Structure for improving anti-electromagnetic interference capability of chip

Abstract

The utility model provides a structure for improving the anti-electromagnetic interference capability of a chip, and the structure comprises a protection assembly which comprises a protection plate, heat dissipation fins, a supporting column, a first protection net, a fixed plate, an elastic buckle, a limiting plate, a groove, a supporting plate, a spring, a connecting plate, and a second protection net. The top of the protection plate is evenly and fixedly connected with cooling fins, the bottom of the protection plate is symmetrically and fixedly connected with supporting columns, and the bottom of the protection plate is fixedly connected with a first protection net. According to the utility model, electromagnetic shielding is carried out through the protection plate and the protection net which are made of metal materials, electromagnetic interference on the chip is reduced, and the anti-electromagnetic interference capability of the chip during working is improved, so that the stability and reliability of the chip are improved. The heat dissipation effect of the chip is guaranteed through the arrangement of the heat dissipation fins and the ventilation holes, installation is carried out through the elastic buckles, installation is convenient and easy, and through the movement of the second protective net, positions can be given for structures such as pins, so that installation and welding of the chip are facilitated.

Description

Technical Field

[0001] This utility model relates to an anti-electromagnetic interference structure, and more particularly to a structure for improving the anti-electromagnetic interference capability of chips, belonging to the field of chip protection technology. Background Technology

[0002] A chip is a miniature electronic circuit that integrates a large number of tiny electronic components onto a single semiconductor substrate. It is the brain of an electronic device, responsible for performing various tasks such as processing information, storing data, performing calculations, and controlling operations. These electronic components are integrated onto a small semiconductor wafer through precise design and manufacturing processes, forming a complex circuit structure.

[0003] When a chip is working, electromagnetic interference can cause problems such as chip performance degradation, data transmission errors, and system crashes. Some chip packaging designs are significantly inadequate in resisting electromagnetic interference. When the chip is in a complex electromagnetic environment, these packages are unable to withstand the attack of interference signals, which not only affects the stability and reliability of the chip, but also limits the application of the chip in fields with high performance and high reliability requirements. Therefore, a structure for improving the chip's electromagnetic interference resistance is proposed. Utility Model Content

[0004] In view of this, the present invention provides a structure for improving the electromagnetic interference resistance of a chip, so as to solve or alleviate one of the technical problems existing in the prior art, and at least provide a beneficial option.

[0005] The technical solution of this utility model embodiment is implemented as follows: a structure for improving the anti-electromagnetic interference capability of a chip includes a protective component, wherein the protective component includes a protective plate, heat dissipation fins, a support column, a first protective net, a fixing plate, an elastic buckle, a limiting plate, a groove, a support plate, a spring, a connecting plate, and a second protective net.

[0006] The top of the protective plate is uniformly fixed with heat dissipation fins, the bottom of the protective plate is symmetrically fixed with support columns, the bottom of the protective plate is fixed with a first protective mesh, the bottom of the support columns is fixed with a fixing plate, the surface of the fixing plate has through holes, the inside of the through holes is fitted with elastic buckles, the bottom of the elastic buckles is fixed with a limit plate, the inside of the protective plate has grooves, the bottom of the protective plate is fixed with several support plates, the inner sidewall of the groove is fixed with a spring, the bottom end of the spring is fixed with a connecting plate, the bottom of the connecting plate is fixed with a second protective mesh. When the chip is working, electromagnetic shielding is achieved through the metal protective plate and protective mesh to reduce electromagnetic interference to the chip, and the heat dissipation effect of the chip is ensured by setting heat dissipation fins and ventilation holes to avoid the chip temperature from becoming too high.

[0007] A further preferred embodiment: the surface of the first protective net is uniformly provided with ventilation holes.

[0008] A further preferred embodiment: the second protective net is slidably connected between the two support plates.

[0009] A further preferred embodiment: the connecting plate is disposed on the top of the support plate.

[0010] A further preferred embodiment: a chip assembly is disposed at the bottom of the protective component, the chip assembly comprising a substrate and a chip body;

[0011] The chip body is mounted on the top of the substrate.

[0012] A further preferred embodiment: the fixing plate is disposed on the top of the substrate.

[0013] A further preferred embodiment: one end of the elastic buckle extends through the top of the substrate.

[0014] A further preferred embodiment: the limiting plate is disposed at the bottom of the substrate.

[0015] The present invention has the following advantages due to the adoption of the above technical solution:

[0016] I. This utility model uses a metal protective plate and protective mesh for electromagnetic shielding, which reduces electromagnetic interference to the chip, improves the chip's anti-electromagnetic interference capability during operation, and thus improves the chip's stability and reliability.

[0017] Second, this utility model ensures the heat dissipation effect of the chip by setting heat dissipation fins and ventilation holes, and is installed by elastic buckles, which is convenient and simple to install. The second protective net can move to make way for pins and other structures, so as to facilitate the installation and soldering of the chip.

[0018] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural diagram of the present invention;

[0021] Figure 2 This is a structural diagram of the chip body of this utility model;

[0022] Figure 3 This is a bottom view of the structure of this utility model;

[0023] Figure 4 This is a structural diagram of the groove inside the present invention.

[0024] Reference numerals: 10, chip assembly; 11, substrate; 12, chip body; 20, protective component; 21, protective plate; 22, heat dissipation fins; 23, support column; 24, first protective net; 25, ventilation hole; 26, fixing plate; 27, elastic buckle; 28, limiting plate; 29, groove; 210, support plate; 211, spring; 212, connecting plate; 213, second protective net. Detailed Implementation

[0025] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0026] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0027] like Figures 1-4 As shown, this utility model embodiment provides a structure for improving the anti-electromagnetic interference capability of a chip, including a protective component 20. The protective component 20 includes a protective plate 21, heat dissipation fins 22, support column 23, first protective net 24, fixing plate 26, elastic buckle 27, limiting plate 28, groove 29, support plate 210, spring 211, connecting plate 212, and second protective net 213.

[0028] The top of the protective plate 21 is uniformly fixed with heat dissipation fins 22, the bottom of the protective plate 21 is symmetrically fixed with support columns 23, the bottom of the protective plate 21 is fixed with a first protective net 24, the bottom of the support columns 23 is fixed with a fixing plate 26, the surface of the fixing plate 26 has through holes, the inside of the through holes is fitted with elastic buckles 27, the bottom of the elastic buckles 27 is fixedly connected with a limit plate 28, the inside of the protective plate 21 has grooves 29, the bottom of the protective plate 21 is fixedly connected with several support plates 210, and the inner sidewall of the grooves 29 is fixedly connected with springs. 211, A connecting plate 212 is fixedly connected to the bottom end of the spring 211, and a second protective net 213 is fixedly connected to the bottom of the connecting plate 212. When the chip is working, electromagnetic shielding is achieved through the metal protective plate 21 and the protective net to reduce electromagnetic interference to the chip. The heat dissipation effect of the chip is ensured by setting heat dissipation fins 22 and ventilation holes 25 to avoid the chip temperature from getting too high. An insulating layer is provided between the support plate 210 and the second protective net 213 and the pins. The protective plate 21 and the protective net are made of metal electromagnetic shielding material and have a conductive coating treatment on their surface.

[0029] In this embodiment, specifically: ventilation holes 25 are evenly provided on the surface of the first protective net 24.

[0030] In this embodiment, specifically: the second protective net 213 is slidably connected between two support plates 210. A guide rail is provided on one side of the support plate 210 to assist the second protective net 213 in sliding. By moving the second protective net 213, space can be made for structures such as pins to facilitate chip installation and soldering.

[0031] In this embodiment, specifically: the connecting plate 212 is disposed on the top of the support plate 210, and the connecting plate 212 moves when the second protective net 213 moves.

[0032] In this embodiment, specifically: a chip assembly 10 is provided at the bottom of the protective component 20, and the chip assembly 10 includes a substrate 11 and a chip body 12;

[0033] A chip body 12 is mounted on the top of the substrate 11, and the chip body 12 is disposed between the protective plate 21 and the protective mesh.

[0034] In this embodiment, specifically: the fixing plate 26 is disposed on the top of the base plate 11, and the fixing plate 26 serves to support the protective plate 21 and other structures.

[0035] In this embodiment, specifically: one end of the elastic buckle 27 penetrates through the top of the substrate 11, and the substrate 11 and the fixing plate 26 are fixed by the elastic buckle 27, which is convenient and simple to operate and saves installation time.

[0036] In this embodiment, specifically: the limiting plate 28 is disposed at the bottom of the substrate 11. The limiting plate 28 is used to limit the elastic buckle 27, so that the elastic buckle 27 can fix the substrate 11 and the fixing plate 26 together.

[0037] In operation, the chip body 12 is mounted on the substrate 11, the fixing plate 26 is placed on the substrate 11, the chip pins press the second protective mesh 213 upwards and enter between the support plates 210, ensuring that the fixing plate 26 can fit tightly against the substrate 11. The elastic buckle 27 passes through the substrate 11 and the fixing plate 26 to fix them, completing the installation of the anti-electromagnetic interference structure. The operation is convenient and simple, saving time. When the chip is working, electromagnetic shielding is achieved through the metal protective plate 21 and the protective mesh, reducing the electromagnetic interference received by the chip. The heat dissipation effect of the chip is ensured by setting heat dissipation fins 22 and ventilation holes 25, avoiding the chip temperature from becoming too high.

[0038] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A structure for improving the electromagnetic interference resistance of a chip, comprising a protective component (20), characterized in that: The protective assembly (20) includes a protective plate (21), heat dissipation fins (22), support column (23), first protective net (24), fixing plate (26), elastic buckle (27), limiting plate (28), groove (29), support plate (210), spring (211), connecting plate (212), and second protective net (213). The top of the protective plate (21) is uniformly fixed with heat dissipation fins (22), the bottom of the protective plate (21) is symmetrically fixed with support columns (23), the bottom of the protective plate (21) is fixed with a first protective net (24), the bottom of the support column (23) is fixed with a fixing plate (26), the surface of the fixing plate (26) is provided with a through hole, the inside of the through hole is installed with an elastic buckle (27), the bottom of the elastic buckle (27) is fixedly connected with a limit plate (28), the inside of the protective plate (21) is provided with a groove (29), the bottom of the protective plate (21) is fixedly connected with several support plates (210), the inner sidewall of the groove (29) is fixedly connected with a spring (211), the bottom end of the spring (211) is fixedly connected with a connecting plate (212), and the bottom of the connecting plate (212) is fixedly connected with a second protective net (213).

2. The structure for improving the electromagnetic interference resistance of a chip according to claim 1, characterized in that: The surface of the first protective net (24) is uniformly provided with ventilation holes (25).

3. The structure for improving the electromagnetic interference resistance of a chip according to claim 1, characterized in that: The second protective net (213) is slidably connected between the two support plates (210).

4. The structure for improving the electromagnetic interference resistance of a chip according to claim 1, characterized in that: The connecting plate (212) is disposed on the top of the support plate (210).

5. The structure for improving the electromagnetic interference resistance of a chip according to claim 1, characterized in that: The bottom of the protective component (20) is provided with a chip component (10), which includes a substrate (11) and a chip body (12). The chip body (12) is mounted on the top of the substrate (11).

6. The structure for improving the electromagnetic interference resistance of a chip according to claim 5, characterized in that: The fixing plate (26) is disposed on the top of the base plate (11).

7. A structure for improving the electromagnetic interference resistance of a chip according to claim 5, characterized in that: One end of the elastic buckle (27) extends through the top of the substrate (11).

8. A structure for improving the electromagnetic interference resistance of a chip according to claim 5, characterized in that: The limiting plate (28) is disposed at the bottom of the substrate (11).

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