Sealing and curing device of semiconductor power module

Abstract

The utility model discloses a sealing and curing device for a semiconductor power module, which comprises at least one tray piece, a plurality of supporting plates, a plurality of sealing plates and a plurality of sealing plates, and is characterized in that a plurality of product grooves for placing products are formed in any tray piece at intervals; and the periphery of each product groove is rotationally connected with one pressing block, and the multiple pressing blocks can rotate by 360 degrees relative to the product grooves so as to press or loosen the products in the product grooves. According to the sealing and curing device provided by the utility model, the plurality of pressing blocks are arranged on the tray piece on which the plurality of products are placed, and each product is pressed by the four pressing blocks, so that the products can be limited and fixed, and the firmness of bonding between the shell and the substrate and the uniformity of a gap are ensured after the shell of the product is glued; the sealing and curing effect between the shell and the substrate of the product is further improved, and the structural performance of the product is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor power module packaging, especially relates to a sealing curing device of semiconductor power module. BACKGROUND

[0002] Semiconductor power module packaging is mainly divided into sintering, bonding, sealing curing, potting and other key production procedures. Among them, the sealing curing procedure is between the product shell and the substrate, which guarantees that there is no glue leakage phenomenon in the potting process of silicon gel. Among them, the sealing glue can be divided into normal temperature glue and high temperature glue, and the curing is divided into normal temperature curing and high temperature curing. In the sealing glue curing process, the sealing firmness between the product shell and the substrate and the gap consistency between the substrate and the shell after sealing curing are particularly important to product performance. If the gap between the shell and the substrate is inconsistent, cracks and other adverse phenomena will occur in the actual installation and application process of the product shell.

[0003] Therefore, it is necessary to further improve the current sealing curing structure. UTILITY MODEL CONTENT

[0004] Therefore, the utility model aims at solving the problems in the prior art to at least some extent, and provides a sealing curing device of semiconductor power module.

[0005] To achieve the above-mentioned purpose, one technical scheme of the utility model is as follows:

[0006] The utility model provides a sealing curing device of semiconductor power module, which comprises:

[0007] At least one tray piece, a plurality of product grooves for placing products are arranged on any tray piece;

[0008] A plurality of pressing blocks, one pressing block is rotatably connected to the periphery of each product groove, and the plurality of pressing blocks can rotate 360 degrees relative to the product groove to press or release the product in the product groove.

[0009] Further, one pressing block is arranged between every two spaced product grooves, and a protruding piece is arranged at the end of the pressing block extending towards the tray piece, so that when the pressing block rotates 360 degrees relative to the product groove, the protruding piece at the end of the pressing block can enter or move away from the two spaced product grooves for pressing or releasing the product.

[0010] Further, any one of the pressing blocks is rotatably connected to the tray member through a connecting member, the pressing block is provided with a first through hole, the tray member is provided with a second through hole matched with the first through hole, the connecting member is fixedly connected to the second through hole through the first through hole, and the pressing block can rotate relative to the connecting member.

[0011] Further, a spring member is sleeved on the part of the connecting member located in the first through hole of the pressing block, two ends of the spring member are respectively abutted against two ends inside the pressing block, and the pressing block can move up and down relative to the tray member through the spring member, so that the pressing block can press the product or move away from the product.

[0012] Further, the pressing block is further connected with a stop block, the pressing block is provided with a slot matched with the stop block, the stop block is arranged in the slot, the stop block is provided with a third through hole matched with the first through hole, and the connecting member penetrates the third through hole, the first through hole and the second through hole in sequence, so that the stop block is connected with the pressing block.

[0013] Further, a gasket is arranged between one end of the connecting member away from the tray member and exposed outside the pressing block and the spring member, the gasket is arranged in the third through hole and abutted against the slot of the pressing block, and the spring member can abut against the gasket through the first through hole.

[0014] Further, a plurality of heightening blocks are arranged at intervals around the tray member, when the protruding member at one end of the pressing block rotates 360° relative to the tray member and rotates to the periphery of the tray member, the protruding member abuts against the heightening block.

[0015] Further, a base and a supporting member are respectively connected to two ends of four corners of the tray member, and the base and the supporting member are connected.

[0016] Further, the tray member is further provided with at least two handles; and the tray member is further provided with a plurality of lightening grooves.

[0017] Further, the tray member is made of aluminum alloy, and the pressing block is made of Teflon.

[0018] The utility model provides a kind of sealing solidification device of semiconductor power module, comprising: at least one tray piece, multiple product slots for placing product are evenly spaced on any described tray piece;Multiple pressing blocks, the periphery of each described product slot is respectively rotationally connected with one described pressing block, multiple described pressing blocks can be 360 ° rotational movement relative to described product slot, to compress or loosen the product in described product slot.The sealing solidification device provided by the utility model, multiple pressing blocks are provided on the tray piece where multiple products are placed, and each product is compressed by four pressing blocks, which can limit and fix the product, ensure the firmness of adhesion between shell and substrate after shell is glued, and the uniformity of gap, further improve the sealing solidification effect between the shell and substrate of product, and ensure the structural performance of product. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the drawings needed to be used in the embodiment or prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to the structure shown in the drawings without creative labor for those skilled in the art.

[0020] Fig. 1 It is the whole structure schematic diagram of the sealing solidification device of semiconductor power module of the utility model;

[0021] Fig. 2 It is the overhead structure schematic diagram of the sealing solidification device of semiconductor power module of the utility model;

[0022] Fig. 3 It is the structure schematic diagram of the pressing block and the stop block connection of the sealing solidification device of semiconductor power module of the utility model;

[0023] Fig. 4 It is the stacking placement schematic diagram of the sealing solidification device of semiconductor power module of the utility model.

[0024] The reference signs in the drawing are shown as follows: 1, tray piece;11, base;12, support;13, handle;14, weight-reducing groove;2, product slot;3, product;4, pressing block;41, first through hole;42, slot;43, protruding piece;5, connecting piece;51, spring piece;52, gasket;6, stop block;61, third through hole;7, pad block. DETAILED DESCRIPTION

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] It should be noted that the descriptions involving "first," "second," etc., in this utility model are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0027] Please refer to Figs. 1 to 4 This utility model provides a sealing and curing device for a semiconductor power module, comprising:

[0028] At least one tray 1, and each tray 1 is provided with a plurality of product slots 2 for placing products 3 at intervals;

[0029] Multiple pressure blocks 4 are rotatably connected around the perimeter of each product groove 2. The multiple pressure blocks 4 can rotate 360° relative to the product groove 2 to press or release the product 3 in the product groove 2.

[0030] In this embodiment, the sealing and curing device for the semiconductor power module includes at least one tray 1, and each tray 1 has multiple product slots 2. The multiple product slots 2 are evenly spaced on the tray 1. The product slots 2 are used to limit the placement of the product 3 after the outer shell and the substrate are bonded, so as to ensure that the product 3 is in the specified position.

[0031] Specifically, each product slot 2 is connected to a pressure block 4 around its four sides. In this embodiment, the product slot 2 is rectangular, so a pressure block 4 is provided on each of the four sides of the rectangular product slot 2. The shape of the product slot 2 is not limited here. If the product slot 2 is polygonal, a pressure block 4 is connected to each side of the product slot 2 to press the product 3 in the product slot 2. The pressure block 4 is used to press the substrate of the product 3 to ensure the consistency of the gap between the substrate of the product 3 and the outer shell.

[0032] Specifically, the pressure block 4 is rotatably connected to the perimeter of the product groove 2 and can rotate 360° relative to the product groove 2 to press or release the product 3 within the product groove 2. When it is necessary to press the outer shell of the product 3 against the substrate, the pressure block 4 is rotated into the product groove 2 to press the outer shell of the product 3 against the substrate, ensuring a consistent gap between the substrate and the outer shell. When it is necessary to remove the pressed product 3 from the product groove 2, the pressure block 4 is simply rotated out of the product groove 2. That is, the sealing and curing device in this embodiment limits and fixes the product 3 by setting multiple pressure blocks 4, which can rotate 360° relative to the product groove 3, on the tray 1, ensuring a good sealing and curing effect between the outer shell of the product 3 and the substrate after the outer shell is coated with adhesive. In other words, this device ensures a good sealing effect between the outer shell of the product 3 and the substrate through a pressing structure design.

[0033] Specifically, the four corners of the tray 1 are respectively connected to the base 11 and the support 12, and the base 11 and the support 12 are connected.

[0034] In this embodiment, the bases 11 at the four corners of the tray 1 are used to support the tray 1, and the bases 11 are connected to the support members 12, so that the tray 1 can be stacked. The support members 12 can also play a supporting role. The support members 12 and the bases 11 are connected by hexagon socket head cap screws.

[0035] Specifically, the pallet component 1 is also provided with at least two handles 13; the pallet component 1 is also provided with multiple weight-reducing grooves 14.

[0036] In this embodiment, a handle 4 is provided on the pallet component 1, allowing the user to move the pallet component 1 using the handle 4. Providing multiple weight-reducing grooves 14 on the pallet component 1 ensures that the overall weight of the device is not excessive.

[0037] Specifically, pallet component 1 is made of aluminum alloy, and pressure block 4 is made of Teflon.

[0038] In this embodiment, the tray 1 is made of aluminum alloy to ensure that the weight of the entire device is not too heavy; the pressure block 4 is made of Teflon to ensure that the substrate of product 3 is not scratched under the action of pressure.

[0039] Furthermore, a pressure block 4 is provided between every two spaced product slots 2, and a protrusion 43 extends from both ends of the pressure block 4 toward the tray 1. When the pressure block 4 rotates 360° relative to the product slot 2, the protrusions 43 at both ends of the pressure block 4 can enter or move away from the two spaced product slots 2 to press or release the product 3.

[0040] In this embodiment, multiple product slots 2 on the tray 1 are spaced apart, and a pressure block 4 is provided between every two spaced product slots 2. A protrusion 43 is provided at each end of the pressure block 4. The two protrusions 43 of the pressure block 4 extend toward the tray 1, so that when the pressure block 4 presses the product 3, it presses the product 3 through the protrusions 43 at both ends of the pressure block 4.

[0041] Specifically, the pressure block 4 can rotate 360° relative to the product slot 2, and the pressure block 4 is positioned between the two product slots 2. When the pressure block 4 rotates 360°, the protrusions 43 at both ends of the pressure block 4 between the two product slots 2 can be rotated into the two spaced product slots 2 respectively, so that the two protrusions 43 can press the products 3 in the two product slots 2 respectively. When the product 3 to be pressed needs to be placed in or after the product 3 has been pressed, the protrusions 43 at both ends of the pressure block 4 can be rotated from the two spaced product slots 2 to the position between the two spaced product slots 2.

[0042] Furthermore, any one of the pressure blocks 4 is rotatably connected to the tray 1 via the connector 5. The pressure block 4 is provided with a first through hole 41, and the tray 1 is provided with a second through hole that matches the first through hole 41. The connector 5 is fixedly connected to the second through hole through the first through hole 41, and the pressure block 4 can rotate relative to the connector 5.

[0043] In this embodiment, each pressure block 4 is rotatably connected to the tray 1 via a connector 5. A first through hole 41 is formed inside the pressure block 4, and a second through hole is also formed on the tray 1. The first through hole 41 and the second through hole are compatible and interconnected. Thus, the connector 5 can pass through the first through hole 41 and be screwed into the second through hole. Since the connector 5 is not fixedly connected to the first through hole 41 of the pressure block 4, the pressure block 4 can rotate relative to the connector 5, that is, the pressure block 4 is rotatably connected to the tray 1. In this embodiment, the connector 5 is specifically a half-thread screw. The specific type of the connector 5 is not limited here and is set according to actual production needs.

[0044] Furthermore, a spring 51 is fitted onto the portion of the connector 5 located in the first through hole 41 of the pressure block 4. The two ends of the spring 51 abut against the two ends inside the pressure block 4, and the pressure block 4 can move up and down relative to the tray 1 through the spring 51 so that the pressure block 4 can press or move away from the product 3.

[0045] In this embodiment, the portion of the connector 5 located within the first through hole 41 of the pressure block 4 is fitted with a spring member 51. The two ends of the spring member 51 abut against the two ends of the first through hole 41 within the pressure block 4, thereby allowing the spring member 51 to be confined within the first through hole 41.

[0046] Specifically, the pressure block 4 can move up and down relative to the tray 1 via the spring member 51. When the pressure block 4 moves away from the tray 1, i.e., by applying an upward lifting force to the pressure block 4, the spring member 51 will be compressed within the first through hole 41. When the pressure block 4 loses its force, the spring member 51 will return to its original shape, thereby driving the pressure block 4 to move towards the tray 1, thus pressing the product 3 in the product groove 2 on the tray 1. This allows the pressure block 4 to act elastically when pressing the product 3 in the product groove 2. That is, according to the height of the product 3 in the product groove 2, when the pressure block 4 is raised, the spring member 51 inside the pressure block 4 acts elastically, allowing the pressure block 4 to better press the product 3. In this embodiment, the spring member 51 is specifically a spring.

[0047] Furthermore, a stop block 6 is also connected to the pressure block 4. A slot 42 adapted to the stop block 6 is opened on the pressure block 4. The stop block 6 is set in the slot 42, and a third through hole 61 adapted to the first through hole 41 is opened on the stop block 6. The connecting member 5 passes through the third through hole 61, the first through hole 41 and the second through hole in sequence, so that the stop block 6 is connected to the pressure block 4.

[0048] In this embodiment, a slot 42 is formed on the pressure block 4, and a stop block 6 is connected through the slot 42. The size of the slot 42 is adapted to the size of the stop block 6. The stop block 6 also has a third through hole 61, which communicates with the first through hole 41 in the pressure block 4. This allows the connector 5 to pass through the third through hole 61, the first through hole 41, and the second through hole in sequence, thereby connecting the stop block 6 to the pressure block 4. The stop block 6 on the pressure block 4 allows the user to rotate the pressure block 4 using the stop block 6, providing greater convenience and speed.

[0049] Furthermore, a gasket 52 is provided between the end of the connector 5 away from the tray 1 and exposed on the pressure block 4 and the spring 51. The gasket 52 is disposed in the third through hole 61 and abuts against the slot 42 of the pressure block 4. The spring 51 can pass through the first through hole 41 and abut against the gasket 52. The gasket 52 is provided here to limit the spring 51 so that the spring 51 will not slip out of the pressure block 4.

[0050] Furthermore, multiple raising blocks 7 are spaced around the pallet 1. When the pressing block 4 rotates 360° relative to the pallet 1 and rotates to the perimeter of the pallet 1, the protrusions 43 of the pressing block 4 abut against the raising blocks 7.

[0051] In this embodiment, multiple raised blocks 7 are spaced around the perimeter of the tray 1. When the product groove 2 on the tray 1 is located at the outermost edge of the tray 1, a pressure block 4 is also provided on the side of the product groove 2 closest to the outermost ring of the tray 1. When only one of the protrusions 43 at both ends of the pressure block 4 can press the product 3 in the product groove 2, the other protrusion 43 presses against the raised block 7 provided on the edge of the tray 1. Specifically, providing raised blocks 7 at the perimeter of the tray 1 allows for a balancing effect when only one end of the protrusion 43 of the pressure block 4 presses against the product 3. The raised blocks 7 are connected to the tray 1 by hexagon socket head cap screws.

[0052] This invention provides a sealing and curing device for a semiconductor power module, comprising: at least one tray, each tray having multiple product slots spaced apart for placing products; and multiple pressure blocks, each product slot having a pressure block rotatably connected to its perimeter. The pressure blocks can rotate 360° relative to the product slots to press or release the products within the slots. By providing a sealing and curing device with multiple pressure blocks on the tray holding the products, and with each product being pressed by four pressure blocks, the device effectively limits and fixes the products, ensuring the strong adhesion and uniformity of the gap between the outer shell and the substrate after adhesive application. This further improves the sealing and curing effect between the outer shell and the substrate, guaranteeing the structural performance of the product.

[0053] It should be noted that the various embodiments in this utility model are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0054] It should also be noted that, in the present invention, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0055] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined in the present invention may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A sealing and curing apparatus for a semiconductor power module, characterized in that, include: At least one tray component, and each of the tray components is provided with a plurality of product slots spaced apart for placing products; Multiple pressure blocks are provided, with one pressure block rotatably connected to the perimeter of each product slot. The multiple pressure blocks can rotate 360° relative to the product slot to press or release the product in the product slot.

2. The sealing and curing apparatus for a semiconductor power module according to claim 1, characterized in that, A pressure block is provided between every two spaced product slots, and a protrusion extends from both ends of the pressure block toward the tray. When the pressure block rotates 360° relative to the product slot, the protrusions at both ends of the pressure block can enter or move away from the two spaced product slots to press or release the product.

3. The sealing and curing apparatus for a semiconductor power module according to claim 1, characterized in that, Each of the pressure blocks is rotatably connected to the tray via a connector. The pressure block has a first through hole, and the tray has a second through hole that matches the first through hole. The connector passes through the first through hole and is fixedly connected to the second through hole. The pressure block can rotate relative to the connector.

4. The sealing and curing apparatus for a semiconductor power module according to claim 3, characterized in that, A spring is fitted onto the portion of the connector located in the first through hole of the pressure block. The two ends of the spring abut against the two ends inside the pressure block. The pressure block can move up and down relative to the tray via the spring, so that the pressure block can press against or move away from the product.

5. The sealing and curing apparatus for a semiconductor power module according to claim 4, characterized in that, A stop block is also connected to the pressure block. A slot adapted to the stop block is opened on the pressure block. The stop block is set in the slot and a third through hole adapted to the first through hole is opened on the stop block. The connector passes through the third through hole, the first through hole and the second through hole in sequence so that the stop block is connected to the pressure block.

6. The sealing and curing apparatus for a semiconductor power module according to claim 5, characterized in that, A gasket is provided between the end of the connector away from the tray and exposed on the pressure block and the spring. The gasket is disposed in the third through hole and abuts against the slot of the pressure block. The spring can pass through the first through hole and abut against the gasket.

7. The sealing and curing apparatus for a semiconductor power module according to claim 2, characterized in that, The pallet is provided with multiple raised blocks at intervals around its perimeter. When the protrusion at one end of the pressing block rotates 360° relative to the pallet and rotates to the perimeter of the pallet, the protrusion abuts against the raised block.

8. The sealing and curing apparatus for a semiconductor power module according to claim 1, characterized in that, The tray has a base and a support at each of its four corners, and the base and the support are connected.

9. The sealing and curing apparatus for a semiconductor power module according to claim 1, characterized in that, The pallet component is also provided with at least two handles; the pallet component is also provided with multiple weight-reducing grooves.

10. The sealing and curing apparatus for a semiconductor power module according to claim 1, characterized in that, The tray is made of aluminum alloy, and the pressure block is made of Teflon.

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