Crystal delivery mechanism applied to semiconductor die bonder

Abstract

The utility model discloses a crystal delivery mechanism applied to a semiconductor die bonder, and relates to the technical field of die bonding, the crystal delivery mechanism comprises a frame body and a feeding conveyor belt arranged on the upper surface of the frame body, a controller is fixedly arranged on one side of the frame body, a rotating assembly used for conveying crystals of different sizes is arranged on one side of the frame body, and the feeding conveyor belt is arranged on the other side of the frame body. A discharging assembly used for conducting classification operation on the crystals is arranged between the feeding conveying belt and the rotating assembly. According to the crystal sorting device, the rotating assembly and the bearing piece can flexibly adjust the distance between the fixing bases through the electric telescopic rod, the crystal sorting device can be conveniently matched with crystals of different sizes, the discharging assembly is arranged, and through cooperative work of a mechanical arm, an electric push rod and an adsorption tray, the crystal sorting efficiency can be improved according to the crystal sorting requirement; the crystals are accurately adsorbed and placed on the corresponding feeding conveying belt, the position of the mechanical arm is adjusted in combination with the adjusting piece, the accuracy of crystal classification is improved, and the production defective rate caused by classification errors is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of die bonding technology, and specifically relates to a crystal conveying mechanism applied to a semiconductor die bonder. BACKGROUND

[0002] The semiconductor die bonder is a key device in semiconductor packaging equipment, mainly used for fixing semiconductor chips on a lead frame or a substrate carrier, and is an important link in the later packaging process of semiconductor manufacturing. Through precise mechanical movement and process control, it realizes high-speed and high-precision mounting of chips, lays a foundation for subsequent packaging process. In the process of crystal conveying, this process usually uses a single mechanical hand to deal with multiple processes, which is low in efficiency, and the above-mentioned mechanical hand can only convey a certain specific crystal, which has poor applicability.

[0003] For example, the patent with the authorization announcement number CN218878674U records a conveying device for semiconductor wafers, which can effectively solve the problem of low efficiency of mechanical arm in the implementation process, but the mechanical arm in the above-mentioned device is not convenient for clamping the crystal, which leads to poor stability of the crystal conveying, so that when the crystal is transferred from the feeding device to the working area of the die bonder, it often cannot classify different sizes of crystals or convey in time, which affects the overall production progress.

[0004] Based on this, the present application provides a crystal conveying mechanism applied to a semiconductor die bonder, which can eliminate the drawbacks of the prior art. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a crystal conveying mechanism applied to a semiconductor die bonder to solve the problems of poor stability of crystal conveying and lack of classification function in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] A crystal conveying mechanism applied to a semiconductor die bonder, comprising a frame body and a feeding conveyor belt arranged on the upper surface of the frame body, a controller is fixedly arranged on one side of the frame body, a rotating assembly for conveying different sizes of crystals is arranged on one side of the frame body, and a discharging assembly for classifying the crystals is arranged between the feeding conveyor belt and the rotating assembly.

[0008] The rotating assembly comprises an annular frame fixedly installed on the upper end of the frame body, a turntable is rotatably arranged on the upper end of the annular frame, a gear ring is fixedly installed on the inner side wall of the turntable, a gear is meshingly arranged on one side of the gear ring, one end of the gear shaft of the gear is fixedly connected with the output end of a driving motor, the driving motor is connected with the annular frame through a support, and the upper surface of the turntable is uniformly distributed with a plurality of bearing parts for placing the crystals.

[0009] Preferably, the carrier comprises symmetrically arranged fixing bases, the opposite sides of the two fixing bases are provided with placing grooves, the bottom of the fixing base is provided with a sliding groove, the inside of the sliding groove is slidably provided with a sliding rail, the sliding rail is fixedly installed on the rotating disc, the top of the sliding rail is fixedly installed with a plurality of electric telescopic rods, and the output end of the electric telescopic rod is fixedly connected with the fixing base.

[0010] Preferably, the unloading assembly comprises a plurality of mechanical arms, the mechanical arms are arranged in rows along the conveying direction of the feeding conveyor belt, one side of the mechanical arm is rotatably connected with an electric push rod, the output end of the electric push rod is connected with a suction tray, the surface of the mechanical arm is provided with an air pump, the air pump is connected with the corresponding suction tray through an air guide pipe, and the mechanical arm and the frame body are connected through an adjusting piece.

[0011] Preferably, the adjusting piece comprises a rotary motor fixedly installed at the top of the frame body, the output end of the rotary motor is fixedly connected with a rotating plate, the inside of the rotating plate is provided with a groove, the inside of the groove is rotatably provided with a lead screw, one end of the lead screw extends to the outside of the rotating plate and is fixedly connected with the output end of the adjusting motor, the outside of the lead screw is threadedly provided with a sliding block, the sliding block is slidably arranged in the groove, and the plurality of mechanical arms are uniformly distributed on the surface of the sliding block.

[0012] Preferably, the two sides of the rotating disc are fixedly provided with a partition plate for preventing the carrier from being damaged, and one side of the partition plate is provided with a position sensor for detecting the position of the crystal.

[0013] Preferably, the shape of the placing groove is matched with the shape of the fixing base.

[0014] Preferably, the outer diameter size of the plurality of suction trays gradually increases from left to right.

[0015] Preferably, one side of the rotating disc close to the mechanical arm is further provided with a lifting piece for assisting the unloading of the crystal, the lifting piece comprises a plurality of through holes formed in the surface of the rotating disc, the upper surface of the frame body is fixedly provided with a lifting push rod, the output end of the lifting push rod is fixedly provided with a push plate, and the outer diameter size of the push plate is smaller than the minimum inner diameter size of the placing groove.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] 1、The utility model discloses a rotating assembly is arranged, and the carrier can flexibly adjust the spacing between the fixing bases through the electric telescopic rod, is convenient for adapting to the crystal of different sizes, greatly improves the adaptability of the conveying mechanism to the crystal specification, reduces the time and cost of needing to replace the conveying mechanism due to the change of the size of the crystal, and improves production efficiency.

[0018] 2, The utility model discloses a blanking subassembly, through the cooperative work between mechanical arm, electric push rod, adsorption tray, can according to the classification requirement of crystal, accurate adsorption and place crystal to corresponding feeding conveyor, adjust the position of mechanical arm in combination adjusting piece, improve the accuracy of crystal classification, reduce the production defective rate caused by classification error. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is structural schematic view of one side of example 1.

[0020] Figure 2 It is structural schematic view of the other side of example 1.

[0021] Figure 3 It is top view of example 1.

[0022] Figure 4 It is structural schematic view of the bearing of example 1.

[0023] Figure 5 It is structural schematic view of the blanking subassembly of example 1.

[0024] Figure 6 It is internal structure schematic view of the blanking subassembly of example 1. Figure 5

[0025] Figure 7 It is structural schematic view of example 2.

[0026] Legend: frame body 101, feeding conveyor 102, controller 103, rotating assembly 200, annular frame 201, rotating disc 202, gear ring 203, gear wheel 204, drive motor 205, fixed base 206, placing groove 207, sliding rail 208, electric telescopic rod 209, partition 210, through hole 211, lifting push rod 212, push plate 213, blanking subassembly 300, mechanical arm 301, electric push rod 302, adsorption tray 303, air pump 304, air duct 305, rotating plate 306, recess 307, lead screw 308, sliding block 309. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following is combined with the drawings and example, and the utility model is further explained in detail.

[0028] Example 1

[0029] In this embodiment, as Figures 1-6 ​As shown, a kind of crystal conveying mechanism applied to semiconductor die bonder, including frame body 101 and the feeding conveyor belt 102 of setting on the upper surface of frame body 101, in the working area of semiconductor die bonder, frame body 101 is stably installed at specified position, ensure that it is horizontal and firm, by feeding conveyor belt 102 ensure that crystal can be smoothly transported, the side of frame body 101 is fixedly provided with controller 103, controller 103 uniformly controls the electrical components of the mechanism, each component works according to preset program, reduce manual intervention, such as motor speed, push rod telescopic quantity, air pump negative pressure value, motor rotation angle and displacement, etc., the side of frame body 101 is provided with rotating assembly 200 for transporting different size crystals, ensure that crystal rotates smoothly and is positioned accurately by rotating assembly 200, carrier can be according to the size range of common crystal, the initial size of placing groove 207 is set in advance, so that the spacing between fixed base 206 adapts to most crystal sizes, the feeding conveyor belt 102 and rotating assembly 200 are provided with blanking assembly 300 for sorting operation to crystal, ensure that crystal can accurately, quickly reach die bonding station, reduce the waiting time and crystal positioning error in die bonding process;

[0030] Rotating assembly 200 includes annular frame 201 fixedly installed on the upper end of frame body 101, rotating disc 202 is rotatably arranged on the upper end of annular frame 201, gear ring 203 is fixedly installed on the inner side wall of rotating disc 202, gear ring 203 is rotatably arranged on the side of gear ring 203, the gear shaft of gear 204 is fixedly connected with the output end of driving motor 205, driving motor 205 is connected with annular frame 201 through support, the upper surface of rotating disc 202 is uniformly distributed with a plurality of carriers for placing crystals, when driving motor 205 is started, the torque output by driving motor 205 is transmitted to gear ring 203 through gear 204, to rotate at constant speed, in turn drive rotating disc 202 to rotate smoothly on annular frame 201, realize the circumferential conveying of carrier and crystal on rotating disc 202, facilitate the transmission of crystal from initial position to subsequent process.

[0031] Among them, as shown in Figures 2-4 As shown, carrier includes symmetrically arranged fixed base 206, placing groove 207 is formed on the opposite side of two fixed bases 206, for placing crystal, the bottom of fixed base 206 is provided with sliding groove, sliding rail 208 is slidably arranged in the inner part of sliding groove, sliding rail 208 is fixedly installed on rotating disc 202, a plurality of electric telescopic rods 209 are fixedly installed on the top of sliding rail 208, the output end of electric telescopic rod 209 is fixedly connected with fixed base 206, the extension and retraction of each carrier electric telescopic rod 209 can be independently controlled by sending instructions by controller 103, when different size crystals need to be placed, electric telescopic rod 209 is lengthened or shortened, in turn drive fixed base 206 to slide along sliding rail 208, so as to adjust the spacing between two fixed bases 206, to adapt to the size change of crystal.

[0032] As shown in Figures 2-6 The blanking assembly 300 includes a plurality of mechanical arms 301 arranged in a row along the conveying direction of the feeding conveyor belt 102. Each mechanical arm 301 is rotatably connected to an electric push rod 302 on one side. The output end of the electric push rod 302 is connected to a suction tray 303. The surface of the suction tray 303 has a plurality of air holes connected to an air duct 305. Each mechanical arm 301 is provided with an air pump 304. The air pump 304 can be provided with a filter box on one side, which is internally provided with a filter layer to prevent some dust from entering the interior of the air pump 304 during the suction process, affecting the internal structure. The air pump 304 is connected to the corresponding suction tray 303 through the air duct 305. When it is necessary to suction and classify the crystals, the air pump 304 is started to generate negative pressure in the suction tray 303 through the air duct 305, thereby suctioning the crystals. The position and angle of the suction tray 303 can be adjusted through the cooperation between the mechanical arm 301 and the electric push rod 302 to accurately suction crystals of different sizes. The mechanical arm 301 is connected to the frame 101 through an adjusting piece. The adjusting piece allows the replacement of different sizes of suction trays 303 according to different sizes of crystals.

[0033] As shown in Figures 1-6 The adjusting piece includes a rotary motor fixedly installed on the top of the frame 101. The output end of the rotary motor is fixedly connected to a rotating plate 306. The rotating plate 306 can be rotated by the rotary motor to change the circumferential position of the mechanical arm 301 to adapt to different working requirements. A groove 307 is formed in the interior of the rotating plate 306. A lead screw 308 is rotatably arranged in the groove 307. One end of the lead screw 308 extends to the outside of the rotating plate 306 and is fixedly connected to the output end of the adjusting motor. A sliding block 309 is threadedly arranged on the outside of the lead screw 308. The sliding block 309 is slidingly arranged in the groove 307. A plurality of mechanical arms 301 are uniformly distributed on the surface of the sliding block 309. The adjusting motor can drive the lead screw 308 to rotate when started, thereby converting the rotation of the lead screw 308 into the linear movement of the sliding block 309 in the groove 307, thereby adjusting the position of different mechanical arms 301 in the horizontal direction to realize flexible adjustment of the suction tray 303 and improve the accuracy of crystal classification.

[0034] As shown in Figure 1 and Figure 2 The rotating disc 202 is fixedly provided with a partition plate 210 on both sides to prevent damage to the carrier and reduce the probability of the carrier being affected by external factors. The partition plate 210 is provided with a position sensor on one side for detecting the position of the crystal.

[0035] As shown in Figure 3 and Figure 4As shown, the shape of the placement groove 207 is matched with the shape of the fixing base 206, and the fixing base 206 can be selected as a semicircle or a square according to the actual production environment, and the placement groove 207 is also adjusted as a plurality of semicircles or squares according to the shape of the fixing base 206, and the adaptability is good.

[0036] As shown in the formula (1), the formula (2) and the formula (3), the formula (4) and the formula (5) and the formula (6) are shown. Figure 1 and Figure 5 As shown, the outer diameter size of the plurality of adsorption trays 303 increases from left to right, and the size is different to realize the feeding operation of more size crystals, and the adsorption tray 303 is matched with the crystal size, so that the adsorption capacity of the adsorption tray 303 is improved, and the adsorption tray 303 can more stably adsorb and move the crystal.

[0037] Example 2

[0038] Different from example 1, as shown in the formula (1), the formula (2) and the formula (3), the formula (4) and the formula (5) and the formula (6) are shown. Figure 7 As shown, the side of the rotating disc 202 close to the mechanical arm 301 is also provided with a lifting piece for assisting the crystal unloading, the lifting piece includes a plurality of through holes 211 opened on the surface of the rotating disc 202, the through holes 211 correspond to the positions of the bearing pieces on the rotating disc 202, the upper surface of the frame body 101 is fixedly provided with a lifting push rod 212, the output end of the lifting push rod 212 is fixedly provided with a push plate 213, and the outer diameter size of the push plate 213 is smaller than the minimum inner diameter size of the placement groove 207, when the crystal unloading operation is needed, the lifting push rod 212 receives the instruction from the controller 103, the output end of the lifting push rod 212 drives the push plate 213 to move upward along the through hole 211, and then the crystal is slowly lifted from the placement groove 207, so that the adsorption tray 303 can more conveniently and accurately adsorb the crystal.

[0039] When in use, before the semiconductor die bonder starts, the controller 103 sends an instruction to the driving motor 205 to drive the gear ring 203 and the gear 204 to engage transmission, and then drive each bearing piece on the rotating disc 202 to start rotating in turn, and move one of the bearing pieces to the predetermined position close to the unloading assembly according to the preset order and speed, and the electric telescopic rod 209 in the process can ensure that the crystal can be placed according to the spacing between the fixing bases 206, when the crystal moves to the position below the unloading assembly along with the rotating disc 202, the rotating motor drives the rotating plate 306 to rotate, the adjusting motor and the screw rod 308 drive the sliding block 309 to move, so that the mechanical arm 301 can be accurately moved to the position corresponding to the horizontal position of the crystal, then the adsorption tray 303 is driven to approach the crystal, the crystal is firmly adsorbed by negative pressure, and then the mechanical arm 301 is controlled to correspond to the feeding conveyor belt 102 by the rotating motor and the adjusting motor, so that the conveying operation of the crystal is realized.

[0040] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can not easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A crystal transfer mechanism applied to a semiconductor die bonder, comprising a frame (101) and a feeding conveyor belt (102) arranged on the upper surface of the frame (101), and a controller (103) fixedly arranged on one side of the frame (101), characterized in that, One side of the frame body (101) is provided with a rotating assembly (200) for conveying different size crystals, and a discharging assembly (300) for classifying crystals is arranged between the feeding conveyor belt (102) and the rotating assembly (200). The rotating assembly (200) comprises an annular frame (201) fixedly installed on the upper end of the frame body (101), a rotating disc (202) rotatably arranged on the upper end of the annular frame (201), a gear ring (203) fixedly installed on the inner side wall of the rotating disc (202), a gear (204) meshingly arranged on one side of the gear ring (203), and a driving motor (205) fixedly connected with the output end of the gear shaft of the gear (204), wherein the driving motor (205) is connected with the annular frame (201) through a support, and the upper surface of the rotating disc (202) is uniformly distributed with a plurality of load-bearing members for placing crystals.

2. The die transfer mechanism for a semiconductor die bonder according to claim 1, wherein The load-bearing member comprises two fixed bases (206) symmetrically arranged, and a placing groove (207) is formed on the opposite side of each fixed base (206), and a sliding groove is arranged on the bottom of the fixed base (206), a sliding rail (208) is slidably arranged in the sliding groove, the sliding rail (208) is fixedly installed on the rotating disc (202), a plurality of electric telescopic rods (209) are fixedly installed on the top of the sliding rail (208), and the output end of the electric telescopic rod (209) is fixedly connected with the fixed base (206).

3. The die transfer mechanism for use in a semiconductor die bonder according to claim 2, wherein The discharging assembly (300) comprises a plurality of mechanical arms (301), the mechanical arms (301) are arranged in a row along the conveying direction of the feeding conveyor belt (102), an electric push rod (302) is rotatably connected on one side of each mechanical arm (301), an adsorption tray (303) is connected with the output end of the electric push rod (302), a gas pump (304) is arranged on the surface of each mechanical arm (301), the gas pump (304) is connected with the corresponding adsorption tray (303) through a gas guide pipe (305), and the mechanical arms (301) and the frame body (101) are connected through an adjusting member.

4. The die transfer mechanism for use in a semiconductor die bonder according to claim 3, wherein The adjusting member comprises a rotary motor fixedly installed on the top of the frame body (101), a rotating plate (306) is fixedly connected with the output end of the rotary motor, a recess (307) is formed in the interior of the rotating plate (306), a lead screw (308) is rotatably arranged in the recess (307), one end of the lead screw (308) extends to the outside of the rotating plate (306) and is fixedly connected with the output end of the adjusting motor, a sliding block (309) is threadedly arranged on the outside of the lead screw (308), the sliding block (309) is slidably arranged in the recess (307), and a plurality of mechanical arms (301) are uniformly distributed on the surface of the sliding block (309).

5. The die transfer mechanism for use in a semiconductor die bonder according to claim 2, wherein The rotating disc (202) is fixedly provided with a baffle (210) on both sides to prevent the load-bearing member from being damaged, and a position sensor is arranged on one side of the baffle (210) to detect the position of the crystal.

6. The die transfer mechanism for use in a semiconductor die bonder according to claim 2, wherein The shape of the placing groove (207) is matched with the shape of the fixed base (206).

7. The die transfer mechanism for use in a semiconductor die bonder according to claim 3, wherein The outer diameter size of the adsorption trays (303) gradually increases from left to right.

8. The die transfer mechanism for use in a semiconductor die bonder according to claim 3, wherein The rotary table (202) is provided with a lifting piece for assisting the unloading of the crystal on the side close to the mechanical arm (301), the lifting piece comprises a plurality of through holes (211) formed on the surface of the rotary table (202), the upper surface of the frame body (101) is fixedly provided with a lifting push rod (212), the output end of the lifting push rod (212) is fixedly provided with a push plate (213), and the outer diameter size of the push plate (213) is smaller than the minimum inner diameter size of the placing groove (207).

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