A patch tantalum capacitor packaging mold

Abstract

The utility model discloses a kind of patch tantalum capacitor packaging mould, including mould frame, the cylinder is fixedly installed on the mould frame, and the output shaft of cylinder is fixed in the bottom of clamping plate with screw joint, the surface of clamping plate is evenly installed with multiple groups of lower mould simultaneously, and the surface of clamping plate is installed with linkage plate, multiple groups of upper mould are evenly installed on linkage plate, and the bottom of both ends of linkage plate is installed with support rod, and the bottom of support rod is fixedly installed in the end surface of mould frame simultaneously.The patch tantalum capacitor packaging mould, a plurality of tantalum capacitors needing to be packaged can be formed by mould once, a large number of products can be packaged within the same time;It can effectively improve production speed, meet the demand of mass production;Utilize mould once forming to give full play to the function of packaging equipment;Equipment can handle multiple tantalum capacitors in one packaging process, reduce the number of times of frequent start and stop of equipment;Greatly reduce the time of entire production process.

Description

Technical Field

[0001] This utility model relates to the field of capacitor molds, specifically a surface mount tantalum capacitor packaging mold. Background Technology

[0002] When encapsulating tantalum capacitors using molds, the following steps should be followed:

[0003] First, select a suitable packaging mold; the size and shape of the mold should match the specifications of the tantalum capacitor to be packaged; ensure that the mold cavity has high precision and a smooth surface to guarantee the appearance quality of the tantalum capacitor after packaging; check whether the mold opening and closing mechanism is flexible and whether the ejection device is working properly.

[0004] Place the surface-mount tantalum capacitor accurately in the designated position on the mold. During placement, ensure the tantalum capacitor has the correct polarity, and that its anode and cathode correspond to the pin positions after packaging. Inaccurate placement of the tantalum capacitor may lead to problems such as incorrect pin spacing after packaging.

[0005] Choose a suitable encapsulation material, such as epoxy resin; determine the performance parameters of the encapsulation material according to the application requirements of the tantalum capacitor, such as insulation performance, temperature resistance, hardness, etc.

[0006] The encapsulation material is injected into the mold cavity using an injection device; during the injection process, the injection speed and pressure must be carefully controlled.

[0007] However, through our long-term observation, we have found that multiple sets of tantalum capacitors that need to be packaged cannot be formed in one step. Each packaging operation involves multiple steps such as placing the capacitor, injecting the packaging material, and curing, which greatly increases the time of the entire production process. Utility Model Content

[0008] The purpose of this invention is to provide a surface mount tantalum capacitor packaging mold to solve the defects mentioned in the background art.

[0009] To achieve the above objectives, a surface mount tantalum capacitor packaging mold is provided, comprising a mold frame, on which a cylinder is fixedly mounted, and the output shaft of the cylinder is screwed to the bottom of a mold plate. Multiple sets of lower molds are evenly mounted on the surface of the mold plate, and a connecting plate is mounted on the surface of the mold plate. Multiple sets of upper molds are evenly mounted on the connecting plate, and support rods are mounted at the bottom of both ends of the connecting plate. The bottom of the support rods is fixedly mounted on the end surface of the mold frame. A gating pipe is fixedly mounted on the upper mold, and a feed pipe is fixedly provided at the top of the gating pipe. A push rod is fixedly provided on the surface of the mold frame, and limit seats are installed at both ends of the mold plate. Support rods are inserted through limit holes opened on the limit seats.

[0010] Preferably, the mold frame, the closing template, and the connecting plate are arranged in parallel, and multiple sets of guide plates are evenly installed between the mold frame and the connecting plate, while the distance between two adjacent sets of guide plates is consistent.

[0011] Preferably, the template has multiple sets of guide openings evenly distributed on it, and the guide plate is adapted to the size of the guide opening. The guide plate is inserted into the inside of the guide opening, and both the guide plate and the guide opening have rectangular cross-sections.

[0012] Preferably, the lower mold and the upper mold are combined to form a packaging mold, and a sealing gasket is fixedly provided at the bottom of the upper mold. At the same time, the lower mold and the upper mold are sealed by the sealing gasket after they are closed.

[0013] Preferably, the lower mold moves upward and inserts into the interior of the upper mold, and the lower mold and the closing mold are driven to move horizontally up and down by two sets of evenly distributed cylinders.

[0014] Preferably, the bottom surface of the lower mold is provided with receiving grooves on both sides, and a demolding piece is movably installed inside the receiving groove. At the same time, the cross-section of the demolding piece and the receiving groove are T-shaped. The bottom of the lower mold is provided with two sets of limiting holes, and a push rod is inserted into the inside of each set of limiting holes.

[0015] Preferably, mounting posts are fixedly provided on both sides of the end of the release piece, and mounting holes are provided on both sides of the bottom inner wall of the receiving groove. The mounting holes are adapted to the size of the mounting posts, and the mounting posts are movably inserted into the interior of the mounting holes.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. This utility model uses a feed pipe to feed molten material through multiple sets of gating pipes into the mold for molding. Multiple sets of tantalum capacitors requiring encapsulation can be molded in one go, enabling the encapsulation of a large number of products at the same time. This effectively improves production speed and meets the needs of large-scale production. The one-time molding process fully utilizes the function of the encapsulation equipment. The equipment can process multiple sets of tantalum capacitors in one encapsulation process, reducing the number of frequent start-ups and stops, and greatly reducing the overall production time.

[0018] 2. This utility model can lift the demolding piece by the top of the ejector rod. Since the mounting post is inserted into the mounting hole, the demolding piece rotates around the mounting post. When the demolding piece is lifted, the capacitor inside the lower mold is also lifted, which can perform a fast demolding operation. Attached Figure Description

[0019] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0020] Figure 2for Figure 1 A bottom view;

[0021] Figure 3 for Figure 1 Side view;

[0022] Figure 4 This is a schematic diagram of the push rod and its connecting structure;

[0023] Figure 5 for Figure 4 A bottom view.

[0024] The following are the labels in the diagram: 1. Mold frame; 2. Cylinder; 3. Ejector rod; 31. Limiting hole; 32. Receiving groove; 33. Mounting hole; 34. Demolding plate; 35. Mounting column; 4. Support rod; 5. Mold plate; 6. Limiting seat; 7. Lower mold; 8. Guide plate; 9. Upper mold; 91. Sealing gasket; 10. Connecting plate; 11. Sprue; 12. Feed pipe. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Please see Figure 1-5 This utility model provides a surface mount tantalum capacitor packaging mold, including a mold frame 1, on which a cylinder 2 is fixedly installed, and the output shaft of the cylinder 2 is screwed to the bottom of the assembly mold 5. At the same time, multiple sets of lower molds 7 are evenly installed on the surface of the assembly mold 5, and a connecting plate 10 is installed on the surface of the assembly mold 5. Multiple sets of upper molds 9 are evenly installed on the connecting plate 10, and support rods 4 are installed at the bottom of both ends of the connecting plate 10. The bottom of the support rods 4 is fixedly installed on the end surface of the mold frame 1. A gating pipe 11 is fixedly installed on the upper mold 9, and a feed pipe 12 is fixedly provided at the top of the gating pipe 11. A push rod 3 is fixedly provided on the surface of the mold frame 1, and limit seats 6 are installed at both ends of the assembly mold 5. The support rods 4 are inserted through the limit holes opened on the limit seats 6.

[0027] Working Principle: During operation, the external switch of cylinder 2 is activated, and the two sets of cylinders 2 work synchronously to drive the mold plate 5 upward, so that multiple sets of lower molds 7 are inserted into the interior of the upper mold 9. After the lower molds 7 and the upper mold 9 are closed, they are sealed by the sealing gasket 91. At this time, the molten material enters the mold from the feed pipe 12 through multiple sets of gating pipes 11 and performs the forming process. Multiple sets of tantalum capacitors that need to be packaged can be formed in one go through the mold, which can package a large number of products at the same time. It can effectively improve the production speed and meet the needs of large-scale production. The one-time molding of the mold fully utilizes the function of the packaging equipment. The equipment can process multiple sets of tantalum capacitors in one packaging process, reducing the number of times the equipment is frequently started and stopped. Compared with multiple small-batch packaging, the equipment can operate stably for a long time, improve the working efficiency of the equipment, and reduce the equipment cost per unit product.

[0028] After the product inside the mold is injection molded and cooled, demolding is required. Specifically, the mold plate 5 is driven downward by two sets of cylinders 2, causing multiple sets of lower molds 7 and upper molds 9 to demold. At this time, the molded product is inside the lower mold 7. When it continues to move downward, the top of the ejector rod 3 can lift the demolding piece 34. Since the mounting post 35 is inserted into the mounting hole 33, the demolding piece 34 rotates around the mounting post 35. When the demolding piece 34 is lifted, the capacitor inside the lower mold 7 is also lifted, allowing for rapid demolding. When the mold plate 5 is raised and lowered, multiple sets of guide holes are evenly opened on the mold plate 5. The guide piece 8 is inserted into the guide hole, which can limit and guide the mold plate 5 during raising and lowering, preventing the mold plate 5 from tilting during raising and lowering.

[0029] The mold frame 1, the mold plate 5, and the connecting plate 10 are arranged in parallel, and multiple sets of guide plates 8 are evenly installed between the mold frame 1 and the connecting plate 10, while the distance between two adjacent sets of guide plates 8 is consistent.

[0030] As a preferred embodiment, multiple sets of guide openings are evenly provided on the template 5, and the guide piece 8 is adapted to the size of the guide opening. At the same time, the guide piece 8 is inserted into the inside of the guide opening, and the cross-section of both the guide piece 8 and the guide opening is rectangular.

[0031] The lower mold 7 and the upper mold 9 are combined to form a packaging mold, and a sealing gasket 91 is fixedly provided at the bottom of the upper mold 9. At the same time, after the lower mold 7 and the upper mold 9 are closed, they are sealed by the sealing gasket 91.

[0032] In a preferred embodiment, the lower mold 7 moves upward and inserts into the interior of the upper mold 9, and the lower mold 7 and the closing mold plate 5 are driven to move horizontally up and down by two sets of evenly distributed cylinders 2.

[0033] The bottom surface of the lower mold 7 is provided with receiving grooves 32 on both sides, and a demolding piece 34 is movably installed inside the receiving groove 32. The cross-section of the demolding piece 34 and the receiving groove 32 are both T-shaped. The bottom of the lower mold 7 is provided with two sets of limiting holes 31, and a push rod 3 is inserted into the inside of each of the two sets of limiting holes 31.

[0034] In a preferred embodiment, mounting posts 35 are fixedly provided on both sides of the end of the release plate 34, and mounting holes 33 are provided on both sides of the bottom inner wall of the receiving groove 32. The mounting holes 33 are adapted to the size of the mounting posts 35, and the mounting posts 35 are movably inserted into the interior of the mounting holes 33.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A surface mount tantalum capacitor packaging mold, comprising a mold frame (1), characterized in that: A cylinder (2) is fixedly installed on the mold frame (1), and the output shaft of the cylinder (2) is screwed to the bottom of the mold plate (5). At the same time, multiple sets of lower molds (7) are evenly installed on the surface of the mold plate (5), and a connecting plate (10) is installed on the surface of the mold plate (5). Multiple sets of upper molds (9) are evenly installed on the connecting plate (10), and support rods (4) are installed at the bottom of both ends of the connecting plate (10). At the same time, the bottom of the support rods (4) is fixedly installed on the end surface of the mold frame (1). A gating pipe (11) is fixedly installed on the upper mold (9), and a feed pipe (12) is fixedly installed on the top of the gating pipe (11). The surface of the frame (1) is fixedly provided with a top rod (3), and both ends of the mold plate (5) are equipped with limit seats (6), and a support rod (4) is inserted through the limit hole opened on the limit seat (6); the lower mold (7) and the upper mold (9) are combined to form a sealing mold, and a sealing gasket (91) is fixedly provided at the bottom of the upper mold (9), and the lower mold (7) and the upper mold (9) are sealed by the sealing gasket (91) after they are closed; the lower mold (7) moves upward and is inserted into the interior of the upper mold (9), and the lower mold (7) and the mold plate (5) are driven to move horizontally by two sets of evenly distributed cylinders (2).

2. The surface mount tantalum capacitor packaging mold according to claim 1, characterized in that: The mold frame (1), the mold plate (5) and the connecting plate (10) are arranged in parallel, and multiple sets of guide plates (8) are evenly installed between the mold frame (1) and the connecting plate (10), while the distance between two adjacent sets of guide plates (8) is consistent.

3. The surface mount tantalum capacitor packaging mold according to claim 2, characterized in that: Multiple sets of guide openings are evenly provided on the template (5), and the guide piece (8) is adapted to the size of the guide opening. At the same time, the guide piece (8) is inserted into the inside of the guide opening, and the cross-section of the guide piece (8) and the guide opening is rectangular.

4. The surface mount tantalum capacitor packaging mold according to claim 1, characterized in that: The bottom surface of the lower mold (7) is provided with receiving grooves (32) on both sides, and a demolding piece (34) is movably installed inside the receiving groove (32). The cross-section of the demolding piece (34) and the receiving groove (32) are both T-shaped. The bottom of the lower mold (7) is provided with two sets of limiting holes (31), and a push rod (3) is inserted into the inside of each of the two sets of limiting holes (31).

5. A surface mount tantalum capacitor packaging mold according to claim 4, characterized in that: The demolding piece (34) has mounting posts (35) fixedly installed on both sides of its end, and mounting holes (33) are opened on both sides of the bottom inner wall of the receiving groove (32). The mounting holes (33) are adapted to the size of the mounting posts (35), and the mounting posts (35) are movably inserted into the inside of the mounting holes (33).

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