structure of the utility model.

[0019] REFERENCE NUMERALS

[0020] 1, LED welding circuit board; 101, substrate body; 102, side edge strip; 103, bonding strip; 104, auxiliary groove; 105, insertion hole; 106, support strip; 107, bottom plate; 108, heat dissipation groove; 109, welding groove; 2, LED structure; 201, LED patch body; 202, needle body; 203, welding point. DETAILED DESCRIPTION

[0021] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise", "coaxial", "bottom", "one end", "top", "the other end", "one side", "front", "both ends", "both sides" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as a limitation on the utility model. The device or element indicated or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0022] In addition, the terms "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" are only used for descriptive purposes and are not to be construed as indicating or implying relative importance or a specific number of the indicated technical features. Therefore, the features defined with "first", "second", "third", "fourth", "fifth", "sixth", "seventh" and "eighth" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more than two, unless otherwise specifically defined.

[0023] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing", "providing" and other terms should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0024] Reference will now be made to the drawings, wherein the purpose of the drawings shown is only to show certain exemplary embodiments, and is not intended to limit the present application. In the drawings, the same reference signs represent the same or corresponding parts. The size and proportion in the drawings are only for illustration, and should not be interpreted as a limitation of the present application, and these sizes may be exaggerated relative to the actual product.

[0025] Referring to Figs. 1-3 , a kind of multi-chip integrated LED patching eutectic welding structure shown in the drawing, including LED welding circuit board 1, the top of the LED welding circuit board 1 is provided with LED structure 2;

[0026] The utility model provides a LED welding circuit board 1, it includes the substrate body 101, the bottom of substrate body 101 is provided with support strip 106, the number of support strip 106 is provided with multiple, the bottom plate 107 is provided with between four support strip 106, the inside of bottom plate 107 is provided with welding groove 109, the both sides of substrate body 101 top are provided with side edge strip 102, the number of side edge strip 102 is provided with multiple, side edge strip 102 is provided with the heat dissipation groove between substrate body 101, the inside of side edge strip 102 is provided with the fit strip 103, the inside of fit strip 103 is provided with auxiliary groove 104, the inside of substrate body 101 is provided with jack 105, when needing to install LED structure 2 on the outer wall of substrate body 101, LED structure 2 is placed into the inside of side edge strip 102, then the bottom of LED structure 2 is attached with fit strip 103, then the air of outside can be contacted with the top and bottom of substrate body 101 through the gap between heat dissipation groove 108 and bottom plate 107 and substrate body 101 between during the process of connecting substrate body 101 and LED structure 2, the heat generated during the process of connecting is driven, avoids the surface delamination or damage after substrate body 101 is heated.

[0027] Further, in the above technical solution, the LED structure 2 includes an LED patch body 201, the bottom of the LED patch body 201 is provided with a pin body 202, the number of the pin body 202 is two, the pin body 202 penetrates the auxiliary groove 104, the jack 105 and the welding groove 109, the pin body 202 and the welding groove 109 are provided with a welding point 203, the bottom of the LED patch body 201 is attached with the top of the fit strip 103, then the pin body 202 is inserted into the auxiliary groove 104, the jack 105 and the inside of the support strip 106 in turn, at the same time, the outer wall of the pin body 202 is attached with the inner wall of the jack 105, then the welding point 203 is connected between the pin body 202 and the welding groove 109, the welding point 203 is composed of two or more metals in a specific ratio, such as Au-Sn, Ag-Sn, Cu-Sn, etc., has the lowest melting point characteristics of eutectic point, for example, the melting point of Au-Sn eutectic alloy is 280°C, at the eutectic temperature, it will directly change from solid to liquid, after cooling, a dense intermetallic compound layer is formed, the metallurgical bonding layer formed after the welding point 203 is melted, has the functions of electrical conductivity, thermal conductivity and mechanical support.

[0028] The above-described embodiments only express certain implementation manners of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the scope of the present application; it should be pointed out that, for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application; therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A eutectic bonding structure for multi-chip integrated LED chips, characterized in that, include LED welding circuit board (1), the top of which is provided with LED structure (2); LED welding circuit board (1) includes a substrate body (101), a support strip (106) is provided at the bottom of the substrate body (101), the number of the support strip (106) is set to multiple, a base plate (107) is provided between the four support strips (106), and a welding groove (109) is opened inside the base plate (107).

2. The eutectic bonding structure for a multi-chip integrated LED chip according to claim 1, characterized in that: Side strips (102) are provided on both sides of the top of the substrate body (101). The number of side strips (102) is set to multiple. The side strips (102) are set to U-shape. A heat dissipation groove is provided between the side strips (102) and the substrate body (101); (108).

3. The eutectic bonding structure for a multi-chip integrated LED chip according to claim 2, characterized in that: The inner side of the side strip (102) is provided with an adhesive strip (103), the inner side of the adhesive strip (103) is provided with an auxiliary groove (104), and the interior of the substrate body (101) is provided with an insertion hole (105).

4. The eutectic bonding structure for multi-chip integrated LED chips according to claim 1, characterized in that: The LED structure (2) includes an LED patch body (201), and a needle-shaped body (202) is provided at the bottom of the LED patch body (201). The number of needle-shaped bodies (202) is set to two.

5. The eutectic bonding structure for a multi-chip integrated LED chip according to claim 4, characterized in that: The needle body (202) passes through the auxiliary groove (104), the insertion hole (105) and the welding groove (109), and a welding point (203) is provided between the needle body (202) and the welding groove (109).

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