Power semiconductor module with composite heat dissipation structure

Abstract

The utility model relates to the technical field of power semiconductor modules, in particular to a power semiconductor module with a composite heat dissipation structure, which comprises a module main body, a blast structure and a heat conduction structure, the module main body comprises a base, and an epoxy plastic sealing shell is poured on the upper side of the base; the blast structure comprises a blast chamber; the heat conduction structure comprises a multi-way connector, the bottom side of the multi-way connector is communicated with the blast chamber, the two sides of the multi-way connector are communicated with a plurality of basic air pipes, the multi-way connector and the basic air pipes are embedded in the inner top of the base, the upper ends of the basic air pipes are communicated with the bottom side of a multi-way pipe, and one side of the multi-way pipe is communicated with a heat conduction pipe disc. The heat conduction pipe disc is embedded in the epoxy plastic sealing shell. According to the utility model, the twisted heat conduction pipe is wound around the protruding integrated element in the module main body and is close to the element, heat is absorbed by the outer wall of each pipeline, heat is conducted and heat is timely dissipated in a short distance from the inner wall of the pipeline by utilizing wind power at the same time, and a simple structure is adopted to provide a high-efficiency heat dissipation effect in the whole device.

Description

Technical Field

[0001] This utility model relates to the field of power semiconductor module technology, specifically a power semiconductor module with a composite heat dissipation structure. Background Technology

[0002] A power semiconductor module is a combination of components designed for specific functions and modes. It consists of high-power electronic devices assembled and encapsulated into a single unit. Different functions can be achieved depending on the packaged components. A power semiconductor module equipped with air cooling can be called an air-cooled module, while one equipped with water cooling can be called a water-cooled module, and so on.

[0003] It relies entirely on natural heat dissipation and the overall temperature reduction achieved by its air-cooling and water-cooling structures. However, the high density of internal components results in significant heat generation during operation, which cannot meet the heat dissipation requirements as it relies entirely on the thermal conductivity of the encapsulation material for natural heat dissipation. Utility Model Content

[0004] The purpose of this invention is to provide a power semiconductor module with a composite heat dissipation structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A power semiconductor module with a composite heat dissipation structure includes:

[0007] The module body includes a base, and an epoxy-sealed shell is cast on the upper side of the base;

[0008] A blower structure, wherein the blower structure includes a blower chamber;

[0009] A heat-conducting structure includes a multi-port connector. The bottom side of the multi-port connector is connected to the blower chamber. Both sides of the multi-port connector are connected to multiple foundation ducts. The multi-port connector and foundation ducts are embedded in the top of the base. The upper end of the foundation ducts is connected to the bottom side of the multi-port connector. One side of the multi-port connector is connected to a heat-conducting pipe coil. The heat-conducting pipe coil is embedded inside an epoxy-sealed shell.

[0010] Furthermore, the main body of the module also includes:

[0011] Air inlet, wherein the air inlet is located on the lower edge of the front and rear surfaces of the base;

[0012] The No. 1 filter port is snapped into the air inlet opening;

[0013] Air outlets are provided on both sides of the base and are connected to the bottom edges of the blower chamber.

[0014] The second filter port is snapped into the air outlet opening.

[0015] Furthermore, the main body of the module also includes:

[0016] A module motherboard, which is snapped onto the upper surface of the base;

[0017] External terminal number one, which is fixedly installed on the upper surface of the module motherboard;

[0018] The second external terminal is fixedly installed on both sides of the upper surface of the base;

[0019] A terminal block is fixedly installed on the upper surface of an epoxy-sealed shell.

[0020] Furthermore, the module motherboard, external terminal number one, external terminal number two, and heat pipe plate are encapsulated inside an epoxy-sealed shell, and one end of the heat pipe plate passes through the base and is connected to the air outlet.

[0021] Furthermore, the blower structure also includes:

[0022] A conical wind-gathering top is provided on the upper surface of the blower chamber, and the top of the conical wind-gathering top is connected to a multi-port connector.

[0023] A drive motor, which is fixedly installed at the bottom of the blower chamber;

[0024] The fan blades are fixedly installed at the output end of the drive motor.

[0025] Furthermore, the heat-conducting structure also includes:

[0026] Corrugated grooves are arranged at equal angles on the outer surface of the heat pipe disc.

[0027] The heat-conducting inner sheet is arranged at equal angles and fixedly installed in the inner wall of the heat-conducting pipe disc.

[0028] Compared with the prior art, the beneficial effects of this utility model are:

[0029] 1. The heat-conducting coil bypasses the protruding integrated components inside the main module body and is close to the components. The multi-port connector, basic air duct, multi-port pipe and heat-conducting coil are all copper pipes that absorb the heat generated by the operation of each component. The air force generated by the blower structure is introduced into the interior of each pipe from the blower chamber and discharged. While absorbing heat on the outer wall of each pipe, the heat is carried away from the inner wall of the pipe by the air force. Heat is conducted and dissipated in a close and timely manner at the same time. The simple structure provides a high-efficiency heat dissipation effect inside the whole device.

[0030] 2. Driven by a motor, the fan blades rotate to draw air from the air inlet and inject it into the multi-port connector through the conical air-gathering top. The air is then cooled in a short distance through various airflow channels and finally discharged from the air outlet. Meanwhile, corrugated grooves are opened on the inner and outer surfaces of the heat-conducting pipe plate, and heat-conducting inner plates are installed to increase the contact area between the outer surface of the pipe and the epoxy-sealed shell and the contact area between the inside of the pipe and the airflow. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0032] Figure 2 This is a schematic diagram of the main body of the module in this utility model;

[0033] Figure 3 This is a schematic diagram of the main body of the module in this utility model;

[0034] Figure 4 This is a schematic diagram of the blower structure in this utility model;

[0035] Figure 5 This is a schematic diagram of the heat-conducting structure in this utility model;

[0036] Figure 6 This is a schematic diagram of the heat pipe disc in this utility model.

[0037] In the diagram: 1. Module body; 101. Base; 102. Air inlet; 103. Filter port 1; 104. Air outlet; 105. Filter port 2; 106. Module main board; 107. External terminal 1; 108. External terminal 2; 109. Epoxy-sealed shell; 110. Terminal block; 2. Blower structure; 201. Blower chamber; 202. Conical air-concentrating top; 203. Drive motor; 204. Fan blade; 3. Heat conduction structure; 301. Multi-port connector; 302. Basic air duct; 303. Multi-port pipe; 304. Heat conduction pipe coil; 305. Corrugated groove; 306. Heat conduction inner plate. Detailed Implementation

[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0039] Please see Figure 1-6In this embodiment of the present invention, a power semiconductor module with a composite heat dissipation structure includes a module body 1, a blower structure 2, and a heat-conducting structure 3. The module body 1 includes a base 101, on which an epoxy-sealed shell 109 is cast. The blower structure 2 includes a blower chamber 201. The heat-conducting structure 3 includes a multi-port connector 301, the bottom of which is connected to the blower chamber 201, and the two sides of which are connected to multiple basic air ducts 302. The multi-port connector 301 and the basic air ducts 302 are embedded in the top of the base 101. The upper end of the basic air ducts 302 is connected to the bottom of the multi-port pipe 303, and one side of the multi-port pipe 303 is connected to a heat-conducting pipe disc 304. The heat-conducting pipe disc 304 is embedded inside the epoxy-sealed shell 109.

[0040] Specifically, the twisted heat-conducting coil 304 bypasses the protruding integrated components inside the main body 1 and is close to the components. The multi-port connector 301, basic air duct 302, multi-port pipe 303 and heat-conducting coil 304 are all copper pipes that absorb the heat generated by each component during operation. The air force generated by the blower structure 2 is introduced into each pipe from the blower chamber 201 and discharged. While absorbing heat on the outer wall of each pipe, the heat is carried away from the inner wall of the pipe by the air force. Heat is conducted and dissipated in a close and timely manner at the same time. The simple structure provides a high-efficiency heat dissipation effect inside the whole device.

[0041] Example 1

[0042] like Figure 2 , 4 As shown, in this embodiment, the main body 1 of the module also includes an air inlet 102, a first filter port 103, an air outlet 104, and a second filter port 105. The air inlet 102 is opened on the lower edge of the front and rear sides of the base 101; the first filter port 103 is snapped into the opening of the air inlet 102; the air outlet 104 is opened on both sides of the base 101, and the air outlet 104 is connected to the bottom sides of the blower chamber 201; the second filter port 105 is snapped into the opening of the air outlet 104.

[0043] In this embodiment, filter structures are snapped into both the air inlet 102 and the air outlet 104 to intercept dust and impurities, preventing dust from entering the various airflow channels and adhering to the inner walls of the channels, thus affecting the heat conduction effect.

[0044] like Figure 1-5As shown, in this embodiment, the module body 1 also includes a module motherboard 106, a first external terminal 107, a second external terminal 108, and a terminal block 110. The module motherboard 106 is snapped onto the upper surface of the base 101; the first external terminal 107 is fixedly installed on the upper surface of the module motherboard 106; the second external terminal 108 is fixedly installed on both sides of the upper surface of the base 101; the terminal block 110 is fixedly installed on the upper surface of the epoxy-sealed shell 109; the module motherboard 106, the first external terminal 107, the second external terminal 108, and the heat pipe plate 304 are cast and encapsulated inside the epoxy-sealed shell 109, and one end of the heat pipe plate 304 passes through the base 101 and communicates with the air outlet 104.

[0045] In practice, both the epoxy-sealed shell 109 and the base 101 are made of epoxy material that covers the windings of a dry-type transformer with good thermal conductivity, which completely wraps all the internal structures of the whole device, allowing for normal natural heat dissipation. Together with the heat-conducting structure 3 and the air-cooling structure 2, they form a composite heat dissipation structure with extremely high heat dissipation efficiency.

[0046] Example 2

[0047] Based on Embodiment 1, in order to supplement the specific method of filling the interior of the heat-conducting structure 3 with airflow through the blower structure 2, which was not mentioned in Embodiment 1.

[0048] like Figure 4-6 As shown, in this embodiment, the blower structure 2 further includes a conical wind-gathering top 202, a drive motor 203, and a fan blade 204. The conical wind-gathering top 202 is opened on the upper surface of the blower chamber 201, and the top of the conical wind-gathering top 202 is connected to the multi-port connector 301. The drive motor 203 is fixedly installed at the bottom of the blower chamber 201. The output end of the drive motor 203 is fixedly installed. The heat-conducting structure 3 further includes corrugated grooves 305 and heat-conducting inner plates 306. The corrugated grooves 305 are arranged at equal angles on the outer surface of the heat-conducting pipe plate 304. The heat-conducting inner plates 306 are arranged at equal angles and fixedly installed in the inner wall of the heat-conducting pipe plate 304.

[0049] In practice, during heat dissipation, the fan blades 204 are driven to rotate by the drive motor 203, drawing air from the air inlet 102 and injecting it into the multi-port connector 301 through the conical air-gathering top 202. The air is then dissipated in a close and timely manner through various airflow channels and finally discharged from the air outlet 104. Meanwhile, corrugated grooves 305 are opened on the inner and outer surfaces of the heat-conducting pipe plate 304, and heat-conducting inner plates 306 are installed to increase the contact area between the outer surface of the pipe and the epoxy-sealed shell 109 and the contact area between the inside of the pipe and the airflow.

[0050] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0051] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A power semiconductor module with a composite heat dissipation structure, characterized in that, include: The module body (1) includes a base (101) and an epoxy-sealed shell (109) is cast on the upper side of the base (101). The blower structure (2) includes a blower chamber (201); The heat-conducting structure (3) includes a multi-port connector (301). The bottom side of the multi-port connector (301) is connected to the blower chamber (201). Both sides of the multi-port connector (301) are connected to multiple basic air ducts (302). The multi-port connector (301) and the basic air ducts (302) are embedded in the top of the base (101). The upper end of the basic air ducts (302) is connected to the bottom side of the multi-port pipe (303). One side of the multi-port pipe (303) is connected to the heat-conducting pipe disc (304). The heat-conducting pipe disc (304) is embedded inside the epoxy-sealed shell (109).

2. The power semiconductor module with a composite heat dissipation structure according to claim 1, characterized in that, The main body of the module (1) also includes: Air inlet (102), the air inlet (102) is opened on the lower edge of the front and rear surfaces of the base (101); The first filter port (103) is snapped into the opening of the air inlet (102); Air outlet (104) is provided on both sides of the base (101), and the air outlet (104) is connected to the bottom edges of the blower chamber (201); The second filter port (105) is snapped into the opening of the air outlet (104).

3. The power semiconductor module with a composite heat dissipation structure according to claim 2, characterized in that, The main body of the module (1) also includes: Module motherboard (106), which is snapped onto the upper surface of base (101); External terminal (107) is fixedly installed on the upper surface of the module motherboard (106); The second external terminal (108) is fixedly installed on both sides of the upper surface of the base (101); Terminal block (110) is fixedly installed on the upper surface of epoxy-sealed shell (109).

4. The power semiconductor module with a composite heat dissipation structure according to claim 3, characterized in that, The module motherboard (106), external terminal 1 (107), external terminal 2 (108) and heat pipe plate (304) are encapsulated in an epoxy-sealed shell (109). One end of the heat pipe plate (304) passes through the base (101) and is connected to the air outlet (104).

5. The power semiconductor module with a composite heat dissipation structure according to claim 4, characterized in that, The blower structure (2) also includes: A conical wind-gathering top (202) is provided on the upper surface of the blower chamber (201), and the top of the conical wind-gathering top (202) is connected to a multi-port connector (301); A drive motor (203) is fixedly installed at the bottom of the blower chamber (201); The fan blade (204) is fixedly installed at the output end of the drive motor (203).

6. The power semiconductor module with a composite heat dissipation structure according to claim 5, characterized in that, The thermally conductive structure (3) also includes: Corrugated grooves (305) are arranged at equal angles on the outer surface of the heat pipe disc (304); The heat-conducting inner sheet (306) is arranged at equal angles and fixedly installed in the inner wall of the heat-conducting tube disk (304).

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