Packaging unit and packaging structure
By designing the working surface and heat dissipation surface of the base island in the packaging unit and setting creepage grooves on the package body, the problem of low heat dissipation efficiency in the prior art is solved, and the effects of high-efficiency heat dissipation and improved device power density are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2026-04-07
AI Technical Summary
Existing through-hole and surface-mount packaging technologies face challenges in terms of heat dissipation efficiency and space utilization, making it difficult to meet the heat dissipation requirements of next-generation high-power devices.
Design a packaging unit including a unit frame and a package body. The unit frame has a base island protruding from the plane. The base island is provided with a working surface and a heat dissipation surface. The chip is mounted on the working surface. When the package body covers the unit frame and the chip, the heat dissipation surface is exposed to achieve top heat dissipation. The creepage distance is increased by providing creepage grooves on the package body.
It improves the heat dissipation efficiency of the packaging unit, reduces the temperature rise of the device, increases the power density and operating efficiency of the device, and reduces the risk of leakage and electrical breakdown.
Smart Images
Figure CN224098158U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a packaging unit and packaging structure. Background Technology
[0002] In the field of electronic packaging, heat dissipation performance is a core factor determining device reliability and system efficiency. With the exponential growth of power density in electronic devices, thermal management has become a key bottleneck restricting technological development. Current mainstream through-hole and surface-mount packaging technologies face severe challenges in terms of both heat dissipation efficiency and space utilization.
[0003] While through-hole packaging technology offers high power dissipation capabilities, its thermal architecture needs to be independent of the PCB design, relying on external heat sinks for heat conduction. This discrete cooling solution not only significantly increases system size and cost but also runs counter to the trend of highly integrated modern electronic devices.
[0004] In contrast, while surface-mount packaging achieves higher space utilization, its heat conduction path must pass through the PCB board with poor thermal conductivity before finally reaching the heat sink. This indirect heat dissipation mode leads to a significant increase in thermal resistance and can only dissipate heat on one side at the bottom, which greatly limits the system's heat dissipation capacity and makes it difficult to meet the stringent heat dissipation requirements of next-generation high-power devices.
[0005] Therefore, a new solution is needed to address the aforementioned technical problems. Utility Model Content
[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a packaging unit and packaging structure to solve the problem of low heat dissipation efficiency of the packaging structure in the prior art.
[0007] To achieve the above and other related objectives, this utility model provides a packaging unit, specifically configured as follows: it includes a unit frame, a chip, and a package body, wherein the unit frame includes a base island protruding from the plane of the unit frame, the base island having a working surface and a heat dissipation surface disposed opposite to each other, the working surface being disposed opposite to the plane of the unit frame; the chip is disposed on the working surface; the package body is used to cover the unit frame and the chip, the heat dissipation surface is exposed on the surface of the package body, and the package body is provided with creepage grooves.
[0008] Optionally, the unit frame further includes a first pin and a second pin disposed opposite to each other on both sides of the base island in the width direction and exposed in the package. The first pin is integrally connected to the base island, or the first pin and the second pin are both spaced apart from the base island, and the side of the first pin and the second pin closest to the base island is offset from the base island in a direction perpendicular to the plane of the unit frame.
[0009] Optionally, at least one chip is disposed on the working surface, and the chip is connected to the first pin or the second pin by wire bonding.
[0010] Optionally, both the first pin and the second pin located inside the package body are provided with pin grooves, and the first pin and / or the second pin are provided with locking holes. The pin grooves and the locking holes are connected and are both located near the edge of the package body.
[0011] Optionally, a welding groove is provided on the working surface where the chip is welded, and an overflow groove is provided around the working surface.
[0012] Optionally, a first protrusion is provided on both sides of the base island along its length. The surface of the first protrusion that is parallel to and connected to the heat dissipation surface is the heat dissipation surface. A stepped surface is provided on the heat dissipation surface. A raised edge is provided on the side of the stepped surface that is away from the heat dissipation surface. The package body covers the stepped surface and the raised edge.
[0013] Optionally, a second boss is provided on both sides of the base island along its length, and a welding groove is provided on the package body at the location corresponding to the second boss, with the second boss exposed in the welding groove.
[0014] Optionally, the package body is provided with at least one top adhesive opening; the creepage groove is provided on the side of the package body that exposes the heat dissipation surface and is located on the side close to the second pin, and the creepage groove is provided with the top adhesive opening.
[0015] Optionally, a foolproof hole is provided on the side of the package that exposes the heat dissipation surface.
[0016] This utility model also provides a packaging structure, including a lead frame and any of the above-described packaging units. The lead frame is provided with a plurality of frame units, the packaging units are disposed on the lead frame, and each frame unit is provided with a plurality of packaging units.
[0017] As described above, the packaging unit and packaging structure of this utility model have the following beneficial effects:
[0018] By setting a working surface and a heat dissipation surface on the base island protruding from the plane of the unit frame, wherein the working surface is set opposite to the plane of the unit frame and is used to mount the chip, when the package covers the unit frame and the chip, the heat dissipation surface is exposed outside the package, so that the heat generated by the chip during operation can be dissipated through the heat dissipation surface, thereby achieving top heat dissipation. This is beneficial to improving the heat dissipation efficiency of the package unit, reducing the temperature rise of the device, and improving the power density and operating efficiency of the device. Attached Figure Description
[0019] Figure 1 The diagram shown is a structural schematic of the packaging unit according to an embodiment of the present invention.
[0020] Figure 2 This is a schematic diagram of the packaging unit from another perspective, representing an embodiment of the present invention.
[0021] Figure 3 The diagram shown is a partial structural schematic of the packaging unit 1 in an embodiment of the present invention.
[0022] Figure 4 This is a schematic diagram showing another example of the packaging unit 1 in an embodiment of the present utility model.
[0023] Figure 5 The diagram shown is a partial structural schematic of the packaging unit 2 in an embodiment of this utility model.
[0024] Figure 6 The diagram shown is a structural schematic of the packaging structure according to an embodiment of the present invention.
[0025] Explanation of reference numerals in the attached figures
[0026] 1-Chip;
[0027] 2-Package body; 21-Crease groove; 22-Bonding groove; 23-Top adhesive nozzle; 24-Follow-through hole;
[0028] 3-Base island; 31-Working surface; 32-Heat dissipation surface; 33-Overflow groove; 34-First boss; 35-Step surface; 36-Protruding edge; 37-Second boss;
[0029] 4-First pin; 41-Pin groove;
[0030] 5-Second pin; 51-Ficking hole;
[0031] 6-Leader frame. Detailed Implementation
[0032] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.
[0033] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show components relevant to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the shape, quantity, and proportion of each component can be arbitrarily changed, and the component layout may be more complex. The structures, proportions, and sizes shown in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effects and objectives of this utility model, should still fall within the scope of the technical content disclosed in this utility model. Furthermore, terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are only for clarity of description and are not intended to limit the scope of implementation of this utility model. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of implementation of this utility model.
[0034] like Figures 1 to 5 As shown, some embodiments of this application provide a packaging unit, including a unit frame, a chip 1, and a package body 2. The unit frame includes a base island 3 protruding from the plane of the unit frame, the base island 3 having a working surface 31 and a heat dissipation surface 32 disposed opposite to each other. Since the base island 3 is parallel to the plane of the unit frame, the working surface 31 can be disposed opposite to the plane of the unit frame. The chip 1 can be mounted on the working surface 31 using solder or the like. When the package body 2 covers the unit frame and the chip 1, the heat dissipation surface 32 is exposed outside the package body 2. The heat generated by the chip 1 is transferred to the heat dissipation surface 32 through the base island 3, and then dissipated through the heat dissipation surface 32, achieving top heat dissipation. This improves the heat dissipation efficiency of the packaging unit, reduces the temperature rise of the device, and improves the power density and operating efficiency of the device. Furthermore, the package body 2 is provided with creepage grooves 21, thereby increasing the creepage distance of the packaging unit, which helps to reduce the risk of leakage and electrical breakdown caused by environmental factors.
[0035] For example, the heat dissipation surface 32 is flush with the surface of the package 2.
[0036] In some embodiments, the unit frame further includes a first pin 4 and a second pin 5, which are disposed opposite to each other and located on opposite sides of the base island 3 in the width direction, and both the first pin 4 and the second pin 5 are partially exposed outside the package 2. The first pin 4 is integrally connected to the base island 3, and the side of the second pin 5 closest to the base island 3 is offset from the base island 3 in a direction perpendicular to the plane of the unit frame. Alternatively, both the first pin 4 and the second pin 5 are spaced apart from the base island 3, and the sides of the first pin 4 and the second pin 5 closest to the base island 3 are offset from the base island 3 in a direction perpendicular to the plane of the unit frame. This offset arrangement of the first pin 4 or the second pin 5 from the base island 3 reduces thermal coupling between the base island 3 and the pins, preventing heat concentration in a certain area and causing localized overheating, and also improves overall heat dissipation efficiency.
[0037] In one example, multiple first pins 4 and second pins 5 are provided. These multiple first pins 4 or second pins 5 extend along the width direction of the base island 3 and are arranged side-by-side along the length direction of the base island 3, with adjacent first pins 4 or second pins 5 spaced apart. In this embodiment, 11 first pins 4 and 11 second pins 5 are provided. The combination of these 11 first pins 4 or second pins 5 can be 1+1+9, 1+10, 2+9, etc.
[0038] For example, both the first pin 4 and the second pin 5 can be set as seagull pins.
[0039] In some embodiments, to improve the reliability and stability of the package, both the first pin 4 and the second pin 5 are provided with pin grooves 41 on the side facing the base island 3, so that fluid overflowing during the soldering of the chip 1 and the pins can flow into the pin grooves 41. Locking holes 51 are provided on the first pin 4, or the second pin 5, or both the first pin 4 and the second pin 5, to further improve the reliability and stability of the package. The pin grooves 41 and the locking holes 51 are connected and both are located inside the package body 2. Specifically, the pin grooves 41 and the locking holes 51 are located near the edge of the package body 2.
[0040] For example, the pin groove 41 may include, but is not limited to, being configured as a V-shaped groove.
[0041] In some embodiments, at least one chip 1 is mounted on the working surface 31 of the base island 3. The specific number of chips 1 can be set to one, two, etc., and can be adapted according to the size of the working surface 31 and the chip 1. When multiple chips 1 are provided, it is beneficial to reduce the area occupied by the package on the circuit board, thereby improving the utilization rate of the circuit board and reducing costs.
[0042] When there is one chip 1, chip 1 is connected to the second pin 5 via wire bonding. When there are two chips 1, one chip 1 is connected to the first pin 4 via wire bonding, and the other chip 1 is connected to the second pin 5 via wire bonding.
[0043] In some embodiments, a welding groove is provided on the working surface 31 of the base island 3, which is correspondingly provided to the chip 1. The welding groove can enhance the uniformity of solder filling, and the groove structure increases the contact area between the solder and the base island 3, improves the wettability of the solder, and ensures a stronger welding interface.
[0044] For example, the welding groove may include, but is not limited to, a cross-shaped groove.
[0045] In some embodiments, in order to improve the reliability and stability of the packaging, an overflow groove 33 is provided on the working surface 31 of the base island 3. The overflow groove 33 is located around the working surface 31 so that the fluid overflowing when the chip 1 is installed can flow into the overflow groove 33.
[0046] For example, the overflow groove 33 may include, but is not limited to, being configured as a V-shaped groove.
[0047] In some embodiments, a first protrusion 34 is provided on both sides of the base island 3 along its length. The surface of the first protrusion 34 that is parallel to and in contact with the heat dissipation surface 32 becomes part of the heat dissipation surface 32, increasing the area of the heat dissipation surface 32 and thus improving heat dissipation efficiency. A stepped surface 35 is provided on the heat dissipation surface 32, and a protruding edge 36 is provided on the side of the stepped surface 35 facing away from the heat dissipation surface 32. Both the stepped surface 35 and the protruding edge 36 are covered by the encapsulation body 2, thereby improving the stability of the connection between the base island 3 and the encapsulation body 2.
[0048] In one example, the base island 3 is provided with stepped surfaces 35 on both sides facing the first pin 4 or the second pin 5, and the second boss 37 is also provided with stepped surfaces 35.
[0049] In some embodiments, a second protrusion 37 is provided on both sides of the base island 3 along its length, and a welding groove 22 is provided on the package body 2. The welding groove 22 is provided in correspondence with the second protrusion 37, and the second protrusion 37 is partially exposed in the welding groove 22. This arrangement is beneficial to achieve the connection between the electrode of the chip 1 inside the package body 2 and the external pins or other circuits by pressing the second protrusion 37 during the welding process.
[0050] For example, one first protrusion 34 and two second protrusions 37 may be provided on one side of the base island 3 along its length, wherein the first protrusion 34 is located in the middle of the side wall of the base island 3, and the two second protrusions 37 are respectively located on both sides of the first protrusion 34.
[0051] In some embodiments, in order to ensure that the package 2 is ejected from the cavity, the package 2 is provided with one or more ejector ports 23. The number of ejector ports 23 can be set to 1, 2, 3, 4, etc., and can be adapted according to actual needs.
[0052] For example, the top adhesive inlet 23 can be located on one side of the package body 2 exposed to the heat dissipation surface 32, or it can be located on the side of the package body 2 away from the heat dissipation surface 32. In this embodiment, four top adhesive inlets 23 are provided on one side of the package body 2 exposed to the heat dissipation surface 32, and these four top adhesive inlets 23 can be distributed at the four opposite corners of the package body 2; two top adhesive inlets 23 are provided on the side of the package body 2 away from the heat dissipation surface 32.
[0053] In some embodiments, the creepage groove 21 is provided on one side of the exposed heat dissipation surface 32 of the package 2 and is located on the side close to the second pin 5. This arrangement helps to extend the current path on the surface of the package 2, thereby increasing the creepage distance.
[0054] In one example, a top adhesive opening 23 is provided in the creepage groove 21.
[0055] In some embodiments, to ensure that the package unit is correctly mounted onto a circuit board or other component in a specific direction, a foolproof hole 24 is provided on one side of the exposed heat dissipation surface 32 of the package 2. For example, the foolproof hole 24 corresponds to the P1N1 pin in the first pin 4, thereby simplifying the installation process and reducing the complexity and error rate of manual operation.
[0056] In summary, the packaging unit provided by this utility model provides a working surface and a heat dissipation surface on a base island protruding from the plane of the unit frame. The working surface is arranged opposite to the plane of the unit frame and is used to mount the chip. When the package body covers the unit frame and the chip, the heat dissipation surface is exposed outside the package body, so that the heat generated by the chip during operation can be dissipated through the heat dissipation surface, achieving top heat dissipation. This is beneficial to improving the heat dissipation efficiency of the packaging unit, reducing the temperature rise of the device, and improving the power density and operating efficiency of the device.
[0057] like Figure 6 As shown, some embodiments of this utility model also provide a packaging structure, including a lead frame 6 and the aforementioned packaging units disposed on the lead frame 6. The lead frame 6 has a plurality of frame units, and each frame unit contains a plurality of packaging units.
[0058] In this embodiment, the lead frame 6 is divided into 24 frame units, each frame unit is provided with 2 rows and 12 columns of encapsulation units, and a pre-cut channel is provided between two adjacent frame units.
[0059] For example, the material of the lead frame 6 may include, but is not limited to, KFC copper alloy.
[0060] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A packaging unit, characterized in that, include: The unit frame includes a base island protruding from the plane of the unit frame, the base island having a working surface and a heat dissipation surface disposed opposite to each other, the working surface being disposed opposite to the plane of the unit frame; The chip is disposed on the working surface; A package is used to cover the unit frame and the chip, the heat dissipation surface is exposed on the surface of the package, and the package is provided with creepage grooves.
2. The packaging unit according to claim 1, characterized in that: The unit frame further includes a first pin and a second pin that are disposed opposite to each other on both sides of the base island in the width direction and exposed in the package. The first pin is connected to the base island as a whole, or the first pin and the second pin are both spaced apart from the base island, and the side of the first pin and the second pin closest to the base island is offset from the base island in a direction perpendicular to the plane of the unit frame.
3. The packaging unit according to claim 2, characterized in that: At least one chip is disposed on the working surface, and the chip is connected to the first pin or the second pin by wire bonding.
4. The packaging unit according to claim 2, characterized in that: Both the first pin and the second pin located inside the package body are provided with pin grooves, and the first pin and / or the second pin are provided with locking holes. The pin grooves and the locking holes are connected and are both located near the edge of the package body.
5. The packaging unit according to any one of claims 1-4, characterized in that: A welding groove is provided on the working surface at the location where the chip is welded, and an overflow groove is provided around the perimeter of the working surface.
6. The packaging unit according to any one of claims 1-4, characterized in that: Both sides of the base island along its length are provided with a first protrusion. The surface of the first protrusion that is parallel to and connected to the heat dissipation surface is the heat dissipation surface. A stepped surface is provided on the heat dissipation surface. A raised edge is provided on the side of the stepped surface that is away from the heat dissipation surface. The package body covers the stepped surface and the raised edge.
7. The packaging unit according to any one of claims 1-4, characterized in that: A second boss is provided on both sides of the base island along its length. A pressure welding groove is provided on the package body at the location corresponding to the second boss, and the second boss is exposed in the pressure welding groove.
8. The packaging unit according to any one of claims 2-4, characterized in that: The package body is provided with at least one top adhesive opening; the creepage groove is provided on the side of the package body that exposes the heat dissipation surface and is located on the side close to the second pin, and the creepage groove is provided with the top adhesive opening.
9. The packaging unit according to any one of claims 1-4, characterized in that: A foolproof hole is provided on the side of the package that exposes the heat dissipation surface.
10. A packaging structure, characterized in that, include: The lead frame is composed of several frame units; The packaging unit as described in any one of claims 1-9 is disposed on the lead frame, and each of the frame units contains a plurality of the packaging units.