Heat dissipation assembly and heat exchanger
By combining a phase change working fluid and a coolant in a sealed cavity, the thermal management problem under high heat flux density is solved, achieving two-stage rapid heat dissipation and improving heat dissipation efficiency and effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2026-04-07
AI Technical Summary
Existing technologies are insufficient to effectively address the thermal management requirements under high heat flux densities, especially in highly integrated electronic systems within limited spaces, where traditional air cooling and liquid cooling solutions are inadequate to meet heat dissipation needs.
The heat dissipation assembly includes a cooling plate, heat dissipation shell, evaporation structure, condensation structure and support structure. It achieves two-stage rapid heat dissipation through the phase change process of the phase change working fluid in the sealed cavity, and the flow of coolant carries away the heat.
It achieves efficient two-stage heat dissipation, improves heat dissipation efficiency, enhances heat dissipation effect, and meets the thermal management requirements under high heat flux density.
Smart Images
Figure CN224098031U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to heat exchange technical field, specifically, relate to a heat dissipation assembly and heat exchanger. BACKGROUND
[0002] In recent years, with the rapid development of electronic technology, the vehicle-mounted electronic system is accelerating to high integration, miniaturization architecture evolution, and the key components such as intelligent driving domain controller, SiC / IGBT power module, vehicle-mounted charger (OBC) are facing severe challenges in heat management under the constraint of limited space. Especially when multiple high-power chips are densely arranged on a single PCB, a large amount of heat will be generated inside these chips, causing the working temperature to rise, which not only affects the performance and reliability, but also shortens the service life, far exceeding the heat dissipation limit of traditional air cooling. At the same time, even the conventional liquid cooling scheme is difficult to effectively cope with the heat management needs of electronic chips under high heat flux.
[0003] Therefore, it is particularly important to design and manufacture a heat dissipation assembly and heat exchanger with high heat dissipation efficiency and good heat dissipation effect in heat management. SUMMARY
[0004] The utility model discloses a heat dissipation assembly, which can realize two-stage rapid heat dissipation, improve heat dissipation efficiency, enhance heat dissipation effect, and meet the heat management needs under high heat flux.
[0005] Another purpose of the utility model is to provide a heat exchanger, which can realize two-stage rapid heat dissipation, improve heat dissipation efficiency, enhance heat dissipation effect, and meet the heat management needs under high heat flux.
[0006] The utility model discloses the following technical scheme.
[0007] A heat dissipation assembly includes a cooling plate, a heat dissipation shell, an evaporation structure, a condensation structure, and a support structure. The heat dissipation shell is connected to the cooling plate and forms a sealed cavity with the cooling plate. The sealed cavity is used to package phase change working medium. The evaporation structure, the condensation structure, and the support structure are all arranged in the sealed cavity. The support structure is arranged between the evaporation structure and the condensation structure. The evaporation structure is arranged close to the heat dissipation shell, and the condensation structure is arranged close to the cooling plate. The evaporation structure and the condensation structure are used to transfer heat from the heat dissipation shell to the cooling plate through phase change working medium. The cooling plate has a flow channel for the flow of cooling liquid to carry away the heat transferred to the cooling plate.
[0008] Optionally, the evaporation structure and the condensation structure are both in the form of a mesh plate. The evaporation structure is arranged in close contact with the heat dissipation shell, and the condensation structure is arranged in close contact with the cooling plate.
[0009] Optionally, the evaporation structure is arranged on the heat dissipation shell, and the condensation structure is arranged on the cooling plate.
[0010] Optionally, the support structure comprises a plurality of support columns, the plurality of support columns are arranged at intervals, one end of the support column abuts against the evaporation structure, and the other end abuts against the condensation structure.
[0011] Optionally, a plurality of grooves are formed in the circumferential surface of the support column, the plurality of grooves are arranged at intervals, the extension direction of the groove is from the evaporation structure to the condensation structure, and the groove is used for flowing the phase change working medium.
[0012] Optionally, the support column is in the shape of a truncated cone, the support column oppositely has a large end and a small end, the large end abuts against the condensation structure, and the small end abuts against the evaporation structure.
[0013] Optionally, the support structure further comprises a fixing plate, the plurality of support columns are connected to the fixing plate, the fixing plate is provided with a plurality of through holes, the plurality of through holes are arranged at intervals, and the through hole is used for flowing the phase change working medium.
[0014] Optionally, the heat dissipation assembly further comprises a partition plate, the partition plate is arranged in the sealed cavity, and the partition plate is used for dividing the sealed cavity into at least two sub-cavities.
[0015] Optionally, the heat dissipation assembly further comprises a bottom plate, one side of the bottom plate is connected with the heat dissipation shell, and the other side is connected with the cooling plate.
[0016] A heat exchanger comprises the heat dissipation assembly, the heat dissipation assembly comprises a cooling plate, a heat dissipation shell, an evaporation structure, a condensation structure and a support structure, the heat dissipation shell is connected to the cooling plate and surrounds a sealed cavity together with the cooling plate, the sealed cavity is used for packaging a phase change working medium, the evaporation structure, the condensation structure and the support structure are arranged in the sealed cavity, the support structure is arranged between the evaporation structure and the condensation structure, the evaporation structure is arranged close to the heat dissipation shell, the condensation structure is arranged close to the cooling plate, and the evaporation structure and the condensation structure are used for transmitting heat of the heat dissipation shell to the cooling plate through the phase change working medium.
[0017] The heat dissipation assembly and the heat exchanger have the following beneficial effects:
[0018] The heat dissipation assembly provided by this utility model has a heat dissipation shell connected to a cooling plate, forming a sealed cavity together with the cooling plate. This sealed cavity encapsulates a phase change working fluid. An evaporation structure, a condensation structure, and a support structure are all disposed within the sealed cavity, with the support structure positioned between the evaporation and condensation structures. The evaporation structure is located close to the heat dissipation shell, and the condensation structure is located close to the cooling plate. The evaporation and condensation structures work together to transfer heat from the heat dissipation shell to the cooling plate via the phase change working fluid. The cooling plate has flow channels for coolant flow to carry away the heat transferred to it. Compared to existing technologies, the heat dissipation assembly provided by this utility model, due to the use of an evaporation structure, a condensation structure, and a support structure disposed within the sealed cavity, as well as a cooling plate connected to the heat dissipation shell, achieves two-stage rapid heat dissipation, improving heat dissipation efficiency and enhancing the heat dissipation effect, thus meeting the thermal management requirements under high heat flux density.
[0019] The heat exchanger provided by this utility model includes a heat dissipation component, which can achieve two-stage rapid heat dissipation, improve heat dissipation efficiency, enhance heat dissipation effect, and meet the thermal management requirements under high heat flux density. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the heat dissipation assembly provided in the first embodiment of the present invention;
[0022] Figure 2 A cross-sectional view of the heat dissipation assembly provided in the first embodiment of this utility model;
[0023] Figure 3 for Figure 2 A magnified view of a section of section III;
[0024] Figure 4 This is a schematic diagram of the support structure in the heat dissipation assembly provided in the second embodiment of the present invention;
[0025] Figure 5 This is a schematic diagram of the connection between the partition plate and the heat dissipation shell in the heat dissipation assembly provided in the third embodiment of the present invention;
[0026] Figure 6 This is a schematic diagram of the connection between the base plate and the heat dissipation shell in the heat dissipation assembly provided in the fourth embodiment of the present invention.
[0027] Icons: 100-Heat dissipation component; 110-Cooling plate; 120-Heat dissipation shell; 130-Evaporation structure; 140-Condensation structure; 150-Support structure; 151-Support column; 152-Groove; 153-Large end; 154-Small end; 155-Fixing plate; 156-Through hole; 160-Sealed cavity; 161-Sub-cavity; 170-Partition; 180-Base plate; 200-Component to be cooled. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0031] In the description of this utility model, it should be noted that the terms "inner," "outer," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0032] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," "installed," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0033] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the features in the following embodiments can be combined with each other.
[0034] First Embodiment
[0035] Please refer to the reference. Figures 1 to 3 This utility model provides a heat exchanger (not shown) for heat exchange. It can achieve two-stage rapid heat dissipation, improve heat dissipation efficiency, enhance heat dissipation effect, and meet the thermal management requirements under high heat flux density.
[0036] The heat exchanger includes a heat dissipation assembly 100 and a cooling assembly (not shown). The heat dissipation assembly 100 includes a cooling plate 110, which is connected to the cooling assembly. The cooling plate 110 and the cooling assembly are used for circulating coolant, and the cooling assembly is used to cool the coolant. Specifically, during the heat dissipation process of the heat dissipation assembly 100, the coolant in the cooling plate 110 absorbs heat and its temperature rises. The cooled coolant then flows to the cooling assembly, which cools the coolant and allows the cooled coolant to flow back to the cooling plate 110.
[0037] The heat dissipation assembly 100 includes a cooling plate 110, a heat dissipation shell 120, an evaporation structure 130, a condensation structure 140, and a support structure 150. The heat dissipation shell 120 is connected to the cooling plate 110 (by welding or bonding, etc.) and together with the cooling plate 110, forms a sealed cavity 160. The sealed cavity 160 is used to encapsulate the phase change working fluid. The side of the heat dissipation shell 120 away from the cooling plate 110 is connected to the heat-dissipating component 200. In this embodiment, the heat-dissipating component 200 is a chip, which is attached to the heat dissipation shell 120. The heat generated by the chip during operation can be transferred to the heat dissipation shell 120 through heat transfer, thereby raising the temperature of the heat dissipation shell 120. However, this is not the only possibility; in other embodiments, the heat-dissipating component 200 can also be other heat sources, and the type of heat-dissipating component 200 is not specifically limited.
[0038] It should be noted that the evaporation structure 130, the condensation structure 140, and the support structure 150 are all disposed within the sealed cavity 160. The support structure 150 is disposed between the evaporation structure 130 and the condensation structure 140. The evaporation structure 130 is disposed close to the heat dissipation shell 120, and the condensation structure 140 is disposed close to the cooling plate 110. That is, the evaporation structure 130 is located on the evaporation side of the sealed cavity 160, and the condensation structure 140 is located on the condensation side of the evaporation cavity. The support structure 150 is used to support both the evaporation structure 130 and the condensation structure 140 simultaneously, thereby separating the evaporation structure 130 and the condensation structure 140. The evaporation structure 130 and the condensation structure 140 are used together to transfer the heat from the heat dissipation shell 120 to the cooling plate 110 through the phase change working fluid. Specifically, when the heat from the heat sink 120 is conducted to the evaporation structure 130, the phase change working fluid in the sealed cavity 160 begins to vaporize after being heated in the low vacuum environment. At this time, the phase change working fluid absorbs heat energy and expands rapidly, causing the gaseous phase change working fluid to quickly fill the entire sealed cavity 160. When the gaseous phase change working fluid comes into contact with a cooler area, it begins to condense and releases the heat accumulated during evaporation. After condensation, the liquid phase change working fluid flows back to the evaporation structure 130 through the condensation structure 140. This cycle repeats to achieve primary heat dissipation for the heat sink 120.
[0039] Furthermore, during the condensation of the gaseous phase change working fluid, the heat released can be transferred to the cooling plate 110 via heat transfer. The cooling plate 110 has flow channels for coolant flow, which carry away the heat transferred to the cooling plate 110, thus achieving secondary heat dissipation for the heat sink 120. In this way, through phase change heat dissipation of the phase change working fluid and water cooling heat dissipation of the coolant, two-stage rapid heat dissipation of the heat sink 200 can be achieved, improving heat dissipation efficiency, enhancing heat dissipation effect, and meeting the thermal management requirements under high heat flux density.
[0040] Preferably, both the evaporation structure 130 and the condensation structure 140 are in the form of a mesh plate; the evaporation structure 130 is fitted to the heat dissipation shell 120 to increase the contact area between the phase change working fluid and the heat dissipation shell 120, thereby improving the heat absorption performance and heat dissipation efficiency; the condensation structure 140 is fitted to the cooling plate 110 to increase the contact area between the phase change working fluid and the cooling plate 110, facilitating the rapid transfer of heat to the cooling plate 110, and further improving the heat dissipation efficiency.
[0041] In this embodiment, the evaporation structure 130 and the heat dissipation shell 120 are separately disposed and attached to each other; the condensation structure 140 and the cooling plate 110 are separately disposed and attached to each other. However, this is not the only embodiment. In other embodiments, the evaporation structure 130 can be directly disposed on the heat dissipation shell 120, that is, the evaporation structure 130 and the heat dissipation shell 120 are integrally formed; the condensation structure 140 can be directly disposed on the cooling plate 110, that is, the condensation structure 140 and the cooling plate 110 are integrally formed; the specific arrangement of the evaporation structure 130 and the condensation structure 140 is not specifically limited.
[0042] Preferably, the support structure 150 includes a plurality of support columns 151, which are spaced apart. One end of each support column 151 abuts against the evaporation structure 130 and the other end abuts against the condensation structure 140. The plurality of support columns 151 work together to ensure that the evaporation structure 130 and the condensation structure 140 are separated, thereby improving the structural strength, enhancing the pressure resistance, and not affecting the flow of the phase change working fluid, thus ensuring the heat dissipation effect.
[0043] Furthermore, the circumferential surface of the support column 151 is provided with multiple grooves 152, which are spaced apart. The extension direction of the grooves 152 is from the evaporation structure 130 to the condensation structure 140. The grooves 152 are used to supply the flow of the phase change working fluid, so as to shorten the return path of the phase change working fluid, accelerate the circulation of the phase change working fluid, improve the heat dissipation efficiency, and enhance the heat dissipation effect.
[0044] In this embodiment, the support column 151 is frustoconical in shape, with a large end 153 and a small end 154 arranged opposite to each other. The large end 153 abuts against the condensation structure 140, and the small end 154 abuts against the evaporation structure 130. A groove 152 is provided between the large end 153 and the small end 154 to facilitate the return of the liquid phase change working fluid on the condensation side to the evaporation side, thereby achieving rapid heat dissipation and improving heat dissipation efficiency.
[0045] The heat dissipation assembly 100 provided in this embodiment of the utility model has a heat dissipation shell 120 connected to a cooling plate 110, and together with the cooling plate 110, forming a sealed cavity 160. The sealed cavity 160 is used to encapsulate the phase change working fluid. An evaporation structure 130, a condensation structure 140, and a support structure 150 are all disposed within the sealed cavity 160. The support structure 150 is disposed between the evaporation structure 130 and the condensation structure 140. The evaporation structure 130 is disposed close to the heat dissipation shell 120, and the condensation structure 140 is disposed close to the cooling plate 110. The evaporation structure 130 and the condensation structure 140 are used together to transfer the heat of the heat dissipation shell 120 to the cooling plate 110 through the phase change working fluid. A flow channel is provided in the cooling plate 110 for the flow of coolant to carry away the heat transferred to the cooling plate 110. Compared with existing technologies, the heat dissipation assembly 100 provided by this utility model, due to the adoption of an evaporation structure 130, a condensation structure 140, and a support structure 150 disposed within a sealed cavity 160, as well as a cooling plate 110 connected to the heat dissipation shell 120, can achieve two-stage rapid heat dissipation, improve heat dissipation efficiency, enhance heat dissipation effect, and meet the thermal management requirements under high heat flux density. This results in a better heat dissipation effect for the radiator, meeting user needs.
[0046] Second Embodiment
[0047] Please refer to Figure 4 This utility model embodiment provides a heat dissipation component 100. Compared with the first embodiment, the difference in this embodiment lies in the different support structure 150.
[0048] In this embodiment, the support structure 150 further includes a fixing plate 155, and multiple support columns 151 are connected to the fixing plate 155. The fixing plate 155 and the support columns 151 are integrally formed, and the fixing plate 155 is used to position the multiple support columns 151. Furthermore, the fixing plate 155 has multiple through holes 156, which are spaced apart. The through holes 156 are used to allow the phase change working fluid to flow, so as to prevent the fixing plate 155 from blocking the phase change working fluid and to ensure the cooling effect.
[0049] In this embodiment, the support column 151 is cylindrical, with the same diameter at both ends. The support column 151 does not have grooves 152 on its circumference to reduce manufacturing costs.
[0050] The beneficial effects of the heat dissipation component 100 provided in this embodiment are the same as those in the first embodiment, and will not be repeated here.
[0051] Third Embodiment
[0052] Please refer to Figure 5 This utility model embodiment provides a heat dissipation component 100. Compared with the first embodiment, the difference in this embodiment is that the heat dissipation component 100 also includes a partition 170.
[0053] In this embodiment, the partition 170 is disposed in the sealed cavity 160 and connected to the heat dissipation housing 120. The partition 170 is used to divide the sealed cavity 160 into at least two sub-cavities 161. Each sub-cavity 161 is provided with an evaporation structure 130, a condensation structure 140 and a support structure 150. By separating the sealed cavity 160, the gas-liquid conversion efficiency can be enhanced, thereby improving the heat exchange performance of the heat dissipation component 100.
[0054] Specifically, there are two partitions 170 to divide the sealed cavity 160 into three sub-cavities 161, but this is not the only option. In other embodiments, there may be one or three partitions 170 to divide the sealed cavity 160 into two or four sub-cavities 161. The number of partitions 170 is not specifically limited.
[0055] The beneficial effects of the heat dissipation component 100 provided in this embodiment are the same as those in the first embodiment, and will not be repeated here.
[0056] Fourth embodiment
[0057] Please refer to Figure 6 This utility model embodiment provides a heat dissipation component 100. Compared with the first embodiment, the difference in this embodiment is that the heat dissipation component 100 also includes a base plate 180.
[0058] In this embodiment, one side of the base plate 180 is connected to the heat dissipation shell 120, and the other side is connected to the cooling plate 110, that is, the base plate 180 and the heat dissipation shell 120 together form a sealed cavity 160. In the production process, the heat dissipation shell 120, the evaporation structure 130, the condensation structure 140, the support structure 150 and the base plate 180 are first made into a heat spreader-like structure, and then the heat spreader structure is connected to the cooling plate 110 (by welding or bonding, etc.), which is convenient, quick and easy to produce.
[0059] The beneficial effects of the heat dissipation component 100 provided in this embodiment are the same as those in the first embodiment, and will not be repeated here.
[0060] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A heat dissipation component, characterized in that, The device includes a cooling plate, a heat dissipation shell, an evaporation structure, a condensation structure, and a support structure. The heat dissipation shell is connected to the cooling plate and together with the cooling plate forms a sealed cavity. The sealed cavity is used to encapsulate a phase change working fluid. The evaporation structure, the condensation structure, and the support structure are all disposed within the sealed cavity. The support structure is disposed between the evaporation structure and the condensation structure. The evaporation structure is disposed close to the heat dissipation shell, and the condensation structure is disposed close to the cooling plate. The evaporation structure and the condensation structure are used together to transfer the heat from the heat dissipation shell to the cooling plate through the phase change working fluid. The cooling plate has flow channels for the flow of coolant to carry away the heat transferred to the cooling plate.
2. The heat dissipation assembly according to claim 1, characterized in that, Both the evaporation structure and the condensation structure are in the form of a mesh plate. The evaporation structure is fitted to the heat dissipation shell, and the condensation structure is fitted to the cooling plate.
3. The heat dissipation assembly according to claim 1, characterized in that, The evaporation structure is disposed on the heat dissipation shell, and the condensation structure is disposed on the cooling plate.
4. The heat dissipation assembly according to claim 1, characterized in that, The support structure includes multiple support columns, which are spaced apart. One end of each support column abuts against the evaporation structure, and the other end abuts against the condensation structure.
5. The heat dissipation assembly according to claim 4, characterized in that, The support column has multiple grooves on its circumference, which are spaced apart. The grooves extend from the evaporation structure to the condensation structure and are used to supply the flow of the phase change working fluid.
6. The heat dissipation assembly according to claim 4, characterized in that, The support column is frustoconical in shape, with a large end and a small end opposite to each other. The large end abuts against the condensation structure, and the small end abuts against the evaporation structure.
7. The heat dissipation assembly according to claim 4, characterized in that, The support structure also includes a fixing plate, and multiple support columns are connected to the fixing plate. The fixing plate has multiple through holes, which are spaced apart and are used to allow the phase change working fluid to flow through.
8. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation assembly also includes a partition plate disposed within the sealed cavity, the partition plate being used to divide the sealed cavity into at least two sub-cavities.
9. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation assembly also includes a base plate, one side of which is connected to the heat dissipation housing and the other side is connected to the cooling plate.
10. A heat exchanger, characterized in that, Includes the heat dissipation component as described in any one of claims 1-9.