Cutting device for semiconductor wafer processing

Abstract

The utility model discloses a cutting device for semiconductor wafer processing, which relates to the technical field of wafer processing and is technically characterized by comprising a position adjusting component arranged on the cutting device, and a lighting component is mounted on the position adjusting component; the lighting assembly comprises a lamplight mounting base, a plurality of mounting grooves distributed in an annular array are formed in the surface of the lamplight mounting base in the radial direction, a horn-shaped light gathering cover is arranged in each mounting groove, light sources are arranged at the bottoms of the light gathering covers, and the light sources are arranged in an annular array with a multi-layer concentric circle structure. The lighting device is movable, and the shadow area is greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially is concerned with a kind of cutting device for semiconductor wafer processing. BACKGROUND

[0002] In modern semiconductor manufacturing, wafer cutting device is crucial, its performance directly affects chip quality and production efficiency. With the development of technology, the precision, efficiency and flexibility of wafer cutting are increasingly improved.

[0003] The patent technology CN202023006012.5 presents "a kind of semiconductor wafer precision cutting device", through advanced positioning system, high-precision motion control algorithm and optimization tool path planning, cutting precision and consistency are significantly improved. However, the existing technology has deficiencies in the lighting system. Its lighting module is fixedly installed, lacks mobile flexibility, is difficult to adjust in real time according to cutting position, causes part of area light uneven, produces shadow, increases cutting deviation risk, and can also interfere with subsequent detection. At the same time, the space layout of the lighting device and other components is poor, the light propagation is blocked by more, the shadow area is expanded, the visibility of the cutting area is reduced, which affects the work efficiency and may threaten the vision health of the operator. SUMMARY

[0004] In order to solve the above technical problems, the purpose of the utility model is to provide a kind of cutting device for semiconductor wafer processing, and the illumination is movable, which greatly reduces the shadow area.

[0005] To achieve the above purpose, the utility model provides the following technical scheme:

[0006] A kind of cutting device for semiconductor wafer processing, including the position adjusting component being arranged on cutting device, the position adjusting component is installed with lighting component;The lighting component includes light installation seat, the surface of the light installation seat is provided with a plurality of installation grooves in radial direction and is arranged in annular array, each installation groove is provided with a horn-shaped light shield, the light shield bottom is provided with light source, the arrangement mode of the light source is provided with the annular array of multilayer concentric circle structure, and the illumination is movable, which greatly reduces the shadow area.

[0007] Preferably, the outer surface of the light shield is covered with a circular-arc light-transmitting cover to provide certain protection.

[0008] Preferably, the outer wall of the light-transmitting cover is coated with an oil-repellent layer to improve the anti-fouling ability.

[0009] Preferably, the light source uses LED lampwick, and each LED lampwick is fixed in the inner cavity bottom of the light shield through a heat-conducting adhesive layer, has higher brightness, and ensures the heat conduction ability.

[0010] Preferably, the position adjusting assembly comprises a telescopic cylinder, the bottom of the telescopic cylinder is provided with a stabilizer through a first damping bearing, the bottom of the stabilizer is rotationally connected with the corner of the cutting device through a second damping bearing, and the top of the telescopic cylinder is rotationally connected with the tail end of the light mounting seat through a third damping bearing, and the adjusting flexibility is higher.

[0011] The utility model has the following beneficial effects:

[0012] The telescopic cylinder in the position adjusting assembly allows the lighting assembly to move in the vertical direction, and different cutting links have different requirements for the height of light in semiconductor wafer processing.

[0013] The rotation connection design of the first, second and third damping bearings gives the lighting assembly multi-directional rotation capability.

[0014] The cooperation of the telescopic cylinder and the damping bearings allows the lighting assembly to be flexibly adjusted in three-dimensional space.

[0015] The light source is arranged in a ring array with a multi-layer concentric circle structure, so that light uniformly irradiates the cutting area from multiple directions.

[0016] The cooperation of the light-shielding cover and the light-transmitting cover reduces light scattering.

[0017] High-brightness LED lampwick provides sufficient illumination intensity: LED lampwick is used as light source, which can provide sufficient light intensity. In cutting area, sufficient light can reduce shadow caused by insufficient light, so that cutting area is more clearly visible, which is beneficial to improve cutting precision and quality, and provides good visual conditions for processing process.

[0018] Thermal conductive glue layer fixation guarantees stability of light source: each LED lampwick is fixed in the bottom of the inner cavity of the spotlight cover through the thermal conductive glue layer. The thermal conductive glue layer not only fixes the lampwick, but also conducts the heat generated by the lampwick in time, so as to ensure that the lampwick works in a stable temperature environment, prolongs the service life, and ensures the stability and reliability of the light source. Stable light source provides continuous and stable light support for reducing shadow area, and ensures that the illumination effect of the cutting area is always good. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the premise of the drawings.

[0020] Fig. 1 It is a front view of the embodiment of the present application.

[0021] Fig. 2 It is a sectional view of the lighting assembly of the embodiment of the present application.

[0022] In the figure: 101, light mounting seat; 102, spotlight cover; 103, light source; 104, light-transmitting cover; 105, thermal conductive glue layer; 201, telescopic air cylinder; 202, first damping bearing; 203, stabilizing frame; 204, second damping bearing; 205, third damping bearing. DETAILED DESCRIPTION

[0023] The technical scheme of the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0024] As Figs. 1-2As shown, a semiconductor wafer dicing apparatus includes a position adjustment component mounted on the dicing apparatus, and an illumination component mounted on the position adjustment component. The illumination component includes a light mounting base 101, and the surface of the light mounting base 101 has a plurality of mounting slots arranged in a ring array along the radial direction. Each mounting slot is provided with a horn-shaped light condenser 102, and a light source 103 is provided at the bottom of the light condenser 102. The light sources 103 are arranged in a ring array with a multi-layer concentric circle structure.

[0025] like Figs. 1-2 As shown, a position adjustment component is installed on the cutting device, and the lighting component is mounted on the position adjustment component. This allows the position and angle of the lighting component to be changed via the position adjustment component, enabling it to be flexibly adjusted to a suitable lighting position according to the actual needs of the cutting operation, providing accurate and effective lighting to the cutting area. The surface of the lighting component's lamp mounting base 101 has multiple mounting slots arranged in a circular array along the radial direction. This design allows the light source 103 to be evenly distributed on the lamp mounting base 101, providing all-around and uniform lighting to the cutting area. A trumpet-shaped condenser 102 is installed in each mounting slot. The condenser 102 can converge the light emitted by the light source 103, improving the light intensity and concentration, and enhancing the lighting effect of the cutting area. The light source 103 is located at the bottom of the condenser 102, and the light source 103 is arranged in a multi-layered concentric circle circular array. This multi-layered concentric circle circular array arrangement further ensures the uniformity of light in the lighting area, ensuring that all positions in the cutting area receive appropriate lighting intensity, while also helping to improve light utilization.

[0026] like Figs. 1-2 As shown, the outer surface of the condenser 102 is covered with an arc-shaped light-transmitting cover 104. The arc-shaped light-transmitting cover 104 can change the propagation path of light, making the light shine more softly on the cutting area, avoiding the phenomenon of excessive light concentration and glare, and at the same time, it can further expand the illumination range and improve the lighting effect. In addition, the light-transmitting cover 104 can also provide a certain degree of protection for the condenser 102 and the light source 103, preventing external dust, impurities, etc. from entering the interior of the condenser 102 and affecting the normal operation of the light source 103.

[0027] like Figs. 1-2 As shown, the outer wall of the light-transmitting cover 104 is coated with an oleophobic layer. Coating the outer wall of the light-transmitting cover 104 with an oleophobic layer gives the surface of the light-transmitting cover 104 oleophobic properties. During the cutting process, some oil and other contaminants may be generated. The oleophobic layer can prevent these oil and contaminants from adhering to the surface of the light-transmitting cover 104, maintaining the cleanliness and transparency of the light-transmitting cover 104, ensuring normal light transmission, and thus guaranteeing the stability of the lighting effect. At the same time, it also facilitates the cleaning and maintenance of the light-transmitting cover 104, extending its service life.

[0028] like Figs. 1-2 As shown, the light source 103 uses LED chips, and each LED chip is fixed to the bottom of the inner cavity of the condenser 102 by a thermally conductive adhesive layer 105. High-brightness LED chips have advantages such as high luminous efficiency, high brightness, and low energy consumption, providing sufficient light to the cutting area and meeting the lighting requirements of cutting operations. The thermally conductive adhesive layer 105 not only firmly fixes the LED chips inside the condenser 102, ensuring their positional stability, but also has good thermal conductivity, effectively dissipating the heat generated by the LED chips during operation, reducing their operating temperature, improving their lifespan and luminous efficiency, and ensuring the stability and reliability of the lighting effect.

[0029] like Figs. 1-2 As shown, the position adjustment assembly includes a telescopic cylinder 201. A stabilizing frame 203 is rotatably mounted on the bottom of the telescopic cylinder 201 via a first damping bearing 202. The bottom of the stabilizing frame 203 is rotatably connected to the edge of the cutting device via a second damping bearing 204. The top of the telescopic cylinder 201 is rotatably connected to the tail end of the light mounting base 101 via a third damping bearing 205. The telescopic cylinder 201 is an important component of the position adjustment assembly. Through the telescopic movement of the cylinder 201, the height position of the lighting assembly can be changed, allowing it to adapt to the lighting needs of cutting operations at different heights. The stabilizing frame 203 rotatably mounted on the bottom of the telescopic cylinder 201 via the first damping bearing 202 allows the telescopic cylinder 201 to rotate within a certain angle range relative to the stabilizing frame 203, thereby adjusting the tilt angle of the lighting assembly so that the light can illuminate the cutting area at a suitable angle. The bottom of the stabilizer 203 is rotatably connected to the corner of the cutting device via a second damping bearing 204, further increasing the rotational flexibility of the lighting assembly. This allows for a wider range of position and angle adjustments to adapt to the lighting requirements of cutting operations in different locations. The top of the telescopic cylinder 201 is rotatably connected to the tail end of the light mounting base 101 via a third damping bearing 205. This rotatable connection allows for further fine-tuning of the tilt angle of the lighting assembly, making the light beam direction more precise and ensuring optimal lighting effects in the cutting area. The damping bearing also ensures the lighting assembly remains stable after position and angle adjustments, preventing wobbling due to external forces and ensuring optimal lighting performance.

[0030] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. A dicing apparatus for semiconductor wafer processing, characterized in that: The application relates to a position adjusting assembly arranged on a cutting device, wherein a lighting assembly is arranged on the position adjusting assembly; the lighting assembly comprises a lamp mounting base (101), a plurality of mounting grooves in annular array are arranged on the surface of the lamp mounting base (101) in a radial direction, a horn-shaped light cover (102) is arranged in each mounting groove, a light source (103) is arranged at the bottom of the light cover (102), and the arrangement mode of the light source (103) is arranged as an annular array with a multilayer concentric circle structure.

2. The semiconductor wafer processing cutting apparatus according to claim 1, characterized by: The outer surface of the light cover (102) is covered with a circular-arc light-transmitting cover (104).

3. The semiconductor wafer processing dicing apparatus according to claim 2, wherein: The outer wall of the light-transmitting cover (104) is coated with an oil-repellent layer.

4. The semiconductor wafer processing dicing apparatus according to claim 3, wherein: The light source (103) adopts an LED lamp core, and each LED lamp core is fixed in the inner cavity bottom of the light cover (102) through a heat-conducting glue layer (105).

5. The semiconductor wafer processing dicing apparatus according to claim 1, wherein: The position adjusting assembly comprises a telescopic air cylinder (201), and the bottom of the telescopic air cylinder (201) is rotationally arranged with a stabilizing frame (203) through a first damping bearing (202).

6. The semiconductor wafer processing dicing apparatus according to claim 5, wherein: The bottom of the stabilizing frame (203) is rotationally connected with the edge corner of the cutting device through a second damping bearing (204).

7. The semiconductor wafer processing dicing apparatus according to claim 6, wherein: The top of the telescopic air cylinder (201) is rotationally connected with the tail end of the lamp mounting base (101) through a third damping bearing (205).

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