Heat dissipation structure and controller

Abstract

The utility model relates to a heat dissipation structure and a controller, the controller comprises a chip and the heat dissipation structure, the heat dissipation structure comprises a shell, a heat dissipation block and a heat dissipation pipe, a containing cavity is defined by the shell, the heat dissipation block and the heat dissipation pipe are both arranged in the containing cavity and connected with the shell, the heat dissipation block is used for bearing the chip, one side of the heat dissipation pipe is connected to the shell, and the other side of the heat dissipation pipe is connected to the shell. At least partial area of the opposite side is connected to the heat dissipation block, so that the chip can directly form a controller after being mounted on the heat dissipation block, and the structure and the assembly process are simplified; and heat generated by the chip installed on the heat dissipation block can be conducted to all positions of the shell through the heat dissipation block and the heat dissipation pipe in sequence, so that the concentrated heat can be dispersed, and compared with the mode that air convection is generated by air depending on electric driving to conduct air cooling heat dissipation or water cooling heat dissipation is conducted by water flowing in the prior art, the heat dissipation efficiency is improved. The device has remarkable advantages in the aspects of heat conduction efficiency, reliability, noise control, space utilization, overall power consumption, maintenance cost and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, in particular to a heat dissipation structure and a controller. BACKGROUND

[0002] Automatic driving control is the core technology of the evolution of automotive electronic architecture. It solves the pain points of traditional distributed architecture through centralized computing and resource sharing, and provides a basic platform for the intelligentization, networking and electrification of automobiles.

[0003] With the rapid development of automatic driving technology, the computing power demand of chips grows exponentially. In order to meet the complex perception, decision and control tasks, the controller of automatic driving needs to carry multiple high-computing-power chips. These chips will generate a large amount of heat when working, so there is a higher requirement for the heat dissipation of the core processing chip. The traditional heat dissipation scheme mainly relies on electric power driving (such as fan or water pump) to make air convection for air cooling or make water flow for water cooling. However, the above heat dissipation methods not only have problems such as large overall power consumption, large noise and high maintenance cost, but also are limited by the limited layout space of the vehicle body and the type of the automotive power system, so the use occasions of the above heat dissipation methods are greatly limited. CONTENT OF THE UTILITY MODEL

[0004] Therefore, in view of the problems in the prior art, the present application provides a heat dissipation structure and a controller comprising the same to solve the above problems of the existing heat dissipation structure.

[0005] According to one aspect of the present application, a heat dissipation structure is provided, comprising:

[0006] a housing, the housing enclosing a containing cavity;

[0007] a heat dissipation block and a heat dissipation pipe, both of which are arranged in the containing cavity and connected with the housing; the heat dissipation block is used for connecting a chip, one side of the heat dissipation pipe is attached to the housing, and at least part of the opposite side is attached to the heat dissipation block, so that the heat generated by the chip can be conducted to the housing in sequence through the heat dissipation block and the heat dissipation pipe.

[0008] In one embodiment, the heat dissipation pipe and the heat dissipation block are both welded to the housing.

[0009] In one embodiment, the heat dissipation pipe comprises a pipe shell and a liquid absorption core, the pipe shell encloses a closed vacuum cavity, the liquid absorption core is attached to the cavity wall of the vacuum cavity along the extension direction of the pipe shell, and a heat dissipation cavity is enclosed in the vacuum cavity, and the heat dissipation cavity is filled with a liquid-phase working medium.

[0010] In one of the embodiments, the pipe shell is formed with an evaporation part and a heat dissipation part connected to the evaporation part, the evaporation part is attached to the heat dissipation block so that the heat dissipation block covers the evaporation part, and at least part of the heat dissipation part is exposed outside the heat dissipation block.

[0011] In one of the embodiments, the heat dissipation part has two, and the two heat dissipation parts are arranged at two ends of the evaporation part, and each of the heat dissipation parts is bent to form an included angle relative to the evaporation part.

[0012] In one of the embodiments, the heat dissipation pipe has two, and the evaporation part of any one of the heat dissipation pipes is arranged close to or attached to the evaporation part of the other heat dissipation pipe.

[0013] In one of the embodiments, the cavity wall of the accommodating cavity is provided with a limiting groove matched with the profile of the heat dissipation pipe, and the heat dissipation pipe is limited in the limiting groove and attached to the groove wall of the limiting groove.

[0014] In one of the embodiments, the side of the heat dissipation block opposite to the heat dissipation pipe has a plurality of bosses, and each of the bosses has an attachment surface for attaching the chip.

[0015] In one of the embodiments, the shell has a plurality of heat dissipation fins arranged at intervals on the side opposite to the accommodating cavity.

[0016] In one of the embodiments, the heat dissipation fin is provided with a plurality of grooves at the positions corresponding to the heat dissipation pipes, so that the heat dissipation fin is formed with a plurality of serrations at the positions corresponding to the heat dissipation pipes.

[0017] According to another aspect of the present application, a controller is provided, comprising a chip and the heat dissipation structure according to any one of the above-mentioned embodiments, and the chip is arranged on the heat dissipation block of the heat dissipation structure.

[0018] The heat dissipation structure and the controller, the heat dissipation pipe and the heat dissipation block are arranged in the accommodating cavity of the shell, the heat dissipation pipe and the heat dissipation block are connected with the shell, and one side of the heat dissipation pipe is connected with the shell, and at least part of the opposite side is connected with the heat dissipation block, on the one hand, the chip mounted on the heat dissipation block can directly form the main part of the controller, and the structure and the assembly process are simplified; on the other hand, the heat generated by the chip attached to the heat dissipation block can be conducted to the position with lower temperature of the shell through the heat dissipation block and the heat dissipation pipe in turn, so that the dispersion of the concentrated heat can be realized, thereby large-area and effective heat dissipation can be carried out, compared with the air convection driven by electric power or the water flow driven by electric power in the prior art, the heat dissipation structure has obvious advantages in heat conduction efficiency, reliability, noise control, space utilization, overall power consumption and maintenance cost, and is particularly suitable for high-power-density, space-limited and high-reliability vehicle application scenarios. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 An explosion schematic diagram of the heat dissipation structure provided by an embodiment of the present application.

[0020] Figure 2 An internal structure schematic diagram of the heat dissipation structure provided by an embodiment of the present application.

[0021] Figure 3 A cross-sectional view of the internal structure of the heat dissipation pipe in the heat dissipation structure provided by an embodiment of the present application.

[0022] Figure 4 A pipe body structure schematic diagram of the heat dissipation pipe provided by an embodiment of the present application.

[0023] Figure 5 A working principle schematic diagram of the heat dissipation pipe provided by an embodiment of the present application.

[0024] Figure 6 A structure schematic diagram of the heat dissipation block in the heat dissipation structure provided by an embodiment of the present application.

[0025] Figure 7 A structure schematic diagram of the shell in the heat dissipation structure provided by an embodiment of the present application.

[0026] Figure 8 A Figure 7 An enlarged schematic diagram of the A area.

[0027] BRIEF DESCRIPTION OF DRAWINGS

[0028] 10, heat dissipation structure; 100, shell; 101, accommodating cavity; 102, limiting groove; 103, heat dissipation fin; 1031, groove; 1032, sawtooth; 200, heat dissipation pipe; 201, heat dissipation cavity; 210, pipe shell; 210a, vacuum cavity; 211, evaporation part; 212, heat dissipation part; 220, liquid absorbing core; 300, heat dissipation block; 301, boss. DETAILED DESCRIPTION

[0029] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond the specific embodiments described herein, and it is understood that similar improvements can be made by those skilled in the art without departing from the spirit of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0030] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0031] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0032] In the present application, unless otherwise specifically defined and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] In this application, unless otherwise explicitly specified and limited, if there is a description such as "on" or "under" or the like between a first feature and a second feature, it can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, "over", "above" and "on" of the first feature to the second feature can be that the first feature is directly above or obliquely above the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. "Under", "below" and "under" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.

[0034] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation.

[0035] The application provides a heat dissipation structure and a controller, wherein the controller comprises a heat dissipation structure and a chip disposed on the heat dissipation structure. Taking the application of the controller to an automatic driving system as an example, the controller is used to support the core functions of the automatic driving system, including environmental perception, real-time decision-making, path planning and vehicle control. The chip can efficiently process massive data from multiple sensors such as cameras, laser radars, millimeter wave radars and ultrasonic sensors, and realize multi-sensor data fusion through advanced algorithms, thereby providing accurate environmental perception and decision support for the automatic driving system; the heat dissipation structure is used to dissipate the large amount of heat generated by the chip, so that the chip can maintain a stable working temperature under high computing power load, to ensure the safety and reliability of the automatic driving system.

[0036] The structure of the heat dissipation structure will be mainly described below. It can be understood that in other embodiments, the heat dissipation system of the application is not limited to being used only in the controller, but can also be used in any electronic device integrated with a chip, and the electronic device is not limited to being an automatic driving system, which is not limited here.

[0037] Referring to Figure 1 and Figure 2 , Figure 1 an exploded schematic view of a heat dissipation structure 10 provided by an embodiment of the application is shown, Figure 2The internal structure diagram of the heat dissipation structure 10 is shown. The heat dissipation structure 10 comprises a shell 100, a heat dissipation pipe 200 and a heat dissipation block 300. The shell 100 has a surrounding edge, so that the shell 100 surrounds a containing cavity 101. The heat dissipation pipe 200 and the heat dissipation block 300 are arranged in the containing cavity 101 and connected with the shell 100. The heat dissipation block 300 is used for connecting a chip, so that the chip can be directly assembled on the heat dissipation block 300 to form a main part of a controller, thereby simplifying the structure and assembly process of the controller. One side of the heat dissipation pipe 200 is connected with the shell 100, and at least part of the opposite side is connected with the heat dissipation block 300, so that the heat generated by the chip can be conducted to the shell 100 through the heat dissipation block 300 and the heat dissipation pipe 200 in turn, thereby uniformly dispersing the heat on the shell 100 to achieve the purpose of dissipating heat of the controller.

[0038] Preferably, the materials of the shell 100 and the heat dissipation block 300 are both aluminum alloy materials with high thermal conductivity. The aluminum alloy material has excellent thermal conductivity, good mechanical strength and corrosion resistance, and can effectively cope with long-time high-load working environment.

[0039] In some embodiments, the heat dissipation pipe 200 and the heat dissipation block 300 are both welded to the shell 100. Preferably, the cavity wall of the containing cavity 101 is provided with a limiting groove 102 matched with the profile of the heat dissipation pipe 200. The heat dissipation pipe 200 is limited in the limiting groove 102, and one side of the heat dissipation pipe 200 is attached to the groove wall of the limiting groove 102, and the other side is attached to the heat dissipation block 300, so that the heat dissipation block 300 can be attached to the cavity wall of the containing cavity 101 while being attached to the heat dissipation pipe 200, thereby having better heat dissipation effect.

[0040] More preferably, the heat dissipation pipe 200 and the heat dissipation block 300 are both connected with the shell 100 by a soldering process, so that the separation force between the heat dissipation pipe 200 and the heat dissipation block 300 and the shell 100 can be above 1500 Newton. Further, the heat dissipation pipe 200 and the heat dissipation block 300 can also be connected by a soldering process, so that the heat dissipation block 300 and the shell 100, the heat dissipation pipe 200 and the shell 100, and the heat dissipation block 300 and the heat dissipation pipe 200 can be maximally closely contacted, the medium with large thermal resistance such as air can be removed, and the heat conduction efficiency between the three can be maximized.

[0041] It can be understood that in other embodiments, the heat dissipation pipe 200 can be directly attached to the cavity wall of the containing cavity 101, but the limiting groove 102 needs to be provided in the heat dissipation block 300 at this time, so that the heat dissipation block 300 can be attached to the cavity wall of the containing cavity 101 and the heat dissipation pipe 200 at the same time. The design can be made according to the needs, which is not limited herein.

[0042] For the structure of heat pipe 200, please refer to Figure 3 and Figure 4 The heat sink 200 includes a housing 210 and a liquid-absorbing core 220 disposed within the housing 210. The housing 210 extends in an elongated shape and has an evaporation section 211 and a heat dissipation section 212 connected to the evaporation section 211. The evaporation section 211 is attached to the heat sink 300, and at least a portion of the heat dissipation section 212 is exposed outside the heat sink 300, such that the heat sink 300 covers the evaporation section 211, thereby clamping the evaporation section 211 between the heat sink 300 and the cavity wall of the receiving cavity 101. When the heat sink 200 is in operation, the evaporation section 211 absorbs the heat transferred from the chip to the heat sink 300, and the heat is dissipated from the evaporation section 211 to the heat dissipation section 212 to achieve rapid heat transfer.

[0043] Figure 4 In the embodiment, there are two heat dissipation sections 212, which are respectively disposed at both ends of the evaporation section 211. Each heat dissipation section 212 is bent relative to the evaporation section 211 to form an angle, so that the heat dissipation pipe 200 is approximately "C" shaped and has an opening. In this way, the heat absorbed by the evaporation section 211 can be evenly distributed to both ends, thereby achieving a better heat dissipation effect, and the heat dissipation pipe 200 can be kept away from occupying too much space in the housing 100, thus making the structure of the controller more compact.

[0044] Furthermore, such as Figure 1 As shown, there are two heat dissipation pipes 200, which are symmetrically arranged. The evaporation section 211 of any one heat dissipation pipe 200 is close to or attached to the evaporation section 211 of the other heat dissipation pipe 200. That is, the opening formed by any one heat dissipation pipe 200 is opposite to the opening formed by the other heat dissipation pipe 200. This allows heat to be dispersed from the two evaporation sections 211 in the middle to the four heat dissipation sections 212 around the perimeter, thereby enabling heat to be transferred to the low temperature area more quickly.

[0045] Regarding the internal structure of heat pipe 200, such as Figure 3 As shown, the tube shell 210 surrounds a closed vacuum cavity 210a, the liquid suction core 220 is attached to the cavity wall of the vacuum cavity 210a along the extension direction of the tube shell 210, and the liquid suction core 220 surrounds a heat dissipation cavity 201 in the vacuum cavity 210a, which is filled with liquid working fluid.

[0046] Since the evaporation section 211 is attached to the heat sink 300 that carries the chip, based on the above structure, as Figure 5As shown, when the evaporation section 211 is heated, the liquid-phase working medium in the shell 210 absorbs heat and rapidly evaporates into steam. Due to the pressure difference, the steam fills the entire heat dissipation cavity 201 and rapidly spreads towards the heat dissipation section 212 at the end of the shell 210. When the steam reaches the heat dissipation section 212, the steam releases the heat carried by it and gradually condenses into liquid-phase working medium due to the low temperature of the heat dissipation section 212 and the wick 220 located at the position of the heat dissipation section 212. The condensed liquid-phase working medium is retransported back to the evaporation section 211 through the porous wick 220 under the capillary action of the wick 220.

[0047] As can be seen, this process not only relies on the phase change heat transfer of the working medium, but also fully utilizes the capillary force to enable the liquid to overcome gravity or other resistance and achieve efficient circulation flow. Through the continuous evaporation, flow, condensation and return flow process, the heat pipe can quickly and efficiently transfer heat from the heat source to the cold end to complete a complete heat transfer cycle.

[0048] It should be emphasized that the heat conduction efficiency of the heat dissipation pipe 200 is tens or even hundreds of times higher than that of traditional metals (such as copper or aluminum) used for heat dissipation. Therefore, it can be seen that the heat dissipation mode described in the above embodiment can quickly transfer heat from the heat source to the heat dissipation area, thus having extremely high heat conduction efficiency. Such heat conduction efficiency is much higher than that of the traditional natural heat dissipation mode, and the heat distribution is more uniform, thereby avoiding heat accumulation. As a heat dissipation structure, it can make the structure more compact, and the noise during heat dissipation is smaller, and the cost is lower compared with the traditional air cooling or water cooling heat dissipation mode.

[0049] It should be noted that since the control board of the controller has multiple chips, the height of each chip is different, and therefore, in order to ensure that each chip can be in close contact with the heat dissipation block 300, reference is made to Figure 6 In a preferred embodiment, the side of the heat dissipation block 300 opposite to the heat dissipation pipe 200 has multiple bosses 301, and each boss 301 has a bonding surface for bonding with a corresponding chip. As a preferred implementation, the bonding surface can be processed by precision numerical control machining to ensure that the bonding surface can be in flat and close contact with the domain control core chip in the controller, thereby minimizing the thermal resistance and ensuring that heat can be quickly conducted from the chip to the heat dissipation block 300.

[0050] In addition, in a more preferred embodiment, as Figure 7As shown, the outer side of the shell 100 (i.e. the side opposite to the accommodating cavity 101) is provided with a plurality of spaced apart heat dissipation fins 103. The heat dissipation fins 103 are arranged to increase the contact area between the shell 100 and air, so as to improve the heat exchange efficiency, and thus the heat transferred to the shell 100 can be dissipated by natural or forced convection.

[0051] In addition, considering that the shell 100 has a higher temperature corresponding to the projected position of the heat dissipation pipe 200 on the shell 100, in order to achieve better heat dissipation effect, as an improvement to the above embodiment, please refer to Figure 8 , the edge of the heat dissipation fin 103 at the position corresponding to the heat dissipation pipe 200 is provided with a plurality of grooves 1031, so that the edge of the heat dissipation fin 103 at the position corresponding to the heat dissipation pipe 200 is formed with a plurality of serrations 1032, and the projection of the profile formed by all the grooves 1031 and serrations 1032 on the heat dissipation fin 103 on a projection plane coincides with the projection of the heat dissipation pipe 200 on the projection plane.

[0052] In this way, it is not difficult to see that the edge of the heat dissipation fin 103 at the position corresponding to the heat dissipation pipe 200 is changed from a straight line extension to a serration 1032-shaped bending extension, so as to further increase the contact area between the shell 100 and air, and thus the heat dissipation effect is better.

[0053] The following will further introduce the heat dissipation process of the heat dissipation structure 10 provided by the present application in combination with Figure 1 , Figure 2 , Figure 5 and Figure 6 .

[0054] When the controller starts to work, the core chip rapidly generates heat due to high load operation, and the heat is first transferred to the heat dissipation block 300 through the contact surface (i.e. the heat dissipation surface) between the chip and the boss 301 of the heat dissipation block 300. Due to the high thermal conductivity of aluminum alloy, the heat is rapidly and uniformly distributed in the heat dissipation block 300, and is transferred to the evaporation part 211 of the heat dissipation pipe 200 through the interface between the heat dissipation block 300 and the heat dissipation pipe 200 connected by soldering. At this time, the liquid phase working medium in the heat dissipation pipe 200 rapidly absorbs heat and changes phase, from liquid to vapor. Due to the pressure difference inside the heat pipe, the vapor will diffuse to the heat dissipation parts 212 at both ends of the heat dissipation pipe 200.

[0055] When the steam diffuses to the heat dissipation part 212 of the heat dissipation pipe 200, the steam is in contact with the wick 220 and the heat dissipation part 212 of the pipe shell 210, and the steam is rapidly liquefied and releases the heat carried. This process transmits heat to the shell 100 through the pipe shell 210 of the heat dissipation pipe 200, and increases the contact area with air through the heat dissipation fins 103 of the shell 100, thereby improving the heat exchange efficiency. When the air flows through the fins, the heat is taken away by natural convection or forced convection, and the purpose of heat dissipation is finally achieved.

[0056] From the foregoing, it can be seen that the heat dissipation structure 10 provided by the present application has the following advantages:

[0057] First, through the integrated design of the heat dissipation pipe 200, the heat dissipation block 300 and the shell 100, the heat can be quickly and uniformly distributed from the core chip to the heat dissipation pipe 200, and then transmitted to the low-temperature area of the shell 100 by the heat dissipation pipe 200, avoiding the local overheating problem that may occur in the traditional natural cooling mode.

[0058] Second, the phase change heat transfer mechanism (liquid working medium evaporation and condensation) inside the heat dissipation pipe 200 has extremely high heat conduction efficiency, which is much higher than the traditional air cooling relying on pure metal heat conduction or water cooling relying on liquid flow.

[0059] Third, unlike the traditional cooling method which needs a fan for air cooling or a water pump for water cooling, the heat dissipation structure 10 with the heat dissipation pipe 200 completely relies on physical phase change and heat conduction, without moving parts, thus reducing the overall power consumption and the possibility of mechanical failure, making the controller more durable, suitable for long-term high-load operation in harsh environments (such as high-vibration, high-dust environments), without the need for regular replacement of cooling liquid or cleaning of fan dust, and the maintenance cost is relatively low.

[0060] Fourth, because there is no need for additional fan or water pump devices, the internal space can be greatly saved, especially suitable for space-limited application scenarios, and almost no noise is generated, suitable for high-noise vehicle arrangements.

[0061] Fifth, the shape and position of the heat dissipation pipe 200 and the heat dissipation block 300 in the heat dissipation structure 10 can be flexibly designed according to the position and shape of the heat source, and the boss 301 on the heat dissipation block 300 can directly correspond to the core chip, thus optimizing the heat conduction path, so that it can adapt to chips of different power and layout, and has higher flexibility than traditional air cooling and water cooling systems in applicable scenarios.

[0062] In summary, the heat dissipation structure 10 provided by the application has significant advantages in heat conduction efficiency, reliability, noise control, space utilization, overall power consumption and maintenance cost compared with the prior art which relies on power-driven air convection or water flow for air cooling or water cooling, and is particularly suitable for high-power-density, space-limited and high-reliability vehicle application scenarios.

[0063] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but it should be considered that any combination of the technical features is within the scope of the present disclosure as long as the combination does not result in contradictions.

[0064] The above-described embodiments only express several implementation manners of the application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the application, and these are within the protection scope of the application. Therefore, the patent protection scope of the application should be subject to the appended claims.

Claims

1. A heat dissipating structure, characterized by comprising: The application relates to a heat dissipation structure (10) comprising: a shell (100) enclosing a containing cavity (101); a heat dissipation pipe (200) and a heat dissipation block (300) both arranged in the containing cavity (101) and connected with the shell (100); the heat dissipation block (300) is used for connecting a chip, one side of the heat dissipation pipe (200) is connected with the shell (100), and at least part of the opposite side is connected with the heat dissipation block (300), so that heat generated by the chip can be conducted to the shell (100) through the heat dissipation block (300) and the heat dissipation pipe (200) in sequence.

2. The heat dissipating structure according to claim 1, wherein The heat dissipation pipe (200) and the heat dissipation block (300) are both welded with the shell (100).

3. The heat dissipating structure according to claim 1, wherein The heat dissipation pipe (200) comprises a pipe shell (210) and a liquid absorbing core (220), the pipe shell (210) encloses a closed vacuum cavity (210a), the liquid absorbing core (220) is arranged along the extension direction of the pipe shell (210) and attached to the cavity wall of the vacuum cavity (210a), and a heat dissipation cavity (201) is enclosed in the vacuum cavity (210a) and filled with liquid-phase working medium.

4. The heat dissipating structure according to claim 3, wherein The pipe shell (210) is formed with an evaporation part (211) and a heat dissipation part (212) connected with the evaporation part (211), the evaporation part (211) is attached to the heat dissipation block (300), so that the heat dissipation block (300) covers the evaporation part (211), and at least part of the heat dissipation part (212) is exposed to the heat dissipation block (300).

5. The heat dissipating structure according to claim 4, wherein The heat dissipation part (212) has two heat dissipation parts (212) arranged at two ends of the evaporation part (211), and each heat dissipation part (212) is bent to form an included angle relative to the evaporation part (211).

6. The heat dissipating structure according to claim 5, wherein The heat dissipation pipe (200) has two heat dissipation pipes (200), and the evaporation part (211) of any one of the heat dissipation pipes (200) is arranged close to or attached to the evaporation part (211) of the other heat dissipation pipe (200).

7. The heat dissipating structure according to claim 1, wherein The side of the heat dissipation block (300) opposite to the heat dissipation pipe (200) has a plurality of bosses (301), and each boss (301) has an attachment surface for attaching the chip.

8. The heat dissipating structure according to claim 1, wherein The shell (100) has a plurality of heat dissipation fins (103) arranged at intervals on the side opposite to the containing cavity (101).

9. The heat dissipating structure according to claim 8, wherein The heat dissipation fin (103) is provided with a plurality of grooves (1031) at the positions corresponding to the heat dissipation pipe (200), so that a plurality of serrations (1032) are formed on the heat dissipation fin (103) at the positions corresponding to the heat dissipation pipe (200).

10. A controller characterized by comprising: The application further relates to a chip and a heat dissipation structure (10) as claimed in any one of claims 1-9, wherein the chip is arranged on the heat dissipation block (300) of the heat dissipation structure (10).

Images