Chip pressure sintering furnace
By using graphite pads and limiting mechanisms in a chip pressure sintering furnace, combined with hydraulic components and sensors, uniform pressure transmission was achieved, solving the problem of uneven pressing and improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2026-04-10
AI Technical Summary
Existing hot pressing and sintering equipment for chips is prone to uneven pressing, resulting in poor product quality.
By employing graphite pads and limiting mechanisms, combined with hydraulic components and sensors, uniform pressure transmission is ensured, and the compression resilience and high strength of the graphite pads achieve a smooth press-fit.
It improved the density and product quality of chip sintering and solved the problem of uneven pressing.
Smart Images
Figure CN224108618U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip processing equipment technical field especially relates to a chip pressure sintering furnace. BACKGROUND
[0002] At present, the mode of nano silver or nano copper hot-press sintering in chip hot-press sintering is mostly integral compression or split compression (distributed on the same plane), the workpiece to be processed is placed on the lower compression platform, the workpiece to be processed located between the two compression heads is completed chip compression by the mutual approaching and moving away of the two compression heads. The existing compression equipment is prone to uneven compression, and the product quality is poor. SUMMARY
[0003] The utility model provides a chip pressure sintering furnace to solve the problem of uneven compression of the existing compression equipment and poor product quality.
[0004] A chip pressure sintering furnace, comprising a support frame, a hydraulic assembly, a first graphite pad, a second graphite pad, a lower compression head assembly, an upper compression head assembly and a drag chain; the hydraulic assembly is arranged above the support frame, the lower compression head assembly is arranged on the bottom plate of the hydraulic assembly, the upper compression head assembly is arranged on the middle plate of the hydraulic assembly, one end of the drag chain is arranged on the support frame, the other end of the drag chain is arranged on the side of the middle plate of the hydraulic assembly, the middle plate of the hydraulic assembly moves up and down, the second graphite pad is arranged below the lower compression head of the lower compression head assembly, and the first graphite pad is arranged above the upper compression head of the upper compression head assembly.
[0005] According to the chip pressure sintering furnace of the utility model, the upper compression head assembly comprises an upper cavity frame, a roller, a connecting plate and an upper compression head; the connecting plate is arranged below the middle plate, the connecting plate is arranged above the upper cavity frame, the upper compression head is arranged in the interior of the upper cavity frame, and the roller is arranged on the side of the upper cavity frame.
[0006] According to the chip pressure sintering furnace of the utility model, the upper cavity frame comprises a limiting mechanism, and the limiting mechanism is arranged on the side of the upper cavity frame.
[0007] According to the chip pressure sintering furnace of the utility model, the upper cavity frame comprises a limiting mechanism, and the limiting mechanism is arranged on the side of the upper cavity frame.
[0008] According to the chip pressure sintering furnace of the utility model, the hydraulic assembly further comprises a hydraulic cylinder, an upper plate, a guide column and a bottom plate; the upper plate is arranged above the middle plate, the bottom plate is arranged below the middle plate, the upper part of the guide column is provided with the upper plate, the lower part of the guide column is provided with the bottom plate, the middle part of the guide column is provided with the middle plate, the middle plate moves up and down along the guide column, and the hydraulic cylinder is arranged above the upper plate.
[0009] The chip pressure sintering furnace according to the present application further comprises a displacement sensor, and the displacement sensor is arranged above the hydraulic cylinder.
[0010] The chip pressure sintering furnace according to the present application further comprises a pressure sensor, and the pressure sensor is arranged above the middle plate.
[0011] The chip pressure sintering furnace according to the present application, the lower pressing head assembly comprises a lower cavity frame, a lower pressing head and a vacuumizing mechanism; the lower pressing head is arranged inside the lower cavity frame, and the vacuumizing mechanism is arranged on both sides of the lower cavity frame.
[0012] The chip pressure sintering furnace according to the present application further comprises an upper heating pipe and a lower heating pipe; the upper heating pipe is arranged inside the upper pressing head assembly, and the lower heating pipe is arranged inside the lower pressing head assembly.
[0013] The chip pressure sintering furnace according to the present application, the first graphite pad and the second graphite pad are arranged with stepped holes or through holes.
[0014] The first graphite pad is arranged above the upper pressing head, and the second graphite pad is arranged below the lower pressing head or jig, and the compression resilience and high strength of graphite help to uniformly transmit the pressure to the silver material, thereby ensuring the sintering density and product quality. The problem of uneven pressing of silver sintering products is solved. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0016] Figure 1 It is a schematic structural view of the chip pressure sintering furnace;
[0017] Figure 2 It is a schematic structural view of the partial A enlarged view;
[0018] Figure 3 It is a schematic structural view of the hydraulic assembly;
[0019] Figure 4 It is a schematic structural view of the upper pressing head assembly;
[0020] Figure 5 It is a schematic structural view of the lower pressing head assembly;
[0021] Figure 6 isometric view of a second graphite pad
[0022] Fig. 1 is a schematic view of a support frame; Fig. 2 is a schematic view of a hydraulic assembly; Fig. 3 is a schematic view of a lower pressing head assembly; Fig. 4 is a schematic view of an upper pressing head assembly; Fig. 5 is a schematic view of a drag chain; Fig. 6 is a schematic view of a film covering mechanism; Fig. 21 is a schematic view of a hydraulic cylinder; Fig. 22 is a schematic view of an upper plate; Fig. 23 is a schematic view of a pressure sensor; Fig. 24 is a schematic view of a middle plate; Fig. 25 is a schematic view of a guide column; Fig. 26 is a schematic view of a bottom plate; Fig. 27 is a schematic view of a displacement sensor; Fig. 31 is a schematic view of a lower cavity frame; Fig. 32 is a schematic view of a lower pressing head; Fig. 33 is a schematic view of a vacuum pumping mechanism; Fig. 34 is a schematic view of a second graphite pad; Fig. 41 is a schematic view of an upper cavity frame; Fig. 42 is a schematic view of a roller; Fig. 43 is a schematic view of a limiting mechanism; Fig. 44 is a schematic view of a connecting plate. DETAILED DESCRIPTION
[0023] The embodiments of the present application will be further described below in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.
[0024] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" are only used for description purposes, and cannot be understood as indicating or implying relative importance.
[0025] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0026] In the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0027] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present embodiment. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or at least one embodiment or example. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.
[0028] The following will be described in combination with Figures 1-6 A chip pressure sintering furnace is described in the present embodiment, comprising a support frame 1, a hydraulic assembly 2, a first graphite pad, a second graphite pad 34, a lower pressing head assembly 3, an upper pressing head assembly 4 and a drag chain 5; the hydraulic assembly 2 is arranged above the support frame 1, the lower pressing head assembly 3 is arranged on the bottom plate 26 of the hydraulic assembly 2, the upper pressing head assembly 4 is arranged on the middle plate 24 of the hydraulic assembly 2, one end of the drag chain 5 is arranged on the support frame 1, the other end of the drag chain 5 is arranged on the side of the middle plate 24 of the hydraulic assembly 2, and the middle plate of the hydraulic assembly 2 moves up and down. The lower pressing head 32 of the lower pressing head assembly 3 is provided with the second graphite pad 34 below, and the upper pressing head of the upper pressing head assembly 4 is provided with the first graphite pad above. The lower pressing head 32 can also be a positioning jig.
[0029] In some embodiments, the first graphite pad and the second graphite pad 34 are provided with stepped holes or through holes.
[0030] In some embodiments, the upper pressing head assembly 4 comprises an upper cavity frame 41, a roller shaft 42, a connecting plate 44 and an upper pressing head; the connecting plate 44 is arranged below the middle plate 24, the connecting plate 44 is arranged above the upper cavity frame 41, the upper pressing head is arranged inside the upper cavity frame 41, and the roller shaft 42 is arranged on the side of the upper cavity frame 41.
[0031] In some embodiments, a limiting mechanism 43 is further included, and the limiting mechanism 43 is arranged on the side of the upper cavity frame 41.
[0032] In some embodiments, a film coating mechanism 6 is further included, and the film coating mechanism 6 is arranged on the side of the middle plate 24.
[0033] In some embodiments, the hydraulic assembly 2 further comprises a hydraulic cylinder 21, an upper plate 22, a guide column 25 and a bottom plate 26; the upper plate 22 is arranged above the middle plate 24, the bottom plate 26 is arranged below the middle plate 24, the upper part of the guide column 25 is arranged on the upper plate 22, the lower part of the guide column 25 is arranged on the bottom plate 26, the middle part of the guide column 25 is arranged on the middle plate 24, the middle plate 24 moves up and down along the guide column 25, and the hydraulic cylinder 21 is arranged above the upper plate 22.
[0034] In some embodiments, a displacement sensor 27 is further included, and the displacement sensor 27 is arranged above the hydraulic cylinder 21.
[0035] In some embodiments, a pressure sensor 23 is further included, and the pressure sensor 23 is arranged above the middle plate 24.
[0036] In some embodiments, the lower pressing head assembly 3 comprises a lower cavity frame 31, a lower pressing head 32 and a vacuumizing mechanism 33; the lower pressing head 32 is arranged inside the lower cavity frame 31, and the vacuumizing mechanism 33 is arranged on both sides of the lower cavity frame 31.
[0037] In some embodiments, an upper heating pipe and a lower heating pipe are further included; the upper heating pipe is arranged inside the upper pressing head assembly 4, and the lower heating pipe is arranged inside the lower pressing head assembly 3.
[0038] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A chip pressure sintering furnace characterized by comprising: The support frame, the hydraulic assembly, the first graphite pad, the second graphite pad, the lower pressing head assembly, the upper pressing head assembly and the drag chain are included; the hydraulic assembly is arranged above the support frame, the lower pressing head assembly is arranged on the bottom plate of the hydraulic assembly, the upper pressing head assembly is arranged on the middle plate of the hydraulic assembly, one end of the drag chain is arranged on the support frame, the other end of the drag chain is arranged on the side of the middle plate of the hydraulic assembly, the middle plate of the hydraulic assembly moves up and down, the second graphite pad is arranged below the lower pressing head of the lower pressing head assembly, and the first graphite pad is arranged above the upper pressing head of the upper pressing head assembly.
2. The chip pressure sintering furnace according to claim 1, wherein The upper pressing head assembly includes an upper cavity frame, a roller, a connecting plate and an upper pressing head; the connecting plate is arranged below the middle plate, the connecting plate is arranged above the upper cavity frame, the upper pressing head is arranged inside the upper cavity frame, and the roller is arranged on the side of the upper cavity frame.
3. The chip pressure sintering furnace according to claim 2, wherein The limiting mechanism is further included, and the limiting mechanism is arranged on the side of the upper cavity frame.
4. The chip pressure sintering furnace according to claim 1, wherein The film covering mechanism is further included, and the film covering mechanism is arranged on the side of the middle plate.
5. The chip pressure sintering furnace according to claim 1, wherein The hydraulic assembly further includes a hydraulic cylinder, an upper plate, a guide column and a bottom plate; the upper plate is arranged above the middle plate, the bottom plate is arranged below the middle plate, the upper part of the guide column is arranged on the upper plate, the lower part of the guide column is arranged on the bottom plate, the middle part of the guide column is arranged on the middle plate, the middle plate moves up and down along the guide column, and the hydraulic cylinder is arranged above the upper plate.
6. The chip pressure sintering furnace according to claim 5, wherein The displacement sensor is further included, and the displacement sensor is arranged above the hydraulic cylinder.
7. The chip pressure sintering furnace according to claim 5, wherein The pressure sensor is further included, and the pressure sensor is arranged above the middle plate.
8. The chip pressure sintering furnace according to claim 1, wherein The lower pressing head assembly includes a lower cavity frame, a lower pressing head and a vacuumizing mechanism; the lower pressing head is arranged inside the lower cavity frame, and the vacuumizing mechanism is arranged on both sides of the lower cavity frame.
9. The chip pressure sintering furnace according to claim 1, wherein The upper heating pipe and the lower heating pipe are further included; the upper heating pipe is arranged inside the upper pressing head assembly, and the lower heating pipe is arranged inside the lower pressing head assembly.
10. The chip pressure sintering furnace according to claim 1, wherein The first graphite pad and the second graphite pad are arranged with stepped holes or through holes.