LED lamp and LED product

Abstract

The utility model provides an LED lamp and an LED product, the LED lamp comprises an insulating base, a plurality of conductive pins, a driving chip, a plurality of light-emitting wafers and packaging glue, the top of the insulating base is recessed downwards to form a first reflection cup and a plurality of second reflection cups, the first reflection cup is located at one side of the insulating base, and the plurality of second reflection cups are arranged at the other side of the insulating base side by side; the plurality of conductive pins and the insulating seat are integrally embedded and molded, and each conductive pin is provided with a die bonding part which is arranged in the first reflection cup and the second reflection cup; the driving chip is arranged on the die bonding part in the first reflection cup; the plurality of light-emitting wafers are respectively arranged on the wafer fixing parts in the second reflection cups, and at least one light-emitting wafer is arranged in each second reflection cup; the packaging adhesive is filled in the first reflection cup and covers the driving chip, and the packaging adhesive is filled in the plurality of second reflection cups and covers the light-emitting wafer. And the driving chip is electrically connected with the plurality of light-emitting wafers respectively so as to control the light-emitting wafer in each second reflection cup to emit light through the packaging adhesive.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED technical field especially relates to a LED lamp and LED product. BACKGROUND

[0002] As a new type of lighting source, LED lamp has the advantages of energy saving, environmental protection, short response time, long service life and the like. At present, the light emitting mode of LED lamp is mainly based on the combination of red, green and blue three primary color light emitting chips or other color chips. This mode has high efficiency, controllable color temperature and good color rendering property, but the different light decay of three primary color chips leads to unstable color temperature, and the simultaneous light emission of light emitting chips with different colors easily causes light mixing and affects the light emitting effect of other chips, resulting in high R&D cost of LED lamp. SUMMARY

[0003] The utility model provides a kind of LED lamp and LED product, to solve the light emitting mode of current realization LED lamp is mainly based on the combination of red, green and blue three primary color light emitting chips or other color chips and emits light. This mode has high efficiency, controllable color temperature and good color rendering property, but the different light decay of three primary color chips leads to unstable color temperature, and the simultaneous light emission of light emitting chips with different colors easily causes light mixing and affects the light emitting effect of other chips, resulting in high R&D cost of LED lamp.

[0004] In a first aspect, the utility model provides a kind of LED lamp, LED lamp includes:

[0005] Insulating seat, insulating seat is formed with first reflector cup and multiple second reflector cups from top concave, first reflector cup is located at one side of insulating seat, and multiple second reflector cups are arranged side by side on the other side of insulating seat;

[0006] Multiple conductive pins, multiple conductive pins are integrally embedded with insulating seat, and the conductive pin has die bonding part, and the die bonding part is arranged in first reflector cup and second reflector cup;

[0007] Driving chip, driving chip is arranged on the die bonding part in first reflector cup;

[0008] Multiple light emitting chips, multiple light emitting chips are respectively arranged on the die bonding part in second reflector cup, and at least one light emitting chip is included in each second reflector cup;

[0009] Encapsulation glue, encapsulation glue is filled in first reflector cup and covers driving chip respectively and is filled in multiple second reflector cups and covers light emitting chip;

[0010] Wherein, driving chip is electrically connected with multiple light emitting chips respectively to control the light emitting chip in each second reflector cup to emit light through encapsulation glue.

[0011] The utility model provides a kind of LED product, including the LED lamp as any embodiment of the utility model provides.

[0012] The utility model provides a kind of LED lamp, LED lamp includes insulating seat, multiple electrically conductive pins, drive chip, multiple light-emitting chips and encapsulation glue, insulating seat is formed with first reflector and multiple second reflectors from top concave, first reflector is located in one side of insulating seat, and multiple second reflectors are side by side and set in the other side of insulating seat;Multiple electrically conductive pins are integrally embedded with insulating seat, and electrically conductive pin has fixed crystal part, and fixed crystal part is arranged in first reflector and second reflector;Drive chip is arranged on the fixed crystal part in first reflector;Multiple light-emitting chips are respectively arranged on the fixed crystal part in second reflector, and at least one light-emitting chip is included in each second reflector;Encapsulation glue is filled in first reflector and covers on drive chip and filled in multiple second reflectors and covers on light-emitting chip respectively.

[0013] Further provided LED lamp is integrally formed by reflector design and electrically conductive pin, so that overall structure is more compact, reflector design can improve light utilization, and the light-emitting effect of LED lamp is enhanced.Separate drive chip and light-emitting chip, it is favorable to heat dispersion, and improve heat dissipation performance.

[0014] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the drawings needed in the embodiment description will be briefly introduced below, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0016] Figure 1 It is the front view of the 1st LED lamp provided by the embodiment of the utility model;

[0017] Figure 2 It is the back view of the 1st LED lamp provided by the embodiment of the utility model;

[0018] Figure 3 It is the structural schematic diagram of the electrically conductive pin provided by the embodiment of the utility model;

[0019] Figure 4is a structure schematic view of a light-emitting assembly and a conductive pin provided by the utility model;

[0020] Figure 5 is an exploded view of the first LED lamp provided by the utility model embodiment;

[0021] Figure 6 is a use state schematic view of the first LED lamp provided by the utility model embodiment;

[0022] Figure 7 is a light-emitting state schematic view of the first LED lamp provided by the utility model embodiment;

[0023] Figure 8 is a front view of the second LED lamp provided by the utility model embodiment;

[0024] Figure 9 is a front view of the third LED lamp provided by the utility model embodiment;

[0025] Figure 10 is a structure schematic block diagram of an LED product provided by the utility model.

[0026] Main elements and symbol explanation:

[0027] 100, LED product.

[0028] 10, LED lamp.

[0029] 11, insulating seat; 111, first light reflection cup; 112, second light reflection cup; 113, partition wall;

[0030] 12, conductive pin; 121, die bonding part; 121a, first power pin; 121b, ground pin; 121c, second power pin; 121d, signal input pin; 121e, signal output pin; 122, welding part;

[0031] 13, driving chip;

[0032] 14, light-emitting wafer;

[0033] 15, support;

[0034] 16, foolproof opening;

[0035] 17, packaging glue; 171, first packaging glue; 172, second packaging glue.

[0036] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and cannot limit the utility model. DETAILED DESCRIPTION

[0037] With reference to the accompanying drawings, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative efforts belong to the scope of the present application.

[0038] The flow chart shown in the drawings is only an example and does not necessarily include all the contents and operations / steps, nor does it necessarily be executed in the described order. For example, some operations / steps can be further decomposed, combined or partially merged, so that the actual execution order can be changed according to the actual situation.

[0039] It should be understood that the terms used in the present application description are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present application description and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0040] It should be understood that, in order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, the same items or similar items with basically the same functions and effects are distinguished by using "first", "second" and the like. For example, the first encapsulation glue and the second encapsulation glue are only used to distinguish different support members, and do not limit the sequence. Those skilled in the art can understand that "first", "second" and the like do not limit the number and execution order, and "first", "second" and the like do not necessarily mean different.

[0041] It should also be understood that the term "and / or" used in the present application description and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0042] As a new type of lighting source, LED lamp has the advantages of energy saving, environmental protection, short response time, long service life and the like. At present, the main light emitting mode of LED lamp is based on the combination of red, green and blue three primary color light emitting chips or other color chips. This mode has high efficiency, controllable color temperature and good color rendering property, but the different light decay of three primary color chips leads to unstable color temperature, and the simultaneous light emission of light emitting chips with different colors easily causes light mixing and affects the light emission effect of other chips, resulting in high development cost of LED lamp.

[0043] Please refer to Figures 1 to 7As shown in the figure, the utility model provides a kind of LED lamp 10, LED lamp 10 includes insulating seat 11, multiple electrically conductive legs 12, driving chip 13, multiple light emitting chips 14 and encapsulation glue 17, insulating seat 11 is formed with first reflector cup 111 and multiple second reflector cups 112 from top concave, first reflector cup 111 is located in one side of insulating seat 11, multiple second reflector cups 112 are side by side and set in the other side of insulating seat 11;Multiple electrically conductive legs are integrally embedded with insulating seat 11, and electrically conductive leg 12 has fixed crystal part 121, and fixed crystal part 121 is arranged in first reflector cup 111 and second reflector cup 112;Driving chip 13 is arranged on fixed crystal part 121 in first reflector cup 111;Multiple light emitting chips 14 are respectively arranged on fixed crystal part 121 in second reflector cup 112, and at least one light emitting chip 14 is included in each second reflector cup 112;Encapsulation glue 17 is filled in first reflector cup 111 and covers driving chip 13 and filled in multiple second reflector cups 112 and covers light emitting chip 14 respectively.Wherein, driving chip 13 is electrically connected with multiple light emitting chips 14 respectively, to control the light emitting chip 14 in each second reflector cup 112 and emit light through encapsulation glue 17.

[0044] Specifically, as Figure 1 And 8 -9 shows, the provided LED lamp 10 is by the shape first reflector cup 111 and multiple second reflector cups 112 (as shown in the figure, the number of second reflector cup 112 can be 3, 4 also can according to the number of light emitting color arbitrary number of restrictions, the utility model embodiment does not limit the number of second reflector cup 112.) On insulating seat 11, and at least one light emitting chip 14 is placed in each second reflector cup 112, so that driving chip 13 can control each light emitting chip 14 to emit light, when the type of light emitting chip 14 is different, then can control it and emit different color light.As Figure 7 Shown, can emit red, green, blue and white four kinds of light in four second reflector cups 112 respectively.Furthermore, the provided LED lamp 10 can realize the following beneficial effects:

[0045] 1.Flexible output: by using different light emitting chips 14 in different reflector cups, realize the output enhancement of multiple color light, enhance the color performance and application flexibility of LED lamp 10.

[0046] 2.Precise color control: driving chip 13 can independently control each light emitting chip 14, realize the precise color adjustment ability, satisfy the diversified application demand.

[0047] 3.Improve the light emitting efficiency: the reflector cup design enhances the light reflection effect, improves the overall light emitting efficiency of LED lamp 10.

[0048] 4. Customization potential: Different combinations of light-emitting chips 14 can be selected according to needs, which can meet the needs of various specific lighting scenarios.

[0049] 5. Cost reduction and miniaturized product development: By placing light-emitting chips 14 in multiple second reflectors 112, the manufacturing cost of LED lamp 1010 can be significantly reduced while ensuring the multi-color light output of LED lamp 10, which is conducive to the development of small, high-performance lighting products.

[0050] In some embodiments, the LED light 10 includes four second reflectors 112. For example... Figure 1 As shown, the LED light 10 can be configured with four second reflectors 112 as needed, and the four second reflectors 112 can emit different lights by selecting different light-emitting chips 14.

[0051] For example, along the arrangement direction of the plurality of second reflectors 112, the colors of the light-emitting chips 14 in the second reflectors 112 are, in sequence, red, green, blue, and white. By using red, green, blue, and white light-emitting chips 14, a rich variety of lighting effects can be created. The combination of the three basic colors, red, green, and blue, can produce a wide range of colors, providing the LED light 10 with a great deal of color expressiveness. White light sources can provide bright illumination and enhance the clarity and contrast of the overall lighting effect. Combining red, green, and blue light-emitting chips 14 can create a more vivid and richer visual effect. By using four different colored light-emitting chips 14, a more uniform light distribution can be achieved in the overall lighting, reducing glare and shadows.

[0052] In some embodiments, the LED light 10 includes three second reflectors 112. For example... Figure 9 As shown, the LED light 10 can be configured with three second reflectors 112 as needed, and the three second reflectors 112 can emit different lights by selecting different light-emitting chips 14.

[0053] For example, along the arrangement direction of the plurality of second reflectors 112, the colors of the light-emitting chips 14 in the second reflectors 112 are, in sequence, red, green, and blue. The combination of the three basic colors of red, green, and blue can produce a variety of colors, which provides the LED light 10 with great color performance.

[0054] In some embodiments, the encapsulant 17 includes: a first encapsulant 171, which fills the first reflector 111 and covers the driver chip 13; and a second encapsulant 172, which fills a plurality of second reflectors 112 and covers the light-emitting wafer 14 chip. The type of second encapsulant 172 in each second reflector 112 is different, while the type of light-emitting wafer 14 in each second reflector 112 is the same, so that the driver chip 13 controls the light emitted by the light-emitting wafer 14 in each second reflector 112 through the second encapsulant 172 to be different colors. Furthermore, by providing a blue or green wafer in each second reflector 112, and by using different types of encapsulants 17, such as different phosphors within the encapsulant 17, the same type of light-emitting wafer 14 can emit different types of light, thereby simplifying the control logic and reducing the cost of the LED lamp 10.

[0055] In some embodiments, the insulating base 11 between each second reflector 112 and the first reflector 111 forms a partition wall 113; the plurality of second reflectors 112 include at least one target reflector, the target reflector is located in the middle of the plurality of side-by-side second reflectors 112, and the height of the partition wall 113 of the target reflector is lower than the height of the partition walls 113 of the other second reflectors 112.

[0056] like Figure 1 As shown, an insulating base 11 forms a partition 113 between each second reflector 112 and the first reflector 111. Among the multiple second reflectors 112 arranged side-by-side, at least one is defined as the target reflector, and the target reflector is located in the middle of the multiple second reflectors 112. By making the height of the partition 113 of the target reflector lower than the height of the partitions 113 of the other second reflectors 112, the partition 113 can effectively separate the different reflectors, reduce light crosstalk, and improve the purity of light in each reflector. Furthermore, through physical isolation, it ensures that the encapsulating adhesive 17 in different reflectors does not mix, guaranteeing the uniqueness of the light color emitted by each reflector.

[0057] Meanwhile, the partitions 113 can isolate the heat between the light emitting chips 14 and the driving chips 13 to some extent, which helps better heat distribution and management. The lower partitions 113 height corresponding to the target reflector cup allows more light diffusion and mixing. This can help to produce more uniform or more special light effects, such as creating a central bright spot or a soft transition zone. By adjusting the partitions 113 height of the target reflector cup, better overall light output effects can be achieved while maintaining color separation. The differentiated partitions 113 height provides more possibilities for LED lamp 10 design, which can adjust the light distribution according to specific application requirements. The lower partitions 113 height corresponding to the target reflector cup can allow different colors of light to mix to some extent, creating a richer color effect. The LED lamp 10 proposed in the utility model helps to create a more balanced and more beautiful overall lighting effect, especially in multi-color lighting applications.

[0058] Therefore, the differentiated partitions 113 design provided increases the flexibility and efficiency of the LED lamp 10 in light control and color management, while providing possibilities for innovative lighting effects. This design shows fine-tuned adjustment of LED performance at the microstructure level, which is expected to play an important role in various high-end lighting applications.

[0059] For example, the LED lamp 10 includes three second reflector cups 112 arranged side by side, and the second reflector cup 112 located in the middle position is the target reflector cup. As shown in Figure 9 When the LED lamp 10 includes three second reflector cups 112, the target reflector cup is the second reflector cup, and the second encapsulation glue 172 of the corresponding color can be selected and arranged in the target reflector cup and the remaining second reflector cups 112 according to requirements, realizing diversified design of the light emitting effect of the LED lamp 10.

[0060] For example, the LED lamp 10 includes four second reflector cups 112 arranged side by side, and the two second reflector cups 112 located in the middle position are the target reflector cups. As shown in Figure 1 When the LED lamp 10 includes four second reflector cups 112, the target reflector cups are the two located in the middle position, and the second encapsulation glue 172 of the corresponding color can be selected and arranged in the target reflector cup and the remaining second reflector cups 112 according to requirements, realizing diversified design of the light emitting effect of the LED lamp 10.

[0061] For example, as shown in Figure 3 and Figure 4As shown, the driving chip 13 and the light-emitting wafer 14 in the target reflector cup are electrically connected by bonding wires; the LED lamp 10 further comprises an extension pin, and the die bonding part 121 of the extension pin is located in the first reflector cup 111 and the remaining second reflector cup 112 at the same time, and the driving chip 13 is electrically connected with the light-emitting wafer 14 in the remaining second reflector cup 112 through the extension pin.

[0062] Since the partition wall 113 causes a gap between the first reflector cup 111 and the target reflector cup, the first reflector cup 111 and the target reflector cup can be directly connected by bonding wires, and since the target reflector cup is located in the middle position, the wiring distance of the LED lamp 10 can also be shortened, the cost of the LED lamp 10 is reduced, and the miniaturized design of the LED lamp 10 is realized.

[0063] Meanwhile, the provided embodiment simplifies the circuit connection mode by using the extension pin as a bridge between the driving chip 13 and the light-emitting wafer 14 in the other second reflector cup 112. The number of bonding wires needed to be directly connected from the driving chip 13 to each light-emitting wafer 14 is reduced. The use of bonding wires is reduced, and the risk of failure caused by the breakage or poor connection of the bonding wires is reduced. The provision of the extension pin die bonding part 121 provides a more stable connection basis. By using the extension pin, the limited space inside the LED lamp 10 can be more effectively utilized. The need for complex wiring is reduced, and more space is left for other elements. The extension pin can help to disperse and conduct heat, and improve the overall heat management effect. The simplified connection mode can make the production process more efficient, and the complex bonding steps are reduced. This design provides more layout options for those skilled in the art, and the positions of the chips and pins can be adjusted as needed.

[0064] Further, the extension pin can provide a shorter and more direct electrical path, potentially improving signal transmission quality. Combined with the wiring mode of the target reflector cup, the reduction in the use of bonding wires can reduce material and production costs. The provided LED lamp 10 can reduce electromagnetic interference and improve the overall performance stability of the LED lamp 10 by using a more concise connection, making the LED lamp 10 more easily adaptable to different packaging and application requirements. And the design of the extension pin can provide the possibility for future functional expansion (such as adding more control elements).

[0065] Therefore, the utility model discloses a design of extension pin, which embodies an innovative connection method. It not only simplifies the internal structure of the LED lamp 10, but also can improve the reliability, performance and production efficiency of the product. This design demonstrates the importance of optimizing the LED lamp 10 at the microscopic structure level, and is expected to play an important role in various high-quality lighting applications, especially in scenarios requiring complex control and multi-color output.

[0066] Exemplarily, a baffle is formed between the target reflector cup and the adjacent second reflector cup 112, and the height of the baffle is lower than the height of the partition wall 113 of the rest of the second reflector cup 112.

[0067] The baffle forms a lower physical separation between the target reflector cup and the adjacent second reflector cup 112. This design allows for some degree of light interaction while still maintaining a basic separation effect. The lower baffle height allows for partial mixing of light between the target reflector cup and the adjacent reflector cup. This can create a richer, more natural color transition effect.

[0068] By allowing the light in the central area (target reflector cup and its adjacent area) to diffuse more freely, the apparent boundaries or color jumps in the light bead output can be reduced. Partially mixed light can produce more diverse colors, increasing the color performance of the light bead. The lower baffle can help improve the heat distribution in the central area, preventing excessive heat concentration in certain areas. This differentiated partition wall 113 design provides more parameter adjustment space for the relevant technical personnel, allowing fine-tuning of light output characteristics according to specific application needs. This design can be used to create unique optical effects, such as soft central halos or gradient effects. By allowing the light in the central area to partially diffuse, it can help balance the light intensity distribution of the entire LED lamp 10. Better light mixing and distribution can result in higher overall light efficiency, reducing light energy loss. The structure provided by the present application makes the LED lamp 10 more adaptable to different application scenarios, from focused lighting to soft ambient light. In some applications, this built-in light control can reduce the need for additional external optical elements. The fine design of the LED lamp 10 provided can bring unique market advantages to the product, especially in high-end lighting applications.

[0069] Therefore, the setting of the baffle embodies a delicate balance, allowing for moderate light mixing while maintaining basic light separation. This design not only improves the performance and flexibility of the LED lamp 10, but also opens up new possibilities for innovative lighting solutions. It demonstrates the importance of fine-tuning LED performance at the microstructure level and is expected to play a key role in various high-quality lighting applications.

[0070] Exemplarily, the height of the second encapsulation glue 172 in the target reflector cup is the same as the height of the partition wall 113 of the target reflector cup, and the first encapsulation glue 171 also fills on the second encapsulation glue 172 of the target reflector cup.

[0071] Since the height of the partition wall 113 of the target reflector cup is lowered, a gap exists between the first reflector cup 111 and the target reflector cup, and thus the first encapsulation glue 171 can be filled on the second encapsulation glue 172 of the target reflector cup. When the first encapsulation glue 171 is transparent glue or diffusion glue, and the second encapsulation glue 172 is fluorescent glue composed of fluorescent powder of any color, the light emitting effect can be adjusted according to the light emitting requirement, and a more rich light emitting effect can be presented.

[0072] It should be noted that, in some embodiments, as shown in Figure 8 , the LED lamp 10 can not be provided with a target reflector cup, that is, each light emitting wafer 14 in each second reflector cup 112 is electrically connected to the driving chip 13 through the extended pin, and thus the unified connection mode can help to ensure that the signals received by each light emitting wafer 14 are more consistent.

[0073] In some embodiments, the conductive pin 12 at least includes a first power pin 121a, a ground pin 121b, and a plurality of second power pins 121c, the first power pin 121a and the ground pin 121b are respectively arranged in the first reflector cup 111 and located at opposite sides of the insulating base 11, and the plurality of second power pins 121c are respectively located in the first reflector cup 111; the driving chip 13 is electrically connected to the first power pin 121a and the ground pin 121b, and the light emitting wafer 14 is electrically connected to the second power pin 121c.

[0074] As shown in Figure 2 and 3 , by arranging the first power pin 121a, the ground pin 121b, and the plurality of second power pins 121c, separate power supply for the driving chip 13 and the light emitting wafer 14 can be realized, so that when the power consumption of the driving chip 13 is higher than that of the light emitting wafer 14, a smaller power supply can be connected to the second power pin 121c, thereby reducing the energy consumption of the entire LED lamp 10.

[0075] For example, the conductive pin 12 further includes a signal input pin 121d and a signal output pin 121e, the signal input pin 121d and the signal output pin 121e are respectively arranged in the first reflector cup 111 and located at opposite sides of the insulating base 11, and the driving chip 13 is electrically connected to the signal input pin 121d and the signal output pin 121e; wherein the signal input pin 121d is arranged on the same side as the first power pin 121a, and the signal output pin 121e is arranged on the same side as the ground pin 121b. As shown in Figures 3-4 , by arranging the signal input pin 121d and the signal output pin 121e, the driving chip 13 can receive external signals to realize fine and intelligent control of each light emitting wafer 14. At the same time, the arrangement of the pins also simplifies the product structure of the provided LED lamp 10.

[0076] Exemplarily, the insulating base 11 comprises a first end face and a second end face arranged oppositely, the first light cup 111, the second light cup 112 and the light emitting component are arranged on the first end face of the insulating base 11, and the die-bonding part 121 of the first power pin 121a, the grounding pin 121b and the plurality of second power pins 121c are arranged on the second end face of the insulating base 11. The die-bonding part 121 of the first power pin 121a on the first end face and the second end face is electrically connected, the die-bonding part 121 of the grounding pin 121b on the first end face and the second end face is electrically connected, and the die-bonding part 121 of the second power pin 121c on the first end face and the second end face is electrically connected. As shown in the figure, the die-bonding part 121 arranged on the second end face makes the connection of the power pin, the grounding pin 121b and the plurality of second power pins 121c more direct, and simplifies the internal circuit layout. This design reduces the complexity of electrical connection and improves the efficiency of overall electrical connection and assembly. Figure 3

[0077] It should be noted that in some embodiments, the conductive pin 12 also has a welding part 122, the welding part 122 of the first power pin 121a is connected to the die-bonding part 121 of the first power pin 121a on the first end face and the second end face, the welding part 122 of the grounding pin 121b is connected to the die-bonding part 121 of the grounding pin 121b on the first end face and the second end face, and the welding part 122 of the second power pin 121c is connected to the die-bonding part 121 of the second power pin 121c on the first end face and the second end face. As shown in the figure, the die-bonding part 121 is extended to the second end face through the welding part 122, which improves the connection stability of the product. Figure 3

[0078] It should be noted that in some embodiments, the LED lamp 10 further comprises: a first conductive via hole for connecting the die-bonding part 121 of the first power pin 121a on the first end face and the second end face; a second conductive via hole for connecting the die-bonding part 121 of the grounding pin on the first end face and the second end face; and a third conductive via hole for connecting the die-bonding part 121 of the second power pin 121c on the first end face and the second end face. By placing a copper column as a conductive material in the conductive via hole, the die-bonding part 121 on the first end face and the second end face can be connected.

[0079] In some embodiments, the projection shape of the first light cup 111 on the insulating base 11 is the same as the projection shape of the plurality of second light cups 112 on the insulating base 11. Please refer to Figure 1 Figure 1 ​​​It can be seen that the overall profile of the first reflective cup 111 and the second reflective cup 112 corresponds to a hexagonal projection shape. By making the projection shape of the first reflective cup 111 and the plurality of second reflective cups 112 the same, the symmetry design of the product can be achieved, and the overall lighting effect can be improved.

[0080] In some embodiments, the LED lamp 10 further comprises a support 15 arranged at the cup wall of the first reflective cup 111 for enhancing the structural strength of the first reflective cup 111 and preventing the conductive pin 12 from being warped. The support 15 can be made of, for example, pre-made plastic, thereby enhancing the structural strength of the first reflective cup 111 and suppressing the corresponding conductive pin from being warped.

[0081] In some embodiments, as shown in Figure 1 The anti-fooling port 16 is arranged on one side of the insulating seat 11111 of the LED lamp 10 bead 10. The main functions of the anti-fooling port 16 include preventing misinsertion, improving installation efficiency, enhancing product reliability, and protecting user safety. These functions collectively provide strong support for the wide application of the LED lamp 1010.

[0082] In some embodiments, the material of the insulating seat 11 is epoxy molding compound, and the conductive pin 12 is pre-injected in the epoxy molding compound by laser direct structuring technology. By using epoxy molding compound (EMC) as the material of the insulating seat 11 and adopting laser direct structuring (LDS) technology for pre-injection of the conductive pin 12, the performance and reliability of the LED lamp 10 are improved, and the manufacturing process is optimized, which provides important support for the miniaturization, high efficiency, and long service life of the product. This innovative combination of materials and processes brings significant technical progress to the design and production of the LED lamp 10.

[0083] For example, the color of the epoxy molding compound is black. The filler of the black resin material is relatively small, and the surface is relatively delicate, and it is not easy to fall off after metallization. The LED lamp 10 has better stability.

[0084] For example, the color of the epoxy molding compound is white. The color of the epoxy molding compound is not limited in the embodiments of the present application.

[0085] The LED lamp 10 provided by the application can realize the output of multiple color lights by arranging the same / different light emitting chips in different reflector cups, thereby enhancing the color performance and application flexibility of the LED lamp 10. Meanwhile, the driving chip 13 can independently control each light emitting chip 14, thereby realizing the precise color mixing and adjusting capability and meeting the diversified application requirements. The reflector cup design enhances the light reflection effect and improves the overall light emitting efficiency of the LED lamp 10. Different light emitting chip 14 combinations can be selected according to requirements, and the requirements of various specific lighting scenes can be met. The provided LED lamp 10 realizes the multifunction in a single LED lamp 10, is beneficial to the development of small and efficient lighting products, and can greatly reduce the manufacturing cost of the LED lamp 10 while ensuring the multi-color light output of the LED lamp 10, which is beneficial to the development of small and high-performance lighting products.

[0086] Please refer to Figure 10 , Figure 10 is a structural schematic diagram of the LED product 100 provided by the embodiments of the application, as shown in Figure 10 , the LED product 100 includes the LED lamp provided by any embodiment of the application, thereby realizing the miniaturization of the LED product 100.

[0087] In some embodiments, the LED product 100 is any device such as a fan or a screen, and the embodiments of the application do not limit the type of the LED product 100.

[0088] In some embodiments, the LED product 100 includes multiple LED lamps 10, and the multiple LED lamps can be connected in the LED product 100 at intervals or can be connected in a corresponding manner according to requirements.

[0089] In the description of the application, it should be explained that, unless otherwise explicitly specified and limited, the terms “mounting”, “connection” and “connection” should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected. Can be mechanically connected, can be electrically connected. Can be directly connected, can be indirectly connected through an intermediate medium, can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0090] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature can include the first and second features directly contact, or can include the first and second features are not directly contact but through the other features between them contact. Moreover, the first feature is "on", "above" and "on" the second feature includes the first feature is directly above and obliquely above the second feature, or just indicates the first feature horizontal height is higher than the second feature. The first feature is "under", "below" and "under" the second feature includes the first feature is directly below and obliquely below the second feature, or just indicates the first feature horizontal height is less than the second feature.

[0091] The above disclosure provides many different implementations or examples to implement different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described in the above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides various specific examples of processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0092] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. An LED lamp, characterized in that, The LED lamp comprises: an insulating base, the insulating base is concave from the top and is formed with a first light reflecting cup and a plurality of second light reflecting cups, the first light reflecting cup is located at one side of the insulating base, and a plurality of the second light reflecting cups are arranged side by side at the other side of the insulating base; a plurality of conductive pins, the plurality of conductive pins are integrally embedded and formed with the insulating base, the conductive pins have die bonding parts, and the die bonding parts are arranged in the first light reflecting cup and the second light reflecting cup; a driving chip, the driving chip is arranged on the die bonding part in the first light reflecting cup; a plurality of light emitting chips, the plurality of light emitting chips are respectively arranged on the die bonding parts in the second light reflecting cups, and each of the second light reflecting cups comprises at least one light emitting chip; an encapsulating glue, the encapsulating glue is respectively filled in the first light reflecting cup and covers the driving chip, and the encapsulating glue is respectively filled in the plurality of second light reflecting cups and covers the light emitting chips; wherein, the driving chip is electrically connected with the plurality of light emitting chips to control the light emitting chips in each of the second light reflecting cups to emit light through the encapsulating glue.

2. The LED lamp of claim 1, wherein, The LED lamp comprises four second light reflecting cups.

3. The LED lamp of claim 2, wherein, Along the arrangement direction of the plurality of second light reflecting cups, the colors of the light emitting chips in the second light reflecting cups are red chips, green chips, blue chips and white chips in sequence.

4. The LED lamp of claim 1, wherein, The LED lamp comprises three second light reflecting cups.

5. The LED lamp of claim 4, wherein, Along the arrangement direction of the plurality of second light reflecting cups, the colors of the light emitting chips in the second light reflecting cups are red chips, green chips and blue chips in sequence.

6. The LED lamp of claim 1, wherein, The encapsulating glue comprises: a first encapsulating glue, the first encapsulating glue is filled in the first light reflecting cup and covers the driving chip; a second encapsulating glue, the second encapsulating glue is respectively filled in the plurality of second light reflecting cups and covers the light emitting chips; wherein, the types of the second encapsulating glue in each of the second light reflecting cups are different, and the types of the light emitting chips in each of the second light reflecting cups are the same, so that the driving chip controls the colors of the light emitted by the light emitting chips in each of the second light reflecting cups through the second encapsulating glue to be different.

7. The LED lamp of claim 1, wherein, The insulating base between each of the second light reflecting cups and the first light reflecting cup forms a partition wall; the plurality of second light reflecting cups comprise at least one target light reflecting cup, the target light reflecting cup is located at the middle position of the plurality of second light reflecting cups arranged side by side, and the height of the partition wall of the target light reflecting cup is lower than the height of the partition wall of the remaining second light reflecting cups.

8. The LED lamp of claim 7, wherein, The LED lamp comprises three second light reflecting cups arranged side by side, and the second light reflecting cup at the middle position is the target light reflecting cup.

9. The LED lamp of claim 7, wherein, The LED lamp comprises four second light reflecting cups arranged side by side, and the two second light reflecting cups at the middle positions are the target light reflecting cups.

10. The LED lamp of claim 7, wherein, The driving chip and the light emitting chips in the target light reflecting cup are electrically connected through a bonding wire; the LED lamp further comprises: an extension pin, the die bonding part of the extension pin is located in the first light reflecting cup and the remaining second light reflecting cups at the same time, and the driving chip is electrically connected with the light emitting chips in the remaining second light reflecting cups through the extension pin.

11. The LED lamp of claim 1, wherein, The conductive pins at least include a first power pin, a ground pin and a plurality of second power pins, the first power pin and the ground pin are respectively arranged in the first reflective cup and located at opposite sides of the insulating base, and the plurality of second power pins are respectively located in the first reflective cup; the driving chip is electrically connected with the first power pin and the ground pin respectively, and the light-emitting wafer is electrically connected with the second power pins.

12. The LED lamp of claim 11, wherein, The conductive pins further include a signal input pin and a signal output pin, the signal input pin and the signal output pin are respectively arranged in the first reflective cup and located at opposite sides of the insulating base, and the driving chip is electrically connected with the signal input pin and the signal output pin respectively. The signal input pin is arranged at the same side as the first power pin, and the signal output pin is arranged at the same side as the ground pin.

13. The LED lamp of claim 11, wherein, The insulating base includes oppositely arranged first and second end faces, the first reflective cup, the second reflective cup and the light-emitting assembly are located on the first end face of the insulating base, and the die bonding portions of the first power pin, the ground pin and the plurality of second power pins are further arranged on the second end face of the insulating base; the die bonding portions of the first power pin located on the first end face and the second end face are electrically connected, the die bonding portions of the ground pin located on the first end face and the second end face are electrically connected, and the die bonding portions of the second power pins located on the first end face and the second end face are electrically connected.

14. The LED lamp of claim 13, wherein, The conductive pins further have welding portions, the welding portion of the first power pin is connected with the die bonding portions of the first power pin located on the first end face and the second end face, the welding portion of the ground pin is connected with the die bonding portions of the ground pin located on the first end face and the second end face, and the welding portion of the second power pin is connected with the die bonding portions of the second power pins located on the first end face and the second end face.

15. The LED lamp of claim 13, wherein, The LED lamp further includes: A first conductive via hole for connecting the die bonding portions of the first power pin located on the first end face and the second end face; A second conductive via hole for connecting the die bonding portions of the ground pin located on the first end face and the second end face; A third conductive via hole for connecting the die bonding portions of the second power pins located on the first end face and the second end face.

16. The LED lamp of claim 1, wherein, The projection shape of the first reflective cup on the insulating base is the same as the projection shape of the plurality of second reflective cups on the insulating base.

17. The LED lamp of claim 1, wherein, The LED lamp further includes: A support arranged at the cup wall of the first reflective cup for enhancing the structural strength of the first reflective cup.

18. An LED product, characterized by The LED lamp includes any one of claims 1-17.

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