Semiconductor packaging mold

Abstract

The utility model relates to the technical field of semiconductor packaging, and particularly discloses a semiconductor packaging mold which comprises an upper mold body and a lower mold body which are matched with each other, and the edges of the left end and the right end of an inner cavity of the upper mold body are respectively provided with a first outer slideway block and a first inner slideway block. A second outer slide block and a second inner slide block are arranged on the edges of the left end and the right end of an inner cavity of the lower die body respectively, first positioning mechanisms used for positioning are arranged in the inner cavities of the upper die body and the lower die body, and a second positioning mechanism used for positioning is further arranged in the inner cavity of the lower die body. According to the utility model, the first outer slideway block and the first inner slideway block can be disassembled and assembled, and the second outer slideway block and the second inner slideway block can be disassembled and assembled, so that the flexible and sharp effect is realized, the cost is effectively reduced, and the heating effect of the heating rod is not influenced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging mold. Background Technology

[0002] Semiconductor packaging molds consist of upper and lower molds. When the upper and lower molds are closed, they form a closed cavity to accommodate the chip, lead frame, and bonding wire structure. Then, the molding compound is injected, and finally, the mold is cooled and demolded.

[0003] Existing molds are mostly of a single type, meaning they can only produce a single product, resulting in poor overall compatibility. Furthermore, the molds need to be sealed under high temperature and pressure, requiring a certain clamping force; otherwise, the molding compound will overflow. Molds with clamping forces corresponding to 180-ton and 120-ton pressing capacities for upper and lower mold boxes must be used separately and are not interchangeable, leading to high production costs in actual production.

[0004] To address these issues, we propose a semiconductor packaging mold. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor packaging mold.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor packaging mold includes an upper mold body and a lower mold body that are matched with each other. The upper mold body has a first outer slide block and a first inner slide block respectively on the left and right ends of its inner cavity. The lower mold body has a second outer slide block and a second inner slide block respectively on the left and right ends of its inner cavity. Both the upper mold body and the lower mold body have a first positioning mechanism for positioning. The lower mold body also has a second positioning mechanism for positioning.

[0008] Preferably, heating rods can be installed inside the inner edges of both sides of the inner cavity of the upper mold body and the lower mold body.

[0009] Preferably, the first outer slide block abuts against the inner wall of the inner cavity of the upper mold body, and the first inner slide block is located on the side of the first outer slide block away from the upper mold body.

[0010] Preferably, the second outer slide block abuts against the inner wall of the lower mold body's inner cavity, and the second inner slide block is located on the side of the second outer slide block away from the lower mold body.

[0011] Preferably, the first positioning mechanism includes two first positioning plates. The two first positioning plates can be locked and fixed to the front and rear ends of the inner cavity of the upper mold body by means of pins, or locked and fixed to the front and rear ends of the inner cavity of the lower mold body by means of pins. The two first positioning plates can be positioned between the two first inner slide blocks, and the two first positioning plates can also be positioned between the two second inner slide blocks.

[0012] Preferably, the first positioning mechanism further includes two second positioning plates. The two second positioning plates can be locked and fixed to the front and rear ends of the inner cavity of the upper mold body by means of pins, or locked and fixed to the front and rear ends of the inner cavity of the lower mold body by means of pins. The two second positioning plates can be positioned and fixed between the two first outer slide blocks. The two second positioning plates can also be positioned and fixed between the two second outer slide blocks.

[0013] Preferably, the second positioning mechanism includes a first claw for positioning the second outer slide block and a second claw for positioning the second inner slide block. The second outer slide block is provided with a groove corresponding to the first claw, and the second inner slide block is also provided with a groove corresponding to the second claw. Both the first claw and the second claw can be fixed to the inner cavity of the lower mold body by inserting a rod. The first claw and the second claw can be quickly inserted and removed.

[0014] Preferably, the bottom of the cavity of the upper mold body is provided with several holes, and spring push rods are provided in the holes. The first claw and the second claw are both provided with through holes, and spring push rods are also provided in the through holes.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This utility model, by setting a first outer slide block, a first inner slide block, a second outer slide block, and a second inner slide block, can correspond to the upper mold body and the lower mold body respectively, and can be flexibly disassembled and assembled, thereby being compatible with the effects of 180-ton pressing capacity and 120-ton pressing capacity, effectively reducing costs, while not reducing the heating effect of the heating rod. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is an isometric view of the upper mold body of the present invention, which is suitable for a pressing capacity of 120 tons.

[0019] Figure 2This is a cross-sectional view of the upper mold body of the present invention, which is suitable for a pressing capacity of 120 tons.

[0020] Figure 3 This is an isometric view of the upper mold body of the present invention, which is suitable for a pressing capacity of 180 tons.

[0021] Figure 4 This is a cross-sectional view of the upper mold body of the present invention, which is suitable for a pressing capacity of 180 tons.

[0022] Figure 5 This is an isometric view of the lower mold body of the present invention, which is suitable for a pressing capacity of 120 tons.

[0023] Figure 6 This is a cross-sectional view of the lower mold body of the present invention, which is suitable for a pressing capacity of 120 tons.

[0024] Figure 7 This is an isometric view of the lower mold body of the present invention, which is suitable for a pressing capacity of 180 tons.

[0025] Figure 8 This is a cross-sectional view of the lower mold body of the present invention, which is suitable for a pressing capacity of 120 tons.

[0026] In the figure: 1. Upper mold body; 2. Lower mold body; 3. First outer slide block; 4. First inner slide block; 5. Second outer slide block; 6. Second inner slide block; 7. First positioning plate; 8. Second positioning plate; 9. First claw; 10. Second claw; 11. Heating rod; 12. Hole; 13. Through hole. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around" and other terms indicating orientation or positional relationship are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0029] Reference Figures 1-8A semiconductor packaging mold includes an upper mold body 1 and a lower mold body 2 that are matched with each other. The left and right ends of the inner cavity of the upper mold body 1 are respectively provided with a first outer slide block 3 and a first inner slide block 4. The left and right ends of the inner cavity of the lower mold body 2 are respectively provided with a second outer slide block 5 and a second inner slide block 6. The inner cavities of the upper mold body 1 and the lower mold body 2 are each provided with a first positioning mechanism for positioning. The inner cavity of the lower mold body 2 is also provided with a second positioning mechanism for positioning.

[0030] As those skilled in the art will know from the above examples, when implementing the above technical solutions, the upper mold body 1 and the lower mold body 2 can be installed on existing equipment, and the closing and separating operations of the upper mold body 1 and the lower mold body 2 can be realized.

[0031] As a technical optimization of this utility model, heating rods 11 can be installed inside both sides of the inner cavity of the upper mold body 1 and the lower mold body 2.

[0032] As a technical optimization of this utility model, the first outer slide block 3 abuts against the inner wall of the inner cavity of the upper mold body 1, and the first inner slide block 4 is located on the side of the first outer slide block 3 away from the upper mold body 1.

[0033] As a technical optimization of this utility model, the second outer slide block 5 abuts against the inner wall of the inner cavity of the lower mold body 2, and the second inner slide block 6 is located on the side of the second outer slide block 5 away from the lower mold body 2.

[0034] As a technical optimization of this utility model, the first positioning mechanism includes two first positioning plates 7. The two first positioning plates 7 can be locked and fixed to the front and rear ends of the inner cavity of the upper mold body 1 by means of pins, or locked and fixed to the front and rear ends of the inner cavity of the lower mold body 2 by means of pins. That is, the first positioning plates 7 and the upper mold body 1 or the lower mold body 2 are provided with corresponding pin holes, into which pins can be inserted. The two first positioning plates 7 can be positioned and abutted between the two first inner slide blocks 4, and the two first positioning plates 7 can also be positioned and abutted between the two second inner slide blocks 6.

[0035] Those skilled in the art should understand that, in implementing the above technical solutions, the pin and the corresponding pin hole can be threaded.

[0036] As a technical optimization of this utility model, the first positioning mechanism further includes two second positioning plates 8. The two second positioning plates 8 can be locked and fixed to the front and rear ends of the inner cavity of the upper mold body 1 by means of pins, or locked and fixed to the front and rear ends of the inner cavity of the lower mold body 2 by means of pins. That is, both the second positioning plates 8 and the upper mold body 1 or the lower mold body 2 are provided with corresponding pin holes, into which pins can be inserted. The two second positioning plates 8 can be positioned and abutted between the two first outer slide blocks 3, and the two second positioning plates 8 can also be positioned and abutted between the two second outer slide blocks 5.

[0037] When the upper mold body 1 is used, and a pressing tonnage of 120 tons is applied, two first outer slide blocks 3 and two first inner slide blocks 4 are installed on the inner cavity of the upper mold body 1. The first outer slide block 3 and the first inner slide block 4 on the same side abut against each other. At this time, the two first positioning plates 7 can be quickly locked and fixed by the pin, thereby positioning the first outer slide block 3 and the first inner slide block 4 on both sides, as detailed below. Figure 1 and Figure 2 As shown. When a pressing capacity of 180 tons is required, the two first inner slide blocks 4 can be disassembled and removed, leaving only the two first outer slide blocks 3. Then, the two second positioning plates 8 are quickly locked in place using pins, thereby positioning the first outer slide blocks 3 on both sides, as detailed below. Figure 3 and Figure 4 As shown.

[0038] As a technical optimization of this utility model, the second positioning mechanism includes a first claw 9 for positioning the second outer slide block 5 and a second claw 10 for positioning the second inner slide block 6. The second outer slide block 5 is provided with a groove corresponding to the first claw 9, and the second inner slide block 6 is also provided with a groove corresponding to the second claw 10. The first claw 9 and the second claw 10 can both be fixed to the inner cavity of the lower mold body 2 by inserting a rod. The first claw 9 and the second claw 10 can be quickly inserted and removed.

[0039] When the lower mold body 2 is used, with a pressing capacity of 120 tons, the second outer slide block 5 and the second inner slide block 6 are installed on the inner cavity of the lower mold body 2. The second outer slide block 5 and the second inner slide block 6 on the same side abut against each other. At this time, the two first positioning plates 7 can be quickly locked and fixed by the pin, thereby positioning the second outer slide block 5 and the second inner slide block 6 on both sides. The corresponding second claw 10 is also installed. The second claw 10 can also achieve the effect of positioning the second inner slide block 6. Specifically, as shown... Figure 5 and Figure 6As shown. When a pressing capacity of 180 tons is required, the two second inner slide blocks 6 can be disassembled and removed, leaving only the two second outer slide blocks 5. Then, the two second positioning plates 8 are quickly locked in place using pins, thereby positioning the first outer slide blocks 3 on both sides. The corresponding first claws 9 are then installed, which also serve to position the second outer slide blocks 5. Specifically, as shown... Figure 7 and Figure 8 As shown.

[0040] As a technical optimization of this utility model, the bottom of the cavity of the upper mold body 1 is provided with several holes 12, and spring push rods are provided in the holes 12. The first claw 9 and the second claw 10 are both provided with through holes 13, and spring push rods are also provided in the through holes 13. The spring push rods are used to eject the material and initiate the demolding operation after molding. The several holes 12 and the spring push rods installed inside can meet the requirements of 120-ton and 180-ton pressing capacities, effectively ensuring the demolding operation. When the first claw 9 and the second claw 10 are set, the spring push rods corresponding to the through holes 13 also correspond to the requirements of 120-ton and 180-ton pressing capacities.

[0041] In this invention, the working principle of the device is as follows:

[0042] When the upper mold body 1 is used, for a pressing capacity of 120 tons, two first outer slide blocks 3 and two first inner slide blocks 4 are installed on the inner cavity of the upper mold body 1. The first outer slide block 3 and the first inner slide block 4 on the same side abut against each other, and their contact can effectively transfer heat without reducing the heating effect of the heating rod 11. Then, the two first positioning plates 7 can be quickly locked and fixed by the pins, thereby positioning the first outer slide blocks 3 and the first inner slide blocks 4 on both sides. When a pressing capacity of 180 tons is required, the two first inner slide blocks 4 can be removed, leaving only the two first outer slide blocks 3. Then, the two second positioning plates 8 can be quickly locked and fixed by the pins, thereby positioning the first outer slide blocks 3 on both sides. When the lower mold body 2 is used, with a pressing capacity of 120 tons, the second outer slide block 5 and the second inner slide block 6 are installed on the inner cavity of the lower mold body 2. The second outer slide block 5 and the second inner slide block 6 on the same side abut against each other, and the contact between the two can effectively transfer heat without reducing the heating effect of the heating rod 11. At this time, the two first positioning plates 7 can be quickly locked and fixed by the pin, thereby positioning the second outer slide block 5 and the second inner slide block 6 on both sides, and the corresponding second claw 10 is installed. The second claw 10 can also achieve the effect of positioning the second inner slide block 6. When a pressing capacity of 180 tons is required, the two second inner slide blocks 6 can be disassembled and removed, leaving only the two second outer slide blocks 5. Then, the two second positioning plates 8 can be quickly locked and fixed by the pin, thereby positioning the first outer slide blocks 3 on both sides, and the corresponding first claw 9 is installed. The first claw 9 can also achieve the effect of positioning the second outer slide block 5.

[0043] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor packaging mold, comprising a matching upper mold body (1) and a lower mold body (2), characterized in that, The upper mold body (1) has a first outer slide block (3) and a first inner slide block (4) on the left and right sides of its inner cavity, respectively. The lower mold body (2) has a second outer slide block (5) and a second inner slide block (6) on the left and right sides of its inner cavity, respectively. The upper mold body (1) and the lower mold body (2) are both provided with a first positioning mechanism for positioning. The lower mold body (2) is also provided with a second positioning mechanism for positioning.

2. A semiconductor packaging mold according to claim 1, characterized in that, Heating rods (11) can be installed inside the inner sides of both the upper mold body (1) and the lower mold body (2).

3. A semiconductor packaging mold according to claim 1, characterized in that, The first outer slide block (3) abuts against the inner wall of the inner cavity of the upper mold body (1), and the first inner slide block (4) is located on the side of the first outer slide block (3) away from the upper mold body (1).

4. A semiconductor packaging mold according to claim 1, characterized in that, The second outer slide block (5) abuts against the inner wall of the inner cavity of the lower mold body (2), and the second inner slide block (6) is located on the side of the second outer slide block (5) away from the lower mold body (2).

5. A semiconductor packaging mold according to claim 1, characterized in that, The first positioning mechanism includes two first positioning plates (7). The two first positioning plates (7) can be locked and fixed to the front and rear ends of the inner cavity of the upper mold body (1) by means of pins, or locked and fixed to the front and rear ends of the inner cavity of the lower mold body (2) by means of pins. The first positioning plates (7) can be quickly disassembled. The two first positioning plates (7) can be positioned between the two first inner slide blocks (4) and the two first positioning plates (7) can also be positioned between the two second inner slide blocks (6).

6. A semiconductor packaging mold according to claim 1, characterized in that, The first positioning mechanism also includes two second positioning plates (8). The two second positioning plates (8) can be locked and fixed to the front and rear ends of the inner cavity of the upper mold body (1) by means of pins, or locked and fixed to the front and rear ends of the inner cavity of the lower mold body (2) by means of pins. The second positioning plates (8) can be quickly disassembled. The two second positioning plates (8) can be positioned between the two first outer slide blocks (3) and the two second positioning plates (8) can also be positioned between the two second outer slide blocks (5).

7. A semiconductor packaging mold according to claim 1, characterized in that, The second positioning mechanism includes a first claw (9) for positioning the second outer slide block (5) and a second claw (10) for positioning the second inner slide block (6). The second outer slide block (5) is provided with a groove corresponding to the first claw (9), and the second inner slide block (6) is also provided with a groove corresponding to the second claw (10). The first claw (9) and the second claw (10) can be fixed to the inner cavity of the lower mold body (2) by inserting a rod. The first claw (9) and the second claw (10) can be quickly inserted and removed.

8. A semiconductor packaging mold according to claim 7, characterized in that, The bottom of the cavity of the upper mold body (1) is provided with several holes (12), and spring push rods are provided in the holes (12). The first claw (9) and the second claw (10) are both provided with through holes (13), and spring push rods are also provided in the through holes (13).

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