Multilayer circuit board and radar communication equipment

Abstract

The utility model provides a multilayer circuit board. The multilayer circuit board comprises a low-frequency signal layer, a power supply layer and a high-frequency signal layer, the low-frequency signal layer comprises a first core board, and a first wiring layer is arranged on the first core board; the power supply layer comprises a second core plate, and a large-current wiring layer is arranged in the second core plate; the high-frequency signal layer comprises a third core plate, and a second wiring layer is arranged in the third core plate. The multilayer circuit board is provided with a first copper deposition hole, a second copper deposition hole, a third copper deposition hole and a fourth copper deposition hole. A first bonding pad, formed on the surface of the multilayer circuit board, of the first copper deposition hole is used for being electrically connected with a large-current connector; a second bonding pad formed on the surface of the multi-layer circuit board by the second copper deposition hole, a third bonding pad formed on the surface of the multi-layer circuit board by the third copper deposition hole and a fourth bonding pad formed on the surface of the multi-layer circuit board by the fourth copper deposition hole are all used for being electrically connected with a mixed signal connector. The utility model further provides a radar communication device which meets the requirements of high power, multi-signal hybrid wiring and vertical interconnection at the same time.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of communication equipment, and in particular to a multi-layer circuit board and a radar communication equipment. BACKGROUND

[0002] With the development of radar communication equipment towards high power and integration, in order to realize the transmission of multiple signals, the printed circuit board in the radar communication equipment also needs high integration and high density wiring to meet the complex signal processing requirements.

[0003] However, the existing printed circuit board cannot simultaneously meet the requirements of high power processing, high density wiring, multi-signal mixed wiring and vertical interconnection, and often faces signal interference problems.

[0004] For example, patent CN202021081429.5 discloses an over-current conducting circuit board, which controls the thickness of the copper plate and sets an alloy plating layer on the surface of the copper plate to reduce the heat generation of the copper plate, thereby solving the problem of large current passing through the printed board, but it fails to handle the problems of low frequency, radio frequency, power and other multi-signal mixed wiring and vertical interconnection, and the signals are prone to interference, affecting the performance of the equipment.

[0005] For another example, patent CN201420399582.0 discloses an improved digital-analog hybrid circuit, which divides the power supply, digital and analog circuits in independent areas. Although it solves the problem of mixed wiring of multiple signals such as digital, radio frequency and power supply, it does not solve the problems of large current passing through the printed board and vertical interconnection. UTILITY MODEL CONTENT

[0006] The purpose of the present disclosure is to overcome the deficiencies in the prior art, and to provide a multi-layer circuit board and a radar communication equipment which can simultaneously meet the requirements of high power processing, high density wiring, multi-signal mixed wiring and vertical interconnection and is anti-interference.

[0007] The purpose of the present disclosure is achieved by the following technical solutions:

[0008] A multi-layer circuit board, comprising: a low-frequency signal layer, a power supply layer and a high-frequency signal layer which are sequentially stacked;

[0009] The low-frequency signal layer is used for transmitting low-frequency current signals; the low-frequency signal layer comprises a first core plate, and a first wiring layer is arranged in the first core plate;

[0010] The power supply layer is used for transmitting power supply signals; the power supply layer comprises a second core plate, and a large current wiring layer is arranged in the second core plate;

[0011] The high-frequency signal layer is used for transmitting high-frequency signals; the high-frequency signal layer comprises a third core plate, and the second wiring layer is arranged in the third core plate;

[0012] The multi-layer circuit board is provided with a first copper sinking hole, a second copper sinking hole, a third copper sinking hole and a fourth copper sinking hole; the first copper sinking hole and the second copper sinking hole both penetrate the low-frequency signal layer, the power supply layer and the high-frequency signal layer, the third copper sinking hole penetrates the high-frequency signal layer, and the fourth copper sinking hole extends into the second core plate; the first copper sinking hole is provided with a first pad formed on the surface of the multi-layer circuit board and used for electrically connecting with a large-current connector, the second copper sinking hole is provided with a second pad formed on the surface of the multi-layer circuit board, the third copper sinking hole is provided with a third pad formed on the surface of the multi-layer circuit board, and the fourth copper sinking hole is provided with a fourth pad formed on the surface of the multi-layer circuit board, which are all used for electrically connecting with a mixed signal connector.

[0013] In one of the embodiments, the large-current trace layer is used for transmitting a large-current signal, and the peak value of the current value of the large-current signal ranges from 300 A to 400 A.

[0014] In one of the embodiments, the power supply layer is further provided with a plurality of first through holes, and each first through hole penetrates the multi-layer circuit board.

[0015] In one of the embodiments, a first adhesive layer is arranged between the first core plate and the second core plate, and the first core plate and the second core plate are fixed by pressure bonding through the first adhesive layer; a second adhesive layer is arranged between the second core plate and the third core plate, and the second core plate and the third core plate are fixed by pressure bonding through the second adhesive layer.

[0016] In one of the embodiments, the first core plate comprises a plurality of first base material plates, and the upper and lower surfaces of each first base material plate are both provided with the first trace layer.

[0017] The third adhesive layer is arranged between adjacent two first base material plates and fixed by pressure bonding through the third adhesive layer.

[0018] In one of the embodiments, the second core plate comprises a plurality of second base material plates, the upper and lower surfaces of each second base material plate are both provided with the first trace layer, and a large-current trace layer is further arranged above each second base material plate.

[0019] The fourth adhesive layer is arranged between the large-current trace layer and the second base material plate and fixed by pressure bonding through the fourth adhesive layer.

[0020] The fifth adhesive layer is arranged between adjacent two second base material plates and fixed by pressure bonding through the fifth adhesive layer.

[0021] In one of the embodiments, the third core plate comprises a plurality of third substrate plates, and the upper and lower surfaces of each of the third substrate plates are provided with the second routing layer;

[0022] The sixth adhesive layer is arranged between the adjacent two third substrate plates and is used for compression bonding and fixing.

[0023] In one of the embodiments, the third copper sinking hole and the fourth copper sinking hole are formed with back-drilling holes away from the side of the power supply layer.

[0024] A radar communication device comprises a large-current connector, a mixed signal connector and the multilayer circuit board according to any one of the embodiments, wherein the large-current connector and the mixed signal connector are detachably connected to the multilayer circuit board, the large-current connector and the mixed signal connector are located on the side of the high-frequency signal layer of the multilayer circuit board away from the power supply layer, the large-current connector is electrically connected to the first pad of the multilayer circuit board, and the mixed signal connector is electrically connected to the second pad, the third pad and the fourth pad of the multilayer circuit board, respectively.

[0025] In one of the embodiments, the radar communication device further comprises a first connecting piece and a second connecting piece, the large-current connector is provided with a first connecting hole, and the mixed signal connector is provided with a second connecting hole; the circuit board is provided with at least two fixing holes, the first connecting piece is screwed to one of the fixing holes through the first connecting hole, and the second connecting piece is screwed to the other fixing hole through the second connecting hole.

[0026] In one of the embodiments, the large-current connector is provided with a plurality of fifth pads, the fifth pads are electrically connected to the corresponding first pads, each of the fifth pads is provided with a plurality of second vias, the fifth pads are electrically connected to the power supply or ground through the second vias, the mixed signal connector is provided with a sixth pad, a radio frequency signal pad and a ground pad, the ground pad is arranged along the periphery of the radio frequency signal pad, the sixth pad is electrically connected to the corresponding second pad, the radio frequency signal pad is electrically connected to the third pad, and the ground pad is electrically connected to the fourth pad.

[0027] Compared with the prior art, the present disclosure has at least the following advantages:

[0028] The multilayer circuit board is provided with the low-frequency signal layer, the power supply layer and the high-frequency signal layer by layer, and vertical interconnection is realized through the first copper sinking hole and the second copper sinking hole, which meets the requirements of high-power processing, high-density wiring and mixed wiring of multiple signals, reduces the crosstalk and interference between signals, and improves the integrity and stability of signal transmission.

[0029] The first copper hole and the second copper hole are arranged on the multilayer circuit board, and are used for realizing vertical interconnection between a low-frequency signal layer, a power supply layer and a high-frequency signal layer, solving the problems of high-density wiring and vertical interconnection, and improving signal transmission efficiency.

[0030] The multilayer circuit board is provided with a low-frequency signal layer, a power supply layer and a high-frequency signal layer, and can simultaneously meet the transmission requirements of low-frequency signals, large-current signals and high-frequency signals, and enhance the multifunctionality and applicability of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings needed to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some of the embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0032] Figure 1 It is a structural schematic diagram of the multilayer circuit board;

[0033] Figure 2 It is a surface layout schematic diagram of the radar communication equipment;

[0034] Figure 3 It is a mounting schematic diagram of the large-current connector;

[0035] Figure 4 It is a mounting schematic diagram of the mixed signal connector. DETAILED DESCRIPTION

[0036] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the related drawings. The preferred embodiments of the present disclosure are shown in the drawings. However, the present disclosure can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thorough and comprehensive.

[0037] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only, and are not intended to be the only implementation.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0039] In order to better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure will be further described in detail below in combination with specific embodiments:

[0040] Please refer to Figures 1 to 4 The multilayer circuit board 10 of the embodiment of the present application comprises a low-frequency signal layer 100, a power supply layer 200 and a high-frequency signal layer 300 which are sequentially stacked, the low-frequency signal layer 100 is used for transmitting low-frequency signals, the power supply layer 200 is used for transmitting power current signals, and the high-frequency signal layer is used for transmitting high-frequency signals. The low-frequency signal layer 100 comprises a first core plate 110, and a first wiring layer 111 is arranged in the first core plate 110. The power supply layer 200 comprises a second core plate 210, and a large-current wiring layer 211 is arranged in the second core plate 210. The high-frequency signal layer 300 comprises a third core plate 310, and a second wiring layer 311 is arranged in the third core plate 310. The multilayer circuit board 10 is provided with a plurality of first copper-filled holes 400, second copper-filled holes (not shown in the figure), third copper-filled holes 500 and fourth copper-filled holes 600; the first copper-filled holes 400 and the second copper-filled holes both penetrate through the low-frequency signal layer 100, the power supply layer 200 and the high-frequency signal layer 300, the third copper-filled holes penetrate through the high-frequency signal layer, and the fourth copper-filled holes extend into the second core plate. The first copper-filled holes 400 are provided with first pads (not shown in the figure) formed on the surface of the multilayer circuit board 10 and used for electrically connecting with a large-current connector 21, the second copper-filled holes are provided with second pads (not shown in the figure) formed on the surface of the multilayer circuit board 10, the third copper-filled holes 500 are provided with third pads (not shown in the figure) formed on the surface of the multilayer circuit board 10, and the fourth copper-filled holes 600 are provided with fourth pads (not shown in the figure) formed on the surface of the multilayer circuit board 10, which are all used for electrically connecting with a mixed signal connector 22.

[0041] In the embodiment, the multilayer circuit board 10 is provided with the low-frequency signal layer 100, the power supply layer 200 and the high-frequency signal layer 300 in a layered manner, and vertical interconnection is realized through the first copper-filled hole 400 and the second copper-filled hole, while meeting the requirements of high-power processing, high-density wiring and mixed wiring of multiple signals, reducing the crosstalk and interference between signals, and improving the integrity and stability of signal transmission. Further, the first copper-filled hole 400 and the second copper-filled hole are provided on the multilayer circuit board 10 to realize vertical interconnection between the low-frequency signal layer 100, the power supply layer 200 and the high-frequency signal layer 300, solve the problem of high-density wiring and vertical interconnection, and improve the signal transmission efficiency. In addition, the multilayer circuit board 10 is provided with the low-frequency signal layer 100, the power supply layer 200 and the high-frequency signal layer 300, which can meet the transmission requirements of low-frequency signals, large-current signals and high-frequency signals at the same time, and enhance the multifunctionality and applicability of the circuit board.

[0042] It should be noted that the multilayer circuit board 10 adopts a copper paste hole and hard gold plating filling process, the through hole is filled with copper paste to form a copper-filled hole, and the copper paste hole ensures the electrical connection between the layers of the circuit, improves the conductivity and reliability of the through hole. At the same time, the thermal conductivity of the through hole is increased, thereby improving the overall heat dissipation performance. The hard gold plating filling process improves the current carrying capacity of the pad, and makes the surface of the copper-filled hole flat and reliable in contact, thereby enhancing the stability and durability of the circuit.

[0043] As shown in FIG. 1, Figure 1 It should be noted that the multilayer circuit board 10 adopts a copper paste hole and hard gold plating filling process, the through hole is filled with copper paste to form a copper-filled hole, and the copper paste hole ensures the electrical connection between the layers of the circuit, improves the conductivity and reliability of the through hole. At the same time, the thermal conductivity of the through hole is increased, thereby improving the overall heat dissipation performance. The hard gold plating filling process improves the current carrying capacity of the pad, and makes the surface of the copper-filled hole flat and reliable in contact, thereby enhancing the stability and durability of the circuit.

[0044] It should be noted that the current value of the large current mentioned in the present disclosure is in the range of 300 A to 400 A, and the peak value of the current value of the current signal transmitted by the large-current wiring layer 211 is in the range of 300 A to 400 A, i.e. the current signal transmitted by the large-current wiring layer 211 is a large-current signal, so it is defined as a large-current wiring layer. The first wiring layer 111 and the second wiring layer 311 are both ordinary wiring layers for transmitting low-frequency small-current signals. In the embodiment, the peak value of the current value of the low-frequency small-current signal is less than 300 A, i.e. the current value of the low-frequency small-current signal transmitted by the first wiring layer 111 and the second wiring layer 311 is less than 300 A.

[0045] In one embodiment, the power layer 200 also has a plurality of first vias (not shown), each of which is disposed through the multilayer circuit board 10, enabling the mounting of multiple energy storage capacitors and improving heat dissipation efficiency.

[0046] like Figure 1 As shown, in one embodiment, a first adhesive layer 700 is provided between the first core board 110 and the second core board 210, and the first core board 110 and the second core board 210 are pressed and fixed together by the first adhesive layer 700. A second adhesive layer 800 is provided between the second core board 210 and the third core board 310, and the second core board 210 and the third core board 310 are pressed and fixed together by the second adhesive layer 800. Specifically, in this embodiment, both the first adhesive layer 700 and the second adhesive layer 800 are prepregs. The first core board 110, the second core board 210, and the third core board 310 are pressed and fixed together sequentially by a pressing process. During pressing, the prepreg melts and fills the gaps between the layers, ensuring a tight bond between each layer and preventing interlayer slippage during subsequent processing, thus ensuring the stability of signal transmission between layers. In addition, the good mechanical strength and dimensional stability of the prepreg can ensure the stability and reliability of the multilayer circuit board 10 during long-term use. Furthermore, the layered lamination manufacturing process is simple, mature, and easy to mass-produce.

[0047] like Figure 1 As shown, in one embodiment, the first core board 110 includes multiple first substrate boards 112, each of which has a first wiring layer 111 on its upper and lower surfaces. A third adhesive layer 113 is provided between two adjacent first substrate boards 112, and the boards are pressed and fixed together by the third adhesive layer 113. Specifically, in this embodiment, the third adhesive layer 113 is a prepreg. The first core board 110 is designed with multiple first substrate boards 112 stacked together, and adjacent first substrate boards 112 are pressed and fixed together by the prepreg, ensuring the tightness and mechanical strength of the interlayer bonding and preventing slippage and misalignment during subsequent processing. This improves the structural stability and reliability of the multilayer circuit board 10.

[0048] Furthermore, each first substrate board 112 has a first wiring layer 111 on its upper and lower surfaces. By layering the wiring, crosstalk between signals is reduced, and the stability and integrity of signal transmission are improved. At the same time, the prepreg enhances the insulation performance between layers, ensuring high efficiency and low loss in signal transmission.

[0049] like Figure 1As shown, in one embodiment, the second core plate 210 includes a plurality of second base material plates 212, the upper and lower surfaces of each second base material plate 212 are provided with a first wiring layer 111, and the upper side of each second base material plate 212 is provided with a large-current wiring layer 211. The fourth adhesive layer 213 is provided between the large-current wiring layer 211 and the second base material plate, and is fixed by the fourth adhesive layer 213. The fifth adhesive layer 214 is provided between the adjacent two second base material plates 212, and is fixed by the fifth adhesive layer 214. Specifically, in this embodiment, the fourth adhesive layer 213 and the fifth adhesive layer 214 are both prepreg, and the second base material plate 212 is a copper base material. The high conductivity and high thermal conductivity of the copper base material can significantly reduce resistance loss and heat accumulation, ensuring efficient and stable transmission of large-current signals. At the same time, the large-current wiring layer 211 and the second base material plate 212 are fixedly connected by the prepreg, and the adjacent two second base material plates 212 are fixedly connected by the prepreg. This multi-layer adhesive structure ensures the tightness and mechanical strength of the interlayer bonding, avoids interlayer slippage or separation, and improves the overall stability and reliability of the multi-layer circuit board 10.

[0050] As shown, Figure 1 In one embodiment, the third core plate 310 includes a plurality of third base material plates 312, the upper and lower surfaces of each third base material plate 312 are provided with a second wiring layer 311. The sixth adhesive layer 313 is provided between the adjacent two third base material plates 312, and is fixed by the sixth adhesive layer 313. The third copper sinking hole 500 extends to the second wiring layer of the third base material plate close to the power layer, and the fourth copper sinking hole 600 penetrates through the third base material plate away from the power layer. Specifically, in this embodiment, the third base material plate 312 is a high-frequency plate material, which can meet the high requirements of high-frequency circuits on signal integrity and stability. The high-frequency plate material has the characteristics of low dielectric constant and low loss factor, which can reduce the attenuation and reflection of high-frequency signals and improve the integrity and stability of signal transmission. Through the layered wiring design, the crosstalk and interference between signals are reduced, ensuring the purity and reliability of high-frequency signal transmission.

[0051] Further, the sixth adhesive layer 313 is prepreg, and the adjacent two third base material plates 312 are fixedly connected by the sixth adhesive layer 313, which ensures the tightness and mechanical strength of the interlayer bonding, avoids slippage or separation between the third base material plates 312 during processing, and improves the overall stability and reliability of the multi-layer circuit board 10.

[0052] As shown, Figure 1As shown, in one of the embodiments, the third copper hole 500 and the fourth copper hole 600 are formed with back-drilling holes 501 on the side away from the power layer 200. It can be understood that the side of the third copper hole 500 and the fourth copper hole 600 away from the power layer 200 is back-drilled to a specified depth to form the back-drilling hole 501, and the diameter of the back-drilling hole 501 is greater than or equal to the diameter of the corresponding copper hole. The multilayer circuit board removes the stubs in the third copper hole 500 and the fourth copper hole 600 through the back-drilling hole 501, which can reduce the signal back resonance caused by the absence of connection at the end of the third copper hole 500 and the fourth copper hole 600, and cause problems such as reflection, scattering and delay, thereby ensuring the integrity and stability of signal transmission.

[0053] Referring to Figures 1 to 4 The application also provides a radar communication device 20 comprising a large-current connector 21, a mixed signal connector 22, and the multilayer circuit board 10 in any one of the above embodiments. The large-current connector 21 and the mixed signal connector 22 are detachably connected to the multilayer circuit board 10. The large-current connector 21 and the mixed signal connector 22 are located on the side of the high-frequency signal layer 300 of the multilayer circuit board 10 away from the power layer 200. The large-current connector 21 is electrically connected to the first pad of the multilayer circuit board 10. The mixed signal connector 22 is electrically connected to the second pad, the third pad, and the fourth pad of the multilayer circuit board 10.

[0054] In this embodiment, the radar communication device 20 solves the problem that the traditional device cannot simultaneously meet the requirements of high-power processing, high-density wiring, multi-signal mixed wiring, and vertical interconnection, and signal interference by using the multilayer circuit board 10 and installing the large-current connector 21 and the mixed signal connector 22 on the multilayer circuit board 10. In addition, the large-current connector 21 and the mixed signal connector 22 are detachably connected to the multilayer circuit board 10, which facilitates the installation and removal of the large-current connector 21 and the mixed signal connector 22.

[0055] As Figures 2 to 4As shown in the drawings, in one of the embodiments, the radar communication device 20 further comprises a first connecting member 23 and a second connecting member 24, the high-current connector 21 is provided with a first connecting hole 21a, the mixed signal connector 22 is provided with a second connecting hole 22a, the multi-layer circuit board 10 is provided with at least two fixing holes 25, the first connecting member 23 is screwed into one of the fixing holes 25 through the first connecting hole 21a, so that the high-current connector 21 is fixed to the multi-layer circuit board 10, and the second connecting member 24 is screwed into the other fixing hole 25 through the second connecting hole 22a, so that the mixed signal connector 22 is fixed to the multi-layer circuit board 10. Specifically, in this embodiment, the fixing holes 25 are threaded holes, and the first connecting member 23 and the second connecting member 24 are both screws. The high-current connector 21 and the mixed signal connector 22 are fixed to the circuit board by the cooperation of the screws and the threaded holes. The threaded connection facilitates the installation, maintenance and replacement of the high-current connector 21 and the mixed signal connector 22, and at the same time, can avoid poor contact caused by vibration during high-speed operation of the connector, ensure stable connection, and improve the reliability and service life of the overall radar communication device 20.

[0056] It should be noted that the detachable connection mode of the connector and the multi-layer circuit board 10 is not limited to the threaded connection mode described above. For example, in other embodiments, the connector is a male snap connector, and the male snap connector is perpendicularly pressed to the multi-layer circuit board 10 to achieve detachable connection of the connector and the multi-layer circuit board 10, thereby improving the efficiency of assembly and maintenance.

[0057] As shown in the drawings, Figure 2 In one of the embodiments, the high-current connector 21 is provided with a plurality of fifth pads 21b, each of which is electrically connected to a corresponding first pad, and each of which is provided with a plurality of second vias 21c, and the fifth pad 21b is connected to a power supply or ground path through the second via 21c. The mixed signal connector 22 is provided with a sixth pad 22b, a radio frequency signal pad 22c and a ground pad 22d, the ground pad 22d is arranged along the periphery of the radio frequency signal pad 22b, the sixth pad 22b is electrically connected to a corresponding second pad, the radio frequency signal pad 22c is electrically connected to a third pad, and the ground pad is electrically connected to a fourth pad. It can be understood that the fifth pad 21b of the high-current connector 21 is electrically connected to the power supply or ground path through the second via 21c, to ensure stable transmission of high current. The mixed signal connector 22 can simultaneously transmit low-frequency, high-frequency and power signals, meeting the demand of the radar communication device for mixed wiring of multiple signals. Among them, the sixth pad 22b is used for low-speed and small-current signal transmission, the radio frequency signal pad 22c is used for high-speed radio frequency signal transmission, and the ground pad 22c surrounds the radio frequency signal pad 22c, which can effectively reduce electromagnetic interference and improve signal quality.

[0058] Specifically, in the embodiment, the fifth pad 21b, the sixth pad 22b, the radio frequency signal pad 22c and the ground pad 22d are all correspondingly provided with pins, and the high-current connector 21 and the mixed signal connector 22 are electrically connected with the multilayer circuit board 10 through the pins.

[0059] Compared with the prior art, the present disclosure has at least the following advantages:

[0060] 1. The multilayer circuit board is provided with a low-frequency signal layer, a power layer and a high-frequency signal layer by layering, and vertical interconnection is realized through the first copper-filled hole and the second copper-filled hole, which meets the requirements of high-power processing, high-density wiring and multi-signal mixed wiring, reduces the crosstalk and interference between signals, and improves the integrity and stability of signal transmission.

[0061] 2. The first copper-filled hole and the second copper-filled hole are provided on the multilayer circuit board to realize vertical interconnection between the low-frequency signal layer, the power layer and the high-frequency signal layer, solve the problem of high-density wiring and vertical interconnection, and improve the signal transmission efficiency.

[0062] 3. The multilayer circuit board is provided with a low-frequency signal layer, a power layer and a high-frequency signal layer, which can meet the transmission requirements of low-frequency signals, large-current signals and high-frequency signals at the same time, and enhance the multifunctionality and applicability of the circuit board.

[0063] The above-described embodiments only express several embodiments of the present disclosure, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the disclosed patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, a number of modifications and improvements can be made, which are all within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. A multilayer circuit board, characterized by, The application relates to a multilayer circuit board. The low-frequency signal layer is used for transmitting a low-frequency signal; the low-frequency signal layer comprises a first core plate, and a first wiring layer is arranged in the first core plate. The power supply layer is used for transmitting a power supply current signal; the power supply layer comprises a second core plate, and a large-current wiring layer is arranged in the second core plate. The high-frequency signal layer is used for transmitting a high-frequency signal; the high-frequency signal layer comprises a third core plate, and a second wiring layer is arranged in the third core plate. The multilayer circuit board is provided with a first copper sinking hole, a second copper sinking hole, a third copper sinking hole and a fourth copper sinking hole; the first copper sinking hole and the second copper sinking hole penetrate through the low-frequency signal layer, the power supply layer and the high-frequency signal layer, the third copper sinking hole penetrates through the high-frequency signal layer, and the fourth copper sinking hole extends into the second core plate; a first pad formed on the surface of the multilayer circuit board is used for electrically connecting with a large-current connector, and a second pad formed on the surface of the multilayer circuit board, a third pad formed on the surface of the multilayer circuit board and a fourth pad formed on the surface of the multilayer circuit board are used for electrically connecting with a mixed signal connector. The large-current wiring layer is used for transmitting a large-current signal, and the peak value range of the current value of the large-current signal is 300 A to 400 A; and / or 2. The multilayer circuit board according to claim 1, characterized by The power supply layer is provided with a plurality of first through holes, and each first through hole penetrates through the multilayer circuit board. A first adhesive layer is arranged between the first core plate and the second core plate, and the first core plate and the second core plate are fixed by pressure bonding through the first adhesive layer; a second adhesive layer is arranged between the second core plate and the third core plate, and the second core plate and the third core plate are fixed by pressure bonding through the second adhesive layer.

3. The multilayer circuit board of claim 1, wherein The first core plate comprises a plurality of first base material plates, and the upper and lower surfaces of each first base material plate are provided with the first wiring layer.

4. The multilayer circuit board of claim 1, wherein A third adhesive layer is arranged between adjacent two first base material plates, and the first base material plates are fixed by pressure bonding through the third adhesive layer. The second core plate comprises a plurality of second base material plates, and the upper and lower surfaces of each second base material plate are provided with the first wiring layer, and the upper surface of each second base material plate is further provided with the large-current wiring layer.

5. The multilayer circuit board of claim 1, wherein, A fourth adhesive layer is arranged between the second wiring layer and the second base material plate, and the second wiring layer and the second base material plate are fixed by pressure bonding through the fourth adhesive layer. A fifth adhesive layer is arranged between adjacent two second base material plates, and the second base material plates are fixed by pressure bonding through the fifth adhesive layer. The third core plate comprises a plurality of third base material plates, and the upper and lower surfaces of each third base material plate are provided with the second wiring layer.

6. The multilayer circuit board of claim 1, wherein, A sixth adhesive layer is arranged between adjacent two third base material plates, and the third base material plates are fixed by pressure bonding through the sixth adhesive layer. The third copper sinking hole and the fourth copper sinking hole are formed with back-drilling holes away from one side of the power supply layer.

7. The multilayer circuit board of claim 1, wherein, ​ 8. A radar communication device, characterized by The radar communication device comprises a large-current connector, a mixed signal connector and the multilayer circuit board according to any one of claims 1-7; wherein the large-current connector and the mixed signal connector are detachably connected with the multilayer circuit board, and the large-current connector and the mixed signal connector are located on the side of the high-frequency signal layer of the multilayer circuit board away from the power supply layer; the large-current connector is electrically connected with the first pad of the multilayer circuit board; and the mixed signal connector is electrically connected with the second pad, the third pad and the fourth pad of the multilayer circuit board.

9. The radar communication device of claim 8, wherein, The radar communication device further comprises a first connecting piece and a second connecting piece, the large-current connector is provided with a first connecting hole, and the mixed signal connector is provided with a second connecting hole; the multilayer circuit board is provided with at least two fixing holes, the first connecting piece is screwed to one of the fixing holes through the first connecting hole, and the second connecting piece is screwed to the other fixing hole through the second connecting hole.

10. The radar communication device of claim 8, wherein, The large-current connector is provided with a plurality of fifth pads, each of the fifth pads is electrically connected with a corresponding first pad, each of the fifth pads is provided with a plurality of second vias, the fifth pad is electrically connected with a power supply or ground passage through the second via, the mixed signal connector is provided with a sixth pad, a radio frequency signal pad and a ground pad, the ground pad is arranged along the circumference of the radio frequency signal pad, the sixth pad is electrically connected with a corresponding second pad, the radio frequency signal pad is electrically connected with the third pad, and the ground pad is electrically connected with the fourth pad.

Images