Micro-channel heat sink channel for cooling liquid resin

Abstract

The utility model relates to the technical field of heat dissipation of liquid resin, and particularly discloses a micro-channel heat sink channel for cooling liquid resin, which comprises a heat sink channel whole body, a cooling liquid inlet is arranged on the side surface of the heat sink channel whole body in a penetrating manner, and cooling liquid outlets are symmetrically arranged on one side of the cooling liquid inlet. The cooling liquid outlets penetrate through the side surface of the whole heat sink channel, and one cooling liquid inlet and one cooling liquid outlet form a group. According to the micro-channel heat sink channel for cooling the liquid resin, cooling liquid passes through the micro-channel main body in the device to cool the liquid resin, each liquid resin transmission layer is located between the adjacent micro-channel layers, and the micro-channel layers can dissipate heat of the upper and lower surfaces of the liquid resin transmission layers, so that the cooling efficiency is improved; in the cooling process, the thickness of the resin is low, the cooling efficiency can be improved, meanwhile, internal residual heat is reduced, and the product quality is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the heat dissipation technical field of liquid resin, specifically for a kind of microchannel heat sink channel for liquid resin cooling. BACKGROUND

[0002] Prepreg resin is important raw material of carbon fiber prepreg, glass fiber prepreg and other intermediate materials, and its main components are liquid epoxy resin, solid resin, curing agent and accelerator composition, and the preparation of traditional prepreg resin is as follows: solid resin is stirred in stirred tank and heated to 120-180 DEG C for mixing;Uniformly stir curing agent dispersion after cooling to 80-95 DEG C;After adding accelerator dispersion and stirring uniformly, cooling to 70-80 DEG C, discharge and refrigerate, so there are multiple liquid resin cooling processes in the production process of prepreg resin.

[0003] However, resin is usually cooled by air natural convection in stirred tank, and the cooling time is relatively long, and residual heat is easily left in resin, which affects the temperature uniformity of resin as a whole, greatly reduces the processing efficiency, and has negative impact on product quality. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of microchannel heat sink channel for liquid resin cooling, and the resin is rapidly cooled by microchannel main body in the device, to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of microchannel heat sink channel for liquid resin cooling, including heat sink channel whole, the side surface of the heat sink channel whole is through and is provided with cooling liquid inlet, the side of the cooling liquid inlet is symmetrically provided with cooling liquid outlet, the side surface of the heat sink channel whole that the cooling liquid outlet is through and is provided, one cooling liquid inlet and cooling liquid outlet are a group, the cooling liquid inlet and cooling liquid outlet are arranged in parallel, one end of the heat sink channel whole is through and is provided with liquid resin inlet, the other end of the heat sink channel whole is symmetrically provided with liquid resin outlet, the inside of the heat sink channel whole is provided with microchannel layer and liquid resin transmission layer, the layer number of the microchannel layer is not less than 2 layers, the layer number of the liquid resin transmission layer is the layer number of microchannel layer minus one.

[0006] Preferably, the liquid resin transmission layer is arranged between adjacent microchannel layers, the microchannel layer dissipates heat from the upper and lower surfaces of the liquid resin transmission layer, the liquid resin transmission layer has a flat plate structure, and the two ends of the liquid resin transmission layer are respectively communicated with the same liquid resin inlet and liquid resin outlet.

[0007] By using the micro-channel layer, the liquid resin flowing in the liquid resin transmission layer can be cooled.

[0008] Preferably, the two ends of the micro-channel layer are connected with the cooling liquid inlet and the cooling liquid outlet respectively, each of the micro-channel layers is connected with a group of the cooling liquid inlets and the cooling liquid outlets respectively, the micro-channel layers are independently arranged, and the micro-channel layers and the liquid resin transmission layers are independently arranged.

[0009] By using the cooling liquid flowing in the micro-channel layer, the liquid resin can be cooled.

[0010] Preferably, the main body of the micro-channel layer is a flat plate structure, the micro-channel layer is internally provided with a rectangular micro-channel main body, the two ends of the micro-channel layer are throughly arranged with the micro-channel main body, and a plurality of the micro-channel main bodies are arranged in parallel in the micro-channel layer.

[0011] By using the micro-channel main body in the micro-channel layer, the cooling liquid can flow.

[0012] Preferably, the inner wall of the micro-channel main body is symmetrically provided with a recess, the recess is a rectangular groove, the symmetric axis of the two recesses is provided with a turbulence block, the turbulence block is a rectangular structure, and the turbulence block is fixedly installed on the inner wall of the micro-channel main body.

[0013] By using the recess and the turbulence block, the disturbance of the cooling liquid during the flowing process can be realized, and the heat dissipation efficiency is improved.

[0014] Compared with the prior art, the micro-channel heat sink channel for cooling liquid resin has the beneficial effects that:

[0015] 1. The cooling liquid passes through the micro-channel main body to cool the liquid resin, each liquid resin transmission layer is located between adjacent micro-channel layers, the micro-channel layer can cool the upper and lower surfaces of the liquid resin transmission layer, the cooling efficiency is improved, the resin transmission layer has a flat plate structure, the thickness of the resin is low during the cooling process, the cooling efficiency is improved, the residual heat in the interior is reduced, and the product quality is improved.

[0016] 2. The micro-channel layers are independent of each other, and the micro-channel layers and the liquid resin transmission layers are also independent of each other, so that the cooling work of each micro-channel layer does not interfere with each other, even if a group of micro-channels has a problem, other micro-channels can still work normally, the stability of the device is ensured, and the liquid resin transmission layer is independently arranged, so that the cooling liquid does not enter the resin and pollute the resin during the operation process.

[0017] 3. The device has the recess and the turbulence block arranged inside the microchannel body, when the cooling liquid flows in the microchannel body, the recess and the turbulence block cooperate to enhance the disturbance of the cooling liquid, increase the contact area and the heat transfer coefficient between the cooling liquid and the inner wall of the microchannel body, and improve the cooling performance of the device on the liquid resin. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a front view structural schematic diagram of the utility model;

[0019] Figure 2 It is a rear view structural schematic diagram of the utility model;

[0020] Figure 3 It is a whole internal structure schematic diagram of the heat sink channel of the utility model;

[0021] Figure 4 It is a microchannel layer and liquid resin transmission layer installation structure schematic diagram of the utility model;

[0022] Figure 5 It is a liquid resin transmission layer structure schematic diagram of the utility model;

[0023] Figure 6 It is a microchannel body installation structure schematic diagram of the utility model;

[0024] Figure 7 It is a recess and turbulence block installation structure schematic diagram of the utility model.

[0025] In the drawing: 1, whole heat sink channel; 2, cooling liquid inlet; 3, cooling liquid outlet; 4, liquid resin inlet; 5, liquid resin outlet; 6, microchannel layer; 7, liquid resin transmission layer; 8, microchannel body; 9, recess; 10, turbulence block. DETAILED DESCRIPTION

[0026] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.

[0027] Please refer to Figures 1-7 The utility model provides a kind of technical scheme: a kind of microchannel heat sink channel for liquid resin cooling, including whole heat sink channel 1, cooling liquid inlet 2, cooling liquid outlet 3, liquid resin inlet 4, liquid resin outlet 5, microchannel layer 6, liquid resin transmission layer 7, microchannel body 8, recess 9, turbulence block 10.

[0028] The side surface of the heat sink channel whole 1 is provided with a cooling liquid inlet 2, and the side surface of the cooling liquid inlet 2 is symmetrically provided with a cooling liquid outlet 3, one cooling liquid inlet 2 and the cooling liquid outlet 3 form a group, the cooling liquid inlet 2 and the cooling liquid outlet 3 are arranged in parallel, one end of the heat sink channel whole 1 is provided with a liquid resin inlet 4, and the other end of the heat sink channel whole 1 is symmetrically provided with a liquid resin outlet 5, the inside of the heat sink channel whole 1 is provided with a microchannel layer 6 and a liquid resin transmission layer 7, the number of layers of the microchannel layer 6 is not less than 2, the number of layers of the liquid resin transmission layer 7 is one less than the number of layers of the microchannel layer 6, the liquid resin transmission layer 7 is arranged between adjacent microchannel layers 6, the microchannel layer 6 radiates the upper and lower surfaces of the liquid resin transmission layer 7, the liquid resin transmission layer 7 is a flat plate structure, the two ends of the liquid resin transmission layer 7 are respectively communicated with the same liquid resin inlet 4 and liquid resin outlet 5, the two ends of the microchannel layer 6 are respectively connected with the cooling liquid inlet 2 and the cooling liquid outlet 3, each layer of the microchannel layer 6 is connected with a group of cooling liquid inlets 2 and cooling liquid outlets 3, the microchannel layers 6 are independently arranged, the microchannel layer 6 and the liquid resin transmission layer 7 are independently arranged, the main body of the microchannel layer 6 is a flat plate structure, the inside of the microchannel layer 6 is provided with a rectangular microchannel main body 8, the two ends of the microchannel main body 8 are provided through the microchannel layer 6, a plurality of microchannel main bodies 8 are arranged in parallel in the inside of the microchannel layer 6, the inner wall of the microchannel main body 8 is symmetrically provided with a recess 9, the recess 9 is a rectangular groove, the symmetry axis of the two recesses 9 is provided with a turbulence block 10, the turbulence block 10 is a rectangular structure, and the turbulence block 10 is fixedly installed on the inner wall of the microchannel main body 8.

[0029] In the production process of the heat sink channel whole 1, the number of the microchannel layer 6 is set to m layers, wherein m is an integer not less than 2, the number of the liquid resin transmission layer 7 is set to m-1 layers, the width of the rectangular microchannel main body 8 arranged in the microchannel layer 6 is in the range of 0.1-30mm, the spacing between the rectangular microchannel main bodies 8 is in the range of 0.1-30mm, the number of the rectangular microchannel main bodies 8 includes at least 3, the height between the upper and lower plates of the liquid resin transmission layer 7 is in the range of 1-50mm, and the spacing between the liquid resin transmission layer 7 and the microchannel layer 6 is in the range of 0.1-100mm.

[0030] As Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 And Figure 7As shown, in the process of using the device to cool the liquid resin, water is used as the cooling liquid, the water is injected from the cooling liquid inlet 2, enters the microchannel layer 6 along the cooling liquid inlet 2, and flows along the microchannel layer 6 to the microchannel body 8, and finally is discharged from the cooling liquid outlet 3, forming a cooling passage between the cooling liquid inlet 2, the microchannel body 8 and the cooling liquid outlet 3, due to the cavities 9 and the turbulence blocks 10 arranged in the microchannel body 8, the cooling water flows in the microchannel body 8, and under the action of the cavities 9 and the turbulence blocks 10, strong turbulence occurs, enhancing the heat exchange effect, the liquid resin is injected from the liquid resin inlet 4 into the device, the liquid resin enters the liquid resin transmission layer 7 along the liquid resin inlet 4, and finally flows out from the liquid resin outlet 5, when the liquid resin flows, the microchannel layer 6 cools the upper and lower surfaces of the liquid resin transmission layer 7, so that the liquid resin is fully cooled during transmission; by adjusting the flow rates of the liquid resin and the cooling water, the heat dissipation efficiency is adjusted, so as to control the temperature of the liquid resin flowing out of the liquid resin outlet 5.

[0031] Working principle: when the microchannel heat sink channel for liquid resin cooling is used, the cooling liquid is injected from the cooling liquid inlet 2, the cooling liquid flows along the microchannel body 8, and forms turbulence under the action of the cavities 9 and the turbulence blocks 10, and finally is discharged from the cooling liquid outlet 3, the liquid resin flows into the liquid resin transmission layer 7 from the liquid resin inlet 4, the upper and lower surfaces of the liquid resin transmission layer 7 are cooled by the cooling liquid in the microchannel layer 6, so that the liquid resin is fully cooled during transmission, and finally flows out from the liquid resin outlet 5, thereby increasing the overall practicability.

[0032] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A microchannel heat sink channel for cooling of liquid resin, comprising a heat sink channel monolith (1), characterized in that: The side surface of the heat sink channel whole (1) is provided with a cooling liquid inlet (2), one side of the cooling liquid inlet (2) is symmetrically provided with a cooling liquid outlet (3), the cooling liquid outlet (3) penetrates the side surface of the heat sink channel whole (1), one cooling liquid inlet (2) and cooling liquid outlet (3) form a group, the cooling liquid inlet (2) and cooling liquid outlet (3) are arranged in parallel, one end of the heat sink channel whole (1) is provided with a liquid resin inlet (4), the other end of the heat sink channel whole (1) is symmetrically provided with a liquid resin outlet (5), the inside of the heat sink channel whole (1) is provided with a microchannel layer (6) and a liquid resin transmission layer (7), the number of layers of the microchannel layer (6) is not less than 2, the number of layers of the liquid resin transmission layer (7) is one less than the number of layers of the microchannel layer (6).

2. A micro-channel heat sink channel for cooling of liquid resin according to claim 1, characterized in that: The liquid resin transmission layer (7) is arranged between adjacent microchannel layers (6), the microchannel layer (6) dissipates heat from the upper and lower surfaces of the liquid resin transmission layer (7), the liquid resin transmission layer (7) is a flat plate structure, and the two ends of the liquid resin transmission layer (7) are respectively communicated with the same liquid resin inlet (4) and liquid resin outlet (5).

3. A micro-channel heat sink channel for cooling of liquid resin as defined in claim 1, characterized in that: The two ends of the microchannel layer (6) are respectively connected with the cooling liquid inlet (2) and the cooling liquid outlet (3), each microchannel layer (6) is connected with a group of cooling liquid inlets (2) and cooling liquid outlets (3), the microchannel layers (6) are independently arranged, and the microchannel layers (6) and the liquid resin transmission layer (7) are independently arranged.

4. A micro-channel heat sink channel for cooling of liquid resin as defined in claim 1, wherein: The main body of the microchannel layer (6) is a flat plate structure, the inside of the microchannel layer (6) is provided with a rectangular microchannel main body (8), the two ends of the microchannel main body (8) penetrate the microchannel layer (6), and a plurality of microchannel main bodies (8) are arranged in parallel in the inside of the microchannel layer (6).

5. A micro-channel heat sink passage for cooling a liquid resin according to claim 4, wherein: The inner wall of the microchannel main body (8) is symmetrically provided with a recess (9), the recess (9) is a rectangular groove, the symmetry axis of the two recesses (9) is provided with a turbulence block (10), the turbulence block (10) is a rectangular structure, and the turbulence block (10) is fixedly installed on the inner wall of the microchannel main body (8).

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