Packaging structure for tantalum capacitor
The encapsulation structure of the support layer and the cover layer solves the problem of damage and warping of tantalum capacitors during the encapsulation process, and realizes the protection of tantalum capacitors and the convenience of cutting.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- VENTEC ELECTRONICS SUZHOU
- Filing Date
- 2025-04-03
- Publication Date
- 2026-04-10
AI Technical Summary
In the packaging process of tantalum capacitors, existing technologies are prone to causing damage and warping of the tantalum capacitors, which affects the subsequent cutting process.
The encapsulation structure employs a support layer and a cover layer with through holes. By heating and pressing, the support layer and the cover layer are melted and wrapped around the tantalum capacitor. The support layer acts as a carrier to withstand the pressure, avoiding direct pressure on the tantalum capacitor. The base plate provides positioning and reduces pressure.
It effectively protects tantalum capacitors from damage during the packaging process and prevents warping, ensuring the smooth progress of subsequent cutting processes.
Smart Images
Figure CN224110143U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to tantalum capacitor packaging technical field especially relates to a kind of packaging structure for tantalum capacitor. BACKGROUND
[0002] Tantalum capacitor is the product of small volume and large capacity in capacitor, which is made into small and sheet components suitable for surface mounting. Tantalum capacitor is widely used in military communication, aerospace, industrial control, video equipment and communication instruments.
[0003] Tantalum capacitor is used individually when mounting, but in production stage, it is made synchronously in multiple, that is, multiple tantalum capacitors are formed on substrate (FR4 material) in array, and each tantalum capacitor needs to be packaged and then cut into independent unit. In the process of heating and pressurizing packaging of tantalum capacitor module, without protective measures, on the one hand, tantalum capacitor may be damaged, on the other hand, tantalum capacitor module may be warped, which is not conducive to subsequent cutting.
[0004] Therefore, it is necessary to provide a structure for packaging tantalum capacitor, which can protect tantalum capacitor during packaging process and facilitate subsequent cutting action. SUMMARY
[0005] The utility model aims at providing a kind of packaging structure for tantalum capacitor, tantalum capacitor can be completely wrapped by the cooperation of support layer with through hole and covering layer, tantalum capacitor can be completely wrapped and packaged in subsequent heating and pressurizing packaging process, and support layer can be used as carrier to bear pressure and avoid applying pressure to tantalum capacitor, so that tantalum capacitor can be prevented from being damaged.
[0006] To achieve the above purpose, the utility model adopts the technical scheme of: a kind of packaging structure for tantalum capacitor, comprising:
[0007] Bottom plate, the upper end surface of which is provided with slot,
[0008] Tantalum capacitor module, comprising substrate and multiple tantalum capacitors arranged in array on the substrate, the substrate is embedded in the slot,
[0009] Support layer, which is made of hot melt material, has multiple through holes penetrating through the body and arranged in array, the support layer abuts against the upper end surface of the substrate, and the tantalum capacitors are embedded in the through holes, and the upper end surface of the tantalum capacitors is not higher than the upper end surface of the support layer,
[0010] Covering layer, which is made of hot melt material, abuts against the bottom plate on the side, and covers the support layer in the middle and is at least supported upward by the support layer.
[0011] As a further optimization, the vertical projection of the tantalum capacitor is located within the vertical projection of the through hole.
[0012] As a further optimization, the upper end surface of the tantalum capacitor is higher than the upper end surface of the bottom plate. When the upper end surface of the tantalum capacitor is flush with the upper end surface of the support layer, the tantalum capacitor is easily abutted with the lower end surface of the cover layer.
[0013] As a further optimization, the horizontal section of the substrate is square.
[0014] As a further optimization, an adhesive layer is provided on the bottom plate beside the slot, and the peripheral side of the cover layer is connected with the adhesive layer, so that the stability of the cover layer and the tantalum capacitor module can be ensured.
[0015] As a further optimization, the vertical projection of the substrate coincides with the vertical projection of the slot.
[0016] As a further optimization, there is a gap between at least two adjacent side walls of the substrate and the side walls of the slot.
[0017] As a further optimization, a positioning plug is arranged in the gap, and the opposite side walls of the positioning plug are respectively abutted with the side walls of the substrate and the slot, so that the tantalum capacitor module can be stably positioned in the slot; a guide inclined surface is arranged on the side wall of the positioning plug, so that the positioning plug can be easily embedded in the gap.
[0018] As a further optimization, the support layer and the cover layer are both heat-conducting adhesive films.
[0019] As a further optimization, the bottom plate comprises a frame plate and a support plate, the frame plate is provided with a window vertically penetrating the body thereof, and the lower end of the frame plate is abutted on the support plate to form the slot from the window, so that the slot is conveniently formed.
[0020] Compared with the prior art, the utility model has the beneficial effects that:
[0021] 1. The tantalum capacitor is completely wrapped by the cooperation of the support layer with the through hole and the cover layer, and the support layer can be used as a carrier to bear the pressure, so that the pressure is not applied to the tantalum capacitor, and the tantalum capacitor is prevented from being damaged.
[0022] 2. The bottom plate is used as a bearing component, the slot of the bottom plate can position the substrate, and the structure of the slot sinking can reduce the pressure applied to the tantalum capacitor. BRIEF DESCRIPTION OF DRAWINGS
[0023] Fig. 1 The structure diagram of the utility model.
[0024] Fig. 2 isomeric embodiment of the utility model.
[0025] Fig. 3 isomeric embodiment of the utility model.
[0026] Fig. 4 isomeric embodiment of the utility model.
[0027] Fig. 5 isomeric embodiment of the utility model.
[0028] Fig. 6 isomeric embodiment of the utility model. DETAILED DESCRIPTION
[0029] The following is a specific embodiment of the utility model and is further described in conjunction with the drawings, but the utility model is not limited to these embodiments.
[0030] As shown in Figs. 1-2 a packaging structure for tantalum capacitor, including bottom plate 10, tantalum capacitor module 20, support layer 30 and cover layer 40, the upper end surface of bottom plate 10 is equipped with slot 100, tantalum capacitor module 20 includes substrate 21 and the multiple tantalum capacitors 22 of array arrangement of being arranged on substrate 21, substrate 21 is embedded in slot 100, support layer 30 is hot melt material, such as heat-conducting adhesive film, it is equipped with multiple through holes 300 that are arrayed and pass through its ontology, support layer 30 is preferably embedded in slot 100 at least its lower part and is abutted on the upper end surface of substrate 21, tantalum capacitor 22 is embedded in through hole 300, the upper end surface of tantalum capacitor 22 is not higher than the upper end surface of support layer 30, namely it does not protrude through hole 300, cover layer 40 is hot melt material, such as RCF material, its circumferential side is abutted on bottom plate 10, and the middle part covers support layer 30 and is at least supported by support layer 30 upwards.
[0031] In the utility model, with the bottom plate 10 as the bearing component, the tantalum capacitor module 20 is placed in the slot 100 of the bottom plate 10 to support and position, since the plurality of tantalum capacitors 22 in the tantalum capacitor module 20 has a certain height and has a gap between each other, the heat-meltable support layer 30 is covered, the support layer 30 is matched and sleeved on the plurality of tantalum capacitors 22 through the plurality of through holes 300, the upper end face of the tantalum capacitor 22 is not protruded from the support layer 30 and is surrounded by the side wall of the through hole 300, and the heat-meltable covering layer 40 is placed on the support layer 30 to realize the complete covering of the tantalum capacitor and form the packaging structure for the tantalum capacitor. When the packaging structure for the tantalum capacitor is used, it is placed on the pressurizing platform, the covering layer 40 is pressed under the heating and pressurizing of certain conditions, the covering layer 40 and the support layer 30 are tightly wrapped around the upper end and the periphery of the tantalum capacitor 22 to realize the packaging of each tantalum capacitor 22, and the side of the covering layer 40 can be connected to the bottom plate 10 after heat melting. After pressing, the bottom plate 10 can not be removed, and the tantalum capacitor is divided into opposite units (the unit is: a tantalum capacitor, a matching substrate and a wrapping layer around the periphery and the upper end of the tantalum capacitor, and the bottom plate and the tantalum capacitor are separated after cutting) with the bottom plate 10 to be used in the subsequent process. In the packaging process of the tantalum capacitor, the abutment and support of the bottom plate 10 and the substrate 21 and the pulling effect of the covering layer 40 on the support layer 30 and the tantalum capacitor module 20 after heat melting and connecting to the bottom plate 10 can prevent the warping of the substrate 21 during the pressing process, the tantalum capacitor module 20 is placed in the form of the slot 100 to reduce the pressure on the tantalum capacitor 22 and prevent the tantalum capacitor 22 from being cracked, and further, the support layer 30 can resist the downward pressure from the top to prevent the tantalum capacitor 22 from being pressed, and the support layer 30 can also wrap the tantalum capacitor 22 from the side in a molten state.
[0032] The utility model discloses a support layer 30 with through hole 300 and the cooperation of covering layer 40 can completely wrap tantalum capacitor 22, and the tantalum capacitor 22 can be completely wrapped and packaged in the subsequent packaging process of heating and pressing, and the support layer 30 can be used as the carrier of bearing the pressure to avoid applying pressure to the tantalum capacitor 22, so that the tantalum capacitor 22 can be prevented from being damaged, and the cooperation of the bottom plate 10 and the covering layer 40 can prevent the tantalum capacitor module 20 from warping during the packaging process.
[0033] Preferably, the vertical projection of the tantalum capacitor 22 is located in the vertical projection of the through hole 300, the size of the through hole 300 is 0.5mm wider than the size of the tantalum capacitor 22 on one side, and the space can be filled after the support layer 30 and the covering layer 40 are melted.
[0034] In addition, the upper end face of the tantalum capacitor 22 is higher than the upper end face of the bottom plate 10.
[0035] The horizontal section of the substrate 21 is square, which can prevent the tantalum capacitor module 20 from rotating in the slot 100.
[0036] As shown in the drawings, Fig. 3 In an embodiment of the present application, in order to ensure that the covering layer 40 can be stably placed on the support layer 30 and the bottom plate 10, the bottom plate 10 can be provided with a bonding layer 11 on the side of the slot 100, and the side of the covering layer 40 is connected with the bonding layer 11, that is, the stability of the covering layer 40 is achieved, and the stability of the tantalum capacitor module 20 in the covering layer 40 during transportation can also be ensured.
[0037] For the connection between the tantalum capacitor module 20 and the bottom plate 10, in an embodiment, the vertical projection of the substrate 21 can be coincided with the vertical projection of the slot 100, that is, the substrate 21 is clamped in the slot 100, which can ensure the stability of the tantalum capacitor module 20, but the process of placing the substrate 21 in the slot 100 is required to be more strict, and the operation needs to be careful and stable.
[0038] As shown in the drawings, Fig. 4 and Fig. 5 In another embodiment, at least two adjacent side walls of the substrate 21 have a gap 101 between the side walls of the slot 100, and the substrate 21 is not clamped in the slot 100, so that the tantalum capacitor module 20 can be easily placed in the slot, but the large space of the slot 100 will affect the stability of the substrate 21 in it.
[0039] Further, in order to ensure the stability of the tantalum capacitor module 20, a positioning plug 12 can be arranged in the above-mentioned gap 101, and the opposite side walls of the positioning plug 12 are respectively in contact with the side walls of the substrate 21 and the slot 100, so that the positioning plug 12 in the gap 101 can transversely support and position the substrate 21, and avoid the movement of the substrate 21 in the slot 100.
[0040] Preferably, a guide slope is arranged on the side wall of the lower part of the positioning plug 12, which facilitates the extension of the positioning plug 12 into the gap 101.
[0041] As shown in the drawings, Fig. 6As shown, in one embodiment of the bottom plate 10, the bottom plate 10 comprises a frame plate 11 and a support plate 12, the frame plate 11 can be FR4 material, and the support plate 12 can be a copper foil, the frame plate 11 is provided with a window vertically penetrating through the body of the frame plate 11, and the lower end of the frame plate 11 abuts on the support plate 12 to form a slot 100 in the window, the above structure makes the bottom plate 10 in a detachable state, the frame plate 11 is placed on the upper end of the support plate 12 to form the slot 100 for positioning the tantalum capacitor module 20, which on the one hand facilitates forming the slot 100 on the thinner bottom plate 10, and on the other hand, after overall heating and pressurizing, the support plate 12 can be removed in the cutting process, which is convenient for cutting and can also be reused.
[0042] The specific embodiments described herein are merely illustrative of the spirit of the present application. Those skilled in the art to which the present application belongs can make various modifications or supplements to the described specific embodiments or replace them with similar ways, but will not deviate from the spirit of the present application or exceed the scope defined by the appended claims.
Claims
1. A packaging structure for a tantalum capacitor, characterized by, The application relates to a tantalum capacitor module, comprising: a bottom plate, an upper end surface of which is provided with a slot, a tantalum capacitor module, comprising a substrate and a plurality of tantalum capacitors arranged in an array on the substrate, the substrate being embedded in the slot, a support layer made of hot melt material, provided with a plurality of through holes arranged in an array, the support layer abutting against the upper end surface of the substrate, and the tantalum capacitors being embedded in the through holes, the upper end surface of the tantalum capacitors being not higher than the upper end surface of the support layer, a covering layer made of hot melt material, the peripheral side of the covering layer abutting against the bottom plate, and the middle part of the covering layer covering the support layer and being supported upward by the support layer.
2. The packaging structure for a tantalum capacitor according to claim 1, wherein The vertical projection of the tantalum capacitor is located in the vertical projection of the through hole.
3. The packaging structure for a tantalum capacitor according to claim 1 or 2, wherein The upper end surface of the tantalum capacitor is higher than the upper end surface of the bottom plate.
4. The packaging structure for a tantalum capacitor according to claim 1, wherein The horizontal section of the substrate is square.
5. The packaging structure for a tantalum capacitor according to claim 1, wherein The bottom plate is provided with an adhesive layer on the side of the slot, and the peripheral side of the covering layer is connected with the adhesive layer.
6. The packaging structure for a tantalum capacitor according to claim 1, wherein The vertical projection of the substrate coincides with the vertical projection of the slot.
7. The packaging structure for a tantalum capacitor according to claim 1, wherein There is a gap between at least two adjacent side walls of the substrate and the side walls of the slot.
8. The packaging structure for a tantalum capacitor according to claim 7, wherein A positioning plug is arranged in the gap, the opposite side walls of the positioning plug abutting against the side walls of the substrate and the slot respectively, and a guide inclined surface is arranged on the side wall of the positioning plug.
9. The packaging structure for a tantalum capacitor according to claim 1, wherein The support layer and the covering layer are both heat-conducting adhesive films.
10. The packaging structure for a tantalum capacitor according to claim 1, wherein The bottom plate comprises a frame plate and a support plate, the frame plate is provided with a window vertically penetrating through the body of the frame plate, and the lower end of the frame plate abuts against the support plate to form the slot.