Electroplating bubble eliminating device for electrocoppering

Abstract

The utility model discloses an electroplating bubble eliminating device for electroplating copper, and belongs to the technical field of electroplating. An electroplating bubble eliminating device for electrocoppering comprises an electroplating pool, an electroplating device, an anode, a lifting hook, a cathode wire and an ultrasonic device, the anode is inserted into the electroplating pool, the electroplating device is electrically connected with the anode, the lifting hook is connected with the electroplating device through the cathode wire, and the lifting hook is used for hanging an electroplated part; the ultrasonic device is arranged in the electroplating tank and can emit ultrasonic waves for breaking bubbles; a positioning mechanism and a knocking mechanism are arranged in the electroplating tank, the positioning mechanism comprises a supporting seat, a positioning plate and a power mechanism, and the positioning plate is movably connected with the supporting seat. According to the electroplating bubble eliminating device for copper electroplating, the electroplating part is located between the two positioning plates, after the positioning plates are knocked, the electroplating part and the positioning plates vibrate together, and compared with knocking a flexible cathode wire, vibration is more obvious, and the bubble separation effect is better.

Description

Technical Field

[0001] This utility model belongs to the field of electroplating technology, specifically relating to an electroplating bubble elimination device for copper electroplating. Background Technology

[0002] The main functions of electroplating coatings are decoration, protection, and functionality.

[0003] During electroplating, the workpiece is suspended by a steel wire and immersed in the electroplating solution. Gases in the solution form bubbles, some of which adhere to the workpiece to be plated with copper. This results in porosity and unevenness in the plating layer on the workpiece's surface. Currently, most methods use hammers or similar striking mechanisms to strike the steel wire suspending the workpiece, causing vibration and separating the workpiece from the bubbles. However, due to the steel wire's flexibility and elasticity, it deforms under stress, consuming some energy. This results in the workpiece actually receiving less energy and experiencing a smaller vibration amplitude, leaving some bubbles remaining on the workpiece. Therefore, this application proposes an electroplating bubble elimination device for copper electroplating. Utility Model Content

[0004] The purpose of this invention is to provide an electroplating bubble elimination device for electroplating copper, in order to solve the problem mentioned in the background art that when steel wire is subjected to force, due to its flexibility and elasticity, the steel wire will deform to a certain extent, consuming some energy, which results in the actual energy borne by the workpiece being small, the vibration amplitude being small, and some bubbles remaining on the workpiece.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an electroplating bubble elimination device for copper electroplating, comprising an electroplating tank, an electroplating device, an anode, a hook, a cathode wire, and an ultrasonic device. The anode is inserted into the electroplating tank, the electroplating device is electrically connected to the anode, and the hook is connected to the electroplating device through the cathode wire. The hook is used to suspend the electroplated parts.

[0006] An ultrasonic device is installed inside the electroplating bath. The ultrasonic device can emit ultrasonic waves to break up bubbles.

[0007] The electroplating tank is equipped with a positioning mechanism and a striking mechanism. The positioning mechanism includes a support base, a positioning plate, and a power mechanism. The positioning plate is movably connected to the support base. There are two positioning plates, and the two positioning plates are located on both sides of the electroplated part.

[0008] The positioning mechanism has a positioning state. When the positioning mechanism is in the positioning state, the two positioning plates are located on both sides of the electroplated part.

[0009] In a further technical solution, a top plate is provided on the top of the electroplating tank, and a through hole is provided in the top plate, through which the cathode wire passes.

[0010] In a further technical solution, an insulating sleeve is provided at the through hole, and the cathode wire is inserted into the insulating sleeve.

[0011] In a further technical solution, the positioning plate is configured in an L-shape, and a positioning head is provided at the end of the positioning plate away from the support base.

[0012] In a further technical solution, the positioning mechanism also includes a push-pull plate and a telescopic rod, the output end of the telescopic rod is movably connected to the push-pull plate, the push-pull plate is movably connected to the positioning plate, and the telescopic rod is set on the top plate.

[0013] In a further technical solution, the positioning mechanism has a retracted state, and when the positioning mechanism is in the retracted state, the positioning plate is located above the electroplating solution in the electroplating tank.

[0014] In a further technical solution, the support base is mounted on the top plate of the electroplating tank.

[0015] In a further technical solution, the striking mechanism is activated to strike the positioning plate in the positioning mechanism when it is in the positioning state.

[0016] In a further technical solution, the striking mechanism includes a striking rod, a striking ball, a mounting base, and a striking drive device. The striking rod is movably connected to the mounting base, and the striking drive device is connected to the striking rod.

[0017] In a further technical solution, the striking ball is installed at the bottom of the striking rod, and the mounting base is connected to the top plate.

[0018] Beneficial effects:

[0019] This utility model provides a device for eliminating bubbles in copper electroplating. A telescopic rod, via a push-pull plate, can push a positioning plate, causing the positioning plate to rotate around a support base. This allows the positioning mechanism to switch between a positioning state and a retracted state. In the positioning state, the two positioning plates are located on either side of the electroplated part. When the striking mechanism strikes the positioning plates, the electroplated part vibrates, separating the bubbles from the part. An ultrasonic device is then activated, emitting ultrasonic waves that break up the separated bubbles. After the electroplated part settles, it is electroplated again, resulting in a uniform, bubble-free electroplated layer. The electroplated part is positioned between the two positioning plates; striking the positioning plates causes them to vibrate together. Compared to striking a flexible steel wire hook, the vibration is more pronounced, resulting in better bubble separation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the electroplating bubble elimination device for copper electroplating in this utility model;

[0021] Figure 2This is a schematic diagram of the positioning mechanism in this utility model;

[0022] Figure 3 In this utility model Figure 2 Enlarged structural diagram at point A;

[0023] Figure 4 This is a schematic diagram of the positioning mechanism and the striking mechanism in this utility model;

[0024] Figure 5 In this utility model Figure 4 Enlarged structural diagram at point B;

[0025] Figure 6 This is a schematic diagram of the internal structure of the electroplating bubble elimination device for copper electroplating in this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Electroplating tank; 2. Electroplating equipment; 3. Anode; 4. Electroplated parts; 5. Hook; 6. Cathode wire; 7. Positioning mechanism; 701. Support base; 702. Positioning plate; 703. Positioning head; 704. Push-pull plate; 705. Telescopic rod; 8. Ultrasonic device; 9. Striking mechanism; 901. Striking rod; 902. Striking ball; 903. Mounting base; 904. Striking drive device. Detailed Implementation

[0028] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0029] like Figures 1-6 As shown in the figure, the present invention provides a copper electroplating bubble elimination device, including an electroplating tank 1, an electroplating device 2, an anode 3, a hook 5, a cathode wire 6, and an ultrasonic device 8. The anode 3 is inserted into the electroplating tank 1, the electroplating device 2 is electrically connected to the anode 3, and the hook 5 is connected to the electroplating device 2 through the cathode wire 6. The hook 5 is used to suspend the electroplated part 4.

[0030] The electroplating device 2, electroplating tank 1, anode 3 and other components work together. When energized, copper can be used as the anode 3 to form a copper plating layer on the electroplated part 4, which serves as the cathode.

[0031] In order to fix the cathode wire 6 and the electroplated part 4, a top plate is provided on the top of the electroplating tank 1. A through hole is provided in the top plate. The cathode wire 6 passes through the through hole, and an insulating sleeve is provided at the through hole. The cathode wire 6 is inserted into the insulating sleeve and the electroplated part 4 is suspended by the hook 5. The cathode wire 6 is connected to the electroplating device 2, so that a copper plating layer can be formed on the outer surface of the electroplated part 4.

[0032] An ultrasonic device 8 is installed inside the electroplating bath 1, and the ultrasonic device 8 can emit ultrasonic waves for breaking bubbles.

[0033] In order to separate the air bubbles on the electroplated part 4 from the electroplated part 4, a positioning mechanism 7 and a tapping mechanism 9 are provided in the electroplating tank 1. The positioning mechanism 7 includes a support base 701, a positioning plate 702 and a power mechanism. The positioning plate 702 is movably connected to the support base 701. There are two positioning plates 702, and the two positioning plates 702 are located on both sides of the electroplated part 4 respectively. The support base 701 is set on the top plate at the top of the electroplating tank 1.

[0034] The power mechanism is used to drive the positioning plate 702 to rotate, so that the positioning mechanism 7 has at least two states, including a positioning state and a retracted state. When the positioning mechanism 7 is in the positioning state, the two positioning plates 702 are located on both sides of the electroplated part 4. There can be a small gap between the positioning plate 702 and the electroplated part 4. The gap is so small that when the positioning plate 702 vibrates, the vibrating positioning plate 702 will push the electroplated part 4 to vibrate together.

[0035] When the positioning mechanism 7 is in the retracted state, the positioning plate 702 is located above the electroplating solution in the electroplating tank 1.

[0036] Specifically, the positioning plate 702 is L-shaped, and a positioning head 703 is provided at the end of the positioning plate 702 away from the support base 701. The positioning mechanism 7 also includes a push-pull plate 704 and a telescopic rod 705. The telescopic rod 705 can be a cylinder or a commercially available electric telescopic rod. The output end of the telescopic rod 705 is movably connected to the push-pull plate 704. The push-pull plate 704 is movably connected to the positioning plate 702. The telescopic rod 705 is set on the top plate.

[0037] In this way, the telescopic rod 705 can push the positioning plate 702 through the push-pull plate 704, allowing the positioning plate 702 to rotate around the support base 701. This allows the positioning mechanism 7 to switch between two states: a positioning state and a retracted state. When the positioning mechanism 7 is in the positioning state, the two positioning plates 702 are located on both sides of the electroplated part 4. When the striking mechanism 9 strikes the positioning plate 702, the electroplated part 4 vibrates along with it, causing the air bubbles on the electroplated part 4 to separate from it. The ultrasonic device 8 is activated, and the emitted ultrasonic waves can break the separated air bubbles. After the electroplated part 4 is left to stand, it is electroplated again, forming a uniform electroplated layer without air bubbles. The electroplated part 4 is located between the two positioning plates 702. After striking the positioning plate 702, the electroplated part 4 will vibrate along with the positioning plate 702. Compared with striking the flexible cathode wire 6, the vibration is more obvious, and the air bubble separation effect is better.

[0038] When the tapping mechanism 9 is activated, it can tap the positioning plate 702 in the positioning mechanism 7, which is in the positioning state, causing the positioning plate 702 to vibrate, thereby causing the electroplated part 4 to vibrate as well, so that the air bubbles on the electroplated part 4 separate from the electroplated part 4.

[0039] Specifically, the striking mechanism 9 includes a striking rod 901, a striking ball 902, a mounting base 903, and a striking drive device 904. The striking ball 902 is installed at the bottom of the striking rod 901. The striking rod 901 is movably connected to the mounting base 903, which is connected to the top plate. The striking drive device 904 is connected to the striking rod 901 and can drive the striking rod 901 to rotate around the mounting base 903, allowing the striking rod 901 to strike the positioning plate 702. The striking drive device 904 can be a motor, which drives the rotating shaft in the mounting base 903 to rotate, thereby driving the striking rod 901 to rotate.

[0040] In summary, this utility model embodiment provides an electroplating bubble elimination device for copper electroplating. The telescopic rod 705 can push the positioning plate 702 through the push-pull plate 704, allowing the positioning plate 702 to rotate around the support base 701, so that the positioning mechanism 7 can switch between two states: positioning state and retracted state. When the positioning mechanism 7 is in the positioning state, the two positioning plates 702 are respectively located on both sides of the electroplated part 4. When the striking mechanism 9 strikes the positioning plate 702, it can cause the electroplated part 4 to vibrate together, separating the bubbles on the electroplated part 4 from the electroplated part 4. The ultrasonic device 8 is activated, and the ultrasonic waves emitted can break the separated bubbles. After the electroplated part 4 is left to stand, it can be electroplated again to form a uniform electroplated layer without bubbles. The electroplated part 4 is located between two positioning plates 702. When the positioning plates 702 are tapped, the electroplated part 4 will vibrate together with the positioning plates 702. Compared with tapping the flexible steel wire hook 5 (the hook 5 is made of bent steel wire to better suspend the electroplated part 4), the vibration is more obvious and the separation effect of air bubbles is better.

[0041] The above-disclosed embodiments are only a few specific examples of the present utility model. However, the embodiments of the present utility model are not limited thereto. Any variations that can be conceived by those skilled in the art should fall within the protection scope of the present utility model.

Claims

1. A device for eliminating bubbles in copper electroplating, comprising an electroplating tank (1), an electroplating apparatus (2), an anode (3), a hook (5), a cathode wire (6), and an ultrasonic device (8), wherein the anode (3) is inserted into the electroplating tank (1), and the electroplating apparatus (2) is electrically connected to the anode (3), characterized in that, The hook (5) is connected to the electroplating device (2) via the cathode wire (6), and the hook (5) is used to suspend the electroplated parts (4); An ultrasonic device (8) is installed inside the electroplating tank (1). The ultrasonic device (8) can emit ultrasonic waves to break up bubbles. The electroplating tank (1) is provided with a positioning mechanism (7) and a striking mechanism (9). The positioning mechanism (7) includes a support base (701), a positioning plate (702), and a power mechanism. The positioning plate (702) is movably connected to the support base (701). There are two positioning plates (702), and the two positioning plates (702) are located on both sides of the electroplated part (4). The positioning mechanism (7) has a positioning state. When the positioning mechanism (7) is in the positioning state, the two positioning plates (702) are located on both sides of the electroplated part (4).

2. The electroplating bubble elimination device for copper electroplating as described in claim 1, characterized in that, The electroplating tank (1) is provided with a top plate, and a through hole is provided in the top plate, through which the cathode wire (6) passes.

3. The electroplating bubble elimination device for copper electroplating as described in claim 2, characterized in that, An insulating sleeve is provided at the through hole, and the cathode wire (6) is inserted into the insulating sleeve.

4. The electroplating bubble elimination device for copper electroplating as described in claim 1, characterized in that, The positioning plate (702) is L-shaped, and a positioning head (703) is provided at one end of the positioning plate (702) away from the support base (701).

5. The electroplating bubble elimination device for copper electroplating as described in claim 4, characterized in that, The positioning mechanism (7) further includes a push-pull plate (704) and a telescopic rod (705). The output end of the telescopic rod (705) is movably connected to the push-pull plate (704). The push-pull plate (704) is movably connected to the positioning plate (702). The telescopic rod (705) is set on the top plate.

6. The electroplating bubble elimination device for copper electroplating as described in claim 1, characterized in that, The positioning mechanism (7) has a retracted state, and when the positioning mechanism (7) is in the retracted state, the positioning plate (702) is located above the electroplating liquid in the electroplating tank (1).

7. The electroplating bubble elimination device for copper electroplating as described in claim 3, characterized in that, The support base (701) is set on the top plate at the top of the electroplating tank (1).

8. The electroplating bubble elimination device for copper electroplating as described in claim 1, characterized in that, When the striking mechanism (9) is activated, it can strike the positioning plate (702) in the positioning mechanism (7) which is in the positioning state.

9. The electroplating bubble elimination device for copper electroplating as described in claim 1, characterized in that, The striking mechanism (9) includes a striking rod (901), a striking ball (902), a mounting base (903), and a striking drive device (904). The striking rod (901) is movably connected to the mounting base (903), and the striking drive device (904) is connected to the striking rod (901).

10. The electroplating bubble elimination device for copper electroplating as described in claim 9, characterized in that, The striking ball (902) is installed at the bottom of the striking rod (901), and the mounting base (903) is connected to the top plate.

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