Turnover die bonder

Abstract

The utility model discloses a turnover die bonder, which comprises a feeding and discharging device, a tube socket feeding device, a turnover fixing device, a dispensing die bonding device and a base, wherein the loading and unloading device is used for storing and conveying a charging tray provided with a tube socket; the tube socket feeding device sucks the tube socket on the material disc for dispensing and die bonding, sucks the tube socket and conveys the tube socket back to the material disc; the turnover fixing device receives the tube socket and turns over the direction of the tube socket; and the glue dispensing and die bonding device is used for carrying out glue dispensing and die bonding on the overturned tube socket. According to the utility model, the tube socket conveyed by the loading and unloading device is transferred to the overturning direction of the overturning fixing device through the tube socket feeding device, so that the dispensing and die bonding are carried out on the tube socket after the direction is overturned through the dispensing and die bonding device; and under the cooperation of the tube socket feeding device and the overturning and fixing device, the tube socket after dispensing and die bonding is overturned to the original angle and transferred back to the loading and unloading device, so that the automatic production process is realized, the problems of errors and low efficiency caused by manual operation are avoided, the production efficiency is improved, and the product quality is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, and in particular to a flip die bonding machine. Background Technology

[0002] In the wafer processing field, in order to facilitate automatic feeding of the sockets, the sockets are usually arranged vertically in the socket positioning holes of the tray. However, when dispensing and fixing the wafers, the sockets usually need to be arranged horizontally in the corresponding fixtures. Existing die bonding equipment generally does not support the operation of flipping the sockets, which means that this process usually requires manual intervention to adjust the socket posture or transfer materials step by step, resulting in low production efficiency and insufficient automation.

[0003] Therefore, how to design a die bonding device that can automatically feed materials and perform tube-mount flipping operations is a problem to be solved by those skilled in the art. Utility Model Content

[0004] This utility model provides a flip die bonder, which aims to overcome the problems existing in related technologies.

[0005] This utility model provides a flip die bonder, including: a loading and unloading device, a tube base feeding device, a flip fixing device, a dispensing die bonder and a base;

[0006] The loading and unloading device includes a tray storage component and a tray conveying component, used for storing and conveying trays equipped with tube seats;

[0007] The tube seat feeding device includes a tube seat feeding drive assembly and a suction assembly connected to the tube seat feeding drive assembly. The suction assembly is used to pick up the tube seats stored on the material tray and is driven by the tube seat feeding drive assembly to transport the tube seats to the flipping and fixing device for dispensing and die bonding. It is also used to pick up the tube seats after dispensing and die bonding on the flipping and fixing device and transport them back to the material tray for storage.

[0008] The flipping and fixing device includes a flipping component and a clamping component rotatably connected to the flipping component. The clamping component is used to receive and fix the tube seat conveyed by the tube seat feeding device, and the flipping component is used to rotate the clamping component to flip the tube seat in the correct direction.

[0009] The dispensing and die bonding device includes a dispensing component and a die bonding component, used to dispense adhesive and bond die to the tube seat after the direction is reversed.

[0010] The loading and unloading device, the tube seat feeding device, the flipping and fixing device, and the dispensing and die-bonding device are all installed on the base and arranged adjacent to each other in sequence.

[0011] In one embodiment, the tray storage assembly includes a tray basket and a basket driving component. The tray basket has an unobstructed opening on its side and multiple tray storage positions for storing trays arranged from top to bottom inside. The basket driving component is used to drive the tray basket to move up and down along the Z-axis.

[0012] In one embodiment, the tray conveying assembly includes a conveyor belt disposed on the side of the tray storage assembly and a pneumatic suction and pusher slidably disposed on the conveyor belt. The pneumatic suction and pusher is used to slide along the conveyor belt along the side of the tray basket to pick up the tray from the unobstructed opening and to push the tray back to the tray basket from the unobstructed opening.

[0013] In one embodiment, the tube seat feeding drive assembly is mounted above the conveyor belt via a support column, and the suction assembly is mounted on the tube seat feeding drive assembly.

[0014] The suction assembly is provided with a tube seat suction nozzle for suctioning and discharging tube seats. The tube seat suction nozzle is fixed to the tube seat feeding drive assembly via a suction nozzle connecting plate. It is used to pick up the tube seat from the material tray and transport it to the clamping assembly under the drive of the tube seat feeding drive assembly, and to pick up the tube seat from the clamping assembly and transport it back to the material tray.

[0015] In one embodiment, the clamping assembly includes a clamping plate, a clamping drive component, and a pressure plate that are fixedly connected in sequence;

[0016] The clamping assembly is rotatably connected to the flipping assembly via a clamping plate, and the clamping plate is provided with a tube seat placement groove adapted to the tube seat;

[0017] The tube seat placement groove is used to receive the tube seat conveyed by the tube seat feeding device, and the clamping drive member drives the pressure plate to press and fix the tube seat in the tube seat placement groove through a motor.

[0018] In one embodiment, the flipping and fixing device further includes a flipping and fixing driving component disposed on the base, for driving the flipping and fixing device to move to the dispensing position and / or the die bonding position;

[0019] The flipping component is mounted on the flipping fixed drive component via a mounting plate;

[0020] The clamping assembly is also provided with a rotation limiting part, which is used to cooperate with the mounting plate to limit the flipping angle of the flipping assembly.

[0021] In one embodiment, the dispensing assembly includes a glue tray component, a dispensing head, and a dispensing drive component. The glue tray component and the dispensing drive component are both mounted on the base via a gantry frame, and the dispensing head is located at the end of the dispensing drive component.

[0022] The dispensing drive component is used to drive the dispensing head to the glue tray component to obtain glue, and to drive the dispensing head to the tube seat after the flip direction to perform dispensing.

[0023] In one embodiment, the die bonding assembly includes a die bonding drive member and a tungsten carbide nozzle disposed on the die bonding drive member;

[0024] The tungsten carbide nozzle is used to pick up the wafer and fix it on the tube seat after the flip direction by heating. The die bonding drive component is used to drive the tungsten carbide nozzle to the wafer acquisition position and drive the tungsten carbide nozzle above the tube seat after the flip direction.

[0025] In one embodiment, the flip die bonder further includes a wafer feeding device, a die picking device, and a transfer device, all of which are mounted on the base.

[0026] The wafer feeding device is equipped with a three-station wafer feeding ring for storing wafers;

[0027] The crystal picking device includes a crystal picking drive component and a bakelite suction nozzle. The crystal picking drive component is used to drive the bakelite suction nozzle to move to the three-station wafer material ring to pick up the wafer, and to drive the bakelite suction nozzle to move to the transfer device to place the wafer.

[0028] The transfer device includes a transfer drive component and a transfer nozzle disposed on the transfer drive component. The transfer nozzle is used to pick up the wafer placed by the bakelite nozzle, and the transfer drive component is used to drive the transfer nozzle to transport the wafer to below the tungsten carbide nozzle.

[0029] In one embodiment, the flip die bonder further includes a calibration device, which includes a calibration camera and a calibration pin assembly;

[0030] The calibration camera is positioned above the three-station wafer material ring and is used to take pictures to detect whether the placement angle of the wafer on the three-station wafer material ring meets the requirements.

[0031] The calibration pin is positioned below the three-station wafer feed ring and is used to extend the pin to adjust the placement angle of the wafers on the three-station wafer feed ring.

[0032] This utility model embodiment uses a tube seat feeding device to transfer the tube seat conveyed by the loading and unloading device to the flipping and fixing device in the flipping direction. Thereby, the dispensing and die-bonding device dispenses and bonds the tube seat after flipping. With the cooperation of the tube seat feeding device and the flipping and fixing device, the tube seat after dispensing and die-bonding is flipped back to its original angle and transferred back to the loading and unloading device. This realizes an automated production process, avoids the errors and inefficiencies caused by manual operation, thereby improving production efficiency and ensuring product quality. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A schematic diagram of a flip die bonder provided in an embodiment of this utility model;

[0035] Figure 2 An exploded view of a flip die bonder provided in an embodiment of this utility model;

[0036] Figure 3 A schematic diagram of the loading and unloading device in a flip die bonder provided for an embodiment of this utility model;

[0037] Figure 4 This is a schematic diagram of the structure of a material tray in a flip die bonder provided by an embodiment of the present invention;

[0038] Figure 5 A schematic diagram of the structure of a tube holder in a flip die bonder provided in this embodiment of the present invention;

[0039] Figure 6 A schematic diagram of the structure of a tube seat feeding device in a flip die bonder provided by an embodiment of this utility model;

[0040] Figure 7 A schematic diagram of the structure of a flipping and fixing device in a flipping die bonder provided in this embodiment of the present invention;

[0041] Figure 8 A schematic diagram of the clamping assembly in a flip die bonder provided for an embodiment of this utility model;

[0042] Figure 9 A schematic diagram of the dispensing assembly in a flip die bonder provided for an embodiment of this utility model;

[0043] Figure 10A schematic diagram of the structure of a die bonding assembly in a flip die bonder provided in this embodiment of the present invention;

[0044] Figure 11 This is a schematic diagram of the structure of a wafer feeding device in a flip die bonder provided by an embodiment of the present invention;

[0045] Figure 12 A schematic diagram of the structure of a crystal-taking device in a flip-type die bonder provided in this embodiment of the present invention;

[0046] Figure 13 This is a schematic diagram of the structure of a transfer device in a flip die bonder provided in an embodiment of the present invention.

[0047] Markings in the image:

[0048] 10. Loading and unloading device; 11. Material tray storage assembly; 111. Material tray lifting basket; 112. Lifting basket driving component; 12. Material tray conveying assembly; 121. Conveyor belt; 122. Pneumatic suction and pushing component; 13. Material tray; 14. Tube seat; 141. Dispensing and solidifying crystal surface;

[0049] 20. Tube seat feeding device; 21. Tube seat feeding drive assembly; 22. Suction assembly; 221. Tube seat suction nozzle;

[0050] 30. Tilting and fixing device; 31. Tilting assembly; 32. Clamping assembly; 321. Clamping plate; 3211. Tube seat placement groove; 322. Clamping drive component; 323. Pressing plate; 324. Rotation limiting part; 33. Tilting and fixing drive component;

[0051] 40. Dispensing and die bonding device; 41. Dispensing assembly; 411. Dispensing tray component; 412. Dispensing head; 413. Dispensing drive component; 42. Die bonding assembly; 421. Die bonding drive component; 422. Tungsten carbide nozzle;

[0052] 50. Base;

[0053] 60. Wafer feeding device; 61. Three-station wafer feed ring;

[0054] 70. Crystal extraction device; 71. Crystal extraction drive component; 72. Bakelite nozzle;

[0055] 80. Transfer device; 81. Transfer drive component; 82. Transfer nozzle. Detailed Implementation

[0056] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0057] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0058] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0059] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0060] Please see below. Figure 1 and Figure 2 The present invention provides a flip die bonder, which specifically includes: a loading and unloading device 10, a tube seat feeding device 20, a flip fixing device 30, a dispensing die bonder 40, and a base 50.

[0061] The loading and unloading device 10 includes a tray storage assembly 11 and a tray conveying assembly 12, which are used to store and convey trays equipped with tube seats.

[0062] The tube seat feeding device 20 includes a tube seat feeding drive assembly 21 and a suction assembly 22 connected to the tube seat feeding drive assembly 21. The suction assembly 22 is used to pick up the tube seats stored on the material tray and is driven by the tube seat feeding drive assembly 21 to transport the tube seats to the flipping and fixing device 30 for dispensing and die bonding. It is also used to pick up the tube seats after dispensing and die bonding on the flipping and fixing device 30 and transport them back to the material tray for storage.

[0063] The flipping and fixing device 30 includes a flipping component 31 and a clamping component 32 rotatably connected to the flipping component 31. The clamping component 32 is used to receive and fix the tube seat conveyed by the tube seat feeding device 20, and the flipping component 31 is used to rotate the clamping component 32 to flip the tube seat in the correct direction.

[0064] The dispensing and die bonding device 40 includes a dispensing assembly 41 and a die bonding assembly 42, which are used to dispense adhesive and bond die to the tube seat after the flipping direction.

[0065] The loading and unloading device 10, the tube seat feeding device 20, the flipping and fixing device 30, and the dispensing and die-bonding device 40 are all installed on the base 50 and arranged adjacent to each other in sequence.

[0066] In this embodiment, the tube seat conveyed by the loading and unloading device 10 is transferred to the flipping and fixing device 30 in the flipping direction by the tube seat feeding device 20. Then, the tube seat after flipping is glued and die-bonded by the dispensing and die-bonding device 40. With the cooperation of the tube seat feeding device 20 and the flipping and fixing device 30, the tube seat after dispensing and die-bonding is flipped back to the original angle and transferred back to the loading and unloading device 10. This realizes the automated production process, avoids the errors and inefficiencies caused by manual operation, thereby improving production efficiency and ensuring product quality.

[0067] Combination Figure 3 As shown, in one embodiment, the tray storage assembly 11 includes a tray basket 111 and a basket driving member 112. The tray basket 111 has an unobstructed opening on its side and multiple tray storage positions for storing trays are arranged from top to bottom inside. The basket driving member 112 is used to drive the tray basket 111 to move up and down along the Z-axis.

[0068] In this embodiment, by providing an unobstructed opening on the side of the tray basket 111 and using the basket drive component 112 to drive the tray basket 111 to move up and down along the Z-axis, operators can quickly retrieve and place trays stored in the tray storage positions through the unobstructed opening. This improves the efficiency and convenience of tray storage and retrieval, reduces operation time and labor intensity, further optimizes the production process, and ensures the smooth operation of the production line. In specific application scenarios, the basket drive component 112 can be equipped with guide rails and slider structures to ensure the stability and accuracy of the tray basket 111 during its up and down movement.

[0069] Combination Figure 4 and Figure 5 As shown, in one specific embodiment, each tray 13 includes multiple tube holder placement holes, each corresponding to a tube holder 14. The tube holder 14 needs to be vertically inserted into the tube holder placement hole. However, for dispensing and die bonding, the tube holder 14 needs to be flipped to a horizontal position so that the dispensing and die bonding surface 141 faces upwards, allowing dispensing and die bonding operations to be performed on the dispensing and die bonding surface 141. Furthermore, the size and number of tray storage positions in the tray basket 111 can be flexibly adjusted according to actual needs to meet the storage requirements of trays of different specifications.

[0070] In one embodiment, the tray conveying assembly 12 includes a conveyor belt 121 disposed on the side of the tray storage assembly 11 and a pneumatic suction and push member 122 slidably disposed on the conveyor belt 121. The pneumatic suction and push member 122 is used to slide along the side of the tray basket 111 along the conveyor belt 121 to pick up the tray from the unobstructed opening and to push the tray back from the unobstructed opening to the tray basket 111.

[0071] In this embodiment, the conveyor belt 121 and the pneumatic suction and push component 122 work together to efficiently transport the material tray from the storage position to the designated position for subsequent work.

[0072] Specifically, when the material tray needs to be conveyed, the tray lifting component 112 first drives the tray lifting basket 111 to move up and down along the Z-axis to a suitable position. Then, the pneumatic suction and push component 122 slides along the conveyor belt 121 to an unobstructed opening, picks up the material tray from the storage position, and pushes it along the conveyor belt 121 to the designated work station, so that the conveying tube can perform subsequent dispensing and die bonding work. After the dispensing and die bonding work of the tube is completed, it will be conveyed back to the material tray on the conveyor belt 121. At this time, the pneumatic suction and push component 122 pushes the material tray back to the tray lifting basket 111 along the conveyor belt 121. The whole process is automated and efficient, reduces human intervention, and improves the accuracy and efficiency of material tray conveying.

[0073] In a specific embodiment, a clamping component can also be provided on the side of the conveyor belt 121 to ensure the stability of the material tray by clamping it when the tray is transported to the designated station on the conveyor belt 121, preventing slippage or displacement, and further ensuring the stability of the material tray transportation.

[0074] Combination Figure 6 As shown, in one embodiment, the tube seat feeding drive assembly 21 is mounted above the conveyor belt 121 via a support column, and the suction assembly 22 is mounted on the tube seat feeding drive assembly 21.

[0075] The suction assembly 22 is provided with a tube seat suction nozzle 221 for suctioning and discharging tube seats. The tube seat suction nozzle 221 is fixed to the tube seat feeding drive assembly 21 through a suction nozzle connecting plate. It is used to pick up the tube seat from the material tray and transport it to the clamping assembly 32 under the drive of the tube seat feeding drive assembly 21, and to pick up the tube seat from the clamping assembly 32 and transport it back to the material tray.

[0076] In this embodiment, the tube seat feeding drive assembly 21 drives the tube seat suction nozzle 221 to pick up the tube seat stored in the material tray on the conveyor belt, and drives the tube seat suction nozzle 221 to transport the tube seat to the clamping assembly 32 for fixation, so as to carry out the subsequent dispensing and die bonding work. After the tube seat dispensing and die bonding work is completed, the tube seat suction nozzle 221 picks up the tube seat from the clamping assembly 32 and the tube seat feeding drive assembly 21 transports it back to the material tray for recycling and storage.

[0077] In a specific embodiment, two suction components 22 can be set on the tube seat feeding drive component 21, so that two tube seats can be picked up at one time and transported to perform dispensing and die bonding work. This can improve work efficiency, reduce operation time, and ensure the continuity and efficiency of the production process.

[0078] In addition, the driving method and driving direction of the tube seat feeding drive component 21 can be set according to different actual scenario requirements. For example, the driving method can be to use a servo motor and guide rail to control the movement of the suction component 22, etc. The driving direction can be set so that the tube seat feeding drive component 21 drives the suction nozzle to move up and down along the Z-axis to pick up and place the tube seat, and drives the suction nozzle to move back and forth along the Y-axis to adapt to the operation requirements of different workstations.

[0079] Combination Figure 7 and Figure 8 As shown, in one embodiment, the clamping assembly 32 includes a clamping plate 321, a clamping drive member 322, and a pressure plate 323 that are fixedly connected in sequence;

[0080] The clamping assembly 32 is rotatably connected to the flipping assembly 31 via the clamping plate 321. The clamping plate 321 is provided with a tube seat placement groove 3211 that is adapted to the tube seat.

[0081] The tube seat placement groove 3211 is used to receive the tube seat conveyed by the tube seat feeding device 20, and the clamping drive component 322 clamps and fixes the tube seat in the tube seat placement groove 3211 by driving the pressure plate 323 through the motor.

[0082] Furthermore, the flipping and fixing device 30 also includes a flipping and fixing drive member 33 disposed on the base 50, for driving the flipping and fixing device 30 to move to the dispensing position and / or the die bonding position.

[0083] The flipping component 31 is mounted on the flipping fixed drive component 33 via a mounting plate;

[0084] The clamping assembly 32 is also provided with a rotation limit part 324, which is used to cooperate with the mounting plate to limit the rotation angle of the flipping assembly 31.

[0085] In this embodiment, a tube seat placement groove 3211 is provided in the clamping assembly 32 to receive the tube seat conveyed by the tube seat feeding device 20, and the clamping drive member 322 drives the pressure plate 323 to clamp it, ensuring that the tube seat is stably fixed during the flipping and dispensing / die bonding process. Then, the flipping and fixing drive member 33 precisely controls the flipping angle to ensure the accuracy of dispensing and die bonding, ensuring the stability and reliability of the tube seat during dispensing and die bonding, further improving the stability and reliability of automated production. In addition, this embodiment also limits the flipping angle of the flipping assembly 31 by setting a rotation limit part 324 in cooperation with the mounting plate, avoiding tube seat displacement or damage caused by excessive flipping, further improving the accuracy and consistency of dispensing and die bonding, and ensuring the stability of product quality.

[0086] In specific applications, the flipping and fixing drive component 33 can be composed of components such as a motor and a rotating shaft. Precise control of the flipping and fixing device 30 is achieved by adjusting the motor speed and the rotating shaft angle, ensuring that the tube seat maintains its optimal position during dispensing and die bonding. Similarly, the clamping drive component 322 can also be composed of components such as a motor and a rotating shaft. Precise control of the clamping force of the pressure plate 323 is achieved by adjusting the motor torque and the rotating shaft displacement, ensuring that the tube seat remains stationary during flipping and dispensing / die bonding. Of course, in addition to motors and rotating shafts, other drive components or systems can be used to meet different production needs.

[0087] Combination Figure 9 and Figure 10 As shown, in one embodiment, the dispensing assembly 41 includes a glue tray component 411, a dispensing head 412, and a dispensing drive component 413. Both the glue tray component 411 and the dispensing drive component 413 are mounted on the base 50 via a gantry frame, and the dispensing head 412 is located at the end of the dispensing drive component 413.

[0088] The dispensing drive component 413 is used to drive the dispensing head 412 to the glue tray component 411 to obtain glue, and to drive the dispensing head 412 to the tube seat after the flip direction for dispensing.

[0089] Furthermore, the die bonding assembly 42 includes a die bonding drive member 421 and a tungsten carbide nozzle 422 disposed on the die bonding drive member 421;

[0090] The tungsten carbide nozzle 422 is used to pick up the wafer and fix it on the tube seat after the flip direction by heating. The die bonding drive component 421 is used to drive the tungsten carbide nozzle 422 to the wafer acquisition position and drive the tungsten carbide nozzle 422 above the tube seat after the flip direction.

[0091] In this embodiment, after the tube socket is delivered to the dispensing position, the dispensing drive component 413 controls the dispensing head 412 to move onto the glue tray component 411 to pick up the glue, and then moves it above the tube socket for precise dispensing. After dispensing is completed, the dispensing head 412 is driven away from above the tube socket. Subsequently, the die-bonding drive component 421 controls the tungsten carbide nozzle 422 to pick up the wafer and deliver it to the tube socket after dispensing, ensuring precise alignment between the wafer and the tube socket. Simultaneously, heating is used to firmly fix the wafer, thereby achieving efficient synergy between dispensing and die bonding, improving production efficiency and product quality. The entire system, through precise driving and control, ensures the stability and reliability of each step, further optimizing the automated production process.

[0092] In specific application scenarios, the dispensing drive component 413 may include a Y-axis drive component and a rotation component. The Y-axis drive component is responsible for the up and down movement of the dispensing head 412, while the rotation component controls the rotation angle of the dispensing head 412. The two work together to ensure that the dispensing head 412 picks up the glue on the glue tray component 411 and releases the glue on the tube seat with accurate and error-free movements.

[0093] Combination Figures 11-13 As shown, in one embodiment, the flip die bonder further includes a wafer feeding device 60, a die picking device 70, and a transfer device 80 disposed on the base 50;

[0094] The wafer feeding device 60 is equipped with a three-station wafer feed ring 61 for storing wafers;

[0095] The crystal picking device 70 includes a crystal picking drive component 71 and a bakelite nozzle 72. The crystal picking drive component 71 is used to drive the bakelite nozzle 72 to move to the three-station wafer material ring 61 to pick up the wafer, and to drive the bakelite nozzle 72 to move to the transfer device 80 to place the wafer.

[0096] The transfer device 80 includes a transfer drive component 81 and a transfer nozzle 82 disposed on the transfer drive component 81. The transfer nozzle 82 is used to pick up the wafer placed on the bakelite nozzle 72, and the transfer drive component 81 is used to drive the transfer nozzle 82 to transport the wafer to below the tungsten carbide nozzle 422.

[0097] In this embodiment, by setting up a wafer feeding device 60, a wafer picking device 70, and a transfer device 80, a fully automated process of wafers from storage to retrieval to transmission is realized, ensuring seamless connection of wafers at each stage and avoiding human error.

[0098] Specifically, the three-station design of the wafer feeding device 60 effectively improves the wafer supply efficiency; the wafer picking device 70 picks up the wafers in the wafer feeding device 60 through the bakelite nozzle 72 and accurately places them in the transfer device 80, which can ensure the wafers are picked up without damage; the transfer device 80 accurately receives the wafers through the transfer nozzle 82 and quickly transfers them to the bottom of the tungsten carbide nozzle 422. The whole process is efficient and smooth, ensuring the stability and safety of the wafers during transmission.

[0099] In one specific embodiment, the three-station wafer feed ring 61 is provided with three wafer disks and a rotating component. The rotating component drives the three wafer disks to switch to the wafer picking position in sequence to ensure continuous wafer supply.

[0100] In another specific embodiment, the transfer drive component 81 can be composed of components such as a motor, a rotating shaft, and a suction arm. The transfer suction nozzle is set on the suction arm. The rotating shaft is driven by the motor to rotate, thereby driving the suction arm to move precisely, thus realizing the precise positioning of the transfer suction nozzle and the rapid transfer of the wafer.

[0101] In one embodiment, the flip die bonder further includes a calibration device, which includes a calibration camera and a calibration pin assembly;

[0102] The calibration camera is positioned above the three-station wafer material ring 61 and is used to take pictures to detect whether the placement angle of the wafer on the three-station wafer material ring 61 meets the requirements.

[0103] The calibration pin is located below the three-station wafer feed ring 61 and is used to extend the pin to adjust the placement angle of the wafer on the three-station wafer feed ring 61.

[0104] In this embodiment, the coordinated operation of the calibration camera and calibration pin ensures precise adjustment of the wafer placement angle, further improving the accuracy of wafer alignment and optimizing the stability and efficiency of the overall production process.

[0105] In specific application scenarios, in addition to the area above the three-station wafer material ring 61, corresponding cameras can be set at other locations to monitor the status of processes such as die bonding and die attaching in real time, ensuring that the parameters of each step meet the preset standards. For example, a detection camera can also be set above the die bonding position to detect whether the amount of die bonding and the distribution of the adhesive meet the requirements, ensuring uniform die bonding and no leakage, thereby further guaranteeing product quality and production efficiency.

[0106] In specific embodiments, to improve the efficiency of collaborative operation between various devices and components, corresponding multi-axis drive components can be set in each device or component. Through the control and coordination of these multi-axis drive components, the positional relationship between the devices or components can be adjusted, thereby achieving precise docking and synchronous operation of each stage and ensuring the continuity and efficiency of the entire automated process. For example, multi-axis drive components can be set below the wafer feeding device 60 and the transfer device 80 to drive the relative position adjustment of the wafer feeding device 60 and the transfer device 80, ensuring seamless docking of the wafers during transmission. Alternatively, corresponding multi-axis drive components can be set below the flip-fixing drive component 33 and the die-bonding component 42 to control the movement and precise positioning of the tube socket and the tungsten carbide nozzle 422, ensuring accurate die-bonding operation. Through the coordinated control of these multi-axis drive components, the cooperation between devices and components can be made more seamless, further improving the overall performance and reliability of the automated production line. The specific driving direction of the multi-axis drive component can be set according to the different needs of the actual application scenario. For example, it can be set to drive the corresponding component to move along the X, Y, and Z axes to adapt to the operation requirements of different workstations.

[0107] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple; relevant parts can be referred to in the method section. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

[0108] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A flip die bonder, characterized in that, include: The loading and unloading device (10), the tube seat feeding device (20), the flipping and fixing device (30), the dispensing and die-bonding device (40), and the base (50); The loading and unloading device (10) includes a tray storage assembly (11) and a tray conveying assembly (12) for storing and conveying trays equipped with tube seats; The tube seat feeding device (20) includes a tube seat feeding drive assembly (21) and a suction assembly (22) connected to the tube seat feeding drive assembly (21). The suction assembly (22) is used to pick up the tube seats stored on the material tray and is driven by the tube seat feeding drive assembly (21) to transport the tube seats to the flipping and fixing device (30) for dispensing and die bonding. It is also used to pick up the tube seats after dispensing and die bonding on the flipping and fixing device (30) and transport them back to the material tray for storage. The flipping and fixing device (30) includes a flipping component (31) and a clamping component (32) rotatably connected to the flipping component (31). The clamping component (32) is used to receive and fix the tube seat conveyed by the tube seat feeding device (20). The flipping component (31) is used to rotate the clamping component (32) to flip the tube seat in the correct direction. The dispensing and die bonding device (40) includes a dispensing assembly (41) and a die bonding assembly (42), which are used to dispense and bond the tube seat after the flipping direction. The loading and unloading device (10), the tube seat feeding device (20), the flipping and fixing device (30), and the dispensing and die-bonding device (40) are all installed on the base (50) and arranged adjacent to each other in sequence.

2. The flip-die bonding machine according to claim 1, characterized in that, The material tray storage assembly (11) includes a material tray basket (111) and a basket driving component (112). The material tray basket (111) has an unobstructed opening on its side and multiple material tray storage positions for storing material trays are arranged inside from top to bottom. The basket driving component (112) is used to drive the material tray basket (111) to move up and down along the Z-axis.

3. The flip-die bonding machine according to claim 2, characterized in that, The tray conveying assembly (12) includes a conveyor belt (121) disposed on the side of the tray storage assembly (11) and a pneumatic suction and push member (122) slidably disposed on the conveyor belt (121). The pneumatic suction and push member (122) is used to slide along the side of the tray basket (111) along the conveyor belt (121) to pick up the tray from the unobstructed opening and to push the tray back to the tray basket (111) from the unobstructed opening.

4. The flip-die bonding machine according to claim 3, characterized in that, The tube seat feeding drive assembly (21) is mounted above the conveyor belt (121) via a support column, and the suction assembly (22) is mounted on the tube seat feeding drive assembly (21). The suction assembly (22) is provided with a tube seat suction nozzle (221) for suctioning and discharging tube seats. The tube seat suction nozzle (221) is fixed to the tube seat feeding drive assembly (21) through a suction nozzle connecting plate. It is used to pick up the tube seat from the material tray and transport it to the clamping assembly (32) under the drive of the tube seat feeding drive assembly (21), and to pick up the tube seat from the clamping assembly (32) and transport it back to the material tray.

5. The flip-die bonding machine according to claim 1, characterized in that, The clamping assembly (32) includes a clamping plate (321), a clamping drive component (322), and a pressure plate (323) that are fixedly connected in sequence; The clamping assembly (32) is rotatably connected to the flipping assembly (31) via a clamping plate (321), and the clamping plate (321) is provided with a tube seat placement groove (3211) adapted to the tube seat; The tube seat placement groove (3211) is used to receive the tube seat conveyed by the tube seat feeding device (20), and the clamping drive member (322) drives the pressure plate (323) by a motor to press and fix the tube seat in the tube seat placement groove (3211).

6. The flip-die bonding machine according to claim 5, characterized in that, The flipping and fixing device (30) further includes a flipping and fixing driving member (33) disposed on the base (50) for driving the flipping and fixing device (30) to move to the dispensing position and / or die bonding position; The flipping assembly (31) is mounted on the flipping fixed drive member (33) via a mounting plate; The clamping assembly (32) is also provided with a rotation limiting part (324) for cooperating with the mounting plate to limit the rotation angle of the flipping assembly (31).

7. The flip die bonder according to claim 1, characterized in that, The dispensing assembly (41) includes a glue tray component (411), a dispensing head (412), and a dispensing drive component (413). The glue tray component (411) and the dispensing drive component (413) are both mounted on the base (50) via a gantry frame. The dispensing head (412) is located at the end of the dispensing drive component (413). The dispensing drive component (413) is used to drive the dispensing head (412) to the glue tray component (411) to obtain glue, and to drive the dispensing head (412) to the tube seat after the flip direction to perform dispensing.

8. The flip die bonder according to claim 1, characterized in that, The die bonding assembly (42) includes a die bonding drive component (421) and a tungsten carbide nozzle (422) disposed on the die bonding drive component (421); The tungsten carbide nozzle (422) is used to pick up the wafer and fix it on the tube seat after the flip direction by heating. The die bonding drive member (421) is used to drive the tungsten carbide nozzle (422) to the wafer acquisition position and drive the tungsten carbide nozzle (422) above the tube seat after the flip direction.

9. The flip-die bonding machine according to claim 8, characterized in that, It also includes a wafer feeding device (60), a wafer picking device (70), and a transfer device (80), all of which are mounted on the base (50); The wafer feeding device (60) is equipped with a three-station wafer feed ring (61) for storing wafers; The crystal picking device (70) includes a crystal picking drive component (71) and a bakelite suction nozzle (72). The crystal picking drive component (71) is used to drive the bakelite suction nozzle (72) to move to the three-station wafer material ring (61) to pick up the wafer, and to drive the bakelite suction nozzle (72) to move to the transfer device (80) to place the wafer. The transfer device (80) includes a transfer drive component (81) and a transfer nozzle (82) disposed on the transfer drive component (81). The transfer nozzle (82) is used to pick up the wafer placed by the bakelite nozzle (72). The transfer drive component (81) is used to drive the transfer nozzle (82) to transport the wafer to below the tungsten carbide nozzle (422).

10. The flip-die bonding machine according to claim 9, characterized in that, It also includes a calibration device, which comprises a calibration camera and a calibration pin assembly; The calibration camera is positioned above the three-station wafer ring (61) and is used to take pictures to detect whether the placement angle of the wafer on the three-station wafer ring (61) meets the requirements. The calibration pin is positioned below the three-station wafer feed ring (61) and is used to extend the pin to adjust the placement angle of the wafer on the three-station wafer feed ring (61).

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